JPH07101445B2 - Method of manufacturing card with hologram - Google Patents

Description

TECHNICAL FIELD OF THE INVENTION The present invention relates to cards in which a hologram is provided at a position visible from the outside, and more specifically, a hologram layer and a reflective metal thin film formed of a specific resin. The present invention relates to a method for manufacturing cards provided with layers.

[Technical background of the invention and its problems]

Conventionally, magnetic materials have been mainly used as recording materials embedded in cards such as credit cards, bank cards and bank passbooks. This magnetic material has an advantage that information can be easily written and read, but on the other hand, information can be easily tampered with, which is a big social problem.

Therefore, there has been a demand for the appearance of cards that are difficult to forge or alter the cards themselves or to tamper with the information written on the recording material of the cards.

On the other hand, holographic recording is a new technique for recording the wavefront of light from an object, and a hologram produced by this technique can reproduce a stereoscopic image and also enables multiple recording. Further, as one method of recording a hologram, interference fringes corresponding to the wavefront of light from an object can be recorded on the surface of the material in a concavo-convex pattern, and this hologram can be easily mass-produced.

Such holograms, such as credit cards,
If it is provided on cards such as bank cards, it is expected that it will be possible to obtain cards that are beautiful and novel and that are difficult to forge and alter the cards themselves.

Conventionally, in order to provide a hologram on the surface of cards, a method of attaching a duplicated hologram to the surface of cards has been used. However, according to this method, there is a problem in that it takes a lot of time and effort when sticking and is not suitable for mass production. Therefore, it has been required to efficiently provide the hologram on the surface of cards or the like.

By the way, although a magnetic recording layer is extremely widely used as a recording layer in cards, this magnetic recording layer is generally provided on a card substrate by a thermal transfer method.
Therefore, if the hologram can be provided on the surface of the card by the thermal transfer method, there is an advantage that the hologram can be efficiently provided on the surface of the card by existing equipment.

When a hologram is transferred onto a card substrate by a thermal transfer method, the hologram layer is generally formed of a thermoplastic resin, so heat is applied to the hologram layer during transfer, and at this time, it corresponds to the wavefront of light from an object. There was a serious problem in that the uneven pattern, which is the interference fringe, disappears.

[Object of the Invention]

The present invention is intended to solve the problems associated with these conventional techniques, can significantly simplify the manufacturing process, and even if heat treatment is applied in the manufacturing process, the wave front of the light from the object An object of the present invention is to provide a method of manufacturing a card with hologram in which a fine uneven pattern that is a corresponding interference fringe does not disappear.

[Outline of Invention]

In order to achieve the above object, the method for producing a card with a hologram according to the present invention is a thermoformable resin which is solid at room temperature on a substrate film and is non-greasy, and an ultraviolet curable resin. Alternatively, a resin selected from the group consisting of electron beam curable resins is used to form a hologram layer by molding by heating and pressing a hologram original plate having an uneven pattern and curing by irradiation with ultraviolet rays or electron beams. A hologram transfer sheet having a metal thin film layer and an adhesive layer provided in this order and a card substrate are heated and pressed so that the adhesive layer and the card substrate are in contact with each other, and the hologram layer is formed on the card. And a reflective metal thin film layer provided by being transferred.

[Specific Description of the Invention]

 Hereinafter, the present invention will be described based on specific examples shown in the drawings.

As shown in FIG. 1, the cross-sectional view of the card 1 which is the manufacturing object of the present invention is such that the hologram layer 3 and the reflective metal thin film layer 4 are formed on the card base material 2. The layer 4 is provided in contact with the card substrate 2. In addition, an oversheet 5 may be provided on the hologram layer 3 if necessary.

The card substrate 2 and the reflective metal thin film layer 4 are integrated via an adhesive layer 6. In some cases, an anchor layer 7 may be provided between the adhesive layer 6 and the reflective metal thin film layer 4 in order to enhance the adhesiveness between them.

Sheet-shaped materials can be widely used as the card substrate 2, and specifically, polyvinyl chloride, polyethylene terephthalate, polyimide, polystyrene, polyvinyl butyral, polycarbonate, paper, synthetic paper, metal sheet, etc. are used. Can be done. The cart base material 2 may be composed of the above materials alone, or may be composed of a laminate of the above materials in some cases.

The thickness of this card substrate is preferably 0.4 to 0.6 μm.

The hologram layer 3 is made of thermosetting UV-curable or electron beam-curable resin or thermoformable thermosetting resin, and a hologram is formed on the surface of the resin in an uneven pattern.

As will be described later, this hologram layer 3 is formed by a duplication method using a hologram master plate on the surface of which interference fringes corresponding to the wavefront of light from an object are formed in an uneven pattern.

The hologram layer 3 has a thickness of 0.1 to 50 μm, preferably 0.5.
It is preferably ˜5 μm.

The resin for the hologram layer that can be used in the present invention can be thermoformed at the time of molding (reproduction) of the hologram, and after the hologram is formed, that is, at the time of transfer, it is necessary that it has heat resistance enough to withstand the heat at the time of transfer. is there. As such a resin, a so-called ultraviolet curable resin, an electron beam curable resin, a thermosetting resin, a natural curable reactive resin, or the like can be used. In particular, when productivity is taken into consideration, a resin curable with ultraviolet rays or electron beams is suitable.

Specifically, for example, methyl methacrylate, methyl acrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate,
Butyl acrylate, butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, t-butyl acrylate, t-butyl methacrylate, isoamyl acrylate, isoamyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate,
2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, ethylene glycol diacrylate,
Ethylene glycol dimethacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, hexanediol diacrylate, hexanediol dimethacrylate, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, trimethylolpropane diacrylate,
Trimethylolpropane dimethacrylate, pentaerythritol tetraacrylate, pentaerythritol tetramethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate,
Dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, ethylene glycol diglycidyl ether diacrylate, ethylene glycol diglycidyl ether dictacrylate, polyethylene glycol diglycidyl ether diacrylate, polyethylene glycol diglycidyl ether dimethacrylate, propylene glycol diglycidyl ether Diacrylate, propylene glycol diglycidyl ether dimethacrylate, polypropylene glycol diglycidyl ether dimethacrylate, polypropylene glycol diglycidyl ether dimethacrylate,
A monomer having a radically polymerizable unsaturated group such as sorbitol tetraglycidyl ether tetraacrylate and soribitol tetraglycidyl ether tetramethacrylate may be used.

Further, in the present invention, an ultraviolet ray or electron beam curable resin having thermoformability can be used. As such a resin, a resin obtained by introducing a radical unsaturated group into a polymer obtained by polymerizing or copolymerizing the following compounds (1) to (2) described below is used.

Monomers having hydroxyl groups: N-methylol acrylamide, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, 2
-Hydroxybutyl acrylate, 2-hydroxybutyl methacrylate, 2-hydroxy, 3-phenoxypropyl methacrylate, 2-hydroxy, 3-phenoxypropyl acrylate and the like.

Monomers having a carboxyl group: acrylic acid, methacrylic acid, acryloyloxyethyl monosuccinate, etc.

Monomers having epoxy groups: glycidyl methacrylate and the like.

Monomers having an aziridinyl group: 2-aziridinyl ethyl methacrylate, allyl 2-aziridinyl propionate, etc.

Monomers having amino groups: acrylamide, methacrylamide, diacetone acrylamide, dimethylaminoethyl methacrylate, diethylaminoethyl methacrylate and the like.

Monomer having sulfone group: 2-acrylamide-
2-methylpropanesulfonic acid and the like.

Monomers having isocyanate groups: 1,4-toluene diisocyanate and 2-hydroxyethyl acrylate, such as an adduct of 1 mole to 1 mole of diisocyanate and a radically polymerizable monomer having active hydrogen.

Further, in order to control the glass transition point of the above copolymer or the physical properties of the cured film, the above compound and the following monomer copolymerizable with this compound are copolymerized. It can be polymerized. Examples of such copolymerizable monomers include methyl titaacrylate, methyl acrylate, ethyl acrylate, ethyl tacrylate, propyl acrylate, propyl methacrylate, butyl acrylate, butyl methacrylate, isobutyl acrylate, isobutyl methacrylate, t-
Examples thereof include butyl acrylate, t-butyl methacrylate, isoamyl acrylate, isoamyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate and the like.

Next, the polymer obtained as described above is reacted by the following methods (a) to (d) to introduce a radically polymerizable unsaturated group, whereby an ultraviolet or electron beam curable resin is obtained. .

(A) In the case of a polymer or copolymer of a monomer having a hydroxyl group, a monomer having a carboxyl group such as acrylic acid or methacrylic acid is subjected to a condensation reaction.

(B) In the case of a polymer or copolymer of a monomer having a carboxyl group or a sulfone group, the above-mentioned monomer having a hydroxyl group is subjected to a condensation reaction.

(C) In the case of a polymer or copolymer of a monomer having an epoxy group, an isocyanate group or an aziridinyl group, the above-mentioned monomer having a hydroxyl group or a monomer having a carboxyl group is subjected to an addition reaction.

(D) In the case of a polymer or copolymer of a monomer having a hydroxyl group or a carboxyl group, a monomer having an epoxy group, a monomer having an aziridinyl group or a diisocyanate compound and a hydroxyl group-containing acrylic acid ester unit amount The addition reaction of 1: 1 mol of the body may be carried out.

Further, the above-mentioned monomer and the thermoformable ultraviolet ray or electron beam curable resin may be mixed and used.

Further, the above can be sufficiently cured by electron beam, but when cured by irradiation with ultraviolet rays, benzoquinone, benzoin, benzoin methyl ether as a sensitizer,
It is also possible to use benzoin ethers such as, halogenated acetophenones, and peeryls that generate radicals by irradiation with ultraviolet rays.

The reflective metal thin film layer 4 is for providing reflectivity to the hologram layer 3, and includes Cr, Ti, Fe, Co, Ni, Cu, Ag,
Au, Ge, Al, Mg, Sb, Pb, Pd, Cd, Bi, Sn, Se, In, G
It is formed using a metal such as a or Rb and an oxide or nitride thereof, or a combination of two or more thereof. Among these metals, Al, Cr, Ni, Ag, Au and the like are particularly preferable.

The film layer of the reflective metal thin film layer 4 preferably has a thickness of 10 to 10,000Å, preferably 200 to 2000Å.

This reflective metal thin film layer 4 may not necessarily be present, but it is more preferable to be present.

The oversheet 5 serves to protect the hologram layer 3 and increase the mechanical strength of the entire card, and is preferably made of a highly transparent material in order to keep the hologram layer 3 visible from the outside. . The oversheet 5 includes polyvinyl chloride, polyester, acrylic resin, epoxy resin, amide resin,
A urethane resin or the like can be used. The thickness of the oversheet 5 is preferably 0.2 to 200 μm.

The adhesive layer 6 plays a role of adhering the hologram layer 3 and the reflective metal thin film layer 4 onto the card base material. As the adhesive layer, those known as conventional adhesive layers such as acrylic resin, vinyl resin, polyester resin, urethane resin, amide resin, and epoxy resin can be widely used. The thickness of this adhesive layer is preferably 0.1 to 50 μm, and more preferably 0.5 to 10 μm.

The anchor layer 7 plays a role of enhancing the adhesiveness between the reflective metal thin film layer 4 and the adhesive layer 5. As the anchor layer 7, conventionally known ones such as vinyl chloride-vinyl acetate copolymer, acrylic resin, urethane resin, epoxy resin and polyester resin can be widely used. The thickness of this anchor layer is 0.02 to 10 μm, preferably 0.2 to 2
It is preferably μm.

Next, an example of a method of manufacturing a card with hologram according to the present invention will be described.

First, the hologram transfer sheet 8 is prepared prior to manufacturing the card with hologram. First, the hologram transfer sheet 8 is provided with a thermoformable ultraviolet ray or electron beam curable resin 3 or thermoformability on the hologram transfer sheet substrate 9 via a peeling layer 10 and an overprint layer 11 if necessary. The thermosetting resin 3 is provided to form a hologram forming film. Among the above resins, an ultraviolet ray or electron beam curable resin having thermoformability is particularly preferable.

Then, the obtained hologram-forming film and the hologram original plate on which the concavo-convex pattern is formed are heated and pressed while the resin layer of the film is in contact with the hologram original plate, and further irradiated with ultraviolet rays or an electron beam or further heated. In addition, the resin is cured to form an uneven pattern on the surface of the resin.

When heating and pressing the hologram original plate and the hologram forming film, a heating and pressing means such as a heating roll can be used, in which case the temperature of the heating roll depends on the type of the resin to be used, the material of the base film, the thickness, etc. Although it varies greatly, it is generally suitable that the temperature is 100 to 200 ° C. Further, the hologram original plate and the hologram forming film are 0.1 kg / cm ² or more, preferably 1 kg / cm ²
It is preferable to press-contact under the above pressure.

At this time, ultraviolet rays or electron beams are applied. The irradiation intensity may be such that the film on the hologram original plate on which the irregularities of the hologram are formed may be peeled from the plate and then irradiated again, and the resin is preferably sufficiently cured. Irradiation with ultraviolet rays and electron beams needs to be appropriately determined according to the resin used.

When a hologram is formed using a thermoformable ultraviolet ray or electron beam curable resin, the unevenness of the hologram is formed under heat and pressure as in the case of using a conventional general thermoplastic resin, and the state After cooling with, peel off the film,
The hologram may be duplicated, and then the resin can be cured by irradiation with ultraviolet rays or electron beams.

Next, the reflective metal thin film layer 4 is applied. This reflective metal thin film layer can be provided on the hologram layer by a sputtering method, an ion plating method, a vacuum deposition method, or the like.

Next, an anchor layer is provided on the reflective metal thin film layer 4 if necessary, and then an adhesive layer 6 is provided by a coating method or the like to obtain a hologram transfer sheet.

The types of UV curable resins and electron beam curable resins that have been conventionally used are generally in a liquid state, and thus are extremely sticky when applied on a base film, and therefore, a conventional UV or electron beam is not applied on the base film. The hologram forming film formed by applying the cured resin cannot be wound up and stored, and the hologram forming film must be formed by applying the ultraviolet curable resin on the base film immediately before contact with the hologram master plate. Although there is a problem that it does not occur, the hologram forming film according to the present invention has an advantage that it can be wound and stored without stickiness because it is formed of a specific resin.

Next, the hologram transfer sheet 8 and the card base material 2 having the above-described configurations are heated and pressure-contacted so that the adhesive layer 6 of the hologram transfer sheet and the card base material are in contact with each other. 3 and the reflective metal thin film layer 4 are transferred onto the card substrate 2 to obtain the card with hologram according to the present invention.

The hologram transfer sheet 8 and the card substrate 2 are 100 to 200
It is preferable that the heating and pressure welding is performed under the pressure of 5 to 50 kg / cm ² at the temperature of ° C.

Next, an oversheet 5 is provided on the hologram transferred onto the card substrate, if necessary. When the hologram transfer sheet 8 is provided with the overprint layer 10, the overprint layer 10 can function as the oversheet 5.

In addition, in the present specification, in addition to a narrowly defined card such as a credit card or a bank card, “cards” means
It means including bank passbooks.

〔The invention's effect〕

Since the card with hologram according to the present invention is formed by using the hologram transfer sheet provided with the hologram layer and the reflective metal thin film layer formed of the specific resin, the manufacturing process can be remarkably simplified and Even by the heat treatment in the manufacturing process, the fine uneven pattern of the hologram layer does not disappear.

Hereinafter, the present invention will be described with reference to examples, but the present invention is not limited to these examples.

Example The following composition was refluxed for 6 hours to carry out copolymerization.

Methyl methacrylate 284
Parts by weight 2-hydroxyethyl methacrylate 130
Parts by weight ethyl acetate 1100
Parts by weight α, α′-azobisisobutyronitrile
2 parts by weight Next, 0.1 part by weight of paramethoxyphenol was added to the obtained reaction product to stop the reaction, and then 100 parts by weight of 2-
Hydroxyl acrylate and 2,4-toluene diisocyanate were added to a 1 mol to 1 mol adduct, and 5 parts by weight of dibutyltin dilaurate was further added, and the mixture was reacted at 80 ° C. for 5 hours while sending dry air.

After the reaction solution was cooled to room temperature, 15 parts by weight of an ultraviolet sensitizer (Irgacure 184 manufactured by Ciba Geigy) was added and uniformly dissolved to obtain an ultraviolet curable resin composition.

Next, the thickness of the hologram transfer sheet as a base material is 25 μm
Onto the polyethylene terephthalate film, a release layer is coated with an acrylic resin (Acrynal ^# 100, acrylic resin manufactured by Toei Kasei Co., Ltd.) to a thickness of 0.5 μm, and the ultraviolet curable resin composition is further coated thereon to a thickness of 2 μm to form a hologram. A film for use was prepared. This hologram-forming film could be stored in a rolled state without stickiness at room temperature.

Next, the resin surface of the obtained film and the concave and convex surface of the mold on which the hologram is recorded in the concave and convex shape are overlapped 150
At a temperature of 20 ° C. and a pressure of 20 kg / cm ² , a nip roll was used to apply heat and pressure to bring the mold into close contact with the film.

Next, the resin thus applied was cured by irradiating with ultraviolet rays through a 10 cm lower portion of an ultraviolet lamp having an output of 80 W / cm from the film side at a speed of 10 m / min in the state of being in close contact with each other. Then, the film was peeled from the mold. Next, a transfer sheet was prepared and the hologram was transferred onto the card substrate.

By using this method, a card with hologram could be manufactured very efficiently.

[Brief description of drawings]

FIG. 1 is a cross-sectional view of a card with hologram according to the present invention, and FIG. 2 is a cross-sectional view of a hologram transfer sheet used in manufacturing the card according to the present invention. 1 ... Card with hologram, 2 ... Card substrate, 3 ...
... Hologram layer, 4 ... Reflective metal thin film layer, 5 ... Oversheet, 6 ... Adhesive layer.

Claims (1)

[Claims] 1. A thermoformable resin which is solid at room temperature and is non-greasy on a substrate film, using a resin selected from the group consisting of an ultraviolet curable resin and an electron beam curable resin. Forming a hologram layer by heating and pressing a hologram original plate having an uneven pattern and irradiating with an ultraviolet ray or an electron beam to form a hologram layer,
A hologram transfer sheet having a reflective metal thin film layer and an adhesive layer provided in this order, and a card base material are heated and pressed so that the adhesive layer and the card base material are in contact with each other, and the card base material is placed on the card. A method for manufacturing a card with a hologram, which comprises providing a hologram layer and a reflective metal thin film layer by transfer.