JPH07101771B2 - Multi-layer fine flexible circuit board and manufacturing method thereof - Google Patents
Multi-layer fine flexible circuit board and manufacturing method thereofInfo
- Publication number
- JPH07101771B2 JPH07101771B2 JP26113090A JP26113090A JPH07101771B2 JP H07101771 B2 JPH07101771 B2 JP H07101771B2 JP 26113090 A JP26113090 A JP 26113090A JP 26113090 A JP26113090 A JP 26113090A JP H07101771 B2 JPH07101771 B2 JP H07101771B2
- Authority
- JP
- Japan
- Prior art keywords
- base material
- insulating base
- circuit board
- flexible
- circuit wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000000463 material Substances 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 32
- 238000002679 ablation Methods 0.000 claims description 16
- 238000007747 plating Methods 0.000 claims description 8
- 239000010410 layer Substances 0.000 description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000012790 adhesive layer Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000011298 ablation treatment Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【発明の詳細な説明】 「産業上の利用分野」 本発明は、可撓性回路基板に形成する回路配線パターン
の端子部をエキシマレーザ手法の併用によってその可撓
性絶縁ベース材から微細な間隔で突出形成させ得るよう
に構成した多層微細可撓性回路基板及びその製造法に関
する。DETAILED DESCRIPTION OF THE INVENTION “Industrial application field” The present invention relates to a terminal portion of a circuit wiring pattern formed on a flexible circuit board, which is finely spaced from the flexible insulating base material by using an excimer laser method together. And a manufacturing method thereof.
「従来技術とその問題点」 この種の可撓性回路基板に於いて、外部接続の為の回路
配線パターンの端子部をその絶縁ベース材から突出形成
させる所謂プリパンチ構造の製品を製作する従来法とし
ては、可撓性絶縁ベース材の所要部位に透孔又は切除部
分を予め形成し、その透孔又は切除部分を含めてこの可
撓性絶縁ベース材面上に銅箔等の導電箔を被着して形成
される可撓性片面銅張積層板等の基材を用意し、一般に
は上記透孔又は切除部分に除去自在に適当な充填物を設
けた状態でフォトエッチング工程に付して所要の回路配
線パターンを形成し、次いで上記充填物を除去すること
により該透孔又は除去部分の端部から突出した外部接続
用の端子部を構成するという手法を採用するのが通常で
あった。"Prior art and its problems" In this type of flexible circuit board, a conventional method for producing a so-called pre-punch structure product in which a terminal portion of a circuit wiring pattern for external connection is formed to project from its insulating base material For example, a through hole or a cut portion is formed in advance at a required portion of the flexible insulating base material, and a conductive foil such as a copper foil is covered on the surface of the flexible insulating base material including the through hole or the cut portion. A base material such as a flexible single-sided copper-clad laminate formed by attachment is prepared and generally subjected to a photo-etching step with an appropriate filling being provided in the through hole or the cut portion in a removable manner. It was usual to employ a method of forming a required circuit wiring pattern and then removing the filler to form an external connection terminal portion protruding from the end of the through hole or the removed portion. .
しかし、このようなプリパンチ方式によって得られる可
撓性回路基板は、その回路配線パターンが片面のものに
限られ、且つその為にプリパンチ部に形成すべきリード
フィンガー乃至は突出端子部の相互間隔も一定以上には
狭く微細に形成することは不可能であった。However, the flexible circuit board obtained by such a pre-punch method has a circuit wiring pattern limited to one side, and therefore the mutual spacing of the lead fingers or the protruding terminal portions to be formed in the pre-punch portion is also small. It was impossible to form a fine and narrower than a certain size.
「発明の目的及び構成」 本発明は、従来法の如き制約の多いプリパンチ方式によ
る突出端子部の形成手法を採用することなく、可撓性絶
縁ベース材の加工性に有利なエキシマレーザによるアブ
レーション方式を採用することにより回路配線パターン
及びその間隔の微細な多層化の容易な多層微細可撓性回
路基板及びその製造手法を提供するものである。[Object and Structure of the Invention] The present invention is an ablation method using an excimer laser, which is advantageous for the workability of a flexible insulating base material, without adopting a method of forming a protruding terminal portion by a pre-punch method, which has many restrictions as in the conventional method. The present invention provides a multilayer fine flexible circuit board in which the circuit wiring pattern and the space between the wiring patterns can be easily formed in a fine multilayer structure, and a manufacturing method thereof.
その為に本発明では、可撓性絶縁ベース材を介して所要
の回路配線パターンを微細で多層に形成した多層可撓性
回路基板に於いて、上記絶縁ベース材の端部両面から該
回路配線パターンの一部が交互に突出して接続用の端子
部を形成すべく構成したことを特徴とする多層微細可撓
性回路基板を提供する。Therefore, according to the present invention, in a multilayer flexible circuit board in which a required circuit wiring pattern is formed in a fine and multi-layered manner via a flexible insulating base material, the circuit wiring is performed from both end portions of the insulating base material. A multilayer fine flexible circuit board, wherein a part of the pattern is alternately projected to form a terminal portion for connection.
そして、斯かる多層微細可撓性回路基板を製作する手法
としては、可撓性絶縁ベース材の両面に所要の回路配線
パターンを形成し、該回路配線パターンを突出形成すべ
き上記可撓性絶縁ベース材の該当部分をエキシマレーザ
手段でアブレーション除去することによって上記可撓性
絶縁ベース材の端部から上記回路配線パターンの一部を
突出させた端子部を形成する各工程を備える製造方法が
提供される。ここで、前記可撓性絶縁ベース材に対する
アブレーション工程は、該アブレーションで除去する上
記ベース材部分以外の領域に遮光マスクを配置しながら
処理することができ、また、このアブレーション工程
を、該アブレーションで除去する上記ベース材部分に対
するエキシマレーザの投影手法で行うように変更するこ
とも可能であり、更に突出する前記端子部に対してはメ
ッキ工程を付加することも出来る。As a method of manufacturing such a multilayer fine flexible circuit board, a required circuit wiring pattern is formed on both surfaces of a flexible insulating base material, and the flexible insulating base material is to be formed so as to project. Provided is a manufacturing method including a step of forming a terminal portion in which a part of the circuit wiring pattern is projected from an end portion of the flexible insulating base material by ablating and removing the corresponding portion of the base material by an excimer laser means. To be done. Here, the ablation process for the flexible insulating base material can be performed while arranging a light-shielding mask in a region other than the base material portion to be removed by the ablation, and the ablation process can be performed by the ablation process. It is also possible to change the method so that the excimer laser projection method is applied to the base material portion to be removed, and a plating process can be added to the protruding terminal portion.
「実 施 例」 以下、図面に示す実施例を参照しながら本発明を更に詳
述する。第１図は本発明に従って構成された多層微細可
撓性回路基板の概念的な要部拡大平面構成図を示し、ポ
リイミドフィルム等からなる可撓性絶縁ベース材１の両
面には図の如く所要の回路配線パターン２、３が各別に
形成されており、それら各回路配線パターン２、３の先
端部は可撓性絶縁ベース材１の端部1Aから外方に突出し
て端子部2A、3Aを構成している。このような突出端子部
2A、3Aは絶縁ベース材１の端部1Aの両面から各々突出伸
長しているので、その端子部2A、3Aの相互の間隔は従来
に比較して極めて狭く形成することが可能である。これ
は、絶縁ベース材１の一方面の突出端子部2A、2Aの間に
他の面の端子部3A、3Aが交互に位置するように配置でき
る為である。従って、多層微細な可撓性回路基板を構成
することが可能となる。[Examples] Hereinafter, the present invention will be described in more detail with reference to the examples shown in the drawings. FIG. 1 is an enlarged plan view showing the concept of an essential part of a multilayer micro flexible circuit board constructed according to the present invention. Both sides of a flexible insulating base material 1 made of a polyimide film or the like are required as shown in the figure. Circuit wiring patterns 2 and 3 are separately formed, and the tip ends of the circuit wiring patterns 2 and 3 project outward from the end portion 1A of the flexible insulating base material 1 to form the terminal portions 2A and 3A. I am configuring. Such protruding terminal part
Since 2A and 3A respectively project and extend from both sides of the end 1A of the insulating base material 1, it is possible to form the distance between the terminal portions 2A and 3A extremely narrower than in the conventional case. This is because the insulating base material 1 can be arranged so that the protruding terminal portions 2A, 2A on one surface are alternately arranged with the terminal portions 3A, 3A on the other surface. Therefore, it becomes possible to form a multilayer fine flexible circuit board.
上記の如き突出端子部2A、3Aの部位に対しては第２図に
示すように金メッキ又は半田メッキ等の所望のメッキ層
４を被着形成することも可能であり、また、それらの突
出端子部2A、3Aの端部は、第３図の如くランド状の端部
2B、3B等、所要の形状に構成することが容易であって、
それら端部に図の如き透孔を設けることも同様に可能で
ある。It is also possible to deposit a desired plating layer 4 such as gold plating or solder plating on the portions of the protruding terminal portions 2A and 3A as described above, as shown in FIG. The ends of the parts 2A and 3A are land-like ends as shown in FIG.
2B, 3B, etc. can be easily configured into the required shape,
It is also possible to provide through holes at the ends as shown in the drawing.
第４図は斯かる多層微細可撓性回路基板を製作する為の
基本的な工程を示し、先ず、同図（１）のようにこの例
では既述の可撓性絶縁ベース材１の両面に銅箔等の導電
層22を有する所謂両面可撓性銅張積層板に代表される基
材を用意する。この基材に対しては常法のフォトエッチ
ング手法に従ってその各面に所要の回路配線パターン
２、３を同図（２）の如く形成する。この回路配線パタ
ーン２、３は絶縁ベース材１の表裏の面に各別に交互に
形成されるので、その回路配線パターン２、３の相互の
間隔、即ちピッチは上記のように50μｍ等極めて狭く設
定することが可能である。図示の実施例では回路配線パ
ターン２、３の材料として銅箔等の導電層22、33を用い
る例を示すが、絶縁ベース材１と各導電層22、33との間
に接着層のある通常の銅張板等の他、その接着層のない
無接着剤銅張積層板等も同様に用いることができ、又、
回路配線パターン２、３の構成材料は、スクリーン印刷
法を採用する場合には他の適宜な導電性インクを使用す
ることも出来、この方式の場合には、該絶縁ベース材１
の表裏の面に各別に交互的に上記の回路配線パターン
２、３を直接的に形成することが可能である。FIG. 4 shows a basic process for manufacturing such a multilayer fine flexible circuit board. First, as shown in FIG. 1A, both sides of the flexible insulating base material 1 described above are used in this example. A base material represented by a so-called double-sided flexible copper clad laminate having a conductive layer 22 such as a copper foil is prepared. With respect to this base material, required circuit wiring patterns 2 and 3 are formed on each surface of the base material according to a conventional photoetching method as shown in FIG. Since the circuit wiring patterns 2 and 3 are alternately formed on the front and back surfaces of the insulating base material 1, the distance between the circuit wiring patterns 2 and 3, that is, the pitch, is set to be extremely narrow such as 50 μm as described above. It is possible to In the illustrated embodiment, the conductive layers 22 and 33 such as copper foil are used as the material of the circuit wiring patterns 2 and 3. However, there is usually an adhesive layer between the insulating base material 1 and the conductive layers 22 and 33. In addition to the copper clad board, etc., a non-adhesive copper clad laminated board without the adhesive layer can be similarly used.
As a constituent material of the circuit wiring patterns 2 and 3, other suitable conductive ink can be used when the screen printing method is adopted. In this method, the insulating base material 1 is used.
It is possible to directly form the above-mentioned circuit wiring patterns 2 and 3 on the front and back surfaces separately.
上記の如き回路配線パターンニング処理工程を施した段
階では、同図（３）のように突出端子部を形成する為の
エキシマレーザALを用いたアブレーション処理工程に付
す。斯かるアブレーション処理工程の一法としては、突
出端子部を形成する以外の部位、即ち、第１図で説明す
ると、可撓性絶縁ベース材１の領域に対し金属性のマス
ク部材を配置して行うアブレーション処理か、或いは、
上記の如きマスク部材を使用することなく、所定の箇所
にのみエキシマレーザALを照射する投影法に従ったアブ
レーション処理を加えて絶縁ベース材１の他、接着層の
存在する場合にはこれも含めてこれら絶縁ベース材１等
のみを除去することによって、第１図及び第４図（４）
のとおり可撓性絶縁ベース材１の端部1Aから端子部2A、
3Aを突出形成した多層微細可撓性回路基板を製作するこ
とが出来る。なお、このようなアブレーション処理は同
図（３）の如く絶縁ベース材１の一方面と他方面とに分
けて施すのが確実である。At the stage where the circuit wiring patterning process as described above is performed, it is subjected to an ablation process using an excimer laser AL for forming a protruding terminal portion as shown in FIG. As one method of such an ablation process, a metallic mask member is arranged in a portion other than the portion where the protruding terminal portion is formed, that is, in FIG. Ablation process to be performed, or
Without using the mask member as described above, an ablation process according to a projection method of irradiating only a predetermined portion with the excimer laser AL is added to include the insulating base material 1 and, if an adhesive layer exists, this is also included. By removing only these insulating base materials 1 etc., FIG. 1 and FIG. 4 (4)
As described above, from the end portion 1A of the flexible insulating base material 1 to the terminal portion 2A,
It is possible to manufacture a multi-layered micro flexible circuit board with 3A protruding. It is certain that such an ablation process is performed separately on one surface and the other surface of the insulating base material 1 as shown in FIG.
上記の工程により突出端子部2A、3Aを構成した後には、
必要に応じて第２図の如くそれらの端子部2A、3Aにメッ
キ層４を被着させる為のメッキ工程に付し、また、突出
端子部2A、3A以外の回路配線パターン２、３の領域に対
しては上記アブレーション処理工程の前又は後にカバー
レイフィルム或いはインク等の表面保護層を従来と同様
に形成することが出来る。After configuring the protruding terminal portions 2A, 3A by the above steps,
If necessary, as shown in FIG. 2, it is subjected to a plating process for applying the plating layer 4 to the terminal portions 2A and 3A, and the area of the circuit wiring patterns 2 and 3 other than the protruding terminal portions 2A and 3A. On the other hand, a surface protective layer such as a coverlay film or ink can be formed in the same manner as in the conventional method before or after the ablation treatment step.
第５図は上記の多層微細型の可撓性回路基板の各突出端
子部2A、3Aを半田メッキ層４に対する熱溶融法で硬質回
路基板５の対応する回路配線パターン６に接続した一例
を示すものである。FIG. 5 shows an example in which the protruding terminal portions 2A and 3A of the above-mentioned multilayer fine type flexible circuit board are connected to the corresponding circuit wiring pattern 6 of the hard circuit board 5 by the heat melting method for the solder plating layer 4. It is a thing.
「発明の効果」 本発明は以上の構成を備えるので、可撓性絶縁ベース材
を介して回路配線パターンが二層以上に多層に形成され
る場合でも従来法では不可能であった所謂プリパンチ構
造の多層微細な突出端子部をエキシマレーザによるアブ
レーション処理を用いて狭いピッチで任意に形成するこ
とができる。[Advantages of the Invention] Since the present invention has the above-mentioned configuration, a so-called pre-punch structure, which is not possible by the conventional method, even when the circuit wiring pattern is formed in two or more layers through the flexible insulating base material. It is possible to arbitrarily form the multi-layered fine protruding terminal portions of the above with a narrow pitch by using an ablation process using an excimer laser.
可撓性絶縁ベース材の端部から突出する斯かる端子部は
エキシマレーザのアブレーション処理で適宜形成するの
で、この可撓性回路基板を構成する為に使用する可撓性
銅張積層板等の基材としては、絶縁ベース材と導電層と
の間に接着層の介在するもの或いは無接着剤のタイプ等
に制約されることなく各所の基材を製品の特性等に応じ
て選択的に使用することができる。Since such a terminal portion protruding from the end portion of the flexible insulating base material is appropriately formed by an ablation process using an excimer laser, a flexible copper clad laminate or the like used to form this flexible circuit board is formed. As the base material, the base material at various places is selectively used according to the characteristics of the product without being restricted by the type in which the adhesive layer is interposed between the insulating base material and the conductive layer or the type of non-adhesive. can do.
また、突出端子部を形成する為に絶縁ベース材を除去す
る手段は、上記の如くエキシマレーザのアブレーション
処理で行うので、窓状に絶縁ベース材を開口させて、そ
の端部から端子部を多層且つ微細に突出形成させること
も任意にできる。Further, since the means for removing the insulating base material to form the protruding terminal portion is performed by the excimer laser ablation process as described above, the insulating base material is opened like a window and the terminal portion is multilayered from its end. In addition, it is possible to optionally form fine protrusions.
第１図は本発明に従って構成した多層微細可撓性回路基
板の概念的な要部拡大平面構成図、 第２図はその突出端子部の方向からみた概念的な拡大側
面構成図、 第３図は本発明に従って突出端子部の終端部をランド状
に形成した例を示す第１図と同様な要部拡大平面構成
図、 第４図（１）〜（４）は本発明の基本的な製造工程図を
示し、そして、 第５図は本発明による多層微細可撓性回路基板と他の硬
質回路基板との相互接続例を示すための説明図である。 1:可撓性絶縁ベース材 1A:絶縁ベース材の端部 ２、3:回路配線パターン 2A、3A:突出端子部 4:端子部のメッキ層 5:硬質回路基板FIG. 1 is an enlarged plan configuration diagram of a conceptual essential part of a multilayer micro flexible circuit board constructed according to the present invention, FIG. 2 is a conceptual enlarged side configuration diagram viewed from the direction of the protruding terminal portion, and FIG. Shows an example in which the terminal portion of the protruding terminal portion is formed in a land shape in accordance with the present invention, and is an enlarged plan view of an essential part similar to FIG. 1, and FIGS. FIG. 5 is a process diagram, and FIG. 5 is an explanatory diagram for showing an example of interconnection between a multilayer micro flexible circuit board according to the present invention and another rigid circuit board. 1: Flexible insulating base material 1A: Edge of insulating base material 2, 3: Circuit wiring pattern 2A, 3A: Projection terminal part 4: Plated layer of terminal part 5: Hard circuit board
Claims (5)
線パターンを微細且つ多層に形成した多層可撓性回路基
板に於いて、上記絶縁ベース材の端部両面から上記回路
配線パターンの一部が交互に突出して接続用の端子部を
形成すべく構成したことを特徴とする多層微細可撓性回
路基板。1. A multi-layer flexible circuit board in which a required circuit wiring pattern is formed in a fine and multi-layered manner via a flexible insulating base material, and the circuit wiring pattern of the insulating base material is formed on both sides of the end portion of the insulating base material. A multilayer micro flexible circuit board, characterized in that a part thereof is alternately projected to form a terminal portion for connection.
線パターンを形成し、該回路配線パターンを突出形成す
べき上記可撓性絶縁ベース材の該当部分をエキシマレー
ザ手段でアブレーション除去することによって上記可撓
性絶縁ベース材の端部から上記回路配線パターンの一部
を突出させた端子部を形成する各工程を備える多層微細
可撓性回路基板の製造法。2. A desired circuit wiring pattern is formed on both sides of a flexible insulating base material, and the corresponding portion of the flexible insulating base material on which the circuit wiring pattern is to be formed in a protruding manner is ablated by excimer laser means. A method for manufacturing a multilayer fine flexible circuit board, comprising the steps of forming a terminal part in which a part of the circuit wiring pattern is projected from an end part of the flexible insulating base material.
ション工程が、該アブレーションで除去する上記ベース
材部分以外の領域に遮光マスクを配置しながら処理され
る請求項（２）の多層微細可撓性回路基板の製造法。3. The multi-layer microflexibility according to claim 2, wherein the ablation step for the flexible insulating base material is performed while disposing a light-shielding mask in a region other than the base material portion to be removed by the ablation. Circuit board manufacturing method.
ション工程が、該アブレーションで除去する上記ベース
材部分にエキシマレーザの投影手法で行われる請求項
（２）の多層微細可撓性回路基板の製造法。4. The method for producing a multilayer fine flexible circuit board according to claim 2, wherein the ablation step for the flexible insulating base material is performed by an excimer laser projection method on the base material portion to be removed by the ablation. Law.
更に備える請求項（２）〜（４）のいずれかに記載の多
層微細可撓性回路基板の製造法。5. The method of manufacturing a multilayer fine flexible circuit board according to claim 2, further comprising a plating step for the protruding terminal portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26113090A JPH07101771B2 (en) | 1990-09-29 | 1990-09-29 | Multi-layer fine flexible circuit board and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26113090A JPH07101771B2 (en) | 1990-09-29 | 1990-09-29 | Multi-layer fine flexible circuit board and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04139789A JPH04139789A (en) | 1992-05-13 |
| JPH07101771B2 true JPH07101771B2 (en) | 1995-11-01 |
Family
ID=17357514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26113090A Expired - Fee Related JPH07101771B2 (en) | 1990-09-29 | 1990-09-29 | Multi-layer fine flexible circuit board and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07101771B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06102410A (en) * | 1992-09-21 | 1994-04-15 | Matsushita Electric Ind Co Ltd | Pattern formation method |
| CN121220186A (en) * | 2023-06-13 | 2025-12-26 | 日东电工株式会社 | Wiring circuit board |
-
1990
- 1990-09-29 JP JP26113090A patent/JPH07101771B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04139789A (en) | 1992-05-13 |
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