JPH07101783B2 - Cooling power supply mechanism for integrated circuits - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling power supply mechanism for an integrated circuit, and in particular, a liquid refrigerant such as water is circulated in the vicinity of the integrated circuit element which constitutes an electronic device such as an information processing device and is generated in the integrated circuit element. The present invention relates to a cooling structure for propagating heat to a liquid refrigerant to cool it.

[0002]

2. Description of the Related Art Conventionally, in this type of cooling structure, a piston 23 is pressed against an integrated circuit 21 on a wiring board 20 by a spring 24, as shown in FIG. When the piston 23 takes away the heat generated in the integrated circuit 21, the heat is transferred to the hat 25 and the intervening layer 26 through the space filled with the helium gas 29, and is transferred from the intervening layer 26 to the cooling plate 27 and into the refrigerant 28. It is designed to dissipate heat.
The above cooling method is "AConduction-Cool".
ed Module for High-Perfor
ance LSI Devices "(S. Okta
y, H .; C. Kammerer, IBM Journal
l of Research and Developm
ent. Vol. 26 No. 26. 1 Jan. 1982)
Are detailed in.

In the cooling structure shown in FIG. 3, since the piston 23 urged by the spring 24 is brought into contact with the integrated circuit 21 to cool it, the integrated circuit 21 is in a state where a force is constantly applied, and 21 may adversely affect the reliability of the connection portion between the wiring board 21 and the wiring board 20.

Further, in order to follow variations in height and inclination that occur when the integrated circuit 21 is mounted on the wiring board 20, the contact surface of the piston 23 with the integrated circuit 21 is made spherical, and the hat 25 and the piston 23 are contacted with each other. Although a gap is provided between them, this reduces the effective heat transfer area, resulting in a decrease in cooling capacity.

Further, the flow path of the refrigerant 28 in the cooling plate 27 is formed for the purpose of heat transfer by forced convection, and the obtained heat transfer coefficient is about 0.1 to 0.5 w / cm ² ° C.
If the power consumption increases as the degree of integration of the integrated circuit 21 increases, the cooling capacity may become insufficient.

On the other hand, as shown in FIG.
The heat generated in the chip 31 on the upper part of 0 is transmitted to the heat transfer substrate 32, the deformable heat transfer body 33, and the heat transfer plate 34, respectively, and the liquid refrigerant is discharged from the nozzle 35 to the heat transfer plate 34 in the bellows 36. There is also a structure for cooling by jetting. In this case, the liquid refrigerant ejected from the nozzle 35 is discharged from the bellows 36 to the flow path inside the cooling header 37. The cooling method described above is disclosed in JP-A-60-160150.

In the cooling structure shown in FIG. 4, the nozzle 35
Since the chip 31 is cooled by the liquid refrigerant ejected from the nozzles, the heat transfer substrate 32, the deformable heat transfer body 33, and the heat transfer plate 34 are provided between the chip 31 and the liquid refrigerant ejected from the nozzle 35. However, the high heat transfer rate may not be obtained and the cooling capacity may be insufficient.

Further, since the thin bellows 36 is used, corrosion occurs and a hole is formed in the bellows 36, and the nozzle 3
It is conceivable that the liquid refrigerant ejected from No. 5 leaks from the bellows 36. Further, since the cooling structure uses the collision jet of the liquid refrigerant ejected from the nozzle 35, the internal pressure is always applied, which may adversely affect the function of the thin bellows 36.

In order to solve the above-mentioned problems of the cooling structure, the technique disclosed in Japanese Patent Laid-Open No. 1-164053 and the technique disclosed in Japanese Patent Laid-Open No. 2-237200 have been proposed.

In the technique disclosed in Japanese Patent Laid-Open No. 1-164053, cooling is performed from both the I / O (input / output) pin side of the wiring board and the integrated circuit side of the wiring board. Further, in the technique disclosed in Japanese Patent Application Laid-Open No. 2-237200, the inert liquid is directly jet-collised with the integrated circuit for cooling.

When the cooling structure as described above is adopted, for example, when the cooling structure as shown in FIG. 3 is adopted, power is supplied to the integrated circuit 21 from the I / O provided on the lower surface of the wiring board 20.
It is performed through the O pin 22.

[0012]

In the above conventional cooling structure, cooling is performed from both the I / O pin side of the wiring board and the integrated circuit side of the wiring board, or the cooling is performed directly on the integrated circuit. In order to cope with the shortage of the cooling capacity when the power consumption is increased due to the high integration of the integrated circuit, the inert liquid is jet-collised to perform the cooling.

However, no matter which cooling structure is adopted, since power is supplied to the integrated circuit through the I / O pins provided on the lower surface of the wiring board, the power supply capacity per wire is limited. There is a problem that some I / O pins cannot cope with an increase in power consumption due to high integration of integrated circuits, resulting in insufficient power supply capability.

Therefore, an object of the present invention is to solve the above-mentioned problems and to cool an integrated circuit capable of improving both the cooling capacity and the power feeding capacity when the power consumption increases due to the high integration of the integrated circuit. The provision of a power supply mechanism.

[0015]

A cooling and feeding mechanism for an integrated circuit according to the present invention includes a wiring board having input / output terminals on the bottom surface, a board frame member for holding the wiring board, and an upper surface side of the wiring board. A plurality of integrated circuits mounted thereon, a conductive member that is closely fixed to the upper surface of the wiring board and partitions each of the plurality of integrated circuits, and a bottom surface of the upper surface of each of the plurality of integrated circuits and the upper surface of the conductive member. A header member that forms a space, an elastic member that is provided between a side surface of each of the plurality of integrated circuits and a side surface of the conductive member, and that maintains the space in a sealed state, and a bottom surface on an upper surface of the integrated circuit. Is fixed, a plurality of cooling members having a discharge hole for discharging the liquid refrigerant for cooling the integrated circuit to the space, a plurality of nozzles for injecting the liquid refrigerant on the bottom surface of the cooling member, The head Provided in the member, and a flow path for distributing the liquid coolant to the plurality of nozzles, and to supply power to the integrated circuit from each said conductive member.

[0016]

An embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a longitudinal sectional view of one embodiment of the present invention seen from one direction, and FIG. 2 is a longitudinal sectional view of one embodiment of the present invention seen from another direction orthogonal to one direction. In these figures, the wiring board 1 has I / O pins 2 on its lower surface and is held by a board frame 3. Further, on the wiring board 1, a plurality of integrated circuits 4-1 to 4-4 and a conductive member (for example, a copper plate)
Is equipped with a power supply bus 7 consisting of an integrated circuit 4-1.
The power supply bus 7 separates each of the sections 4-4.

The side surfaces of each of the integrated circuits 4-1 to 4-4 and the side surface of the power supply bus 7 are in close contact with each other via an O-ring 8, and the substrate frame 3 is fixed in close contact with the header portion 9a of the cooling container 9. There is.
Therefore, the space surrounded by the substrate frame 3, the upper surfaces of the integrated circuits 4-1 to 4-4, the upper surface of the power supply bus 7, the O-ring 8 and the header portion 9a is maintained in a sealed state.

Solder 6-1 to 6 is provided on each of the integrated circuits 4-1 to 4-4.
The cylindrical cooling parts 5-1 to 5-4 are fixed by -4. A plurality of holes are formed in the side walls around the cooling units 5-1 to 5-4, respectively, and the nozzle 1 is provided on the upper surface of the cooling units 5-1 to 5-4.
0-1 to 10-4 are provided so as to inject the liquid refrigerant to the bottom of each of the cooling units 5-1 to 5-4. These nozzles 10-1
The header parts 9 to 10-4 correspond to the cooling parts 5-1 to 5-4, respectively.
It is attached to a.

Further, a liquid refrigerant inlet 12 into which the liquid refrigerant flows into the header portion 9a, an inlet side header 13 and a counterbore groove 14 for distributing the liquid refrigerant to each of the nozzles 10-1 to 10-4, and a refrigerant discharge. An outlet 15 and an outlet-side header 16 for collecting the liquid refrigerant that has cooled each of the integrated circuits 4-1 to 4-4,
Liquid refrigerant outlet 17 for discharging this liquid refrigerant to the outside
And are provided.

That is, the liquid refrigerant flowing in from the liquid refrigerant inlet 12 is injected from the inlet side header 13 through the counterbore groove 14 from each nozzle 10-1 to 10-4 to the bottom of the cooling unit 5-1 to 5-4. , Out of the holes in the side walls of the cooling sections 5-1 to 5-4 and accumulated in the space around the integrated circuits 4-1 to 4-4.

The liquid refrigerant accumulated in the space around the integrated circuits 4-1 to 4-4 passes through the refrigerant discharge port 15 and exit side header 1
6 is discharged to the outside through the liquid refrigerant outlet 17. The flow of the liquid refrigerant is shown by arrows in the figure.

On the other hand, the power supply bus 7 is tightly fixed on the wiring board 1 and supplies power to each of the integrated circuits 4-1 to 4-4 via a wiring pattern (not shown) on the wiring board 1. . Further, power is supplied to the power supply bus 7 from the outside through a connector (not shown) provided on the board frame 3. The integrated circuits 4-1 to 4-4 are arranged on the wiring board 1.
Are arranged in a matrix, the power supply buses 7 are arranged in a grid.

When the power supply buses 7 are installed in a grid pattern, the elastic body 1 having an insulating property is provided between the power supply buses 7 intersecting each other.
8 is provided, and by this elastic body 18, the lateral power supply bus 7 is provided.
It insulates between a and the vertical power supply bus 7b.

The heat generated in each of the integrated circuits 4-1 to 4-4 passes through the solders 6-1 to 6-4 and is transferred to the cooling units 5-1 to 5-4.
The liquid refrigerant ejected from the nozzles 10-1 to 10-4 collides with the flat plate of each of the cooling units 5-1 to 5-4 and the inner surface of the cylindrical portion, where heat transfer is performed.

Further, the liquid refrigerant which has collided with the cooling parts 5-1 to 5-4 passes through the holes on the side wall of the cooling parts 5-1 to 5-4 and is discharged to the outside of the cooling parts 5-1 to 5-4. To be done. Here also heat transfer takes place. In this case, the space in which the discharged liquid refrigerant is stored outside the cooling units 5-1 to 5-4 is the substrate frame 3 and the integrated circuits 4-1 to 4-4.
-4 Since each is maintained in a sealed state by the power supply bus 7, the O-ring 8, the cooling container 9 and the elastic body 18, high reliability without liquid leakage can be obtained.

Further, with respect to variations in height and inclination that occur when the integrated circuits 4-1 to 4-4 are attached to the wiring board 1,
Since the cooling container 9 is not in direct contact with the integrated circuits 4-1 to 4-4, it is possible to absorb variations in height and inclination of the integrated circuits 4-1 to 4-4. It does not adversely affect the connection.

Further, the heat generated in the power supply bus 7 due to the supply of power to the integrated circuits 4-1 to 4-4 also cools the cooling units 5-1 to 4-1.
5-4 is cooled by the liquid refrigerant flowing out from the hole of the peripheral side wall and accumulated in the space around each of the integrated circuits 4-1 to 4-4.

In this case, an insulating refrigerant [for example, a fluorine-based (fluorocarbon, etc.) insulating refrigerant] must be used as the liquid refrigerant. By using this insulating refrigerant, it is okay for the liquid refrigerant to come into direct contact with the outer peripheral surfaces of the integrated circuits 4-1 to 4-4 and the power supply bus 7.
The heat generated in -1 to 4-4 and the power supply bus 7 can be directly cooled by the liquid refrigerant.

The power supply bus 7 is connected to the integrated circuits 4-1 to 4-1 of the wiring board 1.
By fixing it on the same surface as the mounting surface of 4-4, the power supply bus 7
Since the integrated circuits 4-1 to 4-4 can be easily supplied with power, the I / O pin 2 for power of the wiring board 1 can be used for other signals. Therefore, without changing the number of I / O pins 2 or the mounting density of the wiring board 1, the I / O for signals can be used.
The number of O pins 2 can be increased.

Further, the cross-sectional area of the power supply bus 7 is set to the I / O pin 2
Since it is easy to make the cross-sectional area larger than the cross-section area, it is possible to easily supply a large-capacity power source to each integrated circuit 4-1 to 4-4. Therefore, it is possible to easily deal with an increase in power consumption due to high integration of the integrated circuits 4-1 to 4-4.
It is possible to improve the cooling capacity and power supply capacity for ~ 4-4.

Further, when the power feeding buses 7 are installed in a grid pattern, the horizontal power feeding buses 7a and the vertical power feeding buses 7b are insulated from each other by the elastic body 18, so that the horizontal power feeding buses 7a and The vertical power supply bus 7b makes it possible to supply power sources having different voltage values to the integrated circuits 4-1 to 4-4.

In this way, the substrate frame 3 and the integrated circuits 4-1 to 4 are
-4 The nozzles 10-1 to 10-4 directly connected through the counterbore groove 14 maintain the space surrounded by the upper surface of each of them, the upper surface of the power supply bus 7 and the header portion 9a in a sealed state, and the integrated circuit 4
-1 to 4-4 sprays a liquid refrigerant on the bottom surface of each of the cooling parts 5-1 to 5-4 mounted on the power supply buses 7, 7a, 7
By supplying power from b to each of the integrated circuits 4-1 to 4-4, both the cooling capacity and the power supply capacity are improved when the power consumption increases due to the high integration of the integrated circuits 4-1 to 4-4. be able to.

In the embodiment of the present invention, the cooling unit 5
Although -1 to 5-4 have a cylindrical shape, they may have a hollow rectangular parallelepiped shape and are not limited thereto.

[0035]

As described above, according to the present invention, the space formed by the upper surface of each of the plurality of integrated circuits and the upper surface of the conductive member partitioning between the plurality of integrated circuits, the header member and the elastic member is provided. A plurality of nozzles, each of which has a liquid coolant distributed through a flow path, is provided on the bottom surface of each of a plurality of cooling members which maintain a sealed state and have discharge holes for discharging a liquid coolant for cooling an integrated circuit in the space. By supplying the electric power to each integrated circuit from the conductive member, it is possible to improve both the cooling capacity and the power supply capacity when the power consumption increases due to the high integration of the integrated circuit.

[Brief description of drawings]

FIG. 1 is a longitudinal sectional view of an embodiment of the present invention viewed from one direction.

FIG. 2 is a vertical cross-sectional view of an embodiment of the present invention viewed from another direction orthogonal to one direction.

FIG. 3 is a vertical sectional view showing a conventional example.

FIG. 4 is a vertical sectional view showing a conventional example.

[Explanation of symbols]

 1 Wiring board 2 I / O pin 3 Board frame 4-1 to 4-4 Integrated circuit 5-1 to 5-4 Cooling unit 7, 7a, 7b Power supply bus 8 O ring 9 Cooling container 10-1 to 10-4 Nozzle 14 Counterbore 18 Elastic body with insulation

Claims (2)

[Claims] 1. A wiring board having input / output terminals on a bottom surface side, a board frame member for holding the wiring board, a plurality of integrated circuits mounted on an upper surface side of the wiring board, and an upper surface of the wiring board. A conductive member that is closely fixed and partitions between each of the plurality of integrated circuits, a header member that forms a space having an upper surface of each of the plurality of integrated circuits and an upper surface of the conductive member as a bottom surface, and the plurality of integrated circuits An elastic member provided between each side surface and a side surface of the conductive member, for maintaining the space in a sealed state, and a bottom surface fixed to an upper surface of the integrated circuit, a liquid coolant for cooling the integrated circuit. A plurality of cooling members having discharge holes on the peripheral wall surface for discharging into the space, a plurality of nozzles for injecting the liquid refrigerant onto the bottom surface of the cooling member, and a liquid provided to the plurality of nozzles provided in the header member. Refrigerant min A cooling power feeding mechanism for an integrated circuit, comprising: a flow path to be provided, and power is supplied from the conductive member to each of the integrated circuits. 2. The cooling power supply mechanism for an integrated circuit according to claim 1, further comprising an insulating elastic member that insulates between the conductive members that intersect with each other.