JPH07104138B2 - Pattern width measurement method for printed wiring boards - Google Patents
Pattern width measurement method for printed wiring boardsInfo
- Publication number
- JPH07104138B2 JPH07104138B2 JP3008138A JP813891A JPH07104138B2 JP H07104138 B2 JPH07104138 B2 JP H07104138B2 JP 3008138 A JP3008138 A JP 3008138A JP 813891 A JP813891 A JP 813891A JP H07104138 B2 JPH07104138 B2 JP H07104138B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- copper foil
- measured
- wiring board
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000691 measurement method Methods 0.000 title 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 32
- 239000011889 copper foil Substances 0.000 claims description 31
- 238000000034 method Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 description 11
- 238000005259 measurement Methods 0.000 description 8
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
- Image Processing (AREA)
- Image Analysis (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント配線板のパタ
ーン幅測定方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for measuring a pattern width of a printed wiring board.
【０００２】[0002]
【従来の技術】従来、プリント配線板上の銅箔パターン
の幅及び銅箔パターン間のショート、断線、太り、細り
等の欠点を測定する方法では、単なる反射光を用いた２
値化画像処理によって行っていた。2. Description of the Related Art Conventionally, in the method of measuring the width of a copper foil pattern on a printed wiring board and the defects such as short-circuit, disconnection, thickening and thinning between the copper foil patterns, simply reflected light is used.
It was performed by digitized image processing.
【０００３】[0003]
【発明が解決しようとする課題】ところが上記の従来例
方法では、銅箔パターンのサイドウォール部の角度が不
定で、しかも銅面が粗化されており、そのため乱反射等
でプリント配線基板の基材と銅箔パターンとの境界線が
不明瞭となって高精度の測定が不可能であった。本発明
は、上述の問題点に鑑みて為されたもので、その目的と
するところは銅箔パターンの基部の幅、銅箔パターン間
の幅、銅箔パターンの頂上部の幅等を高精度に測定する
ことができるプリント配線板のパターン幅測定方法を提
供するにある。However, in the above-mentioned conventional method, the angle of the side wall portion of the copper foil pattern is indefinite and the copper surface is roughened. Therefore, the base material of the printed wiring board is irregularly reflected or the like. Since the boundary between the copper foil pattern and the copper foil was unclear, high-precision measurement was impossible. The present invention has been made in view of the above-mentioned problems, and the purpose thereof is to make the width of the base portion of the copper foil pattern, the width between the copper foil patterns, the width of the top of the copper foil pattern, etc. highly accurate. Another object of the present invention is to provide a method for measuring a pattern width of a printed wiring board, which can measure the above.
【０００４】[0004]
【課題を解決するための手段】本発明は、上述の目的を
達成するために、被測定プリント配線板の銅箔パターン
側表面にレーザ光を照射するとともに、蛍光Ｘ線を放出
させる所定波長の電磁波を照射し、被測定プリント配線
板の基材から放出される蛍光Ｘ線により銅箔パターンと
基材との境界を検知するとともにこの蛍光Ｘ線が放出さ
れる部分におけるレーザ光の反射光による画像部位をキ
ャンセルすることで銅箔パターンの基部の幅を測定し、
レーザ光の反射光により銅箔パターンの頂上部の幅を測
定するものである。In order to achieve the above-mentioned object, the present invention irradiates a laser beam on the surface of the printed wiring board to be measured on the copper foil pattern side and emits a fluorescent X-ray at a predetermined wavelength. The boundary between the copper foil pattern and the base material is detected by the fluorescent X-ray emitted from the base material of the printed wiring board to be measured, which is irradiated with electromagnetic waves, and the fluorescent X-ray is emitted.
The image area caused by the reflected laser light in the
Measuring the width of the base of the copper foil pattern by Yanseru,
The width of the top of the copper foil pattern is measured by the reflected light of the laser light.
【０００５】[0005]
【作用】而して本発明によれば、被測定プリント配線板
の銅箔パターン側表面にレーザ光を照射するとともに、
蛍光Ｘ線を放出させる所定波長の電磁波を照射するた
め、被測定プリント配線板の基材からは蛍光Ｘ線が放出
され、一方レーザ光が被測定面で反射することになる。
ここで両者の波長が異なるため、基材と銅箔パターンの
境界を検知することができ、この蛍光Ｘ線が放出される
部分におけるレーザ光の反射光による画像部位をキャン
セルすることで銅箔パターンの幅が測定できる。Thus, according to the present invention, the surface of the printed wiring board to be measured on the copper foil pattern side is irradiated with laser light, and
Since the electromagnetic wave having a predetermined wavelength for emitting the fluorescent X-ray is irradiated, the fluorescent X-ray is emitted from the base material of the measured printed wiring board, while the laser light is reflected on the measured surface.
Here, since the wavelengths of the two are different, the boundary between the base material and the copper foil pattern can be detected, and this fluorescent X-ray is emitted.
Cancel the image part by the reflected light of the laser light in the part
The width of the copper foil pattern can be measured by making a cell .
【０００６】更にレーザ光の直進性によって傾きを持つ
銅箔パターンのサイドウォール部と、略平坦な面である
頂上面とでは反射光の受光量が異なり、受光量の相違か
ら２値化画像処理等の処理を行えば頂上面の幅の測定が
できる。Further, the amount of received reflected light is different between the sidewall portion of the copper foil pattern having an inclination due to the straightness of the laser light and the top surface, which is a substantially flat surface. Due to the difference in the amount of received light, binary image processing is performed. The width of the top surface can be measured by performing such processing.
【０００７】[0007]
【実施例】以下本発明方法を用いた装置により実施例を
説明する。図２は幅測定装置の全体構成を示しており、
この装置では予め同じパターンを形成したプリント配線
板１のパターン幅測定を繰り返して行うため、基準とな
るプリント配線板１の基準点を測定し、その基準点に基
づいて測定点及び位置ずれ修正のデータをマイクロコン
ピュータからなる信号処理部２の内蔵記憶部に記憶させ
ておき、被測定プリント配線板１をＸ−Ｙテーブル３の
所定位置に置き、Ｘ−Ｙテーブル３を上記記憶データに
基づいて信号処理部２の制御の下で動かすことにより、
被測定プリント配線板１の測定部位を所定の測定点に移
動させることができるようになっている。EXAMPLES Examples will be described below with an apparatus using the method of the present invention. FIG. 2 shows the overall configuration of the width measuring device,
Since this device repeatedly measures the pattern width of the printed wiring board 1 on which the same pattern is formed in advance, the reference point of the printed wiring board 1 serving as a reference is measured, and the measurement point and the positional deviation are corrected based on the reference point. Data is stored in a built-in storage unit of the signal processing unit 2 including a microcomputer, the printed wiring board 1 to be measured is placed at a predetermined position of the XY table 3, and the XY table 3 is stored based on the stored data. By moving it under the control of the signal processing unit 2,
The measurement site of the measured printed wiring board 1 can be moved to a predetermined measurement point.
【０００８】レーザ光発振器４及び蛍光Ｘ線を被測定プ
リント配線板２の被測定部位より放出させるために所定
波長の電磁波を被測定部位に照射する電磁波発振器５と
は上記信号処理部２の制御の下で動作するもので、上記
のように被測定プリント配線板１の被測定部位を測定点
にセットした後、これらレーザ光発振器４及び電磁波発
振器５は駆動される。The laser light oscillator 4 and the electromagnetic wave oscillator 5 for irradiating an electromagnetic wave of a predetermined wavelength to the measured portion in order to emit the fluorescent X-rays from the measured portion of the measured printed wiring board 2 are controlled by the signal processing unit 2. The laser light oscillator 4 and the electromagnetic wave oscillator 5 are driven after the measured portion of the measured printed wiring board 1 is set at the measurement point as described above.
【０００９】レーザ光発振器４から出たレーザ光はハー
フミラー６により反射されレンズ７を介して被測定部位
に照射される。この照射されたレーザ光は被測定部位で
反射してレンズ７、ハーフミラー６を通過した後、ミラ
ー８で反射され、フィルタ９を介してセンサ１０に受光
される。この受光信号はアンプ１１で増幅された後信号
処理部２に取り込まれて画像処理が為される。The laser light emitted from the laser light oscillator 4 is reflected by the half mirror 6 and radiated to the measurement site through the lens 7. The emitted laser light is reflected by the measurement site, passes through the lens 7 and the half mirror 6, is reflected by the mirror 8, and is received by the sensor 10 via the filter 9. The received light signal is amplified by the amplifier 11 and then taken into the signal processing unit 2 for image processing.
【００１０】一方電磁波発振器５から発射された電磁波
はミラー８、ハーフミラー６、レンズ７を透過した後、
被測定部位に照射される。この照射により被測定部位か
らは素材特有の波長を持つ蛍光Ｘ線が放出される。この
放出された蛍光Ｘ線の内プリント配線板１の基材１Ａか
ら放出される波長の蛍光Ｘ線をフィルタ１２により抽出
して検出器１３で検出する。この検出器１３の検出信号
はアンプ１４で増幅された後、信号処理部２に取り込ま
れて画像処理が為される。On the other hand, the electromagnetic wave emitted from the electromagnetic wave oscillator 5 passes through the mirror 8, the half mirror 6 and the lens 7,
The measurement site is irradiated. By this irradiation, fluorescent X-rays having a wavelength peculiar to the material are emitted from the site to be measured. Of the emitted fluorescent X-rays, the fluorescent X-rays of the wavelength emitted from the substrate 1A of the printed wiring board 1 are extracted by the filter 12 and detected by the detector 13. The detection signal of the detector 13 is amplified by the amplifier 14 and then taken into the signal processing unit 2 for image processing.
【００１１】ここで図１に示すように被測定プリント配
線板１の被測定部位では、銅箔パターン１Ｂと、基材１
Ａとの境界部位は基材１Ａの蛍光Ｘ線により検知するこ
とができ、この蛍光Ｘ線ａが放出される部分におけるレ
ーザ光ｂの反射光ｃによる画像部位をキャンセルすれ
ば、銅箔パターン１Ｂの基部の幅の部分の画像が得ら
れ、この画像より基部の幅を測定する。Here, as shown in FIG. 1, in the measured portion of the measured printed wiring board 1, the copper foil pattern 1B and the substrate 1 are measured.
The boundary part with A can be detected by the fluorescent X-ray of the base material 1A, and if the image part by the reflected light c of the laser beam b in the part where this fluorescent X-ray a is emitted is canceled, the copper foil pattern 1B. An image of the width portion of the base is obtained, and the width of the base is measured from this image.
【００１２】また銅箔パターン１Ｂにおけるレーザ光ｂ
の反射光ｃの受光レベルは銅箔パターン１Ｂのサイドウ
ォール部による受光量に比べて平坦な頂上面の方が大き
いため、２値化処理を行った場合には、頂上面の画像を
抽出することができ、結果頂上面の幅が測定できるので
ある。また基材１Ａ部分が検知できるため、隣接する銅
箔パターン１Ｂ間の幅も測定できる。The laser beam b on the copper foil pattern 1B is also used.
The received light level of the reflected light c is larger on the flat top surface compared to the amount of light received by the sidewall portion of the copper foil pattern 1B, so that the image of the top surface is extracted when the binarization processing is performed. As a result, the width of the top surface can be measured. Further, since the base material 1A portion can be detected, the width between the adjacent copper foil patterns 1B can also be measured.
【００１３】尚画像処理された画像はディスプレィ１５
で出力表示される。The image subjected to the image processing is displayed on the display 15.
The output is displayed.
【００１４】[0014]
【発明の効果】本発明は、被測定プリント配線板の銅箔
パターン側表面にレーザ光を照射するとともに、蛍光Ｘ
線を放出させる所定波長の電磁波を照射するため、被測
定プリント配線板の基材からは蛍光Ｘ線が放出され、一
方レーザ光が被測定面で反射することになる。ここで両
者の波長が異なるため、基材と銅箔パターンの境界を検
知することができ、この蛍光Ｘ線が放出される部分にお
けるレーザ光の反射光による画像部位をキャンセルする
ことで銅箔パターンの幅が測定でき、また隣接する銅箔
パターン間の幅も測定できるという効果を奏する。According to the present invention, the surface of the printed wiring board to be measured on the side of the copper foil pattern is irradiated with laser light and the fluorescent X
Since an electromagnetic wave having a predetermined wavelength for emitting a line is irradiated, fluorescent X-rays are emitted from the base material of the measured printed wiring board, while laser light is reflected on the measured surface. Here, since the wavelengths of the two are different, the boundary between the base material and the copper foil pattern can be detected, and this fluorescent X-ray is emitted at the part where it is emitted.
Cancel the image area due to reflected laser light
As a result, the width of the copper foil pattern can be measured, and the width between adjacent copper foil patterns can be measured.
【００１５】更にレーザ光の直進性によって傾きを持つ
銅箔パターンのサイドウォール部と、略平坦な面である
頂上面とでは反射光の受光量が異なり、受光量の相違か
ら２値化画像処理等の処理を行えば頂上面の幅も高い精
度で測定ができるという効果がある。Furthermore, the amount of reflected light received differs between the sidewall portion of the copper foil pattern having an inclination due to the straightness of the laser light and the top surface, which is a substantially flat surface, and due to the difference in the amount of received light, binary image processing is performed. By performing such processing, the width of the top surface can be measured with high accuracy.
【図１】本発明方法の実施例による被測定プリント配線
板の被測定部位の拡大断面図である。FIG. 1 is an enlarged sectional view of a measured portion of a measured printed wiring board according to an embodiment of the method of the present invention.
【図２】本発明方法を用いた装置の構成を示すブロック
図である。FIG. 2 is a block diagram showing a configuration of an apparatus using the method of the present invention.
１ 被測定プリント配線板 １Ａ 基材 １Ｂ 銅箔パターン ａ 蛍光Ｘ線 ｂ レーザ光 ｃ 反射光 1 Printed wiring board to be measured 1A Base material 1B Copper foil pattern a Fluorescent X-ray b Laser light c Reflected light
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 3/00 Ｑ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Internal reference number FI Technical indication H05K 3/00 Q
Claims (1)
面にレーザ光を照射するとともに、蛍光Ｘ線を放出させ
る所定波長の電磁波を照射し、被測定プリント配線板の
基材から放出される蛍光Ｘ線により銅箔パターンと基材
との境界を検知するとともにこの蛍光Ｘ線が放出される
部分におけるレーザ光の反射光による画像部位をキャン
セルすることで銅箔パターンの基部の幅を測定し、レー
ザ光の反射光により銅箔パターンの頂上部の幅を測定す
ることを特徴とするプリント配線板のパターン幅測定方
法。1. A laser beam is applied to the surface of the printed wiring board to be measured on the side of the copper foil pattern, and an electromagnetic wave of a predetermined wavelength for emitting fluorescent X-rays is also applied to the surface of the printed wiring board to be measured. The fluorescent X-rays detect the boundary between the copper foil pattern and the substrate, and the fluorescent X-rays are emitted.
Cancel the image part by the reflected light of the laser light in the part
A method for measuring a pattern width of a printed wiring board, which comprises measuring a width of a base portion of a copper foil pattern by making a cell and measuring a width of a top portion of the copper foil pattern by reflected light of a laser beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3008138A JPH07104138B2 (en) | 1991-01-28 | 1991-01-28 | Pattern width measurement method for printed wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3008138A JPH07104138B2 (en) | 1991-01-28 | 1991-01-28 | Pattern width measurement method for printed wiring boards |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04250308A JPH04250308A (en) | 1992-09-07 |
| JPH07104138B2 true JPH07104138B2 (en) | 1995-11-13 |
Family
ID=11684941
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3008138A Expired - Lifetime JPH07104138B2 (en) | 1991-01-28 | 1991-01-28 | Pattern width measurement method for printed wiring boards |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07104138B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7324665B2 (en) * | 2019-09-13 | 2023-08-10 | シチズンファインデバイス株式会社 | submount |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59125009A (en) * | 1982-12-29 | 1984-07-19 | Fujitsu Ltd | Pattern detecting method |
| JPS6239707A (en) * | 1985-08-15 | 1987-02-20 | Furukawa Electric Co Ltd:The | Method for detecting width of composite metal material |
-
1991
- 1991-01-28 JP JP3008138A patent/JPH07104138B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04250308A (en) | 1992-09-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 19960604 |