JPH07105626B2 - Electronic component automatic mounting device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component automatic mounting apparatus that mounts a chip-type electronic component on a circuit board that constitutes a circuit of an electronic device.

2. Description of the Related Art An electronic component automatic mounting device of the type shown in FIG. 13 that simultaneously performs adhesive application and electronic component mounting moves two mounted circuit boards 2a, 2b in the X and Y directions for positioning. The XY table 5, a parts shelf 1 installed in the vicinity of the XY table 5 and movable in the arrow Z direction, and arranged between the XY table 5 and the parts shelf 1 in the arrow Q direction. A turntable 4 for rotational indexing, a plurality of vertically movable mounting chucks 3 arranged around the turntable 4, and a turntable 4
A mounting portion made up of a positioning jig 42 for the electronic component 19 installed in one of the stations existing on the outer periphery of the device, and an adhesive application for applying an adhesive for fixing the electronic component 19 to the circuit boards 2a, 2b. It is composed of a coating unit including a head 44.

In this conventional electronic component automatic mounting apparatus, the component shelf 1 on which various electronic components 19 are mounted can be moved in the Z-axis direction,
The electronic component 19 selected at the station at position A is attracted by the mounting chuck 3. After that, the turntable 4 rotates in the Q direction and the electronic component 19 is positioned by the positioning claw 14 of the positioning jig 42 at the station at the B position so as not to be displaced or tilted to the center of the adhesive chuck 3. Then D
At the same time as the turntable 4 is rotated to the station at the position (mounting point), the electronic component mounting pattern 9 of the circuit board 2a on the mounting portion side is brought to the position D by the movement of the XY table 5. Then, as shown in FIG. 14, the mounting chuck 3 is pushed downward by the pusher 45, and the electronic component 19 accurately positioned is mounted on the electronic component mounting pattern 9 on the circuit board 2a on the mounting portion side. An adhesive application head is previously attached to the electronic component mounting pattern 9 portion.
It is fixed by the adhesive 12 applied by 44. At the same time, it is placed on the XY table 5 at the P position (application point) on the XY table 5 while maintaining the distance between the attachment point (D position) and the application point (P position) with respect to the circuit board 2a on the attachment section side. An adhesive is applied to the electronic component mounting pattern 9'of the circuit board 2b on the applied portion side. After the adhesive is applied, the circuit board 2b on the application section side is moved to the mounting section side on the XY table 5 by means not shown, and then electronic parts are mounted.

Problems to be Solved by the Invention Such a conventional automatic electronic component mounting apparatus has the following drawbacks.

When an electronic component pattern recognition device is attached instead of the mechanical electronic component positioning jig 42 for positioning the electronic component, the XY table 5 is corrected and moved, and the electronic component sucked and held by the mounting chuck 3 is held. It is necessary to correct the displacement amount of the component 19, and the electronic component mounting pattern 9'of the circuit board 2b on the coating unit side is displaced from the coating point at the coating unit by the movement amount generated at that time.

When the amount of deviation between the mounting point and the electronic part mounting pattern 9 on the mounting part side or the amount of displacement between the application point and the electronic part mounting pattern 9'on the coating part side is large, it becomes difficult to maintain the mounting quality.

Since the positioning of the electronic component is mechanically performed by the positioning claw 14, the electronic component 19 is burdened. Also, because the electronic component shape must be symmetrical,
Asymmetrical electronic parts cannot be installed.

Means for Solving the Problems The technical means for solving the above problems according to the present invention include a pattern recognition camera for positioning an electronic component, and a circuit for applying an adhesive which is arranged in each of the application section and the mounting section. Two pattern position detection cameras that separately detect the deviation of the electronic component mounting patterns of the circuit board and the circuit board on which the electronic component is mounted, a Δθ correction mechanism that corrects the tilt of the electronic component, and an external power in the XY directions. The configuration is such that an adhesive application head with position correction, which is movable by a fixed amount, is mounted.

Action The action of this technical means is as follows.

That is, the pattern recognition camera detects the displacement and inclination of the electronic component sucked and held on the mounting chuck, and the two pattern position detection cameras detect the displacement and the application point of the mounting point and the electronic component mounting pattern on the mounting portion side. The deviation of the electronic component mounting pattern on the coating unit side is detected separately, and the inclination of the electronic component in the mounting unit is corrected by the Δθ correction mechanism, and the displacement of the electronic component sucked and held by the mounting chuck and the mounting point and the mounting unit side. The deviation of the electronic component mounting pattern of is corrected by moving the XY table for correction,
In the coating unit, the displacement corrected by the XY table and the displacement between the coating point and the electronic component mounting pattern on the coating unit side are corrected by the adhesive coating head with position correction, and the electronic component mounting operation and the adhesive coating operation are performed. By performing at the same time, it is possible to correct the deviation and inclination of the electronic component and mount the electronic component accurately, and to position the electronic component by rotating the mounting chuck and correcting movement of the XY table instead of adjusting the outer shape. It is possible to mount even electronic parts whose shape is asymmetrical without damaging them.

Embodiments First, FIGS. 1 and 2 show the basic configuration of an electronic component automatic mounting apparatus according to the present invention. As shown in the figure, a mounting table including a turntable 11, a plurality of mounting chucks 13 and the like is arranged in the mounting portion, an adhesive coating head 24 with position correction is arranged in the coating portion, and the mounting portion and the coating portion are fixed. Pattern position detection cameras 7 and 7'are provided at positions distant from each other.

This electronic component automatic mounting apparatus is installed near an XY table 10 for moving and positioning two mounted circuit boards 18a, 18b in the directions of arrows X and Y, and in the vicinity of the XY table 10. A parts shelf 8 movable in the arrow Z direction (the same direction as the arrow X direction), and a turntable 11 arranged between the XY table 10 and the parts shelf 8 for rotational indexing in the arrow K direction, this turn A plurality of rotatable holders 23 mounted on the outer periphery of the table 11 at equal intervals, and a plurality of electronic components 19 arranged on the outer periphery of the holder 23 so as to be vertically movable at equal intervals.
A mounting head composed of a mounting chuck 13 for sucking and holding
A mounting direction selection drive system 15 arranged in one of a plurality of stations existing on the outer circumference of the turntable 11, and an electronic device arranged in another station on the outer circumference of the turntable 11 and held by suction on the mounting chuck 13. A pattern recognition camera that can move up and down to detect misalignment and tilt of component 19
16 and a Δθ correction mechanism which is arranged at another station on the outer circumference of the turntable 11 and corrects the inclination of the electronic component 19 based on the detection result of the pattern recognition camera 16.
17 and the electronic component 19 arranged in the coating section, the circuit board 18a, 18b
Apply an adhesive to fix it on top and apply X-
It is composed of an adhesive application head 24 with position correction, which is movable by a fixed amount in the Y direction.

Next, the operation will be described.

In FIG. 1, the electronic component 19 on the component shelf 8 is taken out by the mounting chuck 13 at the station at position E, and the mounting direction selection drive system 15 is driven at the station at position F based on the data on the mounting direction of this electronic component 19. Then, the mounting chuck 13 which is sucking the electronic component 19 is rotated to select the mounting direction. While the mounting chuck 13 is in the stations F to G, pattern recognition is performed in the station G. The camera 16 is moved up and down to adjust the focus according to the height (thickness) of the electronic component 19.

FIG. 3 shows the position of the electronic component 19 by the pattern recognition camera 16, and the shift amount C (vector amount) between the center L of the mounting chuck 13 and the center M of the electronic component 19 and the electronic component
Determine the slope Δθ of 19.

FIG. 4 is a front view of the pattern recognition camera 16 arranged at the G position station. The pulse motor 25 rotates, the ball screw 27 is rotated by the timing belt 26, the pattern recognition camera 16 is moved up and down, and the focus is adjusted by the height (thickness) of the electronic component 19.

FIG. 5 is a configuration diagram of the light source 22 of the pattern recognition camera 16. The light emitted in the L direction is attached by the collar 20 to the chuck 13
It goes out in the M direction through the reflection plate 21 attached to the electronic component 19 by the pattern recognition camera 16 with this light as the background.
To be able to shoot.

FIG. 6 is a front view showing the structure of the Δθ correction mechanism 17 arranged at the station at the H position. The rotary plate 30 is rotated by the pulse motor 28 and the timing belt 29 to rotate the mounting chuck 13 that holds the electronic component 19 by suction.
The inclination Δθ of 19 is corrected, and then the electronic component 19 is carried to the I position (mounting point).

FIG. 7 is a block diagram of a mechanism for performing ΔY correction of the position-correcting adhesive application head 24 capable of correcting the deviation between the application point (J position) and the electronic part mounting pattern on the application section side. The application head unit including the adhesive application nozzle 32 and the holder 23 is configured to be rotatable around the fulcrum 35, and the ΔY pulse motor 38 is rotated to move the lever 36 up and down by the curve of the cam 37. The adhesive application nozzle 32 at the tip is moved to perform ΔY correction.

As shown in FIG. 8, a holder 33 is fixed to a shaft 43, three adhesive syringes 31 are attached to the holder 33, and three kinds of adhesive application nozzles 32 are provided. The shaft 43 and the holder 33 are rotated by the adhesive application nozzle selection pulse motor 40 and the timing belt 41,
It is possible to select the adhesive application nozzle 32 to be used. Utilizing this movement, the adhesive application nozzle 32 is moved by ΔX. In this way, ΔY correction and ΔX correction of the position-corrected adhesive application head 24 are performed, and the adhesive application nozzle 32 is moved to the position according to the regular data to apply the adhesive on the circuit board 18b.

As shown in FIG. 9, pattern position detection cameras 7 and 7'are provided at positions distant from the mounting point I of the mounting portion and the coating point J of the coating portion by A (vector amount), respectively. In order to obtain the amount of deviation between the mounting point I and the electronic part mounting pattern 9 on the mounting part side and the amount of deviation between the coating point J and the electronic part mounting pattern 9'on the coating part side, the circuit boards 18a, 18
By moving b from the XY table 10 by A (vector amount), the above electronic component mounting patterns 9, 9 '
Respectively under the pattern position detection cameras 7, 7 '. At this time, the regular mounting point I and application point J
The positions to which A moves by A (vector amount) are considered as R and S, respectively.

FIG. 10 is an image captured by the pattern position detection cameras 7 and 7'at that time. In this way, the deviation amounts between the electronic component mounting patterns 9, 9'measured by the pattern position detection cameras 7, 7'and the R and S positions of the pattern position detection cameras 7, 7'are respectively calculated by B ₁ , B ₂ (vector amount).

Then the X-Y table 10 as Fig. 11 - (A + B ₁₎
By moving by + C (vector amount), the electronic component mounting pattern 9 on the mounting portion side comes directly under the electronic component 19 brought to the mounting point I by the mounting chuck 13.

In this case, the coating unit, the position and the position of the electronic component mounting pattern 9 'of the coating side of the adhesive application nozzle 32 is A + B ₂ -
Since _{(A + B 1) + C} = B 2 -B 1 + C ( vector quantity) deviate only, position correction with an adhesive coating head 24 as shown in FIG. 12 B ₂ -B ₁ + C (vector quantity) by the movement By doing so, the adhesive application nozzle 32 is positioned directly above the electronic component mounting pattern 9'on the application section side.

Then, the mounting operation and the coating operation are simultaneously performed.

EFFECTS OF THE INVENTION The electronic component automatic mounting apparatus of the present invention configured as described above has the following effects, and is considered to be widely used in the industry in the future. is there.

The deviation and inclination of the electronic components sucked and held by the mounting chuck, the deviation amount between the mounting point and the electronic component mounting pattern on the mounting portion side, and the deviation amount between the coating point and the electronic component mounting pattern on the coating portion side are corrected by the Δθ correction mechanism. Since the correction is performed by correcting and rotating the mounting chuck and by correcting and moving the XY table and the adhesive coating head with position correction, the electronic component can be accurately fixed on the electronic component mounting pattern.

The pattern recognition camera is provided with a focus adjustment mechanism, and the multiple mounting nozzles enable mounting of various types and shapes of electronic components with this single device regardless of the height (thickness) of the electronic components.

By positioning the electronic component by the pattern recognition method, it is possible to mount an asymmetrical electronic component without exerting a force on the electronic component.

By the pattern recognition light source unit of the present invention, the mounting chuck can be made small and the microchip type electronic component can be mounted.

Since the electronic component mounting direction selection and the Δθ correction are performed independently in different stations, the Δθ correction accuracy is improved and the mounting stability is improved.

Since it is not necessary to provide two XY tables, the equipment is compact and the cost can be reduced.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of an electronic component automatic mounting apparatus of the present invention, FIG. 2 is a perspective view thereof, and FIG. 3 is a plan view for explaining the position of electronic components photographed by a pattern recognition camera, and FIG. Is a front view showing the configuration of the pattern recognition camera, FIG. 5 is a configuration view of the light source of the camera, FIG. 6 is a front view showing the configuration of the Δθ correction mechanism, and FIG. 7 is a Δ of the adhesive coating head with position correction.
FIG. 8 is a block diagram showing the movement of Y correction, FIG. 8 is a block diagram showing the movement of ΔX of the coating head, FIG. 9 is a layout of a pattern position detection camera, and FIG. 10 is a pattern position detection camera. Plan view, FIG. 11 is a plan view with correction,
FIG. 12 is a perspective view of the same, FIG. 13 is a plan view of a conventional automatic electronic component mounting apparatus, and FIG. 14 is a side view of the same. 7,7 ′ …… Pattern position detection camera, 8 …… Parts shelf, 9,
9 '... Electronic component mounting pattern, 10 ... XY table, 11 ... Turntable, 12 ... Adhesive, 13 ... Mounting chuck, 15 ... Mounting direction selection drive system, 16 ... Pattern recognition Camera, 17 …… Δθ correction mechanism, 18a …… Circuit board, 1
8b ... Circuit board, 19 ... Electronic parts, 20 ... Color, 21 ...
… Reflector, 22 …… Light source, 23 …… Holder, 24 …… Adhesive application head with position correction, 25 …… Pulse motor, 26 …… Timing belt, 27 …… Ball screw, 28 …… Pulse motor, 29… … Timing belt, 30 …… Rotating plate, 31 …… Adhesive syringe, 32 …… Adhesive application nozzle, 33 …… Holder, 34 …… Pusher, 35 …… Support point, 36 …… Lever, 37
...... Cam, 38 …… ΔY pulse motor, 39 …… Upper base, 40 …… Adhesive application nozzle selection pulse motor, 41 ……
Timing belt, 43 ... Shaft.

Front page continued (72) Inventor Takayoshi Kyotani 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor, Mitsuharu Nakamura 1006 Kadoma, Kadoma City, Osaka Prefecture (72) Invention Toru Takahashi, 1006, Kadoma, Kadoma City, Osaka Prefecture, Matsushita Electric Industrial Co., Ltd. (56) Reference JP 57-45993 (JP, A) JP 62-18087 (JP, A) JP 60-28298 (JP, A)

Claims (2)

[Claims] 1. A parts shelf, a coating section, a mounting section, a circuit board on which an adhesive is coated by an adhesive coating head disposed in the coating section, and a mounting chuck of the mounting head disposed in the mounting section. An XY table for holding a circuit board on which electronic components taken out from the component shelf are mounted is provided in the same device, and the adhesive application head is operated by an external power source for XY table.
A position-correcting adhesive application head that is movable by a fixed amount in the Y direction, and is mounted on the mounting chuck by pattern recognition while transferring the electronic component from the component shelf to the circuit board on the mounting unit side. A pattern recognition camera that detects the amount of deviation between the center of the electronic component that is suction-held and the center of this adhesive chuck and the inclination of this electronic component, and the electronic component is transferred from the pattern recognition camera to the circuit board on the mounting side. In the meantime, based on the detection result of the pattern recognition camera, a Δθ correction mechanism that rotates the mounting chuck that holds the electronic component by suction is arranged, and based on the detection result of the pattern recognition camera, the Δθ correction mechanism causes the mounting chuck to rotate. Is rotated to correct the inclination of the electronic component, and the center of the mounting chuck and the center of the electronic component are This is corrected by correcting and moving the XY table, and at the same time, the position-corrected adhesive application head is corrected and moved by the correction movement amount of the XY table to perform adhesive application and electronic component mounting at the same time. Electronic component automatic mounting device configured. 2. A pattern position detection camera is arranged at each of the coating section and the bonding section to detect the amount of deviation between the electronic component mounting pattern of the circuit board on which the adhesive is applied and the electronic component mounting pattern on the circuit board on which the electronic component is mounted. Then, the inclination of the electronic component sucked and held on the mounting chuck is corrected by rotating the mounting chuck by the Δθ correction mechanism, and the center of the adhesive chuck and the center of the electronic component are deviated and the circuit board on the mounting portion side. X of the electronic component mounting pattern of
In order to correct the correction by moving the Y table, and at the same time, to correct the displacement of the position-corrected adhesive application head from the correction movement amount of the XY table and the electronic component mounting pattern of the circuit board on the application unit side. The electronic component automatic mounting apparatus according to claim 1, wherein the electronic component automatic mounting apparatus is configured to correct and move by an amount corresponding to the movement amount of