JPH07107510B2 - Substrate inspection device and substrate inspection method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION << Industrial Application Field >> The present invention relates to a mounting state of a component on a substrate to be inspected by processing received light data obtained by projecting light on a substrate to be inspected on which a component is mounted and receiving light. The present invention relates to a board inspecting apparatus and a board inspecting method.

<< Prior Art >> When an automatic mounting apparatus is used for mounting various chip components such as resistors and semiconductor elements on a printed circuit board, the components may not be mounted according to the mounting data after mounting.

Therefore, when using such an automatic mounting apparatus, the printed circuit board is checked after mounting, and a proper chip component is mounted in a correct position (position, direction) at a proper position on the printed circuit board. It is necessary to inspect whether or not there is any dropout.

However, if such an inspection is performed by visual inspection by hand as in the conventional case, there is a problem that the occurrence of an inspection error cannot be completely eliminated and the inspection speed cannot be increased.

Therefore, in recent years, various manufacturers have proposed various automatic inspection devices for printed circuit boards that can automatically perform this type of inspection.

FIG. 7 is a block diagram showing an example of such an automatic inspection device.

The automatic inspection apparatus shown in this figure serves as a reference board as shown in FIG. 8, that is, data input from the TV camera 3 that images the printed circuit board 2-2 on which the component 1 is mounted and the keyboard 8. Data on the type of the reference printed circuit board 2-1 and the like, data on the arrangement position, mounting posture, shape, color and reflectance of each component 1 mounted on the reference printed circuit board 2-1 and inspection of each of these components 1. A storage unit 4 for storing information (data) regarding processing procedures,
By comparing the information stored in the storage unit 4 with the information shown by the image from the TV camera 3, whether all the components 1 are present on the inspected printed circuit board 2-2,
Further, it is provided with a judging circuit 5 for judging whether or not the components 1 are displaced or the like, and a display 6 for displaying the judgment result of the judging circuit 5.

When this automatic inspection device is used, prior to the inspection of the inspected printed circuit board 2-2, first, the data of the reference printed circuit board 2-1 on which the component 1 is correctly mounted on the base board 7 is input from the keyboard 8 ( Teaching).

In this case, as shown in the flow chart of FIG. 9, in this teaching operation, the card number of the reference printed circuit board 2-1 is input from the keyboard 8 at step ST1.

Next, in step ST2, the position, shape, characteristics (information such as color and reflectance of the component 1) of the component 1 placed on the reference print reference 2-1 are input from the keyboard 8 and the processing procedure (for example, an image of the component is displayed). 2 which is the standard when binarizing
Numerical data regarding the threshold value, the type of extraction parameter, etc.) is input.

Next, in step ST3, it is checked whether or not the numerical data for all the parts 1 have been input. If there is a part for which the numerical data has not been input yet, check this step.
After returning from ST3 to step ST2, the numerical data input regarding the remaining parts is repeatedly executed.

When the data input for all the components 1 is completed, these numerical data are stored in the storage unit 4 in step ST4.

Further, when inspecting the inspected printed circuit board 2-2,
The image of the inspected printed circuit board 2-2 captured by the TV camera 3 is processed by the processing procedure stored in the storage unit 4, and the numerical data obtained thereby and the storage unit 4 are processed.
Is compared with numerical data regarding the position, shape, characteristics, etc. of the component 1 output by the determination circuit 5, and the comparison result is displayed on the display 6.

If a part of the inspected printed circuit board 2-2 imaged by the TV camera 3 is missing, numerical data obtained based on the image output by the TV camera 3 and the storage unit 4 are obtained. The numerical value data output by the device no longer matches, and the determination circuit 5 detects this and displays the missing component on the display 6.

<< Problems to be Solved by the Invention >> However, in such a conventional automatic inspection apparatus, if it is attempted to increase the inspection accuracy by increasing the number of numerical data serving as a determination reference, the keyboard 8 is used during the teaching. There is a problem that the amount of data that must be input increases, and it takes a lot of time and labor to input this.

Further, for numerical data of the processing procedure (for example, a binarization threshold value) obtained by processing the image of the reference printed circuit board 2-1, this numerical data is extracted in advance before teaching. It must be done, and work cannot be done easily and quickly.

In addition, this type of data extraction work is performed on the standard printed circuit board 2-1.
It is not possible to intuitively understand from the numerical distribution obtained by processing the images of the above, and it is not intuitively understood from this numerical distribution. There is a problem that data such as a threshold value cannot be extracted.

In view of the above circumstances, the present invention can reduce the number of numerical data input from the keyboard while improving the inspection accuracy, and also facilitate the binarization threshold data of each component mounted on the reference printed circuit board. It is an object of the present invention to provide a substrate inspection device and a substrate inspection method capable of teaching.

<< Means for Solving the Problems >> In the substrate inspection apparatus according to the present invention, the mounting state of the portion to be inspected is processed by processing received light data that can be received by receiving light from the substrate to be inspected on which components are mounted. In a board inspecting apparatus for inspecting a board, reference data storage means for storing in advance reference data necessary for inspecting a component placed on the inspected substrate for each type of component, and mounted on the inspected substrate Input means for inputting the position and type of the part, reference data corresponding to the type of the part input by the input means, reference data corresponding to the type of the part input by the reference data storage means, the reference data storage Reference data reading means for reading from the means, position data of the part inputted by the input means, and the reference read by the reference data reading means Reference board information creating means for creating reference board information based on the data,
Inspected information means for processing the received light data to create inspected information, and to compare the reference board information created by the reference board information creating means with the inspected information created by the inspected information creating means. Therefore, a determination unit for inspecting the mounting state of the component on the inspected substrate is provided.

Further, the board inspection method of the present invention is a board inspection method for inspecting a mounting state of a component on an inspected board by processing received light data that can be projected and received on the inspected board on which a component is mounted. The reference data necessary for inspecting the parts placed on the board are stored in advance for each kind of parts, and the position and kind of the parts to be mounted on the board to be inspected are input to correspond to each kind of parts. It is characterized in that reference board information is created based on the reference data and the position of the component, and the received light data is processed according to the created reference board information to inspect the mounting state of the component on the inspected board.

<< Embodiment >> FIG. 1 is a block diagram showing an embodiment of an inspection apparatus for a component mounting board according to the present invention.

The component mounting board inspection apparatus shown in this figure can be operated by inputting the position data and the type data of each of the components 19-1 to 19-n mounted on the reference printed circuit board 16-1 by key input. Based on the dictionary unit 35, each component 19-1 to 19-
shape data D3 about n, chip size data D4,
The binarization threshold value D5 is read and a processing table 37 (see FIG. 5) is created. Based on this processing table 37 and the keyed-in processing procedure, the reference printed circuit board 16-1
(Or the printed circuit board 16-2 to be inspected) is configured to be processed to extract parameters, and includes an XY table unit 10, an imaging unit 11, a processing unit 12, and
The determination result output unit 26, the information input unit 27, the table controller 29, and the imaging controller 30 are provided.

The XY table unit 10 includes two pulse motors 13 and 14 controlled by a table controller 29, and a table 15 driven by the pulse motors 13 and 14 in the X-axis direction and the Y-axis direction. And the reference printed circuit board 16-1 or the inspected printed circuit board 16 placed on the table 15.
-2 is fixed to the check mechanism 17, and the reference printed circuit board 16-1 (or the printed circuit board 16-2 to be inspected) placed on the table 15 is the check mechanism 17.
After being fixed by the pulse motors, the pulse motors 13 and 14 determine the positions in the X-axis direction and the Y-axis direction.
Imaged by 11.

In this case, as shown in FIG. 2, the components 19-1 to 19-n are placed on the reference printed circuit board 16-1 on the base substrate 18 in the correct positions and in the correct postures.

The printed circuit board 16-2 to be inspected is a mass-produced board in which components are arranged so as to be the same as the components 19-1 to 19-n on the reference printed circuit board 16-1.

The image pickup unit 11 is arranged above the XY table unit 10, and the focus, magnification, sensitivity, etc. of the TV camera 20 are controlled by a control signal output from the image pickup controller 30.
And a ring lighting device 21 coaxially arranged with respect to the TV camera 20, the brightness and the like of which are controlled by a control signal output from the image pickup controller 30. The image signal (analog signal) obtained by the camera 20 is supplied to the processing unit 12. Although the image pickup unit 11 is configured to obtain an image signal using the TV camera 20, the image signal is not limited to this, and for example, laser light is applied to the printed circuit boards 16-1 and 16-2. To emit the reflected light, or the slit light to the printed circuit boards 16-1, 16-2.
These printed circuit boards 16-1,
The received light data obtained by imaging the slit pattern formed in 16-2 with a camera may be used.

In addition, the information input unit 27 includes the type of the reference printed circuit board 16-1 (for example, board number, etc.) and the reference printed circuit board.
A keyboard for inputting operation information such as data relating to the types, the number of parts, positions, etc. of the parts 19-1 to 19-n mounted on the 16-1 and a processing procedure (for example, a procedure for extracting parameters). And a mouse, and the data and operation information input from here are supplied to the processing unit 12.

The processing unit 12 includes an image input unit 22, an image processing unit 23, and a memory.
24, a determination unit 25 as a determination unit, a control unit 28, and a dictionary unit 35 as a reference data storage unit. In the dictionary unit 35, reference data necessary for inspecting a component mounted on the inspection object is stored in advance for each type of component. The control unit 28 includes a reading unit, a reference board information creating unit, and an inspected information creating unit (none of which are shown), and in the teaching mode, the parts supplied from the information input unit 27 which is the input unit. Shape data D3 of each component 19-1 to 19-n, chip size data D4, and 2 from the component dictionary 36 (see FIG. 6) of the dictionary unit 35 using the type data of 19-1 to 19-n. The reference data, which is the binarized threshold value data D5, is read by the reading means, and the window 31 as shown in FIG. 4 is obtained from the shape data D3 and the chip size data D4.
-1 to 31-n are created, and the position data supplied from the information input unit 27 and the respective parts 19-1 to 19-n are created.
31-1 to 31-n and binary threshold data
After the processing data 37 (see FIG. 5) corresponding to D5 is created by the reference board information creating means, the processing table 37 is created.
And the reference printed circuit board supplied from the image pickup section 11 using the processing procedure supplied from the information input section 27 and the like.
A reference created by processing the image data obtained from the image input unit 22 based on the image signal of 16-1 and extracting the parameters (reference parameters) of the respective parts 19-1 to 19-n by the reference board information creating means. Store board information. On the other hand, the control unit 28, in the inspection mode, processes the image signal of the inspected printed circuit board 16-2 supplied from the imaging unit 11 by using the processing table 37 and the processing procedure, and inspects information. The creation means extracts the inspection parameters of each of the components 19-1 to 19-n and creates the inspected information. The determination unit 25 compares the inspection parameter, which is the inspected information, with the reference parameter, that is, the reference board information, and determines the quality of the mounting state of the component of the inspected printed circuit board 16-2 from the comparison result. This is displayed on the determination result output unit 26.

In this case, the image input unit 22 performs A / D conversion of the image signal supplied from the image pickup unit 11 and performs various correction processes (for example, shading correction), and the reference printed circuit board 16 -1, for creating image data of the inspected printed circuit board 16-2 (data obtained by correcting and quantizing the image signal), and the reference printed circuit board 16-1 and the inspected printed circuit board 16 obtained here. The image data regarding -2 is supplied to the control unit 28 and the like.

As shown in FIG. 3, the dictionary unit 35 is a parts dictionary in which maker data D1, model data D2, part shape data D3, chip size data D4, binarization threshold value data D5, etc. are written for all parts to be inspected. When the data request signal is supplied from the control unit 28 or the like, the data required by the data request signal is read from the component dictionary 36 and is supplied to the control unit 28 or the like. .

Further, the image processing unit 23, based on the processing procedure, the processing table 37, etc. supplied from the control unit 28, the image of the reference printed circuit board 16-1 supplied via the control unit 28 in the teaching mode. Each part from data 19-1
To 19-n (reference parameters), and in the inspection mode, the inspected printed board 16-2 is supplied from the image data of the inspected printed board 16-2 supplied via the control unit 28. Parts on top 19-1 to 19-
n parameters (parameters to be inspected) are extracted, and the respective parameters relating to the reference printed circuit board 16-1 (or the printed circuit board 16-2 to be inspected) obtained here are the control unit 28 and the determination unit 25. Etc.

Further, the memory 24 is controlled by the controller 28 from the reference printed circuit board.
16-1 image data, parameters (reference parameters) of each component 19-1 to 19-n on the reference printed circuit board 16-1, position data, type data, processing procedure, processing table 37, etc. are supplied. At this time, these are stored, and when a transfer request is issued from the control unit 28, the reference parameters and the like are set to the image processing unit 23 and the determination unit 25.
Etc.

The determination unit 25 compares the reference parameter output by the memory 24 in the inspection mode with the inspection parameter obtained by the image processing unit 23 supplied via the control unit 28, and determines the inspection target. Inspection printed circuit board 16-2 parts 19-1 to 19
-If n is missing, and these parts 19-
It is to determine whether or not 1 to 19-n have a posture deviation, and the determination result is supplied to the control unit 28 and the like.

The control unit 28 controls each component 19 input from the information input unit 27.
The component shape data D3, the chip size data D4, and the binarization threshold value data D5 are read out from the dictionary unit 35 based on the type data of -1 to 19-n, and the component shape data D3 and the chip size are read. The windows 31-1 to 31-n are created based on the data D4, and thereafter, the position data of each of the components 19-1 to 19-n input from the information input section 27 and the windows 31-1 to 31-31. -N and the binarization threshold value data D5 are associated with each other to create a processing table 37 (see FIG. 5), the image input unit 22, the image processing unit 23, and the memory 24.
It controls the judgment unit 25 and the dictionary unit 35 to operate them in the taing mode or the inspection mode. The data obtained in these modes, the processing table 37, etc. Is supplied to the image processing unit 23, the determination result output unit 26, and the like.

The determination result output unit 26 is configured by including a CRT (CRT display), a printer, etc., and is supplied with the reference parameters and the inspection parameters from the control unit 28, the reference printed circuit board 16-1, and the inspection printed circuit board. When the image data of 16-2 is supplied or the judgment result is supplied, it is displayed or printed out. Also,
The data input from the information input unit 27, operation information, etc. are confirmed.

Further, the table controller 29 includes the control unit 28 and the X
-Y table unit 10 is configured to include an interface or the like for connection, and the data obtained by the XY table unit 10 is supplied to the control unit 28 or supplied from the control unit 28. The XY table unit 10 is controlled based on the control signal.

The image pickup controller 30 includes the control unit 28 and the image pickup unit.
The image pickup unit 11 is controlled based on a control signal supplied from the control unit 28.

Next, the operation of this embodiment will be described separately for the teaching mode and the inspection mode.

First, in the teaching mode, the flow chart step ST5 shown in FIG. 6 (A) is executed to set each part of the apparatus to the teaching mode and the step ST5.
At 6 from the information input unit 27, the board number of the reference printed circuit board 16-1 and the position data and kind data (manufacturer name and type data of each of the components 19-1 to 19-n mounted on the reference printed circuit board 16-1). , Model name) and processing procedure are input.

When each of these data is input, the control unit 28 first causes the memory 24 to store the processing procedure and the like in step ST7. After that, the control unit 28, in step ST8, from the dictionary unit 35 to the type data of each of the components 19-1 to 19-n, the corresponding component shape data D3, the chip size D4, and the binarization threshold data D4. At the same time as reading, the window 31-is displayed from each of the parts shape data D3 and each of the chip size data D4.
1 to 31-n are created, and thereafter, in step ST9, the windows 31-1 to 31-n, the position data of each of the parts 19-1 to 19-n, and the respective binarized threshold value data D5 are used as the first data. A processing table 37 as shown in FIG. 4 is created and stored in the memory 24. After that, the control unit 28 reads the processing table 37 and the processing procedure from the memory 24 in step ST10 and supplies them to the image processing unit 23.

In this case, each window 31-1 in the processing table 37
As shown in FIG. 4, .about.31-n are made so as to circumscribe each part 19-1 to 19-n or surround the outside by about 1.5 mm.

Next, when the reference printed circuit board 16-1 is placed on the table 15 of the XY table unit 10, the control unit 28 causes the step ST.
The check mechanism 17 and the pulse motors 13 and 14, the ring illumination device 21, and the TV camera 20 are controlled by 11 to cause the TV camera 20 to image the reference printed circuit board 16-1.
By controlling the image input unit 22 to the determination unit 25, the image signal of the reference printed circuit board 16-1 obtained by the TV camera 20 is converted into image data by the image input unit 22, and the step is performed.
In ST12, this conversion result (reference board image data) is transferred to the image processing unit 23, and the parameter extraction routine 40 is executed.

In this parameter extraction routine 40, the image processing unit 23 uses the position data (X1, Y2) to (Xn, Yn) of the processing table 37 and each window 31-1 in step ST12 shown in FIG. 6B.
31-n and each component from the reference board image data
Cut out parts 19-1 to 19-n (part image).

Then, the image processing unit 23, in step ST13,
To 19-n are binarized by the binarized threshold value data D5, and then, in step ST14, a parameter (reference parameter) is extracted from the binarized result, and this is used as a reference parameter file. The data is collectively stored in the memory 24.

Further, in the inspection mode, the control unit 28 executes the flow chart step ST16 shown in FIG. 6 (C) to set each part of the apparatus to the inspection mode, and then in step ST17, the memory is stored.
The processing table 37 stored in 24 and the processing procedure are transferred to the image processing unit 23, and the reference parameter file stored in the memory 24 is transferred to the determination unit 25.

Next, when the inspected printed circuit board 16-2 is placed on the table 15 of the XY table section 10, the control section 28 operates the check mechanism 17 in step ST18 to move the inspected printed circuit board 16-2. Fixed, then each pulse motor 13,1
4 is controlled to determine the position of the printed circuit board 16-2 in the X-axis direction and the position of the Y-axis direction, and the brightness of the ring illuminator 21 and the imaging conditions of the TV camera 20 are adjusted.

Next, the control unit 28 causes the TV camera 20 to take an image of the printed circuit board 16-2 to be inspected at the step ST19, and also operates the image input unit 22 so that the printed circuit board to be inspected obtained by the TV camera 20. Image data (substrate image data to be inspected) is created from the image signal of 16-2 and is transferred to the image processing unit 23, and the parameter extraction routine 40-2
To execute.

In the parameter extraction routine 40-2, the image processing unit 23
Operates in the same manner as in the parameter extraction routine 40. That is, in this case, the image processing unit 23 uses the respective position data (X1, Y1) to (Xn, Yn) of the processing table 37 and the respective windows.
The component images of the components 19-1 to 19-n are cut out from the inspected board image based on 31-1 to 31-n, and the binarized threshold data (1) to (n) of the processing table 37 are cut out. Each of the component images is binarized by the binarization threshold value of each of the components 19-1 to 19-n shown in FIG. After that, the image processing unit 23 processes the binarized result by the processing procedure used at the time of teaching to extract the parameters (parameters to be inspected) of the parts 19-1 to 19-n, and the control unit 28 Supply to.

In step ST20, the control unit 28 puts these inspected parameters together to create an inspected parameter file, and transfers the inspected parameter file to the determination unit 25 so that each of the parts 19-1 to 19-1.
19-n is compared with the reference parameters to determine whether the parts of the printed circuit board 16-2 to be inspected have fallen off, and whether or not these parts have misaligned, and this determination result is obtained in step ST21. It is supplied to the determination result output unit 26 and displayed.

Further, in the above-described embodiment, the image processing unit 23 and the determination unit
Although the image processing and the parameter determination processing are performed by 25, the processing performed by the image processing unit 23 and the determination unit 25 may be performed by the program of the control unit 28.

Further, in the above-described embodiment, one for one component
We have two windows, but even with one part,
For each part having different characteristics, a plurality of windows may be provided for one part and the parameters may be extracted for each window.

Further, in the above-described embodiment, the parts dictionary 37 including the maker data D1, the image data D2, the parts shape data D3, the chip size data D4, and the binarization threshold value data D5 is used. You may make it use the other data, for example, the parts dictionary provided with the reference parameter about all the parts, a process procedure, etc.

By doing this, the information input unit 27 can be used as a reference printed circuit board.
All the data relating to the reference printed circuit board 16-1 can be input only by inputting the position data and the type data of the components 19-1 to 19-n placed on the 16-1.

Further, in the above-described embodiment, the information input unit 27
Although the position data of 19-1 to 19-n are input, each component 19-1 to 19-n is prepared by using the teaching board in which the base substrate is painted white and the components are painted black. You may make it input the position data of.

Further, in the above-described embodiment, the information input unit 27
The type data of 19-1 to 19-n is input, but when the reference printed circuit board 16-1 is created, the CAD
When (Computer Aided Design) or the like is used, the type data of the parts 19-1 to 19-n may be obtained from this CAD or the like.

<< Effects of the Invention >> As described above, according to the present invention, the reference data corresponding to the type of component is input as in the prior art, but the reference data is stored in advance for each type of component. Since the reference data storage means is provided, the manual input work as in the prior art can be canceled at once.

[Brief description of drawings]

FIG. 1 is a block diagram showing an embodiment of a component mounting board inspection apparatus according to the present invention, FIG. 2 is a plan view showing an example of a reference printed circuit board used in this embodiment, and FIG. 3 is a view showing this embodiment. A schematic diagram showing an example of a parts dictionary used, No. 4
FIG. 5 is a schematic diagram showing an example of a parts dictionary used in the present invention, FIG. 5 is a schematic diagram showing an example of a processing table used in this embodiment, and FIG. 6 (A) is a teaching operation example of this embodiment. FIG. 6 (B) is a flow chart for explaining the parameter extraction operation example in the teaching operation in this embodiment, FIG. 6 (C).
FIG. 7 is a flow chart showing an operation example at the time of inspection in this embodiment, FIG. 7 is a block diagram showing an example of a conventional automatic inspection apparatus, and FIG. 8 is an example of a reference printed circuit board which is an inspection reference of this automatic inspection apparatus. The side view shown in FIG. 9 is a flow chart showing an example of the teaching operation of this automatic inspection apparatus. 11 ... Imaging unit, 12 ... Processing unit, 16-1 ... Reference board (reference printed board), 16-2 ... Inspected board (Inspected printed board), 18 ... Element board, 19-1 to 19-1 19-n ... Parts,
25 ... Judgment part, 28 ... Control part, 35 ... Dictionary part.

Claims (2)

[Claims] 1. A board inspecting apparatus for inspecting a mounting state of a portion of the board to be inspected by processing received light data that can be projected and received on a board to be inspected on which a component is mounted. Reference data storage means for storing in advance reference data required for inspection of mounted components for each type of component; input means for inputting the position and type of the component mounted on the board to be inspected; Reference data corresponding to the type of component input by the means, reference data reading means for reading reference data corresponding to the type of component input from the reference data storage means from the reference data storage means, and input by the input means Reference board information for creating reference board information based on the position data of the produced component and the reference data read by the reference data reading means Creating means, inspected information means for processing the received light data to produce inspected information, reference board information created by the reference board information creating means, and inspected information created by the inspected information creating means A board inspecting device, comprising: a determining unit that inspects a mounting state of a component on the board to be inspected by comparing 2. A substrate inspecting method for inspecting a mounting state of a component on a substrate to be inspected by processing received light data that can be projected and received on a substrate to be inspected on which a component is mounted, the substrate being inspected. The reference data necessary for the inspection of the parts are stored in advance for each type of parts, and the reference data and the parts corresponding to each type of parts are input by inputting the position and the type of the parts mounted on the board to be inspected. The board inspection method is characterized in that the reference board information is created based on the position of, and the received light data is processed according to the created reference board information to inspect the mounting state of the component on the board to be inspected.