JPH07107960B2 - Chip electronic component mounting device - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting a chip electronic component (hereinafter, simply referred to as an electronic component) on a printed circuit board, and particularly to correcting the position and orientation of the electronic component. And the improvement for accurate and high-speed angling.

[Conventional technology]

FIG. 5 is a schematic perspective view of the electronic component mounting apparatus 1. The component supply device 2 (tape feeder type in this figure) moves left and right as instructed by the controller 11,
Bring predetermined electronic components to the suction station. Each of the plurality of mounting heads 3 that can be moved up and down, which are mounted at equal intervals on the peripheral portion of the index rotating disk 4 that rotates intermittently in a certain direction, descends sequentially when coming to the suction station, and the component supply device. After vacuum suction of electronic components from 2,
To rise. After that, the mounting head 3 is transferred to the mounting station as the index rotary disc 4 rotates, and when it arrives at the mounting station, the mounting head 3 descends to mount an electronic component at a predetermined position on the printed board 5 on the XY positioning table 6. To do. After that, the mounting head 3 moves up again, and the index rotating disk 4 rotates to reach the suction station again, and the above operation is repeated. Each of the plurality of mounting heads 3 sequentially performs such an operation.

By the way, in the electronic component mounting apparatus as described above,
Since there are variations in the position / orientation of electronic components that are vacuum-adsorbed by the mounting head 3, correct them to the correct position / orientation for mounting on the printed circuit board 5 before reaching the mounting station. (This is called position / orientation correction of electronic parts) is necessary. Furthermore, when it is necessary to mount the electronic component on the printed circuit board 5 at an angle different from the angle at which the electronic component is adsorbed by the mounting head at the adsorption station, the electronic component vacuum-adsorbed by the mounting head 3 reaches the mounting station. Before this, it is necessary to rotate so as to match the required mounting angle on the printed circuit board 5 (this is referred to as angling the electronic component). Two conventional examples will be described below with respect to the position / orientation correction and angulation of such electronic components.

FIG. 6 is a schematic plan view of the electronic component mounting apparatus according to the first conventional example, and the portions corresponding to the portions in FIG. Reference numerals 7a and 7b in FIG. 6 denote position / orientation correction mechanisms for small electronic components and large electronic components, respectively, and four centering claws 16 slidable in orthogonal directions on a rotatable pedestal 18, respectively. With the centering claws 16 open, the mounting head 3 is lowered to place the vacuum-suctioned electronic components between the centering claws 16, and then the centering is performed so that the electronic components are grasped from four sides. nail
By closing 16 and rotating the pedestal 18 in that state,
The position and orientation of the electronic component is corrected and angled, and then the centering claw 16 is opened to raise the mounting head that vacuum-sucks the electronic component.

The operation of the electronic component mounting apparatus shown in FIG. 6 will be described. As the index rotary disk 4 rotates intermittently, the suction station
The mounting head 3 picks up electronic components from the component supply device 2 at S _{1, the} position and orientation correction mechanism 7 a corrects the position and orientation of small electronic components at station S ₃ , and the position and orientation at station S ₄ . correcting mechanism 7b performs position attachment posture correction and angulation of the large electronic components, performs position and orientation and angling of the detection of the electronic component detector 8 are adsorbed mounting head 3 at station S _5, mounted At the station S _{6, the} mounting head 3 mounts the electronic component on the XY positioning table 6 at a predetermined position on the printed circuit board.

The above operation is shown in a time chart of FIG. In FIG. 7, the horizontal axis represents time, and the vertical axis represents rotation of the index rotary disk 4 (2-a), vertical movement of the mounting head 3 (2-b), and position / orientation correction mechanisms 7a, 7 respectively.
The operation timing of opening / closing (2-c) of the centering claw 16 of b and rotation (2-d) of the position / posture correction mechanism is shown for one tact. While the index rotary disc 4 is rotating intermittently (2-a), the station S ₃ and
Position and orientation correcting mechanism 7a of S _4, 7b performs a homing angle (2-d g), while the indexed rotating disk 4 is stopped (2-a b), in the station S ₃ or S ₄ , Lowering the mounting head 3 (2-b c), closing operation of the centering claw 16 of the position / orientation correction mechanism 7a or 7b (2-c e), rotation of the same mechanism (2-d c), opening of the centering claw. The operation (2-c) and the ascending operation of the mounting head 3 (2-b) are continuously performed.

Next, FIG. 8 shows a schematic plan view of an electronic component mounting apparatus according to a second conventional example. The first conventional example is different from the position and orientation correcting mechanism 9a in the station S _3, S _4, 9b is pedestal 18 'is not rotated, the position of the electronic component by performing only the opening and closing operation of the centering pawl 16 Only posture correction,
The angling of the electronic parts is performed by rotating (spinning) the mounting head 3 by the angling degree adjusting mechanism 10 in the station S ₅ . In operation, as the index rotary disc 4 rotates, the mounting head 3 picks up electronic components at the suction station S _{1, and the} position and posture correction mechanism 9a only corrects the position and posture of small electronic components at station S ₃ . Position and posture correction mechanism 9b at station S ₄
Is a station that only corrects the position and orientation of large electronic components.
At S _{5, the} angling mechanism 10 rotates the mounting head 3 to angle the electronic component, and the detection device 8 detects the position and orientation and the angulation, and at the mounting station S _{6, the} mounting head 3 detects the electronic component. Is mounted at a predetermined position on the printed circuit board 5 on the XY positioning table 6.

The above operation is shown in a time chart in FIG. In FIG. 9, the horizontal axis represents time, and the vertical axes respectively rotate the index rotary disk 4 (4-a),
Vertical movement of mounting head 3 (4-b), position / orientation correction mechanism 9
The operation timings of opening and closing (4-c) of the centering claws 16 of a and 9b and rotating (4-d) of the mounting head 3 are shown for one tact. Index rotating disk 4 rotates intermittently (4-
a)) While stopped (4-a), the mounting head 3 descends (4-b) at stations S ₃ and S ₄ .
C), the closing operation of the centering claw 16 of the position / orientation correction mechanism 9a.9b (4-c E), the opening operation of the centering claw (4)
-C), the mounting head 3 is continuously moved up (4-b d). Further, at the station S ₅ , when the index rotary disc 4 is stopped (4-a), the mounting head 3 is rotated (4-d).

Regarding the above-mentioned first conventional example, Japanese Patent Publication No. 62-12
Japanese Patent Laid-Open No. 679 and Japanese Patent Application Laid-Open No. 6-68242
There is a publication of 1-61499.

[Problems to be solved by the invention]

In the first conventional example, it is necessary to continuously elevate and lower the mounting head, open and close the centering claw of the position / orientation correction mechanism, and rotate at one station during one stop period of the index rotary disk. There is a problem in increasing the speed of the device.

On the other hand, in the second conventional example, while the index rotary disc is stopped, the mounting head is moved up and down and the centering pawl of the position / posture correction mechanism is opened / closed at one station.
Since the angling is performed at the subsequent station, the speed of the electronic component mounting apparatus can be increased as compared with the first conventional example. However, up to 18 mounting heads for angling
Since it is rotated by 0 °, the misalignment of the center of rotation of each mounting head causes the position of the electronic component corrected at the previous station to be deviated, and there is a problem that the mounting accuracy of the electronic component on the printed circuit board is deteriorated. In order to prevent this, there arises a difficulty that the working accuracy and the assembly accuracy of the mounting head must be made very high.

An object of the present invention is to provide an electronic component mounting apparatus capable of mounting electronic components with high accuracy and at high speed without being affected by misalignment of each mounting head.

[Means for solving problems]

According to the present invention, a plurality of mounting heads mounted on the peripheral portion of an index rotary disk sucks a chip electronic component from a component supply device at a suction station, and the chip electronic component sucked by the mounting head is moved to a position / orientation correction station. In a chip electronic component mounting apparatus configured to be mounted on a printed circuit board at a mounting station after the position and orientation are corrected by a position and orientation correction mechanism installed in a motor, an electromagnetic clutch for transmitting a motor and rotation of the motor to a mounting head. And a first rotating means for rotating the mounting head that adsorbs the chip electronic component to an angle corresponding to a command mounting angle of the chip electronic component on the printed circuit board before the mounting head comes to the position / orientation correction station. Before the mounting head comes to the position / orientation correction station, the position / orientation correction mechanism is operated by the finger. A second rotation unit that rotates in advance to an angle corresponding to the mounting angle, and the accuracy of rotation of the mounting head by the first rotation unit is higher than the accuracy of rotation of the position / orientation correction mechanism by the second rotation unit. It is characterized by being roughened.

[Action]

According to the present invention, the electronic component and the position / orientation correction mechanism sucked by the mounting head are rotated to the angle corresponding to the command mounting angle before the electronic component comes to the position / orientation correction station. When it comes to, it is only necessary to correct the position and orientation, so high speed operation is possible. Further, since the mounting heads are not rotated after the position / orientation correction, electronic components can be mounted on the printed circuit board with high accuracy without being affected by misalignment between the mounting heads.

〔Example〕

An embodiment of the present invention will be described with reference to FIGS. The basic configuration and operation described above with reference to FIG. 5 are the same in this embodiment. FIG. 1 is a schematic plan view of the electronic component mounting apparatus of this embodiment. Station S _{2 as} shown
Has an angling mechanism 12 for the mounting head 3 and stations S ₃ and S _{4 respectively} for small electronic components having a centering pawl 16 and a rotatable pedestal 18 similar to that shown in FIG. There are a position / orientation correction mechanism 7a and a position / orientation correction mechanism 7b for large electronic components.
b is installed on the base of the electronic component mounting device. At station S ₅ there is a detection device 8.

Next, a series of operations will be described. Adsorption station
Electronic components (not shown) that are vacuum-sucked from the component supply device 2 by the mounting head 3 at S ₁ are angled to the command mounting angle by rotating the mounting head 3 at the station S _{2 by the} angling mechanism 12. It Then, until if electronic parts are small electronic components said mounting head 3 moves to the station S _3, also the station S ₄ if the large chip component
By the time of shifting to, the position and orientation correction mechanism 7a for small electronic components or the position and orientation correction mechanism 7b for large electronic components are rotationally positioned to the above-mentioned command mounting angle in synchronization with the intermittent rotation of the index rotary disk 4. stand by. Then, when it stops at the station S ₃ or S ₄ , the mounting head 3 descends and the position / orientation correction mechanism 7a or 7b only performs the position / orientation correction operation of the electronic component adsorbed to the mounting head 3. After that, the index rotating disc 4 is further intermittently rotated, and the detecting device 8 detects the position and orientation of the electronic component at the station S ₅ , and the mounting head 3 mounts the electronic component on the XY table at the next mounting station S ₆ . It is mounted on the upper printed circuit board 5.
The above various operations are controlled according to the commands of the controller 11.

The above operation is shown in a time chart in FIG. In FIG. 2, the horizontal axis represents time, and the vertical axis represents rotation of the index rotary disc 4 (7-a), rotation of the mounting head 3 (7-b), and vertical movement of the mounting head 3 (7-c). , Opening and closing the centering claw 16 of the position and posture correction mechanism 7a, 7b (7-
d), the operation timing of rotation (7-e) of the mechanism is set to 1
Only the takt amount is shown. While the index rotary disk 4 rotates intermittently (7-a), stations S ₃ and S ₄
The position / orientation correction mechanisms 7a and 7b are rotationally positioned at the command mounting angle in a substantially synchronized manner (7-e). Then, when the index rotary disk 4 is stopped (7-a), the mounting head is rotated to the command mounting angle at station S ₂ (7-b c) and mounted at station S ₃ or S ₄ . Head 3 descends (7-c), position and posture correction mechanism 7a, 7
B centering claw 16 closing operation (7-d), same opening operation (7-d), raising of the mounting head 3 (7-c)
The continuous operation of.

An embodiment of the angling mechanism 12 at the station S ₂ will be described with reference to FIG. The angling mechanism 12 is a servomotor or stepping motor 13
And consists of 14 electromagnetic clutches. The attraction plate 15 of the electromagnetic clutch 14 is fixed to the upper part of all the mounting heads 3, and when the electronic component 22 that needs to be angled comes to the station S ₂ , the attraction plate 15 of the electromagnetic clutch 14 is attracted. By rotating the mounting head 3 with the motor 13, the electronic components are angled to the command mounting angle.

One embodiment of the position / orientation correction mechanism 7a, 7b is shown in FIG.
It will be described with reference to FIG. The position / orientation correction mechanism 7a, 7b has a centering claw 16 capable of reciprocating motion, and has a rotatable pedestal 18 supported by a ball bearing 17, and the pedestal 18 has a servomotor or a stepping motor via a gear 19. It is adapted to be rotated by 20 (it may be rotated by a motor 20 via a belt instead of the gear 19). The mounting head 3 angled to the commanded mounting angle by the angling mechanism 12 at the station S ₂ is the station.
By coming to S ₃ or S _4, the position and orientation correcting mechanism 7a, 7b are centering pawl 16 is opened, and is rotated in the command mounting angle (i.e., the pedestal 18 is rotated to the finger-old installation angle)
Waiting Then, the mounting head that adsorbs the angled electronic component at the station S ₂ descends when it reaches the correction mechanism 7a or 7b at the station S ₃ or S ₄ , and already rotates to the command mounting angle. The centering pawl 16 that is closed closes to grip the electronic component, immediately opens, and the mounting head rises again with the electronic component. This completes the position / orientation correction of the electronic component.

In the present embodiment, the accuracy of the final position and orientation and angling of the electronic components, the station S _3, S ₄ of the correcting mechanism 7a,
Since it depends on the rotational positioning accuracy of 7b, the accuracy of the angling by the angling mechanism 12 at the station S ₂ may be coarser than that of the straightening mechanisms 7a and 7b.

As a mechanism for rotating the mounting head 3 for angling at the station S ₂ , a gear is attached to the mounting head 3 instead of the angling mechanism 12 shown in FIG.
When the mounting head 3 comes to the station S ₂ , an external gear driven by a motor may be pressed against the gear to rotate the mounting head, or the rotor of the flat motor may be fixed to the mounting head 3 and the stator may be rotated. May be fixed to another main body and the mounting head may be rotated by electromagnetic force in the station S ₂ in a non-contact manner.

According to the electronic component mounting apparatus as described above, since the electronic components and the position / orientation correction mechanism 7a, 7b are angled in advance before reaching the position / orientation correction stations S ₃ , S ₄ , the position / orientation correction station S ₃ , In S ₄ , only the raising / lowering of the mounting head and the opening / closing of the centering claw 16 are performed, and the speed of the electronic component mounting apparatus can be increased. Furthermore, after the electronic components are angled to the command angle, the position and orientation correction mechanism fixed to the base corrects the position and orientation, and thereafter, the mounting head sucking the electronic components is not rotated. The accuracy of the mounting can be improved without being affected by the misalignment between the mounting heads.

〔The invention's effect〕

According to the present invention, before reaching the position / orientation correction station, the mounting head sucking the electronic component and the position / orientation correction mechanism are rotated in advance to an angle corresponding to the command mounting angle of the electronic component on the printed circuit board. Therefore, when the position / orientation correction station is reached, only the position / orientation of the electronic component needs to be corrected by the position / orientation correction mechanism, so that mounting of the electronic component can be speeded up. Further, since the mounting head is not rotated after the position and orientation of the electronic component are corrected, the electronic component can be mounted on the printed board with high accuracy without being affected by the misalignment between the mounting heads.

[Brief description of drawings]

FIG. 1 is a schematic plan view of an embodiment of an electronic component mounting apparatus according to the present invention, FIG. 2 is a timing chart of the operation of the same embodiment, and FIG. 3 is FIG. 1 to show an angling mechanism of a mounting head. FIG. 4 is a side sectional view of the position / orientation correction mechanism in FIG. 1, FIG. 5 is an overall perspective view of the electronic component mounting apparatus, and FIGS. 6 and 7 are conventional views, respectively. FIG. 8 is a schematic plan view and an operation timing chart of an electronic component mounting apparatus according to an example, and FIGS. 8 and 9 are a schematic plan view and an operation timing chart of an electronic component mounting apparatus according to another conventional example. 1 ... Electronic component mounting device, 2 ... component supplying device 3 ... mounting head, 4 ... index rotary disk 5 ... printed circuit board, 6 ... XY positioning table 7a, 7b ... position / orientation correction mechanism , 8 ... Detection device 9a, 9b ... Position / orientation correction mechanism, 10 ... Angle setting mechanism 11 ... Controller, 12 ... Angle setting mechanism 13, 20 ... Servo motor or stepping motor 14 ... Electromagnetic clutch, 15 …… Suction plate 16 …… Centering claws, 17 …… Ball bearings 18 …… Rotable pedestal, 19 …… Gear 22 …… Electronic parts.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Mineo Higashi, 390 Muramatsu, Shimizu City, Shizuoka Prefecture, Hitachi Shimizu Plant, Ltd. (72) Keisuke Fujishiro, 390, Muramatsu, Shimizu City, Shizuoka, Hitachi, Ltd., Shimizu Plant, Hitachi, Ltd. (56) References JP-A-63-174393 (JP, A) JP-A-62-114289 (JP, A) JP-A-62-188631 (JP, A)

Claims (1)

[Claims] 1. A chip electronic component is sucked from a component supply device at a suction station by a plurality of mounting heads mounted on the periphery of an index rotary disc, and the position and orientation of the chip electronic component sucked by the mounting head is corrected. After correcting the position and posture with the position and posture correction mechanism installed in the station,
In a chip electronic component mounting device configured to be mounted on a printed circuit board at a mounting station, a mounting head that includes a motor and an electromagnetic clutch that transmits the rotation of the motor to the mounting head, and the mounting head that adsorbs the chip electronic component is at the position First rotation means for rotating the mounting head in advance to an angle corresponding to a command mounting angle of the chip electronic component on the printed circuit board before coming to the posture correcting station, and before the mounting head comes to the position and posture correcting station. Second rotating means for rotating the position / orientation correction mechanism in advance to an angle corresponding to the command mounting angle, and the accuracy of rotation of the mounting head by the first rotating means is determined by the second rotating means. A chip electronic component mounting device characterized in that the correction mechanism is rougher than the rotation accuracy.