JPH07109668B2 - Method for manufacturing duplicate mold for precision molding - Google Patents
Method for manufacturing duplicate mold for precision moldingInfo
- Publication number
- JPH07109668B2 JPH07109668B2 JP61251917A JP25191786A JPH07109668B2 JP H07109668 B2 JPH07109668 B2 JP H07109668B2 JP 61251917 A JP61251917 A JP 61251917A JP 25191786 A JP25191786 A JP 25191786A JP H07109668 B2 JPH07109668 B2 JP H07109668B2
- Authority
- JP
- Japan
- Prior art keywords
- stamper
- mold
- master
- polishing
- precision molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Manufacturing Optical Record Carriers (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は各種の情報信号が記録された情報記録盤の複製
基板を成形するためのスタンパーと呼ばれる精密成形用
複製金型の製造方法に関し、特に該スタンパーをプレス
用もしくは射出成形用の金型に取付ける際の取付け面と
なるスタンパー裏面の平滑化を効率よく行なうことので
きる精密成形用複製金型の製造方法に関するものであ
る。The present invention relates to a method of manufacturing a duplicate mold for precision molding called a stamper for molding a duplicate substrate of an information recording board on which various information signals are recorded, In particular, the present invention relates to a method for producing a precision molding duplicate mold capable of efficiently smoothing the back surface of the stamper, which serves as a mounting surface when the stamper is mounted on a die for press or injection molding.
例えば音声信号がスパイラル状に刻まれたレコード盤あ
るいはレコード盤に比べ情報記録密度が数百倍にも達す
る光ディスクやコンパクトディスク等の基板(一般には
プラスチック基板)をモールド成形するために利用する
スタンパーは、一般に次のようにして製造される。For example, a stamper used to mold a substrate (generally a plastic substrate) such as an optical disc or a compact disc whose information recording density is several hundred times higher than that of a record disc in which audio signals are engraved in a spiral shape or a record disc is Generally, it is manufactured as follows.
まず、情報信号を記録した原盤(通常はガラス製)の表
面を、銀鏡、無電解メッキ、蒸着等により導電化した
後、その上に電鋳によりニッケルをを0.3mm程度の厚さ
に電着する。その後、電着板を原盤から剥離して一般に
マスターと呼ばれる第1の複製金型をつくる。更にマス
ターを重クロム酸カリウム溶液等に浸漬してマスター表
面に剥離容易な被膜を形成した後、再度、電鋳によりマ
スターと同程度の厚さにニッケルを電着する。この電鋳
には、電着応力と析出速度の関係からスルファミン浴が
一般に用いられている。その後、電着板をマスターから
剥離して一般にマザーと呼ばれる第2の金型をつくる。
更に、マスターからマザーをつくるのと同手段を繰り返
して新たな電着板を形成し、一般にスタンパーと呼ばれ
る精密成形用複製金型をつくるのである。第2図に従来
のスタンパー1の一例を示す。First, the surface of the master (usually made of glass) on which information signals are recorded is made conductive by silver mirror, electroless plating, vapor deposition, etc., and then nickel is electrodeposited to a thickness of about 0.3 mm by electroforming. To do. After that, the electrodeposited plate is peeled off from the master to form a first duplicate mold generally called a master. Further, the master is dipped in a potassium dichromate solution or the like to form a coating film on the surface of the master that is easy to peel off, and then nickel is electrodeposited again by electroforming to the same thickness as the master. For this electroforming, a sulfamine bath is generally used because of the relationship between the electrodeposition stress and the deposition rate. After that, the electrodeposited plate is separated from the master to form a second mold generally called a mother.
Further, the same means as making a mother from a master is repeated to form a new electrodeposition plate, and a duplicate mold for precision molding generally called a stamper is made. FIG. 2 shows an example of a conventional stamper 1.
こうして作成したスタンパーをプレス用の金型もしくは
射出成形用の金型に取り付け該金型に成形用組成物、例
えば塩化ビニル、アクリル、ポリカーボネート等の樹脂
を注入あるいは押圧して前記光ディスクやコンパクトデ
ィスク等の複製基板を作成するのである。The stamper thus created is attached to a pressing die or an injection molding die, and a molding composition, for example, a resin such as vinyl chloride, acryl, or polycarbonate, is injected or pressed into the die to press the optical disc or compact disc. To make a duplicate substrate.
ところで、情報機器の発展にともない、最近は基板の高
精度化への要求が強く、上記マザーやスタンパーを作成
する際のゴミの付着や剥離時のキズが基板の欠陥を増大
するのを防止するためにマスターをマスタースタンパー
と称して上記基板の成形に用いることが多くなってい
る。By the way, recently, with the development of information equipment, there is a strong demand for higher precision of the substrate, and it is possible to prevent the defects of the substrate from increasing due to scratches at the time of dust attachment or peeling when creating the mother or stamper. For this reason, a master is often called a master stamper and used for molding the substrate.
このようなスタンパーはその製造方法からも分かる通
り、原盤の情報信号を移し取ったスタンパー裏面の凹凸
が表面にも投影されるのが普通であり、これをこのまま
射出成形あるいは押圧成形用の金型に取付けて基板の成
形を行なったのではスタンパー表面が歪むなどして精度
のよい基板を得ることができないので、スタンパー裏
面、すなわちスタンパーの金型取付け面を1μm程度以
下のオーダーに平滑化することが一般に行なわれてい
る。そして、このようなスタンパーの金型取付け面の平
滑化は、原盤よりマスターを剥離後、平滑なガラス板も
しくは金属板等に接着剤や両面テープ等を用いてスタン
パーを貼り付けた後、研磨皿と研磨剤を用いて研磨する
のが普通である。もちろん、上記ガラス板や金属板等の
平滑板を特に用いず、スタンパーをそのまま研磨するこ
とも行なわれる。As can be seen from the manufacturing method of such a stamper, the irregularities on the back surface of the stamper to which the information signal of the master has been transferred are usually projected on the front surface, and this is used as it is for a mold for injection molding or press molding. Since the surface of the stamper will be distorted and the accurate substrate cannot be obtained if the substrate is molded by mounting it on the surface of the stamper, smooth the back surface of the stamper, that is, the die mounting surface of the stamper to the order of 1 μm or less. Is generally practiced. The smoothing of the die mounting surface of such a stamper is performed by peeling the master from the master and then attaching the stamper to a smooth glass plate or metal plate using an adhesive or double-sided tape, and then polishing plate. It is common to polish with an abrasive. Of course, it is also possible to polish the stamper as it is without using a smooth plate such as the above glass plate or metal plate.
しかしながら、上記スタンパーを構成するニッケル電着
物は、その硬さがビッカース硬度(Hv)で200〜300程度
と比較的低く、しかもニッケルの特長として展性やねば
りが大きいために研磨がしずらかった。すなわち、研磨
時に砥粒が研磨面に食込んだり、あるいは部分的に削れ
るなどして均一な研磨面を得るのが困難であることが多
く、研磨によってスタンパーの金型取付け面の粗さを1
μm程度以下に仕上げるには5〜10時間程度の研磨時間
を必要として生産性が悪いという欠点があった。However, the nickel electrodeposited material constituting the stamper has a relatively low Vickers hardness (Hv) of about 200 to 300, and is difficult to polish because nickel has large malleability and stickiness. That is, it is often difficult to obtain a uniform polished surface because the abrasive grains are eroded into the polished surface during polishing or are partially scraped off. Therefore, the roughness of the die mounting surface of the stamper can be reduced to 1 by polishing.
A polishing time of about 5 to 10 hours is required to finish to a size of about μm or less, and there is a drawback that productivity is poor.
本発明は上記の諸点に鑑み成されたものであって、本発
明の目的とするところは、上記従来例の精密成形用複製
金型の製造方法における問題点を解消し、精密成形用複
製金型の金型取付け面の平滑化を容易に行なうことが可
能で、平面精度のよい金型取付け面を有する精密成形用
複製金型を生産性よく製造することが可能な精密成形用
複製金型の製造方法を提供することにある。The present invention has been made in view of the above points, and an object of the present invention is to solve the problems in the method for producing a precision molding replication mold of the conventional example described above, and to provide a precision molding replication mold. Duplicate mold for precision molding capable of easily smoothing the die mounting surface of the mold, and capable of producing with high productivity a duplicate mold for precision molding having a mold mounting surface with good plane accuracy It is to provide a manufacturing method of.
本発明の上記目的は、以下の本発明によって達成され
る。The above object of the present invention is achieved by the following present invention.
原盤に記録した情報信号を再生する複製基板を成形する
ためのニッケル製の精密成形用複製金型を製造するに際
して、前記精密成形用複製金型の金型取付け面に、Ni-
P、Ni-B、Ni-B-WもしくはNi-Co系の無電解ニッケル合金
メッキもしくは電気ニッケル合金メッキによるメッキ層
を形成し、該メッキ層を研磨して該精密成形用複製金型
の金型取付け面を平滑化する工程を含むことを特徴とす
る精密成形用複製金型の製造方法。When manufacturing a nickel precision molding duplicate mold for molding a duplicate substrate that reproduces the information signal recorded on the master disc, a Ni-
P, Ni-B, Ni-BW or Ni-Co type electroless nickel alloy plating or electroless nickel alloy plating is used to form a plating layer and the plating layer is polished to attach the duplicate mold for precision molding. A method for producing a duplicate mold for precision molding, comprising the step of smoothing a surface.
本発明の方法では、スタンパーの金型取付け面にニッケ
ルよりも硬度が大きく研磨性に優れたニッケル合金のメ
ッキ層を形成し、該メッキ層をスタンパーの金型取付け
面として研磨平滑化を行なう。このため、展性やねばり
が大きく研磨困難であった従来例のスタンパーにおける
が如き金型取付け面の研磨の困難さを生じることなく、
平面精度のよい金型取付け面を有するスタンパーを生産
性よく製造することが可能である。更にはメッキ層を形
成することによりスタンパーの剛性向上をはかることも
可能である。In the method of the present invention, a plating layer of a nickel alloy having a hardness higher than that of nickel and excellent in polishing property is formed on the die mounting surface of the stamper, and the plating layer is used as the die mounting surface of the stamper to perform smoothing and polishing. Therefore, without causing the difficulty of polishing the die mounting surface as in the conventional stamper, which has large malleability and stickiness and is difficult to polish,
It is possible to manufacture a stamper having a die mounting surface with good plane accuracy with high productivity. Further, the rigidity of the stamper can be improved by forming a plating layer.
本発明の基本的な態様においては、まず、前述した公知
のスタンパー形成方法により、例えば第1図に例示の如
き従来のスタンパーに対応したニッケル製の電着板2を
形成する。In the basic aspect of the present invention, first, the electrodeposition plate 2 made of nickel corresponding to the conventional stamper as illustrated in FIG. 1 is formed by the above-described known stamper forming method.
次に、この電着板2の金型取付け面となる側に、無電解
ニッケル合金メッキもしくは電気ニッケル合金メッキに
よりメッキ層3を形成する。メッキ層3を構成するニッ
ケル合金としては、Ni-P、Ni-B、Ni-B-W、Ni-Co系合金
等を挙げることができる。Next, a plating layer 3 is formed by electroless nickel alloy plating or electric nickel alloy plating on the side of the electrodeposition plate 2 which will be the die mounting surface. Examples of the nickel alloy forming the plating layer 3 include Ni-P, Ni-B, Ni-BW, and Ni-Co alloys.
次に、こうして作成したメッキ層3を有するスタンパー
1を、例えば研磨皿とワーク固定台とを有する周知の研
磨機にメッキ層3を研磨皿側に向けるように設置して研
磨を行なう。この際、研磨はスタンパーを平滑板に貼り
付けて行なってもよいし、平滑板を特に取付けずに行な
ってもよい。Next, the stamper 1 having the plating layer 3 thus prepared is placed in a known polishing machine having, for example, a polishing dish and a work fixing base so that the plating layer 3 faces the polishing dish side and polishing is performed. At this time, the polishing may be performed by attaching the stamper to the smooth plate, or may be performed without attaching the smooth plate.
以下に本発明の実施例を示す。 Examples of the present invention will be shown below.
実施例1 情報信号を記録したガラス原盤上にニッケルを500〜100
0Åの厚みに蒸着して導電化した後、その上に電鋳によ
りニッケルを約0.27mmの厚さに電着してマスタースタン
パーを形成した。Example 1 Nickel 500 to 100 on a glass master recording an information signal.
After vapor-depositing to a thickness of 0Å to make it conductive, nickel was electro-deposited thereon to a thickness of about 0.27 mm to form a master stamper.
次に、このマスタースタンパーをガラス原盤にニッケル
が電着した状態で、80〜90℃に加熱した市販のNi-P無電
解メッキ液(奥野製薬社製、商品名;トツプニコロンN-
47)に浸漬し、時々揺動しながら2時間メッキを行な
い、このマスタースタンパーの金型取付け面に厚さ40μ
mのメッキ層を形成した。メッキ後のマスタースタンパ
ーの厚さは0.31mmであった。Next, in a state where nickel was electrodeposited on the glass master plate of this master stamper, a commercially available Ni-P electroless plating solution (manufactured by Okuno Seiyaku Co., Ltd .; trade name; Toppnicol N-
It is immersed in 47) and plated for 2 hours with occasional rocking, and the thickness of 40 μm is attached to the die mounting surface of this master stamper.
m plating layer was formed. The thickness of the master stamper after plating was 0.31 mm.
こうしてメッキ層を形成したマスタースタンパーを、そ
の金型取付け面の研磨ができるようにして研磨機に取付
け、研磨剤を酸化アルミニウムとして研磨圧0.03kg/cm2
で、時々マスタースタンパーの厚さを測定しながら0.30
mm厚になるまで研磨を行なった。The master stamper with the plated layer thus formed was attached to a polishing machine so that the die mounting surface could be polished, and the polishing pressure was 0.03 kg / cm 2 using aluminum oxide as the polishing agent.
And sometimes 0.30 while measuring the thickness of the master stamper
Polishing was performed until the thickness became mm.
こうして研磨を行なったところ、研磨時間0.5〜2.5時間
で、研磨面の粗さが0.02μmの平滑性のよい金型取付け
面を有するスタンパーを得ることができた。As a result of polishing in this way, it was possible to obtain a stamper having a die attachment surface with good smoothness and a roughness of the polished surface of 0.02 μm in a polishing time of 0.5 to 2.5 hours.
実施例2 情報信号を記録したガラス原盤から作成したマザーを重
クロム酸カリウムの0.1〜3%水溶液に1〜3分間浸漬
した後、その上に電鋳によりニッケルを0.29mmの厚さに
電着した。Example 2 A mother prepared from a glass master recording an information signal was immersed in a 0.1-3% aqueous solution of potassium dichromate for 1 to 3 minutes, and then nickel was electro-deposited thereon to a thickness of 0.29 mm by electroforming. did.
次に、上記マザーから電着物を剥離し、該電着物の情報
信号が記録された側に耐熱、耐薬品性のあるメッキ用マ
スキングコート剤(化工機商事社製、商品名;ターコ51
45)を0.3〜0.5mmの厚さに塗布した。Next, the electrodeposit was peeled from the mother, and a heat- and chemical-resistant masking coating agent for plating (made by Kakohki Shoji Co., Ltd., trade name; Turco 51
45) was applied to a thickness of 0.3 to 0.5 mm.
次に、上記マスキングを施した電着物を60〜70℃に加熱
した市販のNi-B-W無電解メッキ液(ワールドメタル社
製、商品名;ニボフラム)に浸漬し、時々揺動しながら
3時間メッキを行なうことにより、金型取付け面にNi-B
-W合金からなる厚さ20μmメッキ層を有するスタンパー
を得た。このスタンパーの厚さは0.31mmであった。Next, the masked electrodeposit was immersed in a commercially available Ni-BW electroless plating solution (manufactured by World Metal Co., trade name; Nivofram) heated to 60 to 70 ° C, and plated for 3 hours with occasional shaking. The Ni-B on the die mounting surface.
A stamper having a 20 μm thick plating layer made of a -W alloy was obtained. The thickness of this stamper was 0.31 mm.
こうして得られたスタンパーの情報記録面側に両面テー
プを使用してガラス板を貼り付けた後、これを実施例1
と同様の研磨機に取付け、研磨剤を酸化アルミニウムと
して研磨圧0.03kg/cm2で、時々マスタースタンパーの厚
さを測定しながら0.30mm厚になるまで研磨を行なった。After a glass plate was attached to the information recording surface side of the stamper thus obtained using a double-sided tape, this was applied to Example 1
It was attached to the same polishing machine as above, and was polished to a thickness of 0.30 mm while measuring the thickness of the master stamper at a polishing pressure of 0.03 kg / cm 2 with aluminum oxide as the polishing agent.
こうして研磨を行なったところ、研磨時間0.5〜2.5時間
で、研磨面の粗さが0.02μmの平滑性のよい金型取付け
面を有するスタンパーを得ることができた。As a result of polishing in this way, it was possible to obtain a stamper having a die attachment surface with good smoothness and a roughness of the polished surface of 0.02 μm in a polishing time of 0.5 to 2.5 hours.
以上に説明したように、本発明によって、金型取付け面
の平滑化が容易で、研磨時間が従来法の1/10〜1/2程度
に短縮された生産性の高い精密成形用複製金型の製造方
法を提供できるようになった。As described above, according to the present invention, the mold mounting surface can be easily smoothed, and the polishing time is shortened to about 1/10 to 1/2 of that of the conventional method, which is a highly productive duplicate mold for precision molding. The manufacturing method of can be provided.
第1図は本発明によるスタンパーの一例の断面模式図、
第2図は従来のスタンパーの一例の断面模式図である。 1……スタンパー、2……電着板 3……メッキ層FIG. 1 is a schematic sectional view of an example of a stamper according to the present invention,
FIG. 2 is a schematic sectional view of an example of a conventional stamper. 1 ... Stamper, 2 ... Electroplated plate 3 ... Plating layer
Claims (1)
板を成形するためのニッケル製の精密成形用複製金型を
製造するに際して、前記精密成形用複製金型の金型取付
け面に、Ni-P、Ni-B、Ni-B-WもしくはNi-Co系の無電解
ニッケル合金メッキもしくは電気ニッケル合金メッキに
よるメッキ層を形成し、該メッキ層を研磨して該精密成
形用複製金型の金型取付け面を平滑化する工程を含むこ
とを特徴とする精密成形用複製金型の製造方法。1. When manufacturing a nickel precision molding duplicate mold for molding a duplicate substrate for reproducing an information signal recorded on a master, Ni is attached to a mold mounting surface of the precision molding duplicate mold. -P, Ni-B, Ni-BW or Ni-Co type electroless nickel alloy plating or electroless nickel alloy plating to form a plating layer, and polishing the plating layer to mold the duplicate mold for precision molding A method of manufacturing a duplicate mold for precision molding, comprising the step of smoothing a mounting surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61251917A JPH07109668B2 (en) | 1986-10-24 | 1986-10-24 | Method for manufacturing duplicate mold for precision molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61251917A JPH07109668B2 (en) | 1986-10-24 | 1986-10-24 | Method for manufacturing duplicate mold for precision molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63105843A JPS63105843A (en) | 1988-05-11 |
| JPH07109668B2 true JPH07109668B2 (en) | 1995-11-22 |
Family
ID=17229884
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61251917A Expired - Lifetime JPH07109668B2 (en) | 1986-10-24 | 1986-10-24 | Method for manufacturing duplicate mold for precision molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07109668B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100450703C (en) * | 2004-08-26 | 2009-01-14 | 台达电子工业股份有限公司 | molding method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58218352A (en) * | 1982-06-14 | 1983-12-19 | Mishima Kosan Co Ltd | Casting mold for continuous casting and its production |
| JPH0630172B2 (en) * | 1984-03-06 | 1994-04-20 | 富士通株式会社 | Method for manufacturing stamper for optical disk |
-
1986
- 1986-10-24 JP JP61251917A patent/JPH07109668B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100450703C (en) * | 2004-08-26 | 2009-01-14 | 台达电子工业股份有限公司 | molding method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63105843A (en) | 1988-05-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |