JPH07111422B2 - Man-machine interface type portable ultrasonic multi-purpose flaw detector - Google Patents

Description

Detailed Description of the Invention

Technical Field: The present invention relates to a man-machine interface type portable ultrasonic hybrid flaw detector that uses an oscilloscope device to measure observed waveforms from a measurement object and perform flaw detection. The oscilloscope device has the function of capturing the observed waveform of the measurement object and displaying it on a cathode ray tube (CRT). This measurement object refers to any object that undergoes electrical, mechanical, chemical, or physical changes, or changes due to a combination of these, and whose changes can be extracted as an electrical signal. This object includes the field of non-destructive testing using ultrasound. An ultrasonic transducer serving as an ultrasonic probe emits ultrasonic waves into the object to be inspected, and the reflected waves from the object are captured via the transducer as an observed waveform and displayed on the CRT.
This observed waveform varies depending on the material and shape of the object being inspected and the item being inspected. For various measurement targets, including nondestructive testing of objects using ultrasound, how to observe the observed waveform is an important issue. Observation methods for observed waveforms include visual observation and automatic observation, which automatically monitors and observes the observed waveform. Background Art: Oscilloscope devices capture various observed signals from an external measurement target and display the observed waveform representing the observed signal on a cathode ray tube (CRT) screen. When using such an oscilloscope device to measure a specific position within the observed waveform, the operator performs the measurement by visual estimation. However, visual estimation is prone to operator error and requires significant measurement time. In particular, complex waveforms displayed on the CRT screen increase the likelihood of measurement errors and increase measurement time. Instead of manual measurement using an oscilloscope device, there is a fully automated method for obtaining measurements. This method is composed of an automatic measuring device consisting of an A/D converter and a microcomputer connected in parallel to an oscilloscope. The A/D converter samples the observed signal and converts it into an A/D signal.
The microcomputer takes in the digital output of the A/D converter, selects the required observation value, and collects the selected observation value. This method is useful when the observation signal has a regularity or
This is true for low-speed observation signals, but automatic measurement is difficult for high-speed observation signals or observation signals that change in a very complex manner. Another method is to capture the A/D output of the observation signal in real time and then perform the subsequent measurement value selection process offline. However, when the observation signal is complex, this method has the disadvantage of requiring memory for storing the data captured in real time, and this memory capacity must be large. Performing capture and processing in real time places a heavy burden on the computer. On the other hand, whether the input signal is captured automatically or the data is read visually by an operator using an oscilloscope, the data required for subsequent calculations is not the entire input signal; it is only a few points on the input signal. Finding the few points of data (valid data) required for these calculations is a problem for the operator and the computer software. In the case of a computer, even if the input signal is a constant level signal or a complex signal with rapid changes, if the data processing after A/D conversion is relatively simple, such as distinguishing whether the input signal level is above or below a certain reference value, or checking whether a signal level is above a certain level, or calculating the input time of that signal, then software can handle it adequately. However, if the input signal itself is a complex signal with rapid changes, the part that becomes valid data may differ depending on the state of the signal changes.
In this case, the data processing content changes in response to various measurement conditions and input waveform changes, making it difficult to develop software that takes these various changes into account. Examples of complex observation signals include response signals from ultrasonic flaw detection and detection signals from vibrating bodies. In particular, in ultrasonic flaw detection, the test objects have a variety of materials and structures, and there are various flaw detection methods. Furthermore, the measurement values to be measured also vary depending on the content. The same is true for ultrasonic surface pressure measurement. One prior art method involves attaching a position detection panel to the front of a CRT and using this position detection panel (touch sensor) for the same purpose as a light pen. The CRT displays a number of predetermined characters (or symbols) to be input into the computer at specific positions, and the character (or symbol) is designated using the position detection panel. The coordinate signal corresponding to the designated character is extracted, the character (or symbol) corresponding to the coordinate signal is found, and the character (or symbol) is input into the computer (see Japanese Patent Application Laid-Open No. 19836/1982). This method uses a position detection panel instead of a light pen, and the display on the CRT is limited to characters, figures, etc. In contrast, the position of the observed waveform on the CRT is not specified in advance, so it cannot be applied to waveform observation. A prior example of displaying the response observation signal from an ultrasonic probe on a CRT and reading the position and magnitude of the observed waveform is found in U.S. Pat. No. 3,608,361. In this prior example, a graduated sheet is placed on the CRT display surface, and the position and magnitude of the observed waveform on the CRT display surface behind it are read using the graduations on this sheet. This prior example requires the operator to visually read the memory on the sheet. Furthermore, as the observation target changes, a correspondingly scaled sheet must be prepared. Therefore, as is clear from this prior example, measuring ultrasonic observation waveforms is actually more difficult than observing waveforms observed in general measurements other than ultrasonic observation waveforms. Disclosure of the Invention: The object of the present invention is to provide a man-machine interface-type portable ultrasonic hybrid flaw detector that can perform a variety of ultrasonic measurements using multiple measurement modes with a single device. Another object of the present invention is to provide a man-machine interface type portable ultrasonic hybrid flaw detector that can semi-automatically detect various observed waveforms in a plurality of measurement modes and automatically execute processing according to the measurement mode after detection. Another object of the present invention is to provide a man-machine interface type portable ultrasonic hybrid flaw detector that can semi-automatically detect various observed waveforms in a plurality of measurement modes and automatically execute processing according to the measurement mode after detection.
The present invention aims to provide a machine interface type portable ultrasonic combined flaw detector. Another object of the present invention is to provide a man-machine interface type portable ultrasonic combined flaw detector of a portable size. The outline of the present invention is that a processing program (software) for the combined measurement mode is prepared in a microcomputer, any mode of the combined measurement mode is selected by keyboard, and the coordinate values of the observed waveform are read by a man-machine interface method in accordance with the selected processing program. Furthermore, when reading the observed waveform, a transparent position detection panel is provided on the CRT display surface of the oscilloscope device that displays the observed waveform,
The observation waveform is indicated through the panel, and the indicated coordinate values are automatically input into a microcomputer, which then performs the necessary processing. Here, the position detection panel is a thin, flat, transparent panel. When any point on this panel is pressed,
The microcomputer outputs a signal indicating the pressed point. This signal is output as an X-coordinate and a Y-coordinate signal. The microcomputer has various processing programs for man-machine use. The computer captures the X-coordinate and Y-coordinate signals corresponding to the pressed point on the position detection panel. The computer stores the captured X-coordinate and Y-coordinate signals in memory as measured values. Furthermore, in this invention, in addition to the oscilloscope device, a display is provided. This display is provided for man-machine use and gives work instructions to the operator based on the computer output. The operator performs the work in accordance with these work instructions.
The display also displays the numerical results of calculations based on the data of the X and Y coordinates measured as described above. The oscilloscope device has the purpose of displaying observed waveforms and is not capable of direct interaction with the computer. The display described above is what realizes this interaction in place of the oscilloscope device. Furthermore, in this invention, an input means is provided for the operator to transmit his/her intentions to the computer. This input means is usually a keyboard. The input means is used to give instructions for carrying out work and to input necessary setting values. In addition, in this invention, a printer is provided. This printer is useful for recording and checking the work process. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a diagram of an embodiment of the ultrasonic hybrid flaw detector of this invention, and Fig. 2 is a diagram of an embodiment of the ultrasonic hybrid flaw detector of this invention.
1 is a perspective view of the position detection panel, FIG. 3 is a diagram of its layer structure, FIG. 4 is an exploded view, FIGS. 5 and 6 are diagrams explaining its operation, FIG. 7 is a front view of the position detection panel attached to the CRT, FIG. 8 is a cross-sectional view taken along A-A', FIG. 9 is a diagram explaining position detection, FIG. 10 is a diagram showing the layout of the keyboard keys, FIGS. 11(A), (B), and (C) are diagrams explaining the A-scope, FIGS. 12(A), (B), and (C) are diagrams explaining calibration, FIG. 13 is a diagram explaining surface pressure measurement, FIGS. 14(A), (B), and (C) are diagrams explaining flaw detection, FIGS. 15(A), (B), 16(A), (B), 17(A), (B), and 18, and FIGS. 19(A), (B), 20(A), (B), and 21(A), (B) are diagrams explaining each flaw detection operation, and FIGS. 22 and 23
The figure shows a processing flowchart, Figure 24 shows a front panel implementation diagram, and Figure 25 is an explanatory diagram of a frequency detection example. Best Mode for Carrying Out the Invention: Figure 1 shows an embodiment of a man-machine ultrasonic hybrid flaw detection device of the present invention. Solid lines indicate signal lines in the machine system, and dotted lines indicate the operating system (including the monitoring system) in the machine system. The hybrid flaw detection measurement mode refers to performing two types of measurements: ultrasonic flaw detection and surface pressure measurement, and to having at least six flaw detection measurement modes within the flaw detection and performing measurements according to these six measurement modes. Measurements using these six flaw detection measurement modes include: Measurement using the maximum echo height method; Measurement using the probe distance correction method; Measurement using the mode conversion surface wave method; Measurement using the 6 db drop method; Measurement using the longitudinal wave scattered wave method; and Measurement using the edge peak echo method. The transducer 1, which serves as an ultrasonic probe, emits ultrasonic waves to the object 30 to be inspected and detects the reflected waves from the object 30. The oscilloscope device 2 includes a synchronization circuit (SYN) 20, a transmission circuit (TR) 21, a reception circuit (REC) 22, and a logarithmic converter (EXP).
23, a detector (DET) 28, a sweep circuit (SWE) 24, a time base unit (TM) 25, a cathode ray tube (CRT) 26, and a position detection panel 27. Outside the oscilloscope device 2, there is a power supply unit (PS)
3. Repetition period setter (SS) 4. Liquid crystal display (DIS)
The oscilloscope device 2 includes an input unit (I) 6, a keyboard (KB) 7, an A/D converter (AD) 8, a printer (P) 9, a microcomputer (COMP) 10, switches 11 and 12, and a shared bus 13. The synchronous circuit 20 generates a signal voltage that provides time regulation to each circuit in the oscilloscope device 2.
is activated by application of power from the power supply unit 3 via the switch 11. Furthermore, the synchronization period can be changed by the setting value of the repetition period setting device 4. The transmission circuit 21 receives the signal voltage from the synchronization circuit 20 and generates an activation pulse to the transducer 1. The ultrasonic transducer 1 receives the activation pulse and oscillates a specific ultrasonic pulse.
This oscillated ultrasonic pulse propagates inside the inspected part 30. If there is a defect, a reflected wave will be generated from the defect, and the transducer 1 will take in the reflected wave and generate an electrical signal corresponding to the magnitude of the reflected wave. The receiving circuit 22 is made up of an amplifier, and takes in a signal corresponding to the reflected wave from the transducer 1 and amplifies it. The logarithmic converter 23 takes in the amplified output of the receiving circuit 22 and performs a logarithmic conversion. This results in a signal in a digital display format. The detector 28
To provide a DC (one-sided) indication to the CRT, the high-frequency output from the logarithmic converter 23 is rectified and extracted as a DC voltage signal. Additionally, the detector 28 removes various noise components. The sweep circuit 24 synchronizes the triangular wave generation time on the time axis (corresponding to the horizontal axis on the CRT display screen) with a synchronization signal from the synchronization circuit 20. This sweep circuit 24 is also used to display only the vicinity of the measurement point on the CRT and to align the origin of the beam path with the zero point on the scale in the case of oblique incidence. The time base section 25 generates a voltage to move the bright spot on the CRT display screen horizontally at a uniform speed. The CRT 26 receives the time base signal from the time base section 25 and the detection output from the detector 28 and displays the detection output on the time axis. In the waveform displayed on the CRT 26, W1 represents the transmitted wave signal, and W2 and W3 represent the reflected wave signals. The transmission wave signal W1 is a transmission wave when an ultrasonic wave is emitted, and this signal W1 is transmitted to the receiving circuit 22 via the transducer 1.
The reflected wave signals W2 and W3 are the reflected wave signals themselves from the object 30 under test, and as mentioned above, these are also taken in by the receiving circuit 22 via the vibrator 1. The position detection panel 27 is made of a transparent material and is attached to the display screen of the CRT 26. This detection panel 27 is a touch sensor, and when the operator presses a relevant position with a pointer (not shown) or his/her hand, a signal indicating the X coordinate of the pressed position is sent to the terminal.
A signal indicating the Y coordinate is generated from terminal XT, and a signal indicating the Y coordinate is generated from terminal YT. The coordinate position of the CRT display screen is read by the position detection panel 27. In other words, since this detection panel 27 is transparent, the position indication of the detection panel 27 also indicates the position of the CRT display screen. If the coordinate axes of the detection panel 27 and the coordinate axes of the display screen are aligned, the signal from terminal X of the detection panel 27
The signals from terminals XT and YT are the coordinates of the indicated position on the CRT display screen. If the coordinate axes of the detection panel 27 and the coordinate axes of the display screen do not coincide, a conversion formula for both coordinate systems is prepared in the microcomputer 10, and the signals from terminals XT and YT are the coordinates of the indicated position on the CRT display screen.
The signal from T is input into the microcomputer 10 and converted into coordinates on the CRT display screen using a conversion formula. The CRT display screen position to be read by the position detection panel 27 is a specific position within the received wave signals W1, W2, and W3, and is the waveform data of the received wave signals themselves. Typical examples include the maximum amplitude values of waveforms W1, W2, and W3, and the time from the rising edge of waveform W1 to the rising edge of W2 and W3. These maximum amplitude values and the time from the transmitted wave to the reflected wave are essential for analyzing the reflected wave. This waveform data essential for analyzing the reflected wave can be detected by the position detection panel 27 through man-machine operation. Furthermore, because of man-machine operation, the required position can be freely and accurately specified and captured regardless of the displayed waveform shape. There is also a conventional example in which a position detection panel is used instead of a light pen. The position detection panel is attached to the front of the display screen. Predetermined characters (or symbols) are displayed at specific positions on the display screen.
The position of the character to be selected on the display screen is captured by the position detection panel. Based on the position signal from this position detection panel,
The currently displayed and selected character is identified. The identified character is then input to a microcomputer or the like. In the present invention, the position detection panel is intended to detect the waveform data itself. Therefore, character identification processing, as in the prior art, is not required. Furthermore, the CRT display in the present invention is the observed waveform to be measured. In the prior art, characters created offline are used instead of the observed waveform. Furthermore, the present invention uses an analog display, whereas the prior art uses a digital display. The shared bus 13 is under the control of the microcomputer 10. The display 5, input device 6, keyboard 7, A/D converter 8, and printer 9 are also under the control of the microcomputer 10. The microcomputer 10 stores a processing program for composite measurement in its ROM. The processing program for composite measurement refers to two programs: a processing program for surface pressure measurement and a processing program for flaw detection. Furthermore, the processing program for flaw detection has processing programs for the six operating modes mentioned above. The processing programs for surface pressure measurement and flaw detection are accessed in two modes. The first mode is a calibration mode and the second mode is an operational mode.
The calibration mode is a preliminary operation before measurement using a standard test piece, and calibrates various data. The operation modes are:
This refers to the operation during actual measurement. For example, when measuring surface pressure, the surface pressure measurement processing program is started in calibration mode, and surface pressure measurements are performed on a standard test piece according to the program's instructions to obtain standard data. Next, the operating mode is entered, and the surface pressure measurement processing program is started, and surface pressure measurements are performed on the test object according to the program's instructions to obtain measurement (actual measurement) data. Furthermore, the flaw detection processing program is also started during flaw detection, both during calibration and measurement. Calibration obtains calibration data, and measurement obtains measurement data. These surface pressure and flaw detection processing programs are started using the keyboard 7. The measurement of the calibration data and actual measurement data is performed using a man-machine system. That is, each program sequentially issues instructions on the LCD display 5 during its processing. The operator performs the work according to these instructions. During operation, the operator uses the position detection panel 27 to instruct the display waveform data to be read. The read results are input into the microcomputer 10 via the switch 12 and the A/D converter 8. At the same time as capturing the data, the microcomputer 10 stores the measurement data in its memory and sends it to the liquid crystal display 5 for display. The work content for one measurement item generally consists of multiple work instructions. Each of these work instructions is processed by the man-machine system as described above. The input device 6 has the function of capturing the gain setting value of the logarithmic converter 23 and sending it to the microcomputer 10. The liquid crystal display 5 plays an important role in implementing the man-machine interface for the operator. In particular, the oscilloscope device 2 displays only the observed waveform to be measured.
The instructions for each task by the microcomputer 10 cannot be displayed on the oscilloscope 2. Because the oscilloscope 2 cannot display the instructions for each task, a liquid crystal display 5 is provided for indicating the task. In addition to indicating the task, the liquid crystal display 5 also displays waveform data input into the microcomputer 10 via the position detection panel 27 in response to an operator's instructions. It also displays the magnitude of surface pressure and the details (size and location) of defects resulting from flaw detection. All of these displays are instructed by the microcomputer 10, and all display content is output data from the microcomputer 10. This output data, such as defect details and surface pressure magnitude, is the result of calculation, while waveform data is the value indicated by the position detection panel 27. The keyboard 7 has keys for indicating each measurement item for composite measurement and keys for entering numerical values. The keys on the keyboard 7 are turned "on" and "off" by the operator.
The key contents of the keyboard 7 are taken into the microcomputer 10. The microcomputer 10 takes in the "ON" operation key of the keyboard 7, judges the operation content and performs processing. Next, the microcomputer 10 makes the liquid crystal display 5 display the necessary information. The printer 9 prints out the print instructions of the microcomputer 10. The printing can be done by printing out the contents displayed on the liquid crystal display 5 exactly as they are, or by selecting from among them and printing them. The former is useful for tracing the work procedure, while the latter is useful for printing out only the necessary results. The A/D converter 8 takes in the X-coordinate signal and Y-coordinate signal of the waveform data from the terminals XT and YT selected by the switch 12, and outputs them to the A/D
The result of this A/D conversion is taken in by the microcomputer 10. The components that require operation by the operator are the repetition period setting device 4, the logarithmic converter 23, the keyboard 7, and the position detection panel 27. The repetition period setting device 4 sets the repetition period of the transmission pulse, which needs to be changed depending on the material, thickness, etc. of the object to be inspected (Instruction A). The logarithmic converter 23
The gain of the CRT 26 is changeable, and the maximum amplitude value of the waveform that can be displayed on the display screen of the CRT 26 is set. This gain change is performed by the operator (instruction F). This gain change is performed arbitrarily during measurement using a gain setting device (not shown). The operator presses the required key on the keyboard 7 to "enter"
(Instruction B). The operator presses the required indicated position on the position detection panel 27 (Instruction C). The operating procedures for the keyboard 7 and the position detection panel 27 have been described above. The LCD display 5 does not require any operation by the operator. Instead, the operator reads the displayed contents visually (Instruction D). During calibration, a standard test piece is attached in place of the test object 30 and measurement is carried out. Figure 2 shows a perspective view of the position detection panel. The position detection panel 27 is entirely transparent, and the cathode ray tube (CRT) 26
Even when the panel 27 is mounted on a display surface, the waveform on the display surface can be observed from outside the panel 27. Furthermore, the panel 27 is flexible and can be fitted to the display surface. The panel 27 has a single X, Y output terminal XT, YT and a power supply terminal ST. The position detection panel 27 is a transparent touch sensor, and when an observer presses a position with a pointer (not shown) or their hand, a signal indicating the X coordinate of the pressed position is sent to the terminal
A signal indicating the Y-coordinate is generated from terminal XT, and a signal indicating the Y-coordinate is generated from terminal XT. Figure 3 shows a cross-sectional view of the position detection panel 27 shown in Figure 2, taken along the line A-A'. The thickness L of this panel 27 in the layer direction is approximately 0.1 mm. A resistive layer 185 with a uniform resistance density in the planar direction is formed on the surface of a transparent resin layer 186 made of acrylic or other material. This resistive layer 185 is transparent. "Transparent" refers to both cases where the resistor material is transparent and where the resistive layer is thin enough to be transparent. Either method is optional. An X-axis electrode is formed on one of two mutually perpendicular sides of the resistive layer 185, and a Y-axis electrode is formed on the other. In the figure, one of the two electrodes is shown as electrode 182. A transparent electrode layer 181 is formed on the surface of the resistive layer 185, sandwiching an insulating spacer 184. The insulating spacer 184 is a point-like spacer that is elastic in the longitudinal direction and shrinks when pressed from above. The spacer 184 is transparent.
The spacers 184 are arranged regularly in the vertical and horizontal directions. The thickness and spacing of the spacers 184 affect the accuracy of position detection; when the thickness of the spacers 184 is small and the spacing is large, the accuracy of position detection increases. The thickness of the spacers 184 itself indicates the size of the dead zone. Naturally, spaces 183 are formed between the spacers 184. A transparent resin layer 180 made of acrylic or the like is formed on the surface of the electrode layer 181. The position detection panel 27 is formed from the above layer configuration. When one point on the surface of the position detection panel 27 is pressed in the direction of the arrow in the figure, the spacers 184A, 184B at the pressed point move in the direction of the arrow in the figure.
The electrode layer 181 is pressed in, and a part of the electrode layer 181 comes into contact with a part of the resistance layer 185. This contact brings the electrode 181 and the resistance layer 185 into point contact, forming an electrical path. The point contact position is the terminal X
The signals can be taken out externally as signals indicating the X and Y coordinates via T and YT. Figure 4 is an explanatory diagram for making the position detection panel 27 easier to understand. An X-axis electrode 182A and a Y-axis electrode 18B2B are formed along two perpendicular sides of the resistance layer 185. A transparent electrode layer 181 is provided at the opposing point across the insulating spacer 184. This transparent electrode layer 181 is provided over the entire surface of the acrylic resin layer 180 on the spacer side. A DC power source E is applied to the electrode layer 181. The X-axis electrode layer 182
A resistor 188 is set between A and the ground, and the Y-axis electrode layer 18
A resistor 187 is connected between 2B and the ground. When a point on the acrylic resin layer 180 is pressed, an electrical path is formed between a point on the electrode layer 181 (through the corresponding space 183) and a point on the resistor layer 185. The Y-axis coordinate position of the point on this path is
The X-direction position appears as a signal corresponding to the position on the X-electrode 182B, and the X-direction position appears as a signal corresponding to the position on the X-electrode 182A.
An X coordinate signal X is detected through one end of resistor 188, and a Y coordinate signal Y is detected through one end of resistor 187. Fig. 5 is an explanatory diagram for detecting an X coordinate in the position detection panel 27, and Fig. 6 is an explanatory diagram for detecting a Y coordinate in the position detection panel 27. In Fig. 5, three pressed points P ₁ (x ₁ ,
Suppose that points _P1 ( _x2 , y2), _P2 (x2, _y2 ), and _P3 ( _x3 , _y3 ) are given separately. A current flows from the power supply along the electrical path formed by the pressure. Since the resistive layer 185 of the panel 27 is a uniform resistor, when the pressure is applied at point _{P1 ,} a current proportional to the area of the _{triangle Q1P1Q2} flows to the X- _axis electrode 182A _and is extracted. When the pressure is applied at point _{P2 ,} a current proportional to the area of the _{triangle Q1P2Q2} flows from the electrode 182A. Since △ _Q1P1Q2 = _{△ Q1P2Q2 ,} x
If the pressing point is on the line x = _x1 , the same current is obtained from electrode 182A regardless of the pressing point. Furthermore, when the pressing point is a point _P3 ( _x2 , _y3 ) on the line x = _x2 , a signal corresponding to the area _{ΔQ1 P3 Q2} is obtained, and this signal is an _x2 corresponding signal. Therefore, according to Fig. 5, a signal indicating the x coordinate is obtained from electrode 182A. Similarly in Fig. 6, when two points _P4 ( _x4 , y5) and _P5 ( _x5 , _y5 ) on the line y = _y5 are pressed,
₅ ), from the relationship △Q ₂ P ₄ Q ₃ ＝△Q ₂ P ₅ Q ₃ , y＝y ₅
A corresponding identical current is extracted through electrode 182B. Point P ₆ (x ₆ ,
y ₄ ), a current corresponding to y=y ₄ can be extracted via electrode 182B. Figures 7 and 8 show an embodiment in which a position detection panel is attached to a synchroscope device 100. Figure 8 shows a cross section taken along the line A-A' in Figure 7. The synchroscope device 100 has a case 110, which has an opening in the front face. The front face (glass tube part) 101A of the cathode ray tube 101 is inserted into this opening. Front face 101
A is curved outward and forms a display surface on which the observed waveform is displayed.
The position detection panel 103 is transparent and flexible, so it is attached along the curved portion of the front surface 101A. The hood 102 is provided to prevent difficulty in observing the display surface when using this measuring device outdoors in direct sunlight. The hood 102 consists of a case 102A and a base 102B, and the case 102A is configured to protrude in a direction approximately perpendicular to the display surface. The upper end of the protruding portion of the case 102A is longer than the lower end. The perimeter of this case is large enough to cover the entire display surface. The base 102B serves to fix the position detection panel 103 to the front of the display surface. A packing 105 is inserted into the space between the base 102B and the position detection panel 103 to hold the position detection panel 103 in place. There is a hole in the top of the base 102B, and a bolt 106 is inserted into this hole.
and lock it into the case 110. This fixes the position of the position detection panel 103 and also fixes the hood 102. With the above configuration, when the display surface is viewed from the front of the CRT display surface, it appears as shown in Figure 7, and the vertical and horizontal scale 101B of the CRT display surface can be observed directly through the position detection panel 103. Therefore, the operator can observe the observed waveform, specify waveform data, and acquire numerical values. Figure 9 shows the relationship between the coordinate system of the display screen 26A and the coordinate system of the position detection panel 27. In the figure, point _O2 indicates the origin of the coordinate system of the CRT display surface, and point _O1 indicates the origin of the coordinate system of the position detection panel. The origin _O1 of the coordinate system of the position detection panel is merely the origin for measurement; the origin _O2 of the coordinate system of the observed waveform is the origin of the actual measurement coordinate system. Therefore, it is necessary to perform a coordinate transformation from the coordinate system of the position detection panel to the coordinate system of the display surface. This coordinate transformation is performed by software within the microcomputer. However, the calculation formula for this coordinate transformation need only be a translational calculation formula. Figure 10 shows the configuration of the operation panel 7A of the keyboard 7. This panel 7A is used to input the measurement mode, various constants for the object being measured, measurement conditions, etc. It is operated by a human. Furthermore, the peak value and beam path of the measurement waveform displayed on the CRT are input into the microcomputer 10 via the detection panel 27 under the conditions instructed by this panel 7A. When performing each operation, the next operation to be performed is displayed on the LCD display 5, and the operator performs the operation according to the displayed instructions. The functions of each key are as follows: (1) [SHIFT] Key. All keys in the diagram, except for [SHIFT] and [CR], have double functions. The [SHIFT] key has the function of selecting one of the double functions. When the system is initialized, each key functions as its 1st function (the name displayed above the key). When you press the [SHIFT] key once, each key functions as its 2nd function (the name displayed below the key). When you press it again,
Return to the 1st function. This process is repeated from here on. Furthermore, the function of the key currently being operated is always displayed on the LCD display 5. (2) [CR] key When inputting various constants and data, by pressing this [CR] key at the end of a series of data or code, each data or command code will end there. For example, when inputting the data "plate thickness 150 mm", press [plate thickness]. [SHIFT].
[1]. [5].

Press [0] and [CR] in that order.
When using the [SHIFT] key, it is not necessary to use the [CR] key. (3) [Surface pressure] key (1st function) The surface pressure measurement mode is designated when determining the measurement mode at the time of system initialization and when changing the operation mode. When measuring this surface pressure, the [Surface pressure] key is pressed. Regarding "surface pressure" measurement, the same method is used as in the "Method for measuring contact stress on solid contact surfaces by ultrasonic waves" (PC
T/JP82/00087). (4) [Calibration] key (2nd function) Used when determining the measurement mode performed when initializing the system or changing the operation mode. Specifies that the echo height of the JIS standard test piece will be calibrated (determined as the reference sensitivity). (5) [Detection] key (1st function) Used when determining the measurement mode performed when initializing the system or changing the operation mode, and specifies that flaw detection will be performed. (6) [Test] key (2nd function) Used when determining the measurement mode performed when initializing the system or changing the operation mode, and specifies that an operation check of the device itself (especially the microprocessor in the microcomputer) will be performed. (7) [Thickness] key (2nd function) Used when specifying the thickness of the material to be measured. For example, a thickness of 15
To specify mm, press [Thickness]. [SHIFT]. [1].
[5]. Press [CR] in that order. (8). [Refraction angle] key (2nd function) Used to specify the refraction angle of ultrasound determined by the probe. The specification method is the same as (7). (9). [Curved surface] key (2nd function) Specifies that the surface to be measured is curved in surface pressure measurement. The operator presses [Curved surface] and [CR] in that order. (10). [Plane] key (2nd function) Specifies that the surface to be measured is flat in surface pressure measurement. The operator presses [Plane] and [CR] in that order. (11). [Search] key (1st function) Used when searching for the desired S-echo and R-echo in the mode conversion surface wave method. For example, press [Search] and [CR] in that order. (12).

[0]. [1]. …

[9] Key (1st Function) Used to set various data, constants, codes, etc. (13) [・] Key (1st Function) Specifies the decimal point. (14) [m ₁ ] [m ₂ ] [E ₁ ] [E ₂ ] [d ₁ ]
[d ₂ ]. [d ₃ ]. [δ] key (2nd function) Used to set each constant in the pass/fail judgment formula when making a pass/fail judgment on contact surface pressure. The contents are as follows. [m ₁ ], [m ₂ ]...Poisson's ratio [E ₁ ], [E ₂ ]...Young's modulus [d ₁ ]...Bushing inner diameter [d ₂ ]...Bushing outer diameter [d ₃ ]...Boss outer diameter [δ]...Ultrasonic flaw detection using the A-scope method with a configuration of more than an interference is as follows. In the A-scope ultrasonic flaw detection method, Fig. 11 (A),
As shown in (B), the ultrasonic waves emitted from the probe 1
1A is incident on an object 30 to be inspected, such as steel or copper alloy,
Reflected waves (hereafter referred to as echoes) from the defect 30A present in the
is received by probe 1, and the echo is amplified and detected, and then CR
This method displays the echo on the screen and measures the amplitude of the echo and the time it takes to receive the echo (the time it takes for the ultrasonic waves to be transmitted and received) to determine the size and location of the defect. This method includes a perpendicular flaw detection method in which ultrasonic waves are incident perpendicularly to the surface of the object 30 to be inspected, as shown in Figure 11 (A), and a perpendicular flaw detection method in which ultrasonic waves are incident perpendicularly to the surface of the object 30 to be inspected.
As shown in Figure 11 (B), there is an angle beam method in which ultrasonic waves are incident at an oblique angle with a refraction angle θ. The transducer usually has a frequency of 2 to 5 MHz and a transducer size (diameter) of
The angle of refraction used in angle beam testing is 5 to 20 mm. The angle of refraction in angle beam testing is often 40 to 70 degrees. Longitudinal waves are used for perpendicular testing, and shear waves for angle beam testing. On the CRT screen, the horizontal axis (X axis) represents time, and the vertical axis (Y axis) represents amplitude. If there is a defect, an echo with amplitude h will appear at position x on the X axis, as shown in Figure 11 (C).
E2 is obtained. The waveform E1 is a transmission pulse signal. CR
The x value on the T screen corresponds to the distance x between the probe and the defect, as shown in Figures 11(A) and (B), so the defect location can be determined from the x value on the CRT screen. Furthermore, since the echo amplitude h is generally proportional to the defect size H, the defect size can be measured from the echo amplitude. To specify a position using the A-scan method using the position detection panel, press the location (x) of the reflected wave (echo) E2 and then the magnitude (peak point) of the echo E2's amplitude (h), which are then input into the microcomputer 10. The x-position and peak point (magnitude h) vary depending on the detection target and detection content. The position detection panel 27 allows these positions to be easily specified and input into the computer. To determine the location and size of a defect using A-scan ultrasonic flaw detection, it is necessary to know the distance along the X axis (called the beam path) and the amplitude along the Y axis (called the echo height) of the echo displayed on the CRT screen. The beam path and echo height obtained by ultrasonic flaw detection are not absolute but relative values, so a standard test piece or a reference test piece should be used to measure the echo height and beam path length on a CRT before flaw detection.
The X and Y axes of the screen must be calibrated. Calibration is performed using, for example, JIS test piece 30B as shown in Figure 12 (A), (B), and (C). Figure 12 is based on JIS Z 2345
This is a G-type sensitivity standard test piece for ultrasonic flaw detection specified in the JIS C 1994/1995, and is intended for vertical flaw detection. The calibration method using this test piece is as follows. First, the probe is placed on the end face of the test piece, and an echo E2 from the φ2 flat-bottom hole and an echo E3 from the bottom surface appear, as shown in Figure 12 (C). The figure shows the waveform displayed on display surface 26A. Next, the X-axis adjustment knob of the flaw detector is moved to adjust the position 80 mm on the X-axis.
Adjust so that the echo from φ2 is at the position and the bottom echo is at the 100mm position. This completes the calibration of the X axis. Next, move the Y axis adjustment knob to adjust so that the height of the echo from φ2 is 50% of the full scale (100%). The knob value at this time becomes the reference for the echo height. This completes the calibration of the Y axis. In the case of angle beam testing, it is usually specified in JIS Z 2347
STB-A1 test piece and STB-A2 specified in JIS Z 2348
Using a test piece, the beam path and echo height are calibrated. The calibration procedure is exactly the same as in the case of vertical flaw detection described above. Next, the following operations using the keyboard 7 will be explained. (A) Initial set operation (B) Calibration operation (C) Surface pressure measurement (D) Flaw detection The following will be explained in detail. (A) Initial set using the keyboard 7 will be explained. After the power is turned on, after a while the LCD display 5 will display "System ready F=1 Operation start", indicating that the measuring instrument is in an operational state and waiting for instructions from the operator. Here, F=1 indicates that the function of the sheet key is set to the 1st function. 2nd
When in function, F=2 is displayed. The operator sees this display and performs one of the following operations. (A-1) To perform surface pressure measurement, press the keys "Surface Pressure" and "CR" in that order. (A-2) To perform flaw detection, press the keys "Detection" and "CR" in that order. (A-3) To perform calibration, press "SHIFT," confirm that F=2 is displayed on the LCD display 5, then press "Calibration" and "CR" in that order. (A-4) To perform testing, press "SHIFT," confirm that F=2 is displayed on the LCD display 5, then press "Test" and "CR" in that order. Performing one of the above operations will start each measurement or operation check. Furthermore, in the initial set, only the above items (A-1 to A-4) can be specified. (B) Next, calibration using the keyboard 7 will be explained. When performing various measurements using this device, it is necessary to determine the reference sensitivity in advance to specify the echo level of the reflected wave. Therefore, this operation should be performed before any measurement. (B-1) When the calibration mode is selected during the initial setup procedure, the "Calibration Mode" message will appear.
Ultrasonic waves are input to the prepared test piece, the gain is adjusted by the gain setter 23, and the echo height (peak value) of the reflected wave is input by the position detection panel 27.
To input the value, simply touch the peak point of the echo waveform displayed on display surface 26A. (B-2) After entering the echo height, "HS = **Echo Level INPUT" is displayed. The HS shown here simply indicates the Y coordinate of the point specified on the touch panel. Therefore, the operator must specify the dB equivalent of the echo level. Input the echo level using the following procedure. Example: "3", "5", "CR"...when the reference sensitivity is 35 dB. (B-3) By operating steps (B-1) and (B-2), each point on the scope (distance in the Y-axis direction) is defined based on the reference sensitivity. Furthermore, once calibration is performed, the calibration value is stored as a common value in all modes unless memory is corrupted due to a power outage. Upon completion of step (B-2), "HS-35DB Beam Rotation INPUT" is displayed on display 5. (However, this assumes that the reference sensitivity is 35 dB.) (B-4) Enter the beam path length for the standard test piece using panel 27.
This is done by specifying the rising points of the waveforms of the incident and reflected waves. The order of specification is the rising point of the incident wave, then the rising point of the reflected wave. When two points are input, "X = ※※ beam data INPUT" is displayed. The X shown here simply indicates the distance on the X coordinate of the point specified on the touch panel. Therefore, the operator must specify how many mm the beam path length corresponds to. Input the beam path length data using the following procedure. Example: "7", "5", "CR"... The beam path length in the test piece is
If the measured value is 75mm, the beam path length is 75mm. (B-5) By operating item (B-4), each point on the scope (distance in the X-axis direction) is defined based on the reference beam path length. Once calibration is complete, the beam path length defined above is maintained until calibration is performed again, as in item (B-3). Upon completion of item (B-5), "HS=35DB X=75MM System Standby" is displayed, informing the operator that calibration is complete and measurements are ready. (B-6) After completing items (B-1) to (B-5), the operator can select one of the following operations: "Surface Pressure,""FlawDetection,""Test," or "Calibration." (C) Explaining Surface Pressure Measurement. (C-1) When surface pressure measurement mode is selected during initial setup in item (1), the display shows "Surface Pressure Mode Standby F=*(1 or 2) Mode?D2?". The operator specifies whether the surface to be measured is flat or curved, and the bushing outer diameter d2, using the following procedure. Example: "Flat", "CR", "d2", "3", "0", "CR"... When the contact surface is flat and d2 = 30 mm (the key function is displayed on the LCD display 5, so use the "SHIFT" key after checking). (C-2). In accordance with the operation of item (C-1), "Heimen D2 = 30
The operator operates the sheet keys in the order of "1" and "CR" when the contact surfaces are steel to steel, and "2" and "CR" when the contact surfaces are steel and gunmetal. (C-3). With the operation of item (C-2), "Heimen D2 = 30
The operator inputs the peak point of the echo using the touch panel 27. (C-4). By operating item (C-3), "Heimen D2 = 30" is displayed.
The display shows "Contact point H1 = ** dB H2?". The operator inputs the peak point of the transmitted wave from the touch panel. (C-5). Calculation starts by operating item (C-4), and after completion, the display shows "PRESS. * * * KG/MM2 MEAS.NO.?".
The operator inputs the test number. (C-6) By operating item (C-5), "PRESS. * * *" is displayed.
"KG/MM2 MEAS.NO.※※CONST:1 POSITION:2" is displayed. When calculating the surface pressure tolerance using the pre-specified part number, "2" or "CR" is displayed. When calculating by calculation, "1" is displayed.
Enter "CR" and the operator indicates each predetermined part, and enters the code number or the constants "m1", "m2", "d1", "d2", "d3", "E1", and "E2" in the formula that determines whether the contact pressure is acceptable or not.
Select " or "δ" and enter. Example: "1", "2", "CR"... When entering a code number by part "d1", "3", "5", "CR"... When specifying each constant (C-7). The pass/fail judgment of the contact pressure is performed by the operation in section (C-6) and the result is displayed as NO-GO. Display example: "PRESS.※・※※KG/MM2 MEAS.NO.※※GO". (C-8). This completes the measurement of contact pressure. (D). Explains defect inspection. (D-1). When the defect inspection mode is selected by the operation in section (A-2) of the initial set, "Tansho mode standby F = ※ (1 or 2) T?θ? mode?" is displayed. The operator specifies T: plate thickness, θ: refraction angle, and the measurement mode.
The plate thickness is specified in mm and the refraction angle in degrees. The measurement mode is specified by the code shown below.
The explanation is given in the following order: i. Maximum echo height method: 01 ii. Probe distance correction method: 02 iii. Mode conversion surface wave method: 03 iv. 6 dB drop method: 04 v. Longitudinal wave scattered wave method: 05 vi. Edge peak echo method: 06 Example: Plate thickness 15 mm, refraction angle 30 degrees, measurement mode 6 dB drop method F
Measurement method when = 1 "SHIFT""Thickness""SHIFT""1""5""CR""SHIF
"T","RefractionAngle","SHIFT","3","0","CR","0"
Operate "4" and "CR" in that order. (D-2) If you select the maximum echo height method (code 01) in the measurement item (D-1) using the maximum echo height method, "M: Echo height, F = * (1 or 2) T = * *" will be displayed.
θ＝※※H?' is displayed. The operator specifies the echo height using the touch panel 27. By specifying the echo height, measurement and calculation are performed, and the display shows "M:
Echo height F=※ H=※※MM" is displayed. This completes the measurement using the maximum echo height method. (D-3) If you select the probe distance correction method (code 02) or the mode conversion surface wave method (code 03) in the measurement item (D-1) using the probe distance correction method and mode conversion surface wave method, the display will show "M: Distance correction (H-1) F=※ (1 or 2) T=
※※ θ＝※※Auto?” is displayed. In this mode, there is a function that automatically determines whether to use the probe distance correction method or the mode conversion surface wave for calculations depending on the specified plate thickness. However, the operator can also determine the measurement and calculation method regardless of the plate thickness. The operator selects “1” for automatic measurement (the calculation method is automatically determined depending on the plate thickness), and “2” if not. Example: When performing automatic measurement (F=1), “1” “CR” (D-4). When automatic mode is selected in the operation of section (D-3), the following is displayed depending on the specified plate thickness. (D-4-1) When a plate thickness of 6 mm or less is specified (a) “M: Distance correction F=※ (1 or 2) H?” is displayed. The operator inputs the echo height from the touch panel. By specifying the echo height, measurement and calculation are performed, and “H
=※※MM MODE: Distance Correction" is displayed and the measurement ends. (D-4-2) When the plate thickness is more than 6mm and 28mm or less (a). "M: Distance Correction F=※(1 or 2) Auto:0 Surface:1 Internal:02" is displayed. In this mode, the defect depth is automatically calculated and whether it is a surface defect or an internal defect is displayed, but if the operator can determine in advance whether it is a displayed defect or an internal defect, this can be specified using the keys. In accordance with the above display, if the defect depth is to be calculated automatically, press "0" or "CR" using the keys, if it is determined to be a surface defect, press "1" or "CR", and if it is determined to be an internal defect, press "2".
(b) When "0" or "CR" is selected (automatic mode) (b-1) "M: Distance compensation F = * (1 or 2) X?" is displayed. The operator inputs the beam path difference of the echo from the touch panel. The input specifies the rising point of the echo. (b-2) The defect depth is calculated by operating item (b-1) and "M: Distance compensation F = * (1 or 2) D = * * MM height (internal) H?" is displayed. The operator inputs the echo height from the touch panel. (b-3) When operating item (b-2), "M: Distance compensation F = * (1 or 2) D = * * MM height (internal) H = *
※MM" is displayed and the measurement ends. (C) When "1" or "CR" is specified in (D-4-2) (a) (when a surface defect is specified) (c-1) "M: Distance Compensation F = ※(1 or 2) Surface H?" is displayed. The operator inputs the echo height from the touch panel. (c-2) When "M: Distance Compensation F = ※(1 or 2) Surface H = ※※MM" is displayed and the measurement ends. (d) When "2" or "CR" is specified in (D-4-2) (a) (when an internal defect is specified) (d-1) "M: Distance Compensation F = ※(1 or 2) Internal H" is displayed.
?' is displayed. The operator inputs the echo height from the touch panel. (d-2) By operating item (d-1), "M: Distance correction F = * (1 or 2) Internal H = * * MM" is displayed and the measurement ends. (D-4-3) When the plate thickness is over 28 mm (a) "M: Surface depth F = * (1 or 2) Auto: 0 Surface: 1 Internal: 2" is displayed. In this mode, the defect depth is automatically calculated and whether it is a surface defect or an internal defect is displayed, but if the operator can determine in advance whether it is a surface defect or an internal defect, this can be specified using the keys. In accordance with the above display, if the defect depth is to be calculated automatically, enter "0" or "CR" using the keys, if it is determined to be a surface defect, enter "1" or "CR", and if it is determined to be an internal defect, enter "2" or "CR". (b)

If [0] [CR] is selected (automatic mode) (b-1) "M: Hiyomenaha F = * (1 or 2) X?" is displayed. The operator inputs the beam path of the S echo from the touch panel. The input also specifies the rising point of the S echo. (b-2) The defect depth is calculated by the operation in item (b-1), but in the case of a surface defect, "M: Hiyomenaha F = * (1 or
2) D = MM Hiyome H? is displayed. The operator presses S.
Enter the echo height from the touch panel. Measurement and calculation are performed by the above operation, and the result is "M: Echo height F
= * (1 or 2) D = * * MM F = * * MM” is displayed and the measurement ends. (b-3) The defect depth is calculated by the operation in (b-1), but in the case of an internal defect, “M: F = * (1 or
2) D = * * MM, inner surface: 1, outer surface: 2". If the defect shape is planar, the operator inputs [1] [CR] from the keys, and if it is a spherical defect, inputs [2] [CR]. (b-4) By operating item (b-3), "M: inner surface F = * (1 or 2) D = * * inner surface (exhaust) DX?" is displayed. The operator inputs the beam path lengths of the S echo and R echo from the touch panel. The input order is the rising point of the S echo followed by the rising point of the R echo. (b-5) By operating item (b-4), calculation is started, and the measurement is finished with the display of "M: inner surface F = * (1 or 2) D = * * MM, inner surface (exhaust) H = * * MM". (c) By operating item (D-4-3) (a), "1" is displayed.
When "CR" is specified (when a surface defect is specified) (c-1) "M: Hiyoumenha F = * (1 or 2) Hiyoumen H?" is displayed. The operator inputs the echo height of the S echo from the touch panel 27. (c-2) Calculation is performed by the operation of item (c-1), and "M:
The display will show "Hours F = * (1 or 2) Hours H = * * MM" and the measurement will end. (d) Select "2" by operating (a) of item (D-4-3).
When "CR" is specified (when an internal defect is specified) (d-1). "M:HyoumenhaF=※(1 or 2)Naibumein:1Kyu:2" is displayed. If the defect shape is planar, the operator selects "1" or "CR", and if it is spherical, selects "2".
Enter "CR" from the key. (d-2) By operating item (d-1), "M: Hiyoumenha F = * (1 or 2) Naibumen (Kyu) DX?" is displayed. The operator can set the beam path of S echo and R echo on the panel.
Input from 27. The input order is the rising point of the S echo and the rising point of the R echo. (d-3). Calculation starts by the operation of (d-2), and "M: Hiyoumenha F = * (1 or 2) Naibumen (Kyu)
"H = **MM" is displayed and the measurement ends.
When using the mode conversion surface wave method described above, S and R echoes are used, but since the waveforms displayed on the CRT are generally complex, finding the desired echoes can be difficult until you get used to it. This mode has the function of finding the desired S and R echoes, which has the advantage that anyone can easily perform measurements. The operator finds the desired S and R echoes by following the steps below. (a) After selecting the mode conversion surface wave method or the probe distance correction method as the measurement mode, press the [Search] and [CR] keys in that order. (b) By operating item (a), [M: Hyomenha (Distance Correction) F = * (1 or 2) S1?R1?] is displayed. The operator uses panel 27 to indicate the rising edge of the waveform that is thought to be the S echo and R echo. The order of indication is the rising point of the S echo, followed by the rising point of the R echo. (c) By operating item (b), "M: Hiyoumenha (distinction correction) F = * (1 or 2) Tansaku S2?R2?" will be displayed.
The operator operates the probe to move the S echo and R echo, and once again indicates the waveform rising points of the S echo and R echo from the touch panel 27. The indication order is the rising point of the S echo, followed by the rising point of the R echo. (d) Calculation is started by the operation of item (c), and if the difference between the beam path difference indicated in item (b) and the beam path difference indicated in item (c) is within 10%, OK is displayed, otherwise
The NO is displayed as follows: "M: Object (distance correction) F = * (1 or 2) Detection OK (NO) E: 1 R: 2 T: 3" is displayed. If an S echo and an R echo are found after two operations, the search ends. This device has a function to check three times and a function to check again from the beginning. The operator follows the procedure below to instruct the next measurement. However, the function to check three times is only valid if the previous two checks were OK. (d-1) To end the search... Operate "1" and "CR" in that order. The measuring device will return to the state it was in before the search began. (d-2) To check again from the beginning...
Press "2" and "CR" in that order. (d-3) When checking for the third time, press "3" and "CR".
Operate in the order shown above. (e) If "2" or "CR" is selected in operation (d), "M: HIGH MEMBRANE (DISTANCE COMPENSATION) F = * (1 or 2) TANK S1?R1?" is displayed. The operator performs the search by repeating operations in b, c, and d. (f) If "3" or "CR" is selected in operation (d), "M: HIGH MEMBRANE (DISTANCE COMPENSATION) F = * (1 or 2) TANK S3?R3?" is displayed. The operator operates the probe to move the echo position, and then indicates the beam path lengths of the waveforms assumed to be S echo and R echo. The indication order should be the rising edge of the S echo waveform, followed by the rising edge of the R echo waveform. (g) Calculation is performed in operation (f), and if the difference between the average of the previous two measurement data and the third measurement value is within 10%, OK is displayed; otherwise, NO is displayed as shown below. "M: Refraction angle (distance correction) F = * (1 or 2) Search OK (NO) E: 1 R: 2" (h). The three-time check function ends by operating item (g), but if you want to end the search with that, enter "1" and "CR", and if you want to start checking again from the beginning, enter "2" and "CR" from the keys. (h-1). If you operate "1" and "CR", follow item (d-1). (h-2). If you operate "2" and "CR", follow item (e). (D-5). If you select the 6 dB drop method (code: 04) in the measurement item (D-1) operation, "M: 6DB F = * (1 or 2) T = * * θ = * * X?" is displayed. In this measurement, when the refraction angle (θ) is 0 degrees (vertical search),
The measurement method differs for other cases (angle beam scanning). (D-5-1) In the case of vertical scanning (a) Operate the probe to find the point with the highest echo height. Input the beam path length X at that time. The input order is the rising point of the incident wave, then the rising point of the reflected wave. (b) By operating item (a), "M:6DB F = * (1 or 2) T
＝※※θ＝※※D＝※※MM” is displayed and the calculation is completed, but the operator operates the probe to change the echo height from the maximum value.
Find the point 6dB lower (one point on each side, left and right, or front and back). The distance between these two points is the defect height (H). (c). This completes the measurement. (D-5-2). In the case of angle beam testing (a). Operate the probe to find the point where the echo height is maximum, and input the beam path length at that time from panel 27.
The input order is specified as the rising point of the incident wave and then the rising point of the reflected wave. (b) By operating item (a), [M:6DB F = * (1 or 2) T
= * * θ = * * D = * * MMX1?] is displayed. The operator operates the probe and checks whether the echo height is 6 dB higher than the maximum echo height.
The point at which the beam falls is found, and the beam path length at that time is input from panel 27. The input order is the rising point of the incident wave, then the rising point of the reflected wave. (c) By operating item (b), "M:6DB F = * (1 or 2) T
＝※※θ＝※※D＝※※X2?' is displayed. The operator operates the probe to find another point on the opposite side of the point that showed the maximum echo height for the point found in item b, where the echo height is 6 dB lower than the maximum echo height, and inputs the beam path length at that time from the panel. The input order is the rising point of the incident wave, then the rising point of the reflected wave. (d). By operating item (c), 'M:6DBF＝※(1 or 2)T＝
※※θ＝※※D＝※※MM H＝※※MM" is displayed and the measurement ends. When using the 6 dB drop method, by setting the alarm bell in advance to a point 6 dB lower than the maximum echo height using the knob on the top of the measuring device, it is possible to know the target probe position without observing the echo height. (D-6). When the longitudinal scattered wave method (code: 05) is selected in the measurement item (D-1) using the longitudinal scattered wave method, the following is displayed. "M: Longitudinal F＝※ (1 or 2) T＝※※θ＝0X?DX?" is displayed. The operator inputs the beam path lengths of the U echo and L echo from the touch panel. The input order is the rising point of the incident wave, then the rising point of the U echo, then the rising point of the L echo. The above operation starts the calculation and "M: Longitudinal F＝※
(1 or 2) T = ** θ = 0 H = ** MM D = ** MM" is displayed and the measurement ends. (D-7). Measurement using edge peak echo method (a). If the edge peak echo method (code: 06) is selected in the operation of item (D-1), "M: Peak F = * (1 or 2) T = ** θ = ** X?" is displayed. The operator inputs the beam path length X from the touch panel. The input order is specified in the order of the rising point of the incident wave and the rising point of the reflected wave. (b). By operating item (a), "M: Peak F = * (1 or 2)
T = θ = D = MM Internal defect: 1 Opening defect: 2" is displayed. The operator determines whether it is an internal defect or a displayed opening defect.
In the case of a surface opening defect, enter "2" or "CR" using the keys, and in the case of an internal defect, enter "1" or "CR". (c) If you entered "1" or "CR" in item (b) (if it is determined to be an internal defect), enter "M: Peak F = * (1 or 2)
T = ** θ = ** X1?' is displayed. (c-1) The operator operates the probe and inputs the beam path distance X1 of the peak echo from the edge of the defect via the touch panel. The input order is the rising point of the incident wave, then the rising point of the peak echo. (c-2) By operating item (c-1), 'M: Peak F = **
(1 or 2) T = ** θ = ** X2?' is displayed. The operator operates the probe again and inputs the beam path distance X2 of the peak echo from the other end of the defect via the touch panel.
The input order is the rising point of the incident wave, followed by the rising point of the peak echo. (c-3) The echo height (H) is calculated by the operation in (c-2).
is calculated, and the defect depth (D) is recalculated, and the measurement is completed. (d) If "2" or "CR" is entered in item (b) (if it is determined to be a surface opening defect), "M: Peak F = * (1o
r2) T = θ = Top: 1 Bottom: 2. When the defect opening is on the top surface of the measurement material, the operator presses "1" and "CR".
When the measurement is on the bottom surface of the material, enter "2" and "CR" using the keys. (e) By operating item (d), "M: Peak F = * (1 or 2)
The operator inputs the beam path distance X of the reflected wave (peak echo) from the defect edge on panel 18.
The input order is the rising point of the incident wave, the reflected wave (peak echo)
(f) By operating item (e), "M: Peak F = * (1 or 2)
"T=※※θ=※※D=※※MM H=※※MM" is displayed and the measurement ends. The measurement items and details are outlined below. (A) Contact surface pressure measurement function When ultrasonic waves are applied to the contact surface S where metals are in contact with a certain surface pressure, the contact surface pressure (P) is calculated based on the principle that there is a correlation between the sound pressure ratio of the reflected wave from the contact surface S and the bottom surface B. As an example, as shown in Figure 13, we will explain a bearing consisting of a boss 32 made of steel and a bushing 31 made of sintered metal. In Figure 13, the magnitude of the reflected wave from the bottom surface of the boss _{is h1} , and the magnitude of the reflected wave from the bottom surface of the bushing is h2.
When h ₂ is used, the contact pressure P is expressed as follows: There are various calculation formulas depending on the material and shape of the part to be measured. The formulas differ when the surface to be measured is curved, when it is flat, etc. Furthermore, the formulas differ when the contact surfaces are steel to steel, when steel and gunmetal, etc. The calculation formula to be selected based on the difference in material and shape of the part to be measured is selected by the operator by keying on the keyboard 7. (B) Contact pressure pass/fail judgment function The set value for the contact pressure tolerance is determined in advance, and is compared with the actual measured value determined in (A) to judge pass/fail. An example of this set value P _A is formula (2). _d1 : Bushing inner diameter _d1 : Boss outer diameter _d2 : Bushing outer diameter δ: Interference _E1 , _E2 : Young's modulus _m1 , _m2 : Poisson's number Each of the above parameters is entered by the operator using the keys, but for typical measurement locations such as the bolt tightening surface, gear section, and arm bearings, the surface pressure tolerance can be determined by specifying the measurement location. (C) Flaw detection function As with a general flaw detector, the shape, size, depth, etc. of the defect are measured using echoes from the defect displayed on the CRT. (C-1) Measurement function using the maximum echo height method This method is used to determine the defect height in pipes 6mm or less. This method uses oblique incident waves. The "maximum echo height method" is used for angle beam flaw detection of plate thicknesses of 6mm or less using a probe with wideband frequency characteristics, and since there is a proportional relationship between the maximum echo height and the defect size,
This is a method for determining defect dimensions using this relationship. (See Hitachi Hyoron Vol. 64 No. 9 (1982) p. 69.) The measurement procedure for this method is as follows: (i) As shown in Figure 15 (A), the reference sensitivity is determined using the reference object 30B. The displayed results are shown below the figure. To do this, first determine and store the reference sensitivity: hs using JIS-STB-A2-φ4. (ii) As shown in Figure 15 (B), the echo height: h of the material to be measured 30C is determined, and the defect height: H is determined using equation (3). (C-2) Measurement function using the probe distance correction method The "probe distance correction method" is a method of determining the defect size by utilizing the proportional relationship between the maximum echo height, defect size, and the beam path length (or probe distance) when angle beam testing is performed on a plate thickness of 6mm to 28mm. (See Non-Destructive Inspection, Vol. 26, No. 5 (1977), p. 336.) This method uses oblique incident waves and calculates the maximum echo height (h).
The defect height (H) is calculated from the beam path length (X) at that time. Figures 16 (A) and (B) show the basic principle of the probe distance correction method. In this measurement, the plate thickness and maximum echo height, etc. are
Depends on the operator's instructions. It is also necessary to determine and store the reference echo height using a standard test piece specified by JIS in advance. (i) If the plate thickness of the inspection object is 6 mm or less, the defect height (H) is calculated using the following formula (4). (ii) When the thickness of the test object exceeds 6 mm (a). From Figure 17 (A) and (B), first use formula (5) or
The defect depth d is calculated using equation (6): d = X cos θ (5) d = 2t - X cos θ (6) In equations (5) and (6), t is the plate thickness (mm), and θ is the angle of incidence determined by the probe, which is entered in advance by the operator.
However, in equation (5), d≦t, and in equation (6), d>t.
In this device, first, the defect depth d is calculated using equation (5), and compared with t. If d>t, it is recalculated using equation (6). If the result of the above calculation is d≦3, it is displayed as a surface defect, and if d>3, it is displayed as an internal defect. (b) Based on the calculation result of (a), d≦3 (surface defect)
If t is greater than 3 (internal defect) and 6<t≦28, the defect height (H) is measured using the following formula (7). If d>3 (internal defect) and 6<t≦28, the defect height (H) is measured using formula (8). (The above is in auto mode.) However, if the operator knows in advance whether the defect is a surface or internal defect, the judgment based on the calculation result of term (a) can be changed by key input, and the defect height is found using formula (7) when a surface defect is indicated, and using formula (8) when an internal defect is indicated. (C-3) Measurement function using mode conversion surface wave method The "mode conversion surface wave method" is a method for determining defect dimensions by utilizing the beam path difference between the echo of a shear wave due to direct reflection at the defect and the echo obtained due to the mode conversion between shear waves and surface waves at the defect. (See "Non-Destructive Inspection", Vol. 28, No. 3 (1979), p. 182.) This method is used for measurement in the case of internal defects in test objects with a plate thickness of more than 28 mm. In this method, as shown in Figures 14 and 18, the defect height (H) is calculated from the time difference (ΔX) between the echo of the shear wave of the directly reflected wave (S echo) and the echo (R echo) due to the mode conversion from shear waves to surface waves at the defect. Note that
As is clear from Figures 14(A), (B) and (C),
Internal defects can be planar or spherical, but the shape is determined by the operator. In this method, calculations are performed using the following procedure: (i) The defect depth d is calculated using the above formulas (5) and (6). However, in this case, the beam path length X used is that of the S echo. The calculation order is (C-2)-(ii)-(a)
(ii) If the result of the calculation in (i) is d≦3 (surface defect), the calculation is performed using the above formula (7). (iii) If the result of the calculation in (i) is d>3 (internal defect), the calculation is performed using the above formula (7).
In this case, by specifying whether the defect is spherical or planar, the defect height is calculated using the following formula (9) or (10). (a) In the case of a planar defect, H = 0.91ΔX ... (9) (b) In the case of a spherical defect, H = 0.58ΔX ... (10) (iv) In the above item (ii), if the operator determines in advance whether the defect is a surface or internal defect, the calculation result of item (i) can be changed by key input. In the case of a surface defect, formula (7) is used, and in the case of an internal defect, formula (iii) is used.
Calculate the defect height using the formulas (9) and (10) according to the procedure in (C-4). The measurement function using the 6 dB drop method, "6 dB drop method", is performed when the probe is scanned back and forth.
Since there is a proportional relationship between the amount of forward/backward movement when the echo height drops by 6 dB (i.e., 1/2) from the maximum echo height and the defect size, this method utilizes this relationship to determine the defect size.
(See Material·Profng, Vol. 10, No. 10 (1968), p. 329.) This method determines the defect height by manipulating the probe and determining the moving range of the probe when the echo height drops 6 dB from the maximum echo height.
There are two cases, as shown in (B). Figure 19 (A) shows normal testing, and Figure 19 (B) shows angle beam testing. (i) In the case of normal testing, the defect height (H) is calculated from the amount of movement of the probe as shown in Figure 19 (A). In this case, the defect depth (d) is d = X (X: beam path length). (ii) In the case of angle beam testing, the defect height (H) is calculated using the following equation (11): H = (X ₂ -X ₁ ) cos θ ... (11) In this case, the defect depth is calculated using equation (5) or (6) using the beam path length (X) when the echo height is maximum. Here, X ₁ is the beam path length at the probe position where the echo height is 6 dB lower in front of the maximum echo height, and X ₂ is the beam path length behind it. In addition, with this method, by setting the alarm level at a point 6 dB below the maximum echo height, an alarm and lamp will be displayed when the echo height is 6 dB below the maximum echo height. At that point, the operator inputs the echo height. (C-5) Measurement function using the longitudinal scattered wave method "longitudinal scattered wave method" is a method that uses scattered echoes from the upper and lower tips of a defect obtained when a longitudinal wave is incident almost parallel to the defect surface, and determines the defect size from the difference in the beam path length of these echoes (Hitachi Hyoron Vol. 64, No. 9 (1982)
(See page 69 of the previous report.) As shown in Figures 20 (A) and (B), this method calculates the defect height from the time difference (ΔX) between the upper tip scattered wave (U) and the lower tip scattered wave (L) when a longitudinal wave is incident, and the defect height (H) is calculated using the following formula (12): H = ΔX ... (12) Also, the defect depth (d) is calculated using the following formula (13). (C-6) Measurement function using edge peak echo method The "edge peak echo method" is a method in which when a shear wave is incident on a planar defect, an echo is obtained from the edge of the defect, and the defect size is determined from the beam path where this echo is obtained (see Non-Destructive Inspection, Vol. 26, No. 5 (1977), p. 320). As is clear from Figure 21, there are two cases where the measurement object is an internal defect (Figure A) and one where the measurement object is a surface opening defect (Figure B). First, the defect depth d is determined using equation (5) or (6), and then the operator determines the depth using equations (14), (16), and (17).
Calculate the defect height (H) using either equation (15) or equation (6). However, if the result of calculation using equation (15) or equation (6) indicates that the defect is a surface defect, only calculate the defect height (H).
In the case of an internal defect, the defect height (H) is found and then the defect depth (d) is calculated again. (i) In the case of an internal defect, the defect height (H) is found using the following equation (14): H = ( _{X2 -X1} ) cosθ ... (14) Also, here, _X1 is the beam path length when a peak echo is obtained in the front, and _X2 is the beam path length when the peak echo is obtained in the rear.
The defect depth (d) is calculated by the following equation (15). (ii) In the case of a surface opening defect When the surface opening defect is on the same surface as the inspection surface, the following (16)
Calculate the defect height (H) using the formula: H = X cosθ (16) If the surface opening defect is on the opposite side to the surface to be inspected, use the following formula (1
7) The defect height (H) is calculated using the formula: H = t - X cosθ ... (17) Here, t is the plate thickness of the object being inspected. (C-7) Other functions (i) Rejection There is a rejection function that removes unnecessary echoes from flaw detection. Also, while rejection is in operation, the rejection lamp on the front panel lights up, prompting caution when recording data. (ii) Waveform switching It is possible to select the shape of the surface waveform, so a waveform can be obtained according to the measurement and surface purpose. (iii) Target echo search function Mode conversion This is a function to find the S echo and R echo used in the surface wave method. Since the waveforms displayed on the CRT are generally complex, it can be difficult to find the target echo until you get used to it. This function allows you to select the target S echo.
When the waveforms assumed to be echo and R echo are specified (specified on the touch panel), the beam path settings for those two waves are stored. Next, if you move the echo position and then specify (touch) the two waves mentioned above again, the microcomputer will automatically calculate and the difference between the previous beam path setting and the current beam path setting will be 10.
If the accuracy is within 100%, the device will display the correct answer (the two waves specified are S echo and R echo).
There are several types of recheck functions. (a) Clear function: If you want to check again after performing calculations using the above method, give the clear command and the correct answer display will disappear, allowing you to search for S echo and R echo again. The operation method and judgment criteria are the same as for the first time. (b) Triple check function: With this device, two checks are performed, and if it is judged to be correct, it can be checked again to reconfirm. In this case, the judgment is made by comparing the average value of the first and second data with the third data, and if the deviation is within 10%, it will display the correct answer. When using the above functions, the beam path length (X) uses the average value of the beam path length at each check. The processing flow chart for the microcomputer is shown in Figure 22.
The flowchart in Figure 22 shows the overall operation, and this flowchart is stored in the microcomputer's memory as a program. The program in Figure 22 starts when the power is turned on and is activated by the RISET signal. In the "Mode Selection" section, the operator selects which operating mode to use (surface pressure measurement, flaw detection, calibration, or test) and which of the six measurement methods for flaw detection to use. In the "Condition Setting" section, various measurement conditions are set, such as the refraction angle of the probe to be used, and the thickness, shape, and material of the object to be inspected. The "Data Input" section is the actual measurement section, and imports data from the touch panel. The "Calculation Processing" section calculates the measurement results using a predetermined equation determined by the touch panel data imported in the "Data Input" section and the measurement item and method. The "Display" section displays the calculation results numerically on the LCD display. In addition, the embodiment is equipped with a man-machine interface function via an LCD display to reduce the burden on the operator. In general, not only for measuring instruments, but for all instruments, the more sophisticated and multifunctional the device, the more complicated its operation becomes, making it impossible to use without thorough knowledge of how to use it. Furthermore, the operator must understand all of the information in order to fully utilize the device's functions, which increases the burden on the operator. Therefore, in this embodiment, all of the operator's operating procedures and details are sequentially displayed on the LCD display, allowing the operator to perform measurements by following the displayed information. The flow chart for this man-machine interface is shown in Figure 23. The program based on the flowchart in Figure 23 is a subroutine, and is therefore invoked by the main program whenever a man-machine interface is required in the sections marked with an asterisk in the flowchart in Figure 22. In the "Request Display" section of the flowchart in Figure 23, the LCD display displays the next step the operator should take. In the "Data Input" section, data entered by the operator using the keys or measurement data from the touch panel is read. In the "Confirmation Display" section, the data of the key or touch panel specified by the operator is displayed directly on the LCD display, and the operator is asked whether there are any mistakes in the instructions. In the "OK (Judgment)" section, the operator checks the above display and presses OK.
Enter YES or NO using the keys, and if it is OK, proceed to the "Display" section, and if it is NO, return to the "Request Display" section and re-enter the data. In the "Display" section, the data specified by the operator is displayed on the LCD display. By adopting this type of system, the operator only needs to read the manual and memorize the general operation method, and can operate the device without having to be familiar with the detailed methods, which reduces the burden on the operator and eliminates operational errors. Figure 24 shows the layout of various switches, keys, etc. on the front panel section (front section) 40 when the device is actually made into a portable type as a composite flaw detection device. Front panel section 40
, the CRT display surface 26A, the display surface 5A of the liquid crystal display 5, the keyboard arrangement surface 7A, and the setting switches 23A, 23B, 23C of the logarithmic converter 23.
C, the repeating period setting device 4 has a setting switch 4A.
A measuring range setting device 48 not disclosed in the embodiment of FIG.
It consists of a transmission terminal 41 to the probe 1, a reception terminal 42, an indicator 43 for power application, a battery lamp 44, an alarm lamp 45, a rejection lamp 46, a pulse position designation switch 47, and a reset button 49. The Float Pulse 40 is mounted in a size of 10 cm high, 20 cm wide, and 10 cm deep.
It can be made extremely small, with a length of about 30 cm and a weight of about 5 kg. This compact size makes it particularly easy to transport, allowing it to be transported to various measurement locations and applied to various measurement targets. This embodiment offers the following advantages: (1) It can be widely used, since it can measure not only the depth of the defect but also its size and shape. (2) By simply specifying (pressing or touching) any point on the CRT, the waveform data for that point is read and calculated. (3) It can also measure the contact pressure of bearings, etc., facilitating the maintenance and inspection of construction machinery and structures. (4) It uses a microcomputer to facilitate setup and operation, and digitally displays the size of the defect, contact pressure, etc. (5) It can be powered by a battery, making it convenient to use on-site. In addition to the six types mentioned above, there are other measurement modes available in the flaw detection mode, such as the well-known DGS (Distance Gain Size).
The F/B (Flaw/Bottom) method can also be applied. The present invention can be applied to various observation signals other than ultrasonic flaw detection. When an excited material is excited using an exciter, the vibration waveform from the excited material also exhibits a waveform similar to the ultrasonic response waveform. Therefore, the present invention can also be applied to the observation of such vibration waveforms. Figure 25 shows an observation signal for frequency measurement taken in and displayed as an observed waveform on the CRT display surface 26A. The observed waveform W is a waveform that is in an attenuated state overall,
The intervals of each period are detected from this waveform. To do this, the intersections _P1 , _P2 , _P3 , _P4 , and _P5 with the zero level Z are found. The microcomputer 10 takes in these intersections with the zero level, changes the coordinate system from the coordinate system of the position detection pulse to the coordinate system on the CRT screen, and calculates the intervals _T1 , _T2 , and _T3 for each period.
Using these values of _T1 , _T2 , and _T3 , the frequency (f) can be calculated by, for example, the averaging method, as follows: According to the present invention, a processing program corresponding to the composite measurement mode is prepared in the microcomputer, a position detection panel is attached to the display screen of the oscilloscope, and the position indicated in accordance with the processing program is input to the microcomputer from this position detection panel. This configuration makes it possible to easily perform measurements and automate the measurements while utilizing various measurement know-how gained through experience. Furthermore, because the position is specified using the position detection panel, the computer's memory capacity can be small, and various mounting boards are not required, making it possible to provide a portable ultrasonic composite flaw detector that is compact and lightweight overall.

──────────────────────────────────────────────────── Continued from the front page (56) References: Japanese Patent Application Publication No. 58-2651 (JP, A) Japanese Patent Application Publication No. 53-1586 (JP, A) Japanese Patent Application Publication No. 57-19836 (JP, A) Japanese Patent Application Publication No. 47-8206 (JP, A) Japanese Utility Model Application Publication No. 54-8458 (JP, U) Japanese Utility Model Application Publication No. 55-31188 (JP, U) Japanese Patent Publication No. 53-35460 (JP, B2) U.S. Patent No. 3608361 (US, A)

Claims (1)

[Claims] [Claim 1] A keyboard having a data calibration key, a composite flaw detection measurement mode designation key capable of designating a plurality of ultrasonic flaw detection measurement modes, and numeric input keys; a microcomputer having a processing program for the processing procedures corresponding to the calibration keys, and a processing program consisting of the processing procedures corresponding to each mode of the composite flaw detection measurement mode designation key, an arithmetic expression for performing calculations corresponding to each mode, and a function for outputting the calculation results; a display that displays the processing procedures and calculation results in the microcomputer; an oscilloscope device that displays the response observation signal of the object to be inspected from the ultrasonic probe directly on a CRT as an A-scope in accordance with the mode designation of the composite flaw detection measurement mode designation key without temporarily storing it; a transparent position detection panel that is attached to the CRT display surface of the oscilloscope device, is operated under a processing procedure determined in accordance with the mode designation, and outputs X and Y coordinate signals of an operation instruction point on the A-scope response observation signal waveform on the CRT; and the X and Y coordinate signals of the operation instruction point from the panel are taken into the microcomputer as signals on the observation signal waveform to be processed in accordance with the arithmetic expression at that time.
A man-machine interface type portable ultrasonic hybrid flaw detector consisting of an AD converter.