JPH07112110B2 - Removal method of flat lead parts - Google Patents

Description

Detailed Description [Overview] It is a remove method for flat lead parts, and after confirming that the parts to be removed can be adsorbed by vacuum, the remove work sequence is started and the package is cooled to prevent overheating of the package. In addition, the load is not applied to the parts to be removed.

[Industrial application field]

The present invention relates to a remove method for flat lead parts, for example, a remove method for replacing a package-shaped flat lead part mounted on a printed board through leads with another part due to a defect or a change in use.

[Conventional technology]

A conventional method of removing flat lead components will be described with reference to FIG.

(1) First, the suction vacuum pipe 1'is pressed against the upper surface of the flat lead component 3 '.

(2) Next, hot air is blown from the hot air nozzle 2'on the leads 4'as indicated by the arrow to melt the solder 41 'at the lead joint 4'.

(3) After blowing hot air for a predetermined time, this blowing operation is finished.

(4) Then, vacuum work is started (vacuum start).

(5) The vacuum work is completed after a predetermined time has elapsed.

(6) Parts 3'are removed by raising the suction vacuum pipe 1'in the direction of arrow A '.

[Problems to be solved by the invention]

 The above conventional technique has the following problems.

First, because the vacuum pipe 1'is pressed against the component 3 ', its load is always applied during the above-described remove sequence, and when the solder 41' of the lead 4'begins to melt, the position of the component 3 ' Misalignment or deformation of the lead 4'is likely to occur.

Secondly, since the hot air blowing work is completed ((3)) and the vacuum work is completed ((5)), it takes time to fix the solder 41 'which has been melted. Remove work becomes unstable.

Thirdly, since the adsorption is not completely performed depending on the shape of the component 3'and the vacuum pipe 1 ', the component may not be reliably removed even if the solder 41' is completely melted.

Fourthly, the heat from the hot air is conducted and the leads 4 '
From the component to the component 3 ', the component may be damaged.

Fifth, since the hot air diffuses not only into the solder 41 'but also around the solder 41', the signal discrete wire 5
Etc. may be damaged.

An object of the present invention is to solve the above problems, to make the vacuum pipe also serve as a cooling pipe, bend the hot air nozzle toward the lead joint, and start the remove sequence after confirming the component adsorption without applying a load to the component. Due to
It is to improve the efficiency of the remove work.

[Means for solving problems]

Means for achieving the above-mentioned object are to arrange a vacuum pipe above a flat lead component mounted on a printed board through a lead and a hot air nozzle above the lead, respectively, and to supply hot air from the hot air nozzle. In the remove system in which the solder of the lead is melted and the flat lead component is adsorbed by the vacuum pipe to remove the component, the vacuum pipe (1) is also used for cooling with adsorption and the hot air nozzle (2). Is bent toward the joint between the lead (4) and the printed board (6), the inside of the vacuum pipe (1) is first evacuated, and after confirming the suction of components, the vacuum pipe (1) is moved to a predetermined height (δh). Raise
Next, the solder (41) of the lead (4) is melted while blowing cooling air and hot air, and finally the vacuum pipe (1) is evacuated to remove the component after confirming the component adsorption.

[Action]

As described above, according to the present invention, the vacuum pipe is also used for cooling, the touch sensor is provided, and the hot air nozzle is bent toward the lead joint to bend the component without checking the sequence of the component after the suction confirmation of the component. I decided to start.

For this reason, the displacement of the component does not deform the lead,
In addition, the solder is no longer stuck and the component is completely adsorbed, and further damage to the component and breakage of the discrete wire are prevented, and the efficiency of the remove operation is further improved as compared with the conventional case.

〔Example〕

Hereinafter, the present invention will be described by way of examples with reference to the accompanying drawings.

FIG. 1 is a diagram showing an embodiment of the present invention.

In the drawings, reference numeral 1 is a vacuum pipe, 2 is a hot air nozzle, 3 is a flat lead component, 4 is a lead,
Reference numeral 5 is a discrete wire, 6 is a printed board, 11 is a touch sensor, and 12 is cooling air.

The lead 4 is joined to the printed board 6 by solder 41, and the flat lead component 3 is connected to the lead 4.

The flat lead component 3 is in the form of a package, and the vacuum pipe 1 is arranged above the upper surface thereof.

The vacuum pipe 1 is adapted to be attracted to the upper surface of the flat lead component 3 by a vacuum action to remove the component and also to release cooling air for cooling. In addition, a touch sensor is provided at the opening of the vacuum pipe 1.
11 is provided to check the presence / absence of a component and to detect the height of the component package surface.

A hot air nozzle 2 is arranged above the joint between the lead 4 and the printed board 6, and the nozzle is bent toward the joint so that hot air is directly blown only to the joint, and a discrete wire for signal is provided. It is designed not to damage the etc.

Next, the operation of the apparatus of FIG. 1 having the above configuration will be described step by step.

(1) First, the vacuum pipe 1 is lowered onto the upper surface of the component 3, and the presence or absence of the component and the height of the component package surface are detected by the touch sensor 11.

(2) Next, the inside of the vacuum pipe 1 is evacuated to check whether or not the component 3 can be adsorbed.

(3) After confirming component suction, raise the vacuum pipe 1 by a predetermined height dimension δh.

This δh is set to the minimum dimension that allows the flat lead component to be adsorbed without the pattern rising on the printed board or the component lead being deformed.

(4) After that, cooling air is supplied from the vacuum pipe 1.
12 is sprayed and hot air is sprayed from the hot air nozzle 2.

The cooling air is blown to the entire flat lead component 3 through the gap having the height dimension δh described above, and thermal destruction of the component is prevented.

(5) The discharge of cooling air is stopped and the inside of the vacuum pipe 1 is evacuated.

(6) Components are adsorbed to the vacuum pipe 1 that has been evacuated, and the confirmation is performed.

(7) Stop the hot air discharge, vacuum pipe 1
While adsorbing the component 3 on the above, the component 3 is lifted in the direction of the arrow A to remove the component.

In this case, if the suction signal of the component is not input within the predetermined time, alarm processing, for example, alarm lamp on, return of the vacuum pipe head to the origin and the like are performed.

〔The invention's effect〕

Since the present invention is configured as described above, the following effects can be achieved.

First, since no load is applied to the component 3 while the solder 41 of the lead 4 is being melted, displacement of the component 3 and deformation of the lead 4 do not occur.

Secondly, since the release of the hot air and the removal of the component are performed at the same time after the component is adsorbed, the remove error caused by the re-adhesion of the molten solder does not occur.

Thirdly, since the remove sequence is started after confirming the component adsorption, the remove error after the complete melting of the solder does not occur.

Fourthly, since the parts are cooled by discharging the cooling air, there is no obstacle due to overheating of the parts.

Fifth, since the hot air nozzle was bent toward the lead joint, damage to the discrete wire and the like around the component disappeared.

For this reason, the efficiency of the removal work of the flat lead parts is further improved as compared with the conventional one.

Furthermore, for cooling air blowing for cooling, the vacuum pipe also serves as the cooling pipe,
Since it can be performed, there is a secondary effect that the structure of the remove head can be simplified.

[Brief description of drawings]

FIG. 1 is a diagram showing an embodiment of the present invention, and FIG. 2 is an explanatory diagram of a conventional technique. 1 ... Vacuum pipe, 2 ... Hot air nozzle, 3
Flat lead parts, 4 leads, 5 discrete wires, 6 printed boards, 11 touch sensors, 12 cooling air, 41 solder.

Claims (1)

[Claims] 1. A vacuum pipe is provided above a flat lead component mounted on a printed board via a lead, and a hot air nozzle is provided above the lead, and the solder of the lead is melted by hot air from the hot air nozzle. In the remove system in which the flat parts are removed by sucking the flat parts with a vacuum pipe, the vacuum pipe (1) is also used for cooling with suction and the hot air nozzle (2) is printed with the lead (4). Bend toward the joint of the plate (6), first evacuate the inside of the vacuum pipe (1), and after confirming the component adsorption, vacuum the pipe (1) to a predetermined height (δh).
The flat lead is characterized in that the solder (41) of the lead (4) is melted while blowing cooling air and hot air, and finally the vacuum pipe (1) is evacuated to remove the component after confirming the component adsorption. Parts removal method.