JPH07112641B2 - Diamond-coated cutting tool and manufacturing method thereof - Google Patents
Diamond-coated cutting tool and manufacturing method thereofInfo
- Publication number
- JPH07112641B2 JPH07112641B2 JP60094181A JP9418185A JPH07112641B2 JP H07112641 B2 JPH07112641 B2 JP H07112641B2 JP 60094181 A JP60094181 A JP 60094181A JP 9418185 A JP9418185 A JP 9418185A JP H07112641 B2 JPH07112641 B2 JP H07112641B2
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- Prior art keywords
- diamond
- film
- cutting tool
- cutting
- coated cutting
- Prior art date
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Description
【発明の詳細な説明】 （発明の分野） 本発明は表面にダイヤモンド膜を有する切削工具に関
し、より詳細には、ダイヤモンド膜の剥離のない切削性
能に優れた切削工具に関する。Description: FIELD OF THE INVENTION The present invention relates to a cutting tool having a diamond film on its surface, and more particularly to a cutting tool excellent in cutting performance without peeling of a diamond film.
（従来技術） 従来から、切削工具としては超硬合金、Al2O3等の酸化
物、SiC、Si3N4等の炭化物、窒化物が、あるいは超硬合
金に炭化物、窒化物を被覆したものが、強度および耐摩
耗性にすぐれることから一般的に使用されている。(Prior Art) Conventionally, as a cutting tool, cemented carbide, oxides such as Al 2 O 3 , carbides and nitrides such as SiC and Si 3 N 4 , or cemented carbides coated with carbides and nitrides However, it is generally used because of its excellent strength and abrasion resistance.
近年に至っては、さらに耐摩耗性を有する材料として、
ダイヤモンドが注目され、薄膜技術の発展に伴い所定の
基体表面にダイヤモンド膜を気相成長法等により設けて
成る耐摩耗性に優れた切削工具が提案されている。In recent years, as a material having further wear resistance,
Diamond has attracted attention, and with the development of thin film technology, a cutting tool excellent in wear resistance has been proposed which is formed by providing a diamond film on a predetermined substrate surface by a vapor phase growth method or the like.
しかしながら、気相成長法により基体、例えば窒化ケイ
素上に設けられたダイヤモンド膜は、それ自体多結晶で
あり、その表面層には、約３〜５μｍの凹凸が形成され
ている。特に刃部等のエッジ部では、第１図および第２
図のエッジ部の電子顕微鏡写真からも明らかなように異
常成長が起りやすく、10μｍ以上の粒子が成長すること
もある。However, the diamond film provided on the substrate, for example, silicon nitride by the vapor phase growth method is itself polycrystalline, and irregularities of about 3 to 5 μm are formed on its surface layer. Especially in the edge part such as the blade part, FIG.
As is clear from the electron micrograph of the edge portion in the figure, abnormal growth is likely to occur, and particles of 10 μm or more may grow.
このようなダイヤモンド被覆切削工具を用いて、切削を
行なう場合、被削材の切屑と刃先表面との摩擦抵抗が過
大となり、切屑が膜表面の凹凸部に溶着し、切削性能を
低下させる恐れがあり、しかも、膜の凹凸に応じて摩擦
抵抗による外部応力が膜に対し局部的に加わり、膜の剥
離を起こす原因となっていた。特に、ダイヤモンド被覆
切削工具の特徴である高速切削時には、これらの傾向が
顕著であり、実用化に乏しいものであった。When cutting is performed using such a diamond-coated cutting tool, the friction resistance between the chips of the work material and the cutting edge surface becomes excessive, and the chips may adhere to the uneven portions of the film surface, which may reduce the cutting performance. In addition, the external stress due to the frictional resistance is locally applied to the film according to the unevenness of the film, which causes the film to peel off. In particular, during high-speed cutting, which is a characteristic of diamond-coated cutting tools, these tendencies are remarkable, and they are not practically used.
（発明の構成） 本発明者等は、気相成長法により工具基体上のダイヤモ
ンド膜表面の表面粗さを１μｍ以下にすることにより、
高速切削時においても膜剥離のない切削性能に優れた切
削工具が得られることを知見した。(Structure of the Invention) The present inventors set the surface roughness of the diamond film surface on the tool substrate to 1 μm or less by the vapor phase growth method.
It was found that a cutting tool having excellent cutting performance without film separation even at high speed cutting can be obtained.
即ち、本発明によれば靭性（K1c）6MPa・ｍ1/2以上の基
体の少なくとも刃部を含む表面にダイヤモンド膜を形成
させたダイヤモンド被覆切削工具において、少なくとも
刃部のダイヤモンド膜が11μｍ以上の膜厚を有するとと
もに、ダイヤモンド膜の表面粗さが１μｍ以下であるこ
とを特徴とするダイヤモンド被覆切削工具が提供され
る。That is, according to the present invention, in a diamond-coated cutting tool in which a diamond film is formed on the surface of a substrate having a toughness (K 1 c) of 6 MPa · m 1/2 or more including at least the blade portion, at least the diamond film of the blade portion is 11 μm. A diamond-coated cutting tool having the above-mentioned film thickness and having a surface roughness of the diamond film of 1 μm or less is provided.
さらに、本発明によれば靭性（K1c）6MPa・ｍ1/2以上の
基体上に気相成長法によりダイヤモンド膜を形成した
後、ダイヤモンド膜の少なくとも刃部を含む表面を表面
粗さ１μｍ以下、および膜厚11μｍ以上に研摩すること
を特徴とするダイヤモンド被覆切削工具の製造方法が提
供される。Further, according to the present invention, after forming a diamond film on a substrate having a toughness (K 1 c) of 6 MPa · m 1/2 or more by a vapor phase growth method, the surface of the diamond film including at least the blade portion has a surface roughness of 1 μm. The following provides a method for manufacturing a diamond-coated cutting tool, which comprises polishing to a film thickness of 11 μm or more.
CVD法等の気相成長法によりダイヤモンド膜を設ける場
合、条件によって結晶質ダイヤモンドまたはダイヤモン
ド状（非晶質）炭素が形成されるが、切削工具用として
は、結晶質の方が非晶質に比較して、基体との付着力、
熱応力、膜強度が優れることから、結晶質ダイヤモンド
が好ましい。結晶質ダイヤモンドは、窒化ケイ素等の基
体に対しては、核成長により多結晶が形成される。多結
晶質ダイヤモンドは単結晶ダイヤモンドと比較して膜強
度に優れることから切削工具等には好適である。多結晶
ダイヤモンド膜は、その結晶粒径にもよるが、その表面
層は第２図のダイヤモンド膜の顕微鏡写真に示されるよ
うに単位結晶粒間には谷間が形成され、全体として凹凸
が形成される。When a diamond film is formed by a vapor deposition method such as CVD method, crystalline diamond or diamond-like (amorphous) carbon is formed depending on the conditions, but for cutting tools, crystalline is more amorphous. By comparison, the adhesion to the substrate,
Crystalline diamond is preferable because it has excellent thermal stress and film strength. Polycrystalline diamond is formed by nucleus growth on a substrate such as silicon nitride. Polycrystalline diamond is suitable for cutting tools and the like because it is superior in film strength to single crystal diamond. Although depending on the crystal grain size of the polycrystalline diamond film, a valley is formed between the unit crystal grains in the surface layer as shown in the microscopic photograph of the diamond film in FIG. 2, and unevenness is formed as a whole. It
本発明においては、この凹凸、即ち表面粗さ、詳しくは
最大高さ粗さ（JIS B0601に基づく）を１μｍ以下、よ
り好ましくは0.2μｍ以下に制御することが重要であ
る。この構成により、被削材の切屑と刃部表面との抵抗
が低減されるとともに局部的な外部応力の発生を防止す
ることができ、膜の剥離を低減し、切削工具の寿命を向
上させることができる。表面粗さが１μｍより大きくな
ると、前述したように切屑との抵抗が大きくなり、ダイ
ヤモンド膜の剥離をきたす。In the present invention, it is important to control the unevenness, that is, the surface roughness, specifically, the maximum height roughness (based on JIS B0601) to 1 μm or less, more preferably 0.2 μm or less. With this configuration, it is possible to reduce the resistance between the chips of the work material and the surface of the blade portion and prevent the occurrence of local external stress, reduce the peeling of the film, and improve the life of the cutting tool. You can If the surface roughness is larger than 1 μm, the resistance to the chips becomes large as described above, and the diamond film is peeled off.
ダイヤモンド膜の成膜時の表面は、成膜条件にもよる
が、膜厚が小さい程平滑であるが、所望の切削性能を得
るためには膜強度を大きくする必要があることから、ダ
イヤモンド膜の膜厚は、11μｍ以上、好ましくは30乃至
100μｍに制御すべきである。膜厚が0.1μｍ未満である
と膜強度が不十分であり、剥離し易くなる。また、工具
のコーナー部、特に刃部には、前述したように数μｍ〜
10μｍの粒径の結晶粒が成長しやすく、しかも結晶粒間
には谷間が形成されるので、膜厚が11μｍより薄い場
合、谷間の部分の影響が強く、切削時の衝撃が加わる
と、谷間の部分に応力が集中するため、膜の剥離が発生
しやすくなる。100μｍを超えると成膜時間が長くな
り、生産効率およびコストの面から好ましくない。Although the surface of the diamond film during film formation is smoother as the film thickness decreases, depending on the film formation conditions, it is necessary to increase the film strength to obtain the desired cutting performance. Has a thickness of 11 μm or more, preferably 30 to
It should be controlled to 100 μm. When the film thickness is less than 0.1 μm, the film strength is insufficient and peeling easily occurs. In addition, as described above, the corner portion of the tool, especially the blade portion, is several μm to
Since crystal grains with a grain size of 10 μm easily grow and a valley is formed between the crystal grains, when the film thickness is less than 11 μm, the influence of the valley portion is strong, and when a shock is applied during cutting, Since the stress concentrates on the portion, peeling of the film is likely to occur. When it exceeds 100 μm, the film formation time becomes long, which is not preferable in terms of production efficiency and cost.
切削工具用の基体としては、それ自体ある程度の機械的
強度を必要とし、例えば超硬、サーメット、ジルコニ
ア、窒化珪素、炭化珪素等が挙げられるが、ダイヤモン
ド膜との密着性を考慮した場合、特に窒化珪素質焼結体
が最も好適である。また、ダイヤモンド被覆切削工具
は、仕上げ用としても適するが、仕上用工具形状はシャ
ープエッジを有するため靭性の高いものが要求される。
このような点から、靭性（K1c）は6MPa・ｍ1/2以上が好
適である。K1cが6MPa・ｍ1/2より小さいと、切削時、お
よび取扱い時にエッジ部からチッピングを起こし、ダイ
ヤモンド膜の剥離の原因となる。The substrate for a cutting tool requires a certain amount of mechanical strength itself, and includes, for example, cemented carbide, cermet, zirconia, silicon nitride, silicon carbide, etc., but when considering the adhesion with a diamond film, The silicon nitride sintered material is most suitable. The diamond-coated cutting tool is also suitable for finishing, but the finishing tool shape is required to have high toughness because it has a sharp edge.
From this point of view, the toughness (K 1 c) is preferably 6 MPa · m 1/2 or more. If K 1 c is smaller than 6 MPa · m 1/2 , chipping will occur from the edge portion during cutting and handling, which may cause peeling of the diamond film.
前述したように膜表面には成膜時、核成長による多結晶
が形成されるが、おのおのの結晶粒子の粒径は、膜強度
を考慮すれば、粒径の大きい方が好ましい。具体的に
は、成膜時の膜面のおのおのの凹凸から測定し、0.5μ
ｍ以上が好ましい。As described above, polycrystals are formed on the surface of the film by the nucleus growth at the time of film formation, but it is preferable that the particle size of each crystal particle is larger in view of film strength. Specifically, 0.5μ is measured from the unevenness of each film surface during film formation.
m or more is preferable.
表面粗さ１μｍ以下のダイヤモンド膜を得るためには、
気相成長法による成膜条件を制御し、前述した所定の膜
厚、結晶粒径を有するダイヤモンド膜を形成することも
可能ではあるが、先にも述べたように膜厚を大きくする
と、表面粗さは、大きくなる傾向にあり、表面粗さ１μ
ｍ以下のダイヤモンド膜を得るため、膜厚を小さくして
も異常成長粒や異常成長部が存在する事があるため、膜
剥離を招き易い。To obtain a diamond film with a surface roughness of 1 μm or less,
It is possible to form a diamond film having the above-mentioned predetermined film thickness and crystal grain size by controlling the film-forming conditions by the vapor phase epitaxy method. Roughness tends to increase, surface roughness 1μ
In order to obtain a diamond film having a thickness of m or less, abnormally grown grains or abnormally grown portions may exist even if the film thickness is reduced, so that film peeling is likely to occur.
また、ダイヤモンド膜を生成した場合に生じる粒子間の
谷間は、膜の亀裂と等価であり、膜に負荷が加わった時
に亀裂が発展してクラックとなり、クラックが基体と膜
との界面まで達するとクラックは界面を伝わり、膜剥離
を起こす。Further, the valley between particles generated when a diamond film is formed is equivalent to a crack in the film, and when a load is applied to the film, the crack develops and becomes a crack, and when the crack reaches the interface between the substrate and the film. The crack propagates through the interface and causes film peeling.
このようなことから、本発明の切削工具の製造に当たっ
ては、熱CVD,rfプラズマCVD,マイクロ波CVD,ECRプラズ
マCVD等のCVD法、イオンビーム法、スパッタ法等公知の
気相成長法により、ダイヤモンド膜を形成した後、ダイ
ヤモンド膜を研摩し、表面粗さを１μｍ以下に制御する
ことが最適である。この研摩処理により、第３図の電子
顕微鏡写真に示すようにほとんど凹凸のない平滑な面を
得ることができる。なお、研摩後の膜厚は、11μｍ以上
にすべきである。膜厚が11μｍより小さいと、膜と基体
との密着が不十分であり、膜強度も弱いため、切削時膜
剥離を生じ易くなる。このような構成により膜強度に優
れ、剥離のないダイヤモンド膜を形成することができ
る。Therefore, in manufacturing the cutting tool of the present invention, thermal CVD, rf plasma CVD, microwave CVD, CVD method such as ECR plasma CVD, ion beam method, by a known vapor phase growth method such as sputtering method, After forming the diamond film, it is optimal to polish the diamond film to control the surface roughness to 1 μm or less. By this polishing treatment, a smooth surface with almost no unevenness can be obtained as shown in the electron micrograph of FIG. The film thickness after polishing should be 11 μm or more. When the film thickness is less than 11 μm, the film and the substrate are not sufficiently adhered to each other and the film strength is weak, so that the film peeling easily occurs during cutting. With such a structure, it is possible to form a diamond film that is excellent in film strength and does not peel off.
ダイヤモンド膜の研摩を行なう際は、公知の任意の手段
を用いることができ、例えばラッピング、ポリッシング
等により行なうことができる。When polishing the diamond film, any known means can be used, for example, lapping, polishing or the like.
本発明を次の例で説明する。The invention is illustrated by the following example.
実施例 （ダイヤモンド膜形成） 靭性が異なる各種の窒化珪素質焼結体からなる切削工具
用基体に第１表の４種の方法によりダイヤモンド膜を形
成した。Example (Diamond film formation) A diamond film was formed on a cutting tool substrate made of various silicon nitride sintered bodies having different toughness by the four kinds of methods shown in Table 1.
（研摩工程） ダイヤモンドホィールにより研摩を行なった。 (Polishing process) Polishing was performed with a diamond wheel.
（特性測定） 下記の方法に従い、それぞれの基体の靭性、表面粗さを
測定し、切削テストを行なった。(Measurement of characteristics) The toughness and surface roughness of each substrate were measured according to the following methods, and a cutting test was performed.
A.靭性（K1c） 圧痕押し込み法により測定した。A. Toughness (K 1 c) Measured by the indentation method.
B.表面粗さ JIS規格B 0601に基づき、触針式表面粗さ測定器および
走査型電子顕微鏡により最大高さ粗さを求めた。B. Surface Roughness Based on JIS Standard B 0601, the maximum height roughness was determined by a stylus type surface roughness measuring instrument and a scanning electron microscope.
C.切削テスト ・被削材…Al−Si（18％）合金 ・切削条件 （Ｉ）切削速度 200（m/min） 送 り 0.1（mm/rev） 切り込み 0.2（mm） 時 間 ５（min） （II）切削速度 700（m/min） 送 り 0.1（mm/rev） 切り込み 0.2（mm） 時 間 ５（min） （測定結果） 測定結果は第２表に示した。C. Cutting test ・ Work material: Al-Si (18%) alloy ・ Cutting conditions (I) Cutting speed 200 (m / min) Feed 0.1 (mm / rev) Cut 0.2 (mm) Time 5 (min) (II) Cutting speed 700 (m / min) Feed 0.1 (mm / rev) Depth of cut 0.2 (mm) Time 5 (min) (Measurement result) The measurement results are shown in Table 2.
第２表から明らかな通り、基体の靭性が本発明の範囲よ
りも小さい試料No.6,7はいずれもチッピング又は膜剥離
を発生し、摩耗も大きいものであった。また、表面粗さ
が1.5μｍの研摩を行なわなかった試料No.11は、低速切
削テストの（Ｉ）では剥離、摩耗はないものの溶着が多
いもので、高速切削テスト（II）では使用に耐えないも
のであった。さらに成膜条件を変更し、成膜時で表面粗
さ0.1μｍのダイヤモンド膜を有する試料No.12は膜の結
晶粒径が小さく低速切削テストではほとんど問題なかっ
たが、高速テストでは、使用に耐えないものであった。
膜厚が、11μｍより小さい試料No.13は低速テストでさ
え膜剥離が発生し、使用できなかった。これら以外の本
発明の試料はいずれも優れた切削性能を示し、低速、高
速切削テストでもまったく問題はなかった。As is clear from Table 2, in Sample Nos. 6 and 7 in which the toughness of the substrate was smaller than the range of the present invention, chipping or film peeling occurred and wear was large. In addition, Sample No. 11 with a surface roughness of 1.5 μm that was not ground was peeled off in the low speed cutting test (I), and there was much wear even though there was no wear, and it could withstand use in the high speed cutting test (II). It was not there. Furthermore, by changing the film formation conditions, sample No. 12 having a diamond film with a surface roughness of 0.1 μm at the time of film formation had a small crystal grain size of the film and had no problem in the low speed cutting test, but was used in the high speed test. It was unbearable.
Sample No. 13 having a film thickness of less than 11 μm could not be used because film peeling occurred even in the low speed test. All the samples of the present invention other than these showed excellent cutting performance, and there was no problem even in the low speed and high speed cutting tests.
（発明の効果） 本発明のダイヤモンド被覆切削工具および切削工具の製
造方法によれば、切削時の刃部と、被削材との抵抗を低
減でき、しかも刃部にかかる応力を均一にすることがで
きることから、ダイヤモンド膜の剥離がなく、耐摩耗性
に優れ、低速、高速切削にも適用し得る優れた切削性能
を有する切削工具を得ることができる。 (Effect of the Invention) According to the diamond-coated cutting tool and the method for manufacturing a cutting tool of the present invention, it is possible to reduce the resistance between the blade portion and the work material during cutting, and to make the stress applied to the blade portion uniform. Therefore, it is possible to obtain a cutting tool having no diamond film peeling, excellent wear resistance, and excellent cutting performance applicable to low speed and high speed cutting.
第１図および第２図は、刃部におけるダイヤモンド膜表
面の電子顕微鏡写真、第３図は研摩後のダイヤモンド膜
の電子顕微鏡写真である。1 and 2 are electron microscope photographs of the diamond film surface at the blade portion, and FIG. 3 is an electron microscope photograph of the diamond film after polishing.
Claims (4)
焼結体からなる基体の少なくとも刃部を含む表面にダイ
ヤモンド膜を形成させたダイヤモンド被覆切削工具にお
いて、少なくとも刃部のダイヤモンド膜が11μｍ以上の
膜厚を有するとともにダイヤモンド膜の表面粗さが１μ
ｍ以下であることを特徴とするダイヤモンド被覆切削工
具。1. A diamond-coated cutting tool having a diamond film formed on a surface including at least a blade portion of a substrate made of a silicon nitride sintered body having a toughness (K 1 c) of 6 MPa · m 1/2 or more, at least a blade Part of the diamond film has a film thickness of 11 μm or more and the surface roughness of the diamond film is 1 μm
A diamond-coated cutting tool having a diameter of m or less.
である特許請求の範囲第１項記載のダイヤモンド被覆切
削工具。2. The diamond-coated cutting tool according to claim 1, wherein the crystal grain size of the diamond film is 0.5 μm or more.
焼結体からなる基体上に気相成長法によりダイヤモンド
膜を形成した後、ダイヤモンド膜の少なくとも刃部を含
む表面を表面粗さ１μｍ以下、および膜厚11μｍ以上に
研摩することを特徴するダイヤモンド被覆切削工具の製
造方法。3. After forming a diamond film by a vapor phase epitaxy method on a substrate made of a silicon nitride sintered body having a toughness (K 1 c) of 6 MPa · m 1/2 or more, at least a blade portion of the diamond film is included. A method for producing a diamond-coated cutting tool, which comprises polishing the surface to have a surface roughness of 1 μm or less and a film thickness of 11 μm or more.
である特許請求の範囲第３項記載のダイヤモンド被覆切
削工具の製造方法。4. The method for producing a diamond-coated cutting tool according to claim 3, wherein the crystal grain size of the diamond film is 0.5 μm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60094181A JPH07112641B2 (en) | 1985-04-30 | 1985-04-30 | Diamond-coated cutting tool and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60094181A JPH07112641B2 (en) | 1985-04-30 | 1985-04-30 | Diamond-coated cutting tool and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61252004A JPS61252004A (en) | 1986-11-10 |
| JPH07112641B2 true JPH07112641B2 (en) | 1995-12-06 |
Family
ID=14103154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60094181A Expired - Lifetime JPH07112641B2 (en) | 1985-04-30 | 1985-04-30 | Diamond-coated cutting tool and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07112641B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5334453A (en) * | 1989-12-28 | 1994-08-02 | Ngk Spark Plug Company Limited | Diamond-coated bodies and process for preparation thereof |
| US5855974A (en) * | 1993-10-25 | 1999-01-05 | Ford Global Technologies, Inc. | Method of producing CVD diamond coated scribing wheels |
| JP2013233793A (en) * | 2012-04-13 | 2013-11-21 | Mitsuboshi Diamond Industrial Co Ltd | Scribing wheel and method of manufacturing the same |
| DE102013218446A1 (en) * | 2013-09-13 | 2015-03-19 | Cemecon Ag | Tool and method for cutting fiber reinforced materials |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60152676A (en) * | 1984-01-18 | 1985-08-10 | Hitachi Choko Kk | Surface-coated sintered hard member |
-
1985
- 1985-04-30 JP JP60094181A patent/JPH07112641B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61252004A (en) | 1986-11-10 |
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| Date | Code | Title | Description |
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| EXPY | Cancellation because of completion of term |