JPH07113776B2 - Resist developing device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a resist developing apparatus, and more particularly to a resist developing apparatus for developing a resist layer mounted on an object to be developed such as a semiconductor wafer, a semiconductor mask and an optical disk.

(Prior Art) Conventionally, a resist developing apparatus of this type is described in, for example, Japanese Unexamined Patent Publication No. 57-166032, and as shown in FIG. 2, a semiconductor wafer housed in a developing tank (D) ( The resist solution on the wafer (W) is developed by discharging the chemical solution used for the developing process from the discharging means (N) such as a nozzle to W).

In addition to the so-called developing solution that dissolves the resist layer, generally, the chemical solution is a pretreatment solution for removing the variation in resist sensitivity due to the aging of the wafer (W) prior to the release of the developing solution, and After the developing solution is released, the wafer (W) is cleaned by a post-treatment solution or the like.
Organic solvents or inorganic solvents are widely used.

(Problems to be Solved by the Invention) By the way, the developing tank (D) is naturally provided with an inlet / outlet port for the wafer (W) so that the wafer (W) can be inserted and removed. Is there.

Then, the entrance and exit is closed by a door having a sheet surface to seal the inside of the developing tank (D) to the outside, but this seal is not perfect, and
When the chemical solution is discharged from the discharging means (N), the internal pressure of the developing tank (D) rises and a pressure difference is generated between the developing tank (D) and the outside. There is a problem that the alkaline solvent leaks and contaminates the clean room in which the developing tank (D) is installed.

After completion of development in the developing tank (D), so-called nitrogen blowing for blowing nitrogen gas is performed to replace the inside of the developing tank (D) with nitrogen for the purpose of drying the wafer (W). However, when the wafer (W) is taken out and a new wafer (W) is set, when the door is opened, the remaining organic solvent gas or the like remains. Since it flows out to the outside, there is a problem that the clean room in which the developing tank (D) is installed is also contaminated by this outflow.

An object of the present invention is to solve the above problems and to provide a resist developing apparatus capable of preventing the chemical solution from contaminating a room such as a clean room where the developing apparatus is installed.

(Means for Solving the Problems) Therefore, the present invention is configured as shown in FIG. 1, and the development target (W) is inserted into and removed from the development tank (1). A resist developing device comprising a holding means (W) and a discharging means (2) for discharging a chemical solution to be used in a developing process, the developing object being held by the holding means. Opening and closing means (2
An opening for connecting to the negative pressure source (5) via 7) and for covering the outer portion of the developing tank (1) to allow the development target (W) to be taken in and out of the developing tank (1). (20) (For example, an inlet / outlet in a closed type developing tank, an open portion in an open type developing tank, etc.), and the object to be developed (W) put in / out through the opening (20) The cover body (4) including the transfer space (8) is provided, and the inside of the cover body (4) is connected to the negative pressure source (5) through the backflow prevention means (28). It is what

(Function) By opening the opening / closing means (27) and connecting the inside of the developing tank (1) to the negative pressure source (5), it can be made suitable for exhausting nitrogen blow. In addition, when the development target (W) is taken in and out,
Organic solvent and the like leaking to the outside of the developing tank (1) can be confined inside the cover body (4) and exhausted to the negative pressure source (5), and at the same time, the developing operation is accompanied by the opening operation of the opening / closing means (27). It is possible to prevent the gas exhausted from the inside of the tank (1) to the negative pressure source (5) from flowing backward to the cover body (4) side by the backflow blocking means (28), and the negative pressure source from the cover body (4). Exhaust to (5) can be secured well. In this way, both exhaust from the inside of the developing tank (1) to the negative pressure source (5) and exhaust from the cover body (4) covering the outside of the developing tank (1) to the negative pressure source (5) are made compatible. Therefore, the contamination of the clean room can be reliably prevented.

(Embodiment) The one shown in FIG. 1 is one in which a developing tank (1) is supported on the upper surface of a frame (100) which is framed, and a frame (201) for mounting a wafer cassette (200) described later is installed. The developing tank (1) includes a dome-shaped casing (11) having a double-wall structure, a bottom wall (12) and a ceiling plate (13), and a developing object (W) such as a semiconductor wafer is provided inside. A developing chamber (10) for developing the wafer (hereinafter simply referred to as a wafer) is formed, and an inlet / outlet port (20) serving as an opening portion for loading / unloading the wafer (W) to the side of the casing (11), and A door (21) for opening and closing the entrance (20) is provided.

Further, a support cylinder (15) is erected on the bottom wall (12), and a chuck (16) constituting a holding means for the wafer (W) is provided on the upper end of the support cylinder (15) via a rotary shaft (17). The chuck (16) is rotatably mounted and is rotated by a motor (M) via a belt (101).

Further, on the ceiling plate (13), a discharging means such as a spray nozzle for discharging a chemical solution used for a developing process such as a developing solution to the wafer (W) held by the chuck (16) and rotating. (2) is arranged, and the discharge means (2) is partially coiled, and a chemical liquid container (a chemical tank for constituting a pressurization tank via a liquid supply pipe (6) built in the casing (11) ( 3), and the chemical liquid is discharged from the discharging means (2) to the wafer (W) by jetting, for example, as indicated by a dotted arrow in the figure. Examples of the chemical liquid include a pretreatment liquid, a developing liquid, a post-treatment liquid, and the like, and a discharge means (2) or the like may be provided for each of these chemical liquids, or a switching valve or the like in the liquid supply pipe (6). May be provided so that the discharging means (2) is also used.
In addition, the liquid delivery pipe (6) is provided with a control valve (6
1) and a strainer (62) for removing minute dust in the chemical solution.

An example of the chemical solution using an organic solvent is a mixture of isobutyl alcohol and ethanol at a ratio of about 50:50, and an example of the chemical solution using an inorganic alkaline solvent is about 5% ammonia water. is there.

On the other hand, the gantry (201) is installed on the upper part of the frame (100) at a position opposite to the entrance (20), and the gantry (201) accommodates a plurality of wafers (W). The cassette (200) is placed,
The wafers (W) are taken out from the cassette (200) one by one, and are transferred into and out of the developing tank (1) by the transfer arm (9) via the entrance (20). still,
The transfer arm (9) is automatically driven in conjunction with the opening / closing operation of the door (21).

Further, the chemical liquid after being discharged to the wafer (W) is discharged to a drain tank (not shown) through a drain pipe (120) extending downward from the bottom wall (12), and After the completion of the chemical discharge (generally, after the post-treatment liquid is discharged and the development is completed), nitrogen is blown onto the wafer (W) from the nitrogen blow nozzle (25) arranged on the ceiling plate (13). The (W) is dried.

A pipe (26) opening to the developing chamber (10) is connected to the developing tank (1), and an opening / closing valve (27) forming an opening / closing means is provided in the middle of the pipe (26). In addition, the pipe (26) is connected to a negative pressure source (5) such as a vacuum pump, the opening / closing valve (27) is opened when the nitrogen is blown, and the developing chamber (10) is connected to the negative pressure source. The pressure source (5) is opened.

Thus, in the resist developing apparatus configured as described above, the outer portion of the developing tank (1) is covered and the developing tank (1) is covered.
A cover body (4) is provided which includes a doorway (20) and a transfer space (8) for the development target (W) which is moved in and out through the doorway (20). The inside was connected to the negative pressure source (5).

In the embodiment shown in FIG. 1, the cover body (4) is formed in a box shape, and the cover body (4) is installed on the upper surface of the frame (100) and is supported on the upper surface of the frame (100). Developing tank (1), frame (201), and wafer cassette (20)
It covers all of 0).

A replacement door (40) for the cassette (200) is attached to the side of the cover body (4).

The transfer space (8) is formed between the doorway (20) and the transfer arm (9) and the wafer cassette (200), and the wafer (W) is stored in the developing tank (1). It is the minimum space required to move in and out.

On the other hand, the inside of the cover body (4) has a gas vent pipe (45).
It is connected via a negative pressure source (5) such as a vacuum pump provided for exhausting the nitrogen blow described above.

Thus, the pressure inside the cover body (4) can be made lower than the pressure inside the clean room or the like in which the developing device is placed, and the leak from the entrance (20) into the cover body (4). The gaseous organic solvent and the like no longer leak into the clean room. Then, the leaked gaseous organic solvent and the like are exhausted to the negative pressure source (5).

In this case, a small hole is opened in the cover body (4), or an air filter (400) is provided on the upper portion as shown in the drawing so that the inside of the cover body (4) is
Furthermore, by forming a ventilation path to the negative pressure source (5), it is possible to improve the ventilation ability inside the cover body (4).

Further, it is conceivable that the exhaust gas due to the above-mentioned nitrogen blow flows back into the cover body (4) through the gas vent pipe (45). Therefore, in order to prevent this back flow, the gas vent pipe (45) ) Is provided with an on-off valve (28) which constitutes a backflow prevention means. Further, instead of the opening / closing valve (28), a check valve that allows only the flow from the inside of the cover body (4) to the negative pressure source (5) may be interposed. Further, the on-off valve (28) and the nitrogen blow exhaust on-off valve (27) are constituted by one three-way valve, and the three-way valve includes the gas vent pipe (45) and the pipe (26). You may intervene in the connection part of.

In this embodiment, a double wall structure of the casing (11) forms a heat exchange chamber (14) surrounding the developing chamber (10), and the frame (14) is provided inside the chamber (14). The developing chamber (10) can be controlled to an arbitrary set temperature by circulating a constant temperature heating medium from a constant temperature heating medium generator (7) such as constant temperature water stored under 100) via pipes (76, 77). I am trying.

Further, as described above, the chemical liquid feed pipe (6) is partially coiled to form a chemical liquid heat exchanger (50), and the heat exchanger (50) is connected to the chamber (14). By disposing the liquid medicine inside, the chemical liquid can be controlled to an arbitrary set temperature.

The constant temperature heat medium generating device (7) comprises a constant temperature tank (70) having a heat insulating structure, a heater (71) and an evaporator (72) of a refrigerating device, and a heat medium pump (75). .

(Effects of the Invention) As described above, according to the present invention, the developing tank (1) configured to allow the development target (W) to be taken in and out is internally provided with the holding means for the development target (W) and the holding means. A resist developing device, in which a developing means (2) for discharging a chemical solution to be used in a developing process is provided on a developed material (W) held by a developing means, wherein an opening / closing means (27) is provided inside the developing tank (1). An opening (20) which is connected to a negative pressure source (5) via an external port and covers the outer part of the developing tank (1) and allows the developing body (W) to be taken in and out of the developing tank (1). And a cover body (4) that encloses the transfer space (8) for the developed material (W) that is put in and taken out through the opening (20), and backflows inside the cover body (4). Since it is connected to the negative pressure source (5) through the blocking means (28), it has flammability and emits a foul odor. The interior of a clean room or the like organic solvent or gaseous fluid such as an inorganic alkali solvent developing device leaks are placed that would be contaminated, it was led to be reliably prevented.

[Brief description of drawings]

FIG. 1 is a schematic explanatory view showing an embodiment of the developing device of the present invention,
FIG. 2 is a schematic explanatory view showing a conventional example. (1) …… Developing tank (2) …… Discharging means (4) …… Cover body (5) …… Negative pressure source (8) …… Transport space (20) …… Opening part (doorway) (W)… … Developer (27) …… Opening / closing means (opening / closing valve) (28) …… Backflow prevention means (opening / closing valve)

Claims (1)

[Claims] 1. A developing tank (1) configured so that a development target (W) can be put in and taken out, and a holding means for holding the development target (W) is built in the development tank (1) and the development target held by the holding means. A resist developing apparatus having (W) a discharging means (2) for discharging a chemical liquid to be used in a developing process, wherein a negative pressure source () is provided inside the developing tank (1) via an opening / closing means (27). 5) and an opening (20) for covering the outer portion of the developing tank (1) to allow the development target (W) to be put in and taken out of the developing tank (1), and the opening (20). A cover body (4) including a transfer space (8) for the development target (W) which is put in and taken out through the inside of the cover body (4) is provided, and a backflow preventing means (28) is provided inside the cover body (4). A resist developing device, wherein the resist developing device is connected to the negative pressure source (5) through the resist developing device.