JPH07115173B2 - Cream solder applicator - Google Patents
Cream solder applicatorInfo
- Publication number
- JPH07115173B2 JPH07115173B2 JP62141092A JP14109287A JPH07115173B2 JP H07115173 B2 JPH07115173 B2 JP H07115173B2 JP 62141092 A JP62141092 A JP 62141092A JP 14109287 A JP14109287 A JP 14109287A JP H07115173 B2 JPH07115173 B2 JP H07115173B2
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- pattern
- discharge port
- circuit board
- cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3465—Application of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
【発明の詳細な説明】 (産業上の利用分野) 本発明は、電子部品をプリト回路基板上に表面実装する
場合に使用されるクリーム半田を一定量だけ塗布する装
置に関する。Description: TECHNICAL FIELD The present invention relates to an apparatus for applying a fixed amount of cream solder used when surface mounting an electronic component on a printed circuit board.
(従来技術) 電子部品をプリント回路基板に表面実装する場合には、
電子部品のリード配列に合わせて形成されたプリント回
路基板上のパターンにクリーム半田を塗布し、これの上
に電子部品を載置した状態でクリーム半田を加熱融解す
ることが行なわれている。(Prior Art) When surface mounting an electronic component on a printed circuit board,
BACKGROUND ART Cream solder is applied to a pattern on a printed circuit board formed in accordance with a lead arrangement of an electronic component, and the cream solder is heated and melted while the electronic component is placed on the pattern.
この場合、フラットパックドICのようにリード間の間隔
が0.5mm程度と極めて狭いものにあっては、塗布するク
リーム半田の量が多すぎるとリード間をブリッジして短
絡することになり、また反対に少な過ぎると接続不良を
引き起こすため、塗布量を正確に管理する必要がある。In this case, if the lead-to-lead spacing is extremely narrow, around 0.5 mm, such as in flat-packed ICs, if the amount of cream solder applied is too large, the leads will short-circuit by bridging the leads. If the amount is too small, poor connection may occur, so it is necessary to accurately control the coating amount.
このため、通常第4図に示したように、一定の厚みを有
する板材にリードパターンPに合わせて通孔Hを穿設し
てなるマスク板Mを、プリント回路基板Kに重ね合わせ
(同図I)、これの上からクリーム半田RをスクージS
により塗布することが行なわれている(II)。これによ
れば、マスク板Mの通孔Hの面積と厚みでもって一定量
のクリーム半田R′を塗布することが可能となるが(II
I)、塗布時多目のクリーム半田を用意する関係上、余
分となったクリーム半田R″(II)がマスク板Mに付着
して無駄になるばかりでなく、たとえ、この余剰となっ
たクリーム半田を回収するとしても空気に曝されたり、
マスク板表面の塵埃を吸着しているため劣化を招きやす
いという問題がある。Therefore, as shown in FIG. 4, a mask plate M, which is generally a plate material having a certain thickness and a through hole H formed in accordance with the lead pattern P, is overlaid on the printed circuit board K (see FIG. I), squeegee S cream cream R from above
Has been applied (II). According to this, it becomes possible to apply a certain amount of cream solder R ′ depending on the area and thickness of the through hole H of the mask plate M (II
I), because extra cream solder R ″ (II) is attached to the mask plate M and is wasted due to the fact that a large amount of cream solder is prepared at the time of application. Even if solder is collected, it is exposed to air,
Since the dust on the surface of the mask plate is adsorbed, there is a problem that deterioration is likely to occur.
このような問題を解消するため、注射器のようなディス
ペンサーを用いてパターン点毎に定量塗布する装置も存
在するが、塗布に手間と時間が掛るという問題がある。In order to solve such a problem, there is also an apparatus for quantitatively applying each pattern point by using a dispenser such as a syringe, but there is a problem that the application takes time and labor.
(目的) 本発明はこのような問題に鑑みてなされたものであっ
て、その目的とするところは必要十分な量のクリーム半
田だけを収納容器から吐出させ、これをパターンに合わ
せて一度に塗布することができる装置を提供することに
ある。(Purpose) The present invention has been made in view of such a problem, and an object of the present invention is to discharge only a necessary and sufficient amount of cream solder from a storage container and apply it at one time according to a pattern. It is to provide a device capable of doing.
(発明の概要) すなわち、本発明が特徴とするところは、外部からの操
作により軸方向に進退させられるピストン部材を嵌入し
たシリンダ部材の他端に、回路パターンに合わせた吐出
口を形成するとともに、吐出口の先端から若干突出する
ように弾性部材を前記吐出口の近傍に取付けた点にあ
る。(Summary of the Invention) That is, a feature of the present invention is that a discharge port matched with a circuit pattern is formed at the other end of a cylinder member into which a piston member that is axially advanced and retracted by an external operation is fitted The elastic member is attached in the vicinity of the discharge port so as to slightly project from the tip of the discharge port.
(構成) そこで、以下に本発明の詳細を図示した実施例に基づい
て説明する。(Structure) Therefore, details of the present invention will be described below based on illustrated embodiments.
第1図は本発明の一実施例を示すものであって、図中符
号1は、クリーム半田の収容容器を形成するシリンダー
で、一端にはシリンダ1と気密的に嵌入するピストン2
に固定されたネジ3と螺合するネジ穴4aを中心に形成さ
れた蓋部材4が着脱自在に取付けられ、また他端には回
路基板のリードパターンに合わせた吐出口6、6、6、
6が形成されている。この吐出口6は同図(ロ)に示し
たように塗布すべきパターンに合わせて基板7の外周部
に矩形状の通孔を穿設して形成されており、また中央部
には吐出口先端から塗布厚みdを確保するようにゴム板
等のスベリ止め板8を突出させて固定されている。FIG. 1 shows an embodiment of the present invention, in which reference numeral 1 is a cylinder forming a container for cream solder, and a piston 2 which is hermetically fitted into the cylinder 1 at one end thereof.
A lid member 4 formed around a screw hole 4a to be screwed with a screw 3 fixed to is detachably attached, and at the other end, discharge ports 6, 6, 6, which match the lead pattern of the circuit board,
6 is formed. The discharge port 6 is formed by forming a rectangular through hole in the outer peripheral portion of the substrate 7 in accordance with the pattern to be applied, as shown in FIG. A non-slip plate 8 such as a rubber plate is projected and fixed so as to secure the coating thickness d from the tip.
なお、図中符号5はネジに固定されたノブを、また10は
空気抜き口を、さらに11はピストン2に嵌着したOリン
グをそれぞれ示す。In the figure, reference numeral 5 is a knob fixed to a screw, 10 is an air vent, and 11 is an O-ring fitted to the piston 2.
この実施例において、シリンダ1にクリーム半田Rを充
填してピストン2を挿入し、吐出口6、6、6‥‥から
クリーム半田が排出される程度までノブ5を回動させて
ピストン2を押し下げておく、(第2図I)。In this embodiment, the cylinder 1 is filled with cream solder R, the piston 2 is inserted, and the knob 5 is rotated until the cream solder is discharged from the discharge ports 6, 6, 6 ,. (Fig. 2I).
このような準備を終えた段階で、吐出口6、6、6‥‥
がプリント回路基板K上のパターンPに一致するように
シリンダ1を基板Kに押し当てると、スベリ止め板8を
介して回路基板Kに当接するため、滑ることなく回路基
板Kに固定されるとともに、回路基板表面と吐出口先端
との間に一定の間隙dが形成される(II)。At the stage of completing such preparation, the discharge ports 6, 6, 6 ...
When the cylinder 1 is pressed against the board K so that the pattern matches the pattern P on the printed circuit board K, the cylinder 1 comes into contact with the circuit board K through the anti-slip plate 8 and is fixed to the circuit board K without slipping. A constant gap d is formed between the surface of the circuit board and the tip of the discharge port (II).
このような状態で、ノブを回転させると、ピストン2
は、シリンダ1内を軸方向に相対的に吐出口6、6、6
‥‥側に移動してシリンダ1内のクリーム半田Rを押し
出す(III)。これにより、クリーム半田Rは、吐出口
6、6、6‥‥からその形状に一致した形状でもって、
ノブ5の回転量により決る量だけ排出され、間隙長dに
略々一致する厚みをもってプリント回路基板Pのパター
ン上に塗布されることになる(IV)。When the knob is rotated in this state, the piston 2
Are discharge ports 6, 6, 6 relatively in the cylinder 1 in the axial direction.
Move to the side and push out the cream solder R in the cylinder 1 (III). As a result, the cream solder R has a shape corresponding to the shape from the discharge ports 6, 6, 6 ...
It is discharged by an amount determined by the amount of rotation of the knob 5, and is applied onto the pattern of the printed circuit board P with a thickness that substantially matches the gap length d (IV).
このような状態で、取付けるべき電子部品を、回路基板
のパターンに合わせて配置して加熱すると、隣接する2
つのリードパターを橋絡するように付着していたクリー
ム半田は、溶融による表面張力によってパターンPに引
寄せられて分離するとともに、電子部品のリードとパタ
ーンを濡らせた後、冷却時に両者を固定する。In this state, when the electronic components to be mounted are arranged according to the pattern of the circuit board and heated, the adjacent two
The cream solder adhered so as to bridge the two lead putters is attracted to the pattern P by the surface tension due to melting and separated, and after the leads and the pattern of the electronic component are wetted, they are fixed during cooling. .
第3図は、前述の塗布器を載置しておくのに適したスタ
ンドの一実施例を示すものであって、合成樹脂板20の表
面に複数の凸条21、21、21‥‥を形成するとともに、前
述した塗布器23の底面形状に合わせた凹部24を形成して
構成されている。FIG. 3 shows an embodiment of a stand suitable for mounting the above-mentioned applicator, in which a plurality of ridges 21, 21, 21 ... Are provided on the surface of the synthetic resin plate 20. Along with the formation, the concave portion 24 is formed in conformity with the bottom shape of the applicator 23 described above.
この実施例によれば、不使用時には塗布器23を凹部24に
載置しておくことにより空気との接触を可及的に断って
クリーム半田の劣化を防止することができ、また使用開
始時には塗布器23の底面を凸条21、21、21‥‥に押し当
ててコスルことにより残渣を簡単に取除くことができ
る。According to this embodiment, when not in use, the applicator 23 can be placed in the recess 24 to prevent contact with air as much as possible to prevent deterioration of the cream solder, and at the start of use. The residue can be easily removed by pressing the bottom surface of the applicator 23 against the ridges 21, 21, 21 ...
なお、この実施例においては、融解時におけるクリーム
半田の表面張力による分離を積極的に利用して、各辺の
吐出口を連続口としているが、回路パターン通りに独立
孔を設けたり、長孔を複数に分断させても同様の作用を
奏することは明らかである。In this embodiment, the discharge port on each side is made continuous by positively utilizing the separation due to the surface tension of the cream solder at the time of melting, but an independent hole is provided according to the circuit pattern, or a long hole is formed. It is clear that the same effect can be obtained by dividing the same into a plurality of parts.
また、この実施例においてはノブの回動操作により軸方
向にピストンを移動させているが、トリガ機構やプッシ
ュボタンにより駆動螺子を回動させるようにしてもよ
く、また一定回転量を規制するクリック機構を設けるこ
とにより一層正確に塗布量を管理することができる。Further, in this embodiment, the piston is moved in the axial direction by the turning operation of the knob. However, the driving screw may be turned by a trigger mechanism or a push button, and a click that restricts a constant rotation amount By providing the mechanism, the applied amount can be controlled more accurately.
さらに、この実施例においてはノブを手動で移動させる
ようにしているが、パルスモータ等の動力源や圧力空気
限に接続しても同様の作用を奏することは明らかであ
る。また、この実施例においては、螺子部材をピストン
と一体的に構成しているが、両者間を可回動的に固定し
てもよく、さらに、ピストンの外周とシリンダの内周に
螺子を設け、両者間を相対的に回動させるようにしても
同様の作用を奏することは明らかである。Further, although the knob is manually moved in this embodiment, it is apparent that the same effect can be obtained even if the knob is connected to a power source such as a pulse motor or a pressure air limit. Further, in this embodiment, the screw member is integrally formed with the piston, but the screw member may be rotatably fixed between them, and further, the screw is provided on the outer circumference of the piston and the inner circumference of the cylinder. It is clear that the same effect can be obtained even if the two are relatively rotated.
(効果) 以上、説明したようにシリンダの一端に電子部品のリー
ドパターンに合わせて吐出口を形成するとともに、螺条
により進退するピストンを設けたので、クリーム半田を
可及的に気密性をもってストックする一方、螺条による
強力な圧力を作用させて確実にクリーム半田を供給する
ことができるばかりでなく、ストローク長を精密に調節
できて塗布量を正確に調整することができる。(Effect) As described above, the discharge port is formed at one end of the cylinder according to the lead pattern of the electronic component, and the piston that moves forward and backward by the screw is provided, so the cream solder is stocked as tightly as possible. On the other hand, not only the cream solder can be reliably supplied by exerting a strong pressure by the screw thread, but also the stroke length can be precisely adjusted and the application amount can be accurately adjusted.
また、表面が吐出口から若干突出するようにスベリ止め
板を底部に設けたので、当接時に回路基板の所定位置に
確実に固定することができるばかりでなく、回路基板面
との間に形成される一定隙長でもって塗布厚さを一定値
に管理することができる。Also, since the anti-slip plate is provided on the bottom so that the surface slightly protrudes from the discharge port, not only can it be securely fixed at a predetermined position on the circuit board at the time of contact, but it can also be formed between the surface and the circuit board surface. The coating thickness can be controlled to a constant value with the constant gap length.
第1図(イ)(ロ)は、それぞれ本発明の一実施例を示
す装置の断面図と底面図、第2図は同上装置の動作を示
す説明図、第3図は本発明の他の実施例を示す斜視図、
及び第4図は従来のクリーム半田塗布方法を示す説明図
である。 1……シリンダ、2……ピストン 3……ネジ、4……蓋部材 6、6……吐出口、7……基板 8……すべり止め板1 (a) and (b) are a cross-sectional view and a bottom view of an apparatus showing an embodiment of the present invention, FIG. 2 is an explanatory view showing the operation of the same apparatus, and FIG. 3 is another view of the present invention. A perspective view showing an embodiment,
FIG. 4 and FIG. 4 are explanatory views showing a conventional cream solder applying method. 1 ... Cylinder, 2 ... Piston 3 ... Screw, 4 ... Lid member 6, 6 ... Discharge port, 7 ... Substrate 8 ... Anti-slip plate
Claims (1)
れるピストン部材を嵌入したシリンダ部材の他端に、電
子部品のリードパターンに合わせた吐出口を形成すると
ともに、前記吐出口の先端から若干突出するように弾性
部材を前記吐出口の近傍に取付けてなるクリーム半田塗
布器。1. A discharge port matching the lead pattern of an electronic component is formed at the other end of a cylinder member into which a piston member that is axially advanced and retracted by an operation from the outside is formed, and slightly from the tip of the discharge port. A cream solder applicator in which an elastic member is attached in the vicinity of the discharge port so as to project.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62141092A JPH07115173B2 (en) | 1987-06-04 | 1987-06-04 | Cream solder applicator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62141092A JPH07115173B2 (en) | 1987-06-04 | 1987-06-04 | Cream solder applicator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63303681A JPS63303681A (en) | 1988-12-12 |
| JPH07115173B2 true JPH07115173B2 (en) | 1995-12-13 |
Family
ID=15284010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62141092A Expired - Lifetime JPH07115173B2 (en) | 1987-06-04 | 1987-06-04 | Cream solder applicator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07115173B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9216469B2 (en) * | 2013-10-18 | 2015-12-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Indirect printing bumping method for solder ball deposition |
-
1987
- 1987-06-04 JP JP62141092A patent/JPH07115173B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63303681A (en) | 1988-12-12 |
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