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JPH07115408B2 - Resin pipe branching method - Google Patents
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JPH07115408B2 - Resin pipe branching method - Google Patents

Resin pipe branching method

Info

Publication number
JPH07115408B2
JPH07115408B2 JP2049923A JP4992390A JPH07115408B2 JP H07115408 B2 JPH07115408 B2 JP H07115408B2 JP 2049923 A JP2049923 A JP 2049923A JP 4992390 A JP4992390 A JP 4992390A JP H07115408 B2 JPH07115408 B2 JP H07115408B2
Authority
JP
Japan
Prior art keywords
small hole
heating device
resin
resin pipe
surface side
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2049923A
Other languages
Japanese (ja)
Other versions
JPH03251429A (en
Inventor
貞良 棚町
米数 山田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Priority to JP2049923A priority Critical patent/JPH07115408B2/en
Publication of JPH03251429A publication Critical patent/JPH03251429A/en
Publication of JPH07115408B2 publication Critical patent/JPH07115408B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Shaping Of Tube Ends By Bending Or Straightening (AREA)

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、塩化ビニール等の樹脂管の管壁に分岐部を形
成する分岐部加工方法に関する。
TECHNICAL FIELD The present invention relates to a branching portion processing method for forming a branching portion on the wall of a resin pipe such as vinyl chloride.

[従来の技術] 上下水道の各種配管ラインに用いられる塩化ビニール管
に、第5図に示すような分岐部Bを形成する場合、特に
少量生産の現場においては、次の手順で引き抜き加工を
行っている。
[Prior Art] When forming a branch portion B as shown in FIG. 5 in a vinyl chloride pipe used for various water supply and sewer pipe lines, particularly in a small-quantity production site, a drawing process is performed by the following procedure. ing.

まず、第6図に示すように、管Pの周壁の分岐部を形成
する位置に、小孔100をあける。そして、その小孔100の
周囲を内面及び外面から加熱する。加熱して樹脂が軟ら
かくなったら、第7図に示すように、予め管Pの内部に
挿入しておいた円柱状(または球状)の金型101を小孔1
00の直下に位置決めして、小孔100から金型101を引き上
げる。そうすると、金型101の周部に持ち上げられて、
小孔100の周縁の樹脂が引きずられて立ち上がる。そし
て、この状態で冷却を待つことにより分岐部Bが出来上
がる。
First, as shown in FIG. 6, a small hole 100 is formed at a position where a branch portion of the peripheral wall of the pipe P is formed. Then, the periphery of the small hole 100 is heated from the inner surface and the outer surface. When the resin becomes soft by heating, as shown in FIG. 7, the cylindrical (or spherical) mold 101 previously inserted inside the pipe P is inserted into the small hole 1
Position it directly below 00 and pull up the mold 101 from the small hole 100. Then, it is lifted up around the mold 101,
The resin on the periphery of the small hole 100 is dragged and rises. Then, by waiting for cooling in this state, the branch portion B is completed.

ところで、従来では樹脂管Pの内面及び外面を加熱する
に当たり、第6図に示すようにLPガスバーナー102の火
炎で小孔100の周縁をあぶる、といった方法をとってい
る。
By the way, conventionally, when heating the inner surface and the outer surface of the resin pipe P, as shown in FIG. 6, the periphery of the small hole 100 is abraded by the flame of the LP gas burner 102.

[発明が解決しようとする課題] しかし、バーナー102であぶる方法は、引き抜き加工に
要する箇所を均一に加熱することが容易ではなく、あぶ
り過ぎの箇所やあぶり不足の箇所が生じて成形不良を起
こすことがあった。また、あぶる範囲が広すぎたり狭す
ぎたりすることもあり、この点からも成形不良を起こす
ことがあった。
[Problems to be Solved by the Invention] However, in the method of burning with the burner 102, it is not easy to uniformly heat the portion required for the drawing process, and a portion that is excessively burned or a portion that is insufficiently burned causes defective molding. There was an occasion. In addition, the range of exposure may be too wide or too narrow, which may cause defective molding.

さらに、樹脂管Pの内外面を同時に加熱することが困難
であり、そのため内外面で加熱むらを生じたり、加熱に
時間がかかって作業能率が悪い等の問題もあった。
Further, it is difficult to heat the inner and outer surfaces of the resin pipe P at the same time, which causes uneven heating on the inner and outer surfaces, and it takes a long time to heat, resulting in poor work efficiency.

本発明は、上記事情を考慮し、引き抜き加工に要する箇
所を正確かつ均一にしかも効率良く加熱し、それにより
成形性の良好な分岐部を効率良く製作するようにした分
岐部加工方法を提供することを目的とする。
In consideration of the above-mentioned circumstances, the present invention provides a branching portion processing method for accurately, uniformly and efficiently heating a portion required for drawing, thereby efficiently producing a branching portion having good formability. The purpose is to

[課題を解決するための手段] 本発明の分岐部加工方法は、樹脂管の管壁に小孔をあ
け、その小孔の周囲を加熱して樹脂を軟化させ、その後
樹脂管内部に挿入した引き抜き型を上記小孔から引き上
げることにより小孔周囲の軟化した樹脂を立ち上げ、そ
の状態で冷却することにより分岐部を得る樹脂管の分岐
部加工方法において、面状のヒータを有する外面側加熱
装置と面状のヒータを有する内面側加熱装置とを用い、
その面状のヒータのうち少なくとも一方には上記小孔と
対応する孔が設けられており、上記小孔をあけた後、小
孔の周囲の樹脂管の内面及び外面にそれぞれ外面側加熱
装置及び内面側加熱装置の面状のヒータを密着させて両
ヒータにより内外面から小孔周囲の樹脂を加熱し、加熱
後、上記ヒータを退避させてその状態で引き抜き型によ
り引き抜き加工を行うことを特徴としている。
[Means for Solving the Problem] In the branching portion processing method of the present invention, a small hole is made in the wall of a resin pipe, the periphery of the small hole is heated to soften the resin, and then the resin pipe is inserted. In the method of processing a branched portion of a resin pipe, in which a softened resin around the small hole is raised by pulling up the drawing die from the small hole and then cooled to obtain a branched portion. Using the device and the inner heating device having a planar heater,
At least one of the planar heaters is provided with a hole corresponding to the small hole, and after forming the small hole, an outer surface side heating device and an outer surface side heating device are provided on the inner surface and the outer surface of the resin pipe around the small hole, respectively. Characteristic is that the heater around the small hole is heated from the inner and outer surfaces by both heaters and the heaters of the inner heating device are brought into close contact with each other. After heating, the heater is retracted and the drawing process is performed by the drawing die in that state. I am trying.

[作用] 本発明の加工方法によれば、樹脂管の管壁にあけた小孔
の周囲を加熱するにあたり、面状のヒータを有する外面
側加熱装置と面状のヒータを有する内面側加熱装置とを
用い、その面状のヒータのうち少なくとも一方には上記
小孔と対応する孔が設けられており、上記小孔をあけた
後、小孔の周囲の樹脂管の内面及び外面にそれぞれ外面
側加熱装置及び内面側加熱装置の面状のヒータを密着さ
せて両ヒータにより内外面から小孔周囲の樹脂を加熱す
るものであるから、小孔の周囲の樹脂を内外から効率よ
く加熱でき、小孔部に熱がこもって小孔周縁部が過熱さ
れて損傷することがなく、正確かつ均一に加熱されるこ
とになり、安定した条件で引き抜き加工が行われる。
[Operation] According to the processing method of the present invention, in heating the periphery of the small hole formed in the pipe wall of the resin pipe, the outer surface side heating device having the sheet heater and the inner surface heating device having the sheet heater. And a hole corresponding to the small hole is provided in at least one of the planar heaters, and after forming the small hole, the outer surface is formed on the inner surface and the outer surface of the resin pipe around the small hole. Since the surface heaters of the inner side heating device and the inner side heating device are brought into close contact with each other to heat the resin around the small holes from the inner and outer surfaces by both heaters, the resin around the small holes can be efficiently heated from the inside and outside, Accurate and uniform heating can be achieved without causing damage to the peripheral edge of the small hole due to heat being accumulated in the small hole, and the drawing process is performed under stable conditions.

[実施例] 以下、本発明の分岐部加工方法の一実施例を図面を参照
しながら説明する。
[Embodiment] An embodiment of the branching portion processing method of the present invention will be described below with reference to the drawings.

まず、第1図、第2図に示す加熱のための装置10及び20
について説明する。内面側加熱装置10は、第3図、第4
図にその詳細を示すように、樹脂管Pの内部に挿入され
る半筒状に湾曲された基板1を有している。この基板1
は、ステンレス板を半筒状に湾曲形成したものである。
この基板1は、実際には加熱対象箇所の大きさに応じて
周長が決定されるので、ここで言う「半筒」の概念の中
には、一部が切欠かれた筒体の全てが含まれるものとす
る。
First, the heating devices 10 and 20 shown in FIGS.
Will be described. The inner heating device 10 is shown in FIGS.
As shown in detail in the drawing, it has a substrate 1 curved in a semi-cylindrical shape to be inserted into a resin pipe P. This board 1
Is a semi-cylindrical bent stainless plate.
Since the perimeter of this substrate 1 is actually determined according to the size of the heating target portion, the concept of the “half cylinder” referred to here is that all of the cylinders partially cut away are included. Shall be included.

この実施例の基板1は、中心角θが300度程度となるよ
うに湾曲形成され、直径が加熱対象の樹脂管Pの内径よ
りやや小さい程度に設定されている。基板1の材料とし
ては、ステンレス以外の他の金属板、あるいは強化プラ
スチック板等を用いることができる。また、厚さは復元
性を有する範囲であれば特に限定されない。
The substrate 1 of this embodiment is curved so that the central angle θ is about 300 degrees, and its diameter is set to be slightly smaller than the inner diameter of the resin pipe P to be heated. As the material of the substrate 1, a metal plate other than stainless steel, a reinforced plastic plate, or the like can be used. Further, the thickness is not particularly limited as long as it has a restoring property.

そして、この基板1の外周面に、断熱材2を介して面状
ヒータ3が張り付けられている。断熱材2としては、プ
ラスチック、ゴムなどの発泡体、あるいは石綿等、柔軟
性を有するものであれば何を用いてもよい。また、面状
ヒータ3としては、例えばシリコンラバーヒータ、プレ
ート型ニクロムヒータ等、通電することにより発熱す
る、柔軟性を有したものであれば何を用いてもよい。な
お、基板1をプラスチック等の断熱性を有する材料で構
成した場合には、断熱材3を省略しても構わない。
A planar heater 3 is attached to the outer peripheral surface of the substrate 1 with a heat insulating material 2 interposed therebetween. As the heat insulating material 2, any material having flexibility such as a foamed material such as plastic or rubber, or asbestos may be used. Further, as the planar heater 3, for example, a silicon rubber heater, a plate-type nichrome heater, or the like may be used as long as it has flexibility and generates heat when energized. When the substrate 1 is made of a material having a heat insulating property such as plastic, the heat insulating material 3 may be omitted.

また、基板1の周方向の両端1A、1B間には、両端1A、1B
の間隔を拡げたり狭めたりすることにより、半筒状の基
板1の直径を拡げたり縮めたりするシリンダ(拡縮径手
段)4が連結されている。シリンダ4は、第4図に示す
ように基板1の軸方向両端にそれぞれ同様な形態で取り
付けられている。また、基板1の両端1A、1Bには、それ
ぞれ基板1の曲率中心に向かって延びるアーム5A、5Bが
一体に設けられており、これらアーム5A、5Bの先端同士
が、基板1の曲率中心に通した軸棒6に回動自在に連結
されている。
In addition, between both ends 1A, 1B in the circumferential direction of the substrate 1, both ends 1A, 1B
A cylinder (expansion / contraction diameter means) 4 for expanding or contracting the diameter of the semi-cylindrical substrate 1 by expanding or narrowing the interval is connected. The cylinders 4 are attached to both ends of the substrate 1 in the axial direction in the same manner as shown in FIG. Further, arms 5A and 5B extending toward the center of curvature of the substrate 1 are integrally provided at both ends 1A and 1B of the substrate 1, and the tips of these arms 5A and 5B are located at the center of curvature of the substrate 1. It is rotatably connected to the through shaft 6.

また、外面側加熱装置20としては、内面側加熱装置10の
面状ヒータ3と全く同じもので、中央に樹脂管Pの小孔
100に対応した孔20aのある面状ヒータが用いられてい
る。この外面側加熱装置20は独立しているが、内面側加
熱装置10は引き抜き型30と一定間隔Hをおいて互いに連
結されている。そして、内面加熱装置10を移動すると一
緒に引き抜き型30も移動するようになっている。なお、
引き抜き型30は、内面側加熱装置10と連結されているも
のの、自由に引き抜き加工方向に移動できるようになっ
ている。
Further, the outer surface side heating device 20 is exactly the same as the planar heater 3 of the inner surface side heating device 10, and has a small hole of the resin pipe P in the center.
A planar heater having holes 20a corresponding to 100 is used. Although the outer surface side heating device 20 is independent, the inner surface side heating device 10 is connected to the drawing die 30 at a constant interval H. Then, when the inner surface heating device 10 is moved, the drawing die 30 is also moved together with it. In addition,
Although the drawing die 30 is connected to the inner heating device 10, it can be freely moved in the drawing direction.

ここで、引き抜き型30と内面側加熱装置10の間隔Hは、
分岐部Bの形成間隔とほぼ等しく設定されている。
Here, the distance H between the drawing die 30 and the inner heating device 10 is
It is set to be almost equal to the formation interval of the branch portion B.

次に上記の装置を用いた分岐部加工方法を説明する。Next, a method for processing a branched portion using the above device will be described.

この方法では、まず分岐部Bを成形しようとする樹脂管
Pの管壁部に小孔100をあける。この小孔100の大きさは
分岐部Bの径の1/2程度とする。ついで、内面側加熱装
置10のシリンダ4を操作して装置10を縮径させ、その状
態で加熱装置10を樹脂管Pの内部に挿入して小孔100の
近くの管内面に配置する。それから、シリンダ4を操作
して装置10を拡径させ、面状ヒータ3を管Pの内面に密
着させる。
In this method, first, a small hole 100 is formed in the pipe wall portion of the resin pipe P where the branch portion B is to be formed. The size of the small hole 100 is about 1/2 of the diameter of the branch portion B. Then, the cylinder 4 of the inner heating device 10 is operated to reduce the diameter of the device 10, and in that state, the heating device 10 is inserted into the resin pipe P and placed on the inner surface of the pipe near the small hole 100. Then, the cylinder 4 is operated to expand the diameter of the device 10 to bring the planar heater 3 into close contact with the inner surface of the pipe P.

またこれと前後して、外面側加熱装置20を小孔100の周
囲の管外面に被せる。そして管Pの内外面に配置した両
加熱装置10、20により、同時に管内外面から小孔100の
周囲の樹脂を加熱する。加熱して樹脂を所定の軟らかさ
にしたら、両装置10、20を取り除く。内面側加熱装置10
については、シリンダ4を操作して装置10を縮径させて
ヒータ3を退避させる。
Around this, the outer surface side heating device 20 is covered on the outer surface of the tube around the small hole 100. Then, the resin around the small hole 100 is simultaneously heated from the inner and outer surfaces of the tube by both heating devices 10 and 20 arranged on the inner and outer surfaces of the tube P. When the resin is heated to a predetermined softness, both devices 10 and 20 are removed. Inner heating device 10
With regard to (3), the cylinder 4 is operated to reduce the diameter of the device 10 to retract the heater 3.

そして、続いて今加熱した小孔100に引き抜き型30を位
置決めして引き抜き加工を行う。この場合、樹脂加熱を
面状のヒータで内外面から行い、外面側加熱装置20に樹
脂管Pの管壁部にあけた小孔100と対応する孔20aがある
ので、内外のヒータからの熱が小孔100にこもらず、小
孔100の周縁部が過熱されて損傷することがなく、ま
た、面状ヒータの大きさを予め加熱箇所の大きさに設定
しておくことで、引き抜き加工に要する箇所が、過不足
なく正確にまた均一に加熱される。したがって、引き抜
き加工を安定した条件でスムーズに行うことができ、良
好な品質の分岐部を得ることができる。また、内外面か
ら同時に加熱するので、加熱効率が非常に良い上内外面
での加熱むらも生じず、この点からも成形性が向上す
る。
Then, subsequently, the drawing die 30 is positioned in the small hole 100 that has just been heated, and the drawing process is performed. In this case, the resin heating is performed from the inner and outer surfaces by the planar heater, and since the outer surface side heating device 20 has the hole 20a corresponding to the small hole 100 formed in the pipe wall portion of the resin pipe P, the heat from the inner and outer heaters is generated. Does not stay in the small hole 100, the peripheral portion of the small hole 100 is not overheated and damaged, and the size of the planar heater is set in advance to the size of the heating portion, so that it can be used for drawing. The required area is heated accurately and uniformly without excess or deficiency. Therefore, the drawing process can be performed smoothly under stable conditions, and the branch portion with good quality can be obtained. In addition, since heating is performed from the inner and outer surfaces at the same time, the heating efficiency is very good, and uneven heating on the inner and outer surfaces does not occur, which also improves the formability.

またこの実施例においては、一方の小孔100の周囲を引
き抜き加工しているときに、内面側加熱装置10及び外面
側加熱装置20を移動して隣の小孔100の周囲に位置決め
し、該小孔100の周囲の樹脂を同時に加熱する。そし
て、これを繰り返すことにより、間隔的に並ぶ複数の分
岐部を効率よく加工することができる。
Further, in this embodiment, when the periphery of one of the small holes 100 is being drawn, the inner surface side heating device 10 and the outer surface side heating device 20 are moved and positioned around the adjacent small hole 100, The resin around the small holes 100 is heated at the same time. Then, by repeating this, it is possible to efficiently process the plurality of branch portions lined up at intervals.

なお、上記のように連続して分岐部を形成する際に、内
面側加熱装置10が引き抜き型30から距離H離れた位置に
連結されているので、引き抜き型30を手前の小孔100に
位置決めすれば、自動的に次の小孔100の周囲に内面側
加熱装置10が位置決めされ、位置決めの手間が一部省略
される。
Since the inner heating device 10 is connected to the position separated from the drawing die 30 by the distance H when forming the branched portions continuously as described above, the drawing die 30 is positioned in the front small hole 100. Then, the inner heating device 10 is automatically positioned around the next small hole 100, and part of the positioning work is omitted.

[発明の効果] 以上説明したように、本発明の分岐部加工方法によれ
ば、樹脂管の内外面に配する内外面加熱装置のそれぞれ
の面状ヒータの大きさを加熱対象箇所の大きさに設定す
ることにより、また、面状ヒータのうち少なくとも一方
には樹脂管にあけられた小孔と対応する孔が設けられて
いることにより樹脂管の小孔部には熱がこもって小孔の
周縁部が過熱されて損傷することなく、加熱箇所を正確
かつ均一に加熱することができる。また、内外面から加
熱して引き抜き加工を行うので、加熱効率が良く、良好
な成形条件のもとに引き抜き加工を行うことができ、品
質の安定した分岐部を得ることができる。
[Effects of the Invention] As described above, according to the branching portion processing method of the present invention, the size of each planar heater of the inner and outer surface heating devices arranged on the inner and outer surfaces of the resin pipe is set to the size of the heating target portion. In addition, since at least one of the planar heaters is provided with a hole corresponding to the small hole formed in the resin pipe, the small hole portion of the resin pipe is filled with heat and has a small hole. The heated portion can be heated accurately and uniformly without being damaged due to overheating of the peripheral portion of the. Further, since the drawing is carried out by heating from the inner and outer surfaces, the heating efficiency is good, the drawing can be carried out under favorable molding conditions, and a branched portion with stable quality can be obtained.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の分岐部加工方法の実施例の説明図、第
2図は第1図に示した管Pの内部の状況を示す図、第3
図は実施例の加工方法に用いた管加熱装置の正面図、第
4図は同装置の側面図、第5図は分岐部を有した管の例
を示す外観図、第6図及び第7図は分岐部の形成の仕方
を示す図であり、第6図は従来の加熱方法の説明図、第
7図は分岐部を引き抜き加工している状態を示す図であ
る。 P……加熱対象の管、B……分岐部、10……内面側加熱
装置、20……外面側加熱装置、30……引き抜き型。
FIG. 1 is an explanatory diagram of an embodiment of a method for processing a branched portion of the present invention, FIG. 2 is a diagram showing an internal condition of the pipe P shown in FIG. 1, and FIG.
FIG. 4 is a front view of a tube heating apparatus used in the processing method of the embodiment, FIG. 4 is a side view of the apparatus, FIG. 5 is an external view showing an example of a tube having a branch portion, FIGS. 6 and 7. FIG. 6 is a view showing a method of forming a branch portion, FIG. 6 is an explanatory view of a conventional heating method, and FIG. 7 is a view showing a state where the branch portion is being drawn. P ... Pipe to be heated, B ... Branch, 10 ... Inner heating device, 20 ... Outer heating device, 30 ... Extraction type.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】樹脂管の管壁に小孔をあけ、その小孔の周
囲を加熱して樹脂を軟化させ、その後樹脂管内部に挿入
した引き抜き型を上記小孔から引き上げることにより小
孔周囲の軟化した樹脂を立ち上げ、その状態で冷却する
ことにより分岐部を得る樹脂管の分岐部加工方法におい
て、面状のヒータを有する外面側加熱装置と面状のヒー
タを有する内面側加熱装置とを用い、その面状のヒータ
のうち少なくとも一方には上記小孔と対応する孔が設け
られており、上記小孔をあけた後、小孔の周囲の樹脂管
の内面及び外面に上記小孔と孔とを対応させてそれぞれ
外面側加熱装置及び内面側加熱装置の面状のヒータを密
着させて両ヒータにより内外面から小孔周囲の樹脂を加
熱し、加熱後、上記ヒータを退避させてその状態で引き
抜き型により引き抜き加工を行うことを特徴とする樹脂
管の分岐部加工方法。
1. A small hole is formed in the wall of a resin pipe by heating the periphery of the small hole to soften the resin and then pulling up a drawing die inserted inside the resin pipe from the small hole. In the method for processing a branched portion of a resin pipe, in which a softened resin is started up and a branched portion is obtained by cooling in that state, an outer surface side heating device having a planar heater and an inner surface side heating device having a planar heater At least one of the planar heaters is provided with a hole corresponding to the small hole, and after the small hole is formed, the small hole is formed on the inner surface and the outer surface of the resin pipe around the small hole. The heater and the hole are made to correspond to each other, and the sheet-like heaters of the outer surface side heating device and the inner surface side heating device are brought into close contact with each other to heat the resin around the small holes from the inner and outer surfaces by both heaters, and then the heater is retracted In that state, pull with a pulling die Bifurcation processing method of the resin tube which is characterized in that the came processing.
JP2049923A 1990-03-01 1990-03-01 Resin pipe branching method Expired - Lifetime JPH07115408B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2049923A JPH07115408B2 (en) 1990-03-01 1990-03-01 Resin pipe branching method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2049923A JPH07115408B2 (en) 1990-03-01 1990-03-01 Resin pipe branching method

Publications (2)

Publication Number Publication Date
JPH03251429A JPH03251429A (en) 1991-11-08
JPH07115408B2 true JPH07115408B2 (en) 1995-12-13

Family

ID=12844537

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2049923A Expired - Lifetime JPH07115408B2 (en) 1990-03-01 1990-03-01 Resin pipe branching method

Country Status (1)

Country Link
JP (1) JPH07115408B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6859652B2 (en) 2000-08-02 2005-02-22 Mobile Satellite Ventures, Lp Integrated or autonomous system and method of satellite-terrestrial frequency reuse using signal attenuation and/or blockage, dynamic assignment of frequencies and/or hysteresis
US6892068B2 (en) 2000-08-02 2005-05-10 Mobile Satellite Ventures, Lp Coordinated satellite-terrestrial frequency reuse

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4810645B2 (en) * 2006-09-15 2011-11-09 アクアインテック株式会社 Repair device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50167U (en) * 1973-05-02 1975-01-06
JPS6029625B2 (en) * 1976-01-27 1985-07-11 三菱樹脂株式会社 Manufacturing method of thermoplastic resin branch pipe

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6859652B2 (en) 2000-08-02 2005-02-22 Mobile Satellite Ventures, Lp Integrated or autonomous system and method of satellite-terrestrial frequency reuse using signal attenuation and/or blockage, dynamic assignment of frequencies and/or hysteresis
US6892068B2 (en) 2000-08-02 2005-05-10 Mobile Satellite Ventures, Lp Coordinated satellite-terrestrial frequency reuse
US7577400B2 (en) 2000-08-02 2009-08-18 Atc Technologies, Llc Integrated or autonomous system and method of satellite-terrestrial frequency reuse using signal attenuation and/or blockage, dynamic assignment of frequencies and/or hysteresis
US7593726B2 (en) 2000-08-02 2009-09-22 Atc Technologies, Llc Coordinated satellite-terrestrial frequency reuse
US7636567B2 (en) 2000-08-02 2009-12-22 Atc Technologies, Llc Coordinated satellite-terrestrial frequency reuse

Also Published As

Publication number Publication date
JPH03251429A (en) 1991-11-08

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