JPH07117572B2 - Semiconductor device measuring device - Google Patents

Description

TECHNICAL FIELD The present invention relates to a semiconductor device measuring apparatus for measuring electrical characteristics of a semiconductor device, and more particularly, to improving its transport mechanism to perform quick measurement and the like. The present invention relates to a measuring device of a semiconductor device.

B. SUMMARY OF THE INVENTION The present invention provides a semiconductor device measuring apparatus that includes a carry-in means, a measuring means, and a carry-out means to measure the electrical characteristics of a semiconductor device. By performing the rotation operation of the rotary shaft while holding the semiconductor device by the provided semiconductor device holding means, it is possible to shorten the carrying time.

C. Conventional technology Before shipment of a semiconductor device as a product, it is necessary to electrically check whether the product is good or bad, and in order to sequentially measure the mass-produced semiconductor devices, a so-called handler is used for measurement. The semiconductor device for measurement is engaged with this unit with a constant pressure for inspection.

FIG. 4 shows an example of a conventional semiconductor device measuring apparatus used for product inspection. The operation of the semiconductor device 100 will be briefly described. Transfer arm at position 102
It is held by 103, lifted and moved in parallel, and set on the measuring unit 105 of the measuring unit 104. At this time, at the same time, the semiconductor device 100 in the measuring section 105 after the measurement is lifted by the transfer arm 103 and moved in parallel, and sent to the IC take-out unit 107 at the contact position 106. The semiconductor device 100 brought into the measuring unit 105 is subjected to measurement of electricity, characteristics, etc., but in order to secure electrical connection with the terminals in the measuring unit 105, a clamp lever 108 that can be rotated and moved up and down. Is pressed downward by and measurement is performed. After the measurement, the measured semiconductor device 100 is unloaded by the transfer arm 103 as the new semiconductor device 100 is set.

Then, the transport time, which is obtained by subtracting the measurement time from the cycle time from the loading to the unloading of the semiconductor device 100 in this measuring device, is required to be about 3.6 seconds.

D. Problems to be solved by the invention The measurement for such product inspection has an economic merit as the time is shortened.

However, if the measurement time for performing electrical measurement is shortened in the cycle time from loading to unloading, it may not be possible to perform a sufficient inspection. Therefore, it becomes necessary to shorten the transportation time itself.

Therefore, in view of the above problems, the present invention has an object to provide a measuring apparatus for a semiconductor device, which shortens the transportation time and has good working efficiency.

E. Means for Solving the Problems In order to achieve the above-mentioned object, the semiconductor device measuring apparatus according to the present invention reciprocates in the direction orthogonal to the axial direction of the rotating shaft and holds the semiconductor device by suction. And a plurality of semiconductor device holding units that are integrally rotated with the rotating shaft, and that are held in the rotating shaft by reciprocating in the axial direction of the rotating shaft. A reciprocating member for reciprocating operation, and a semiconductor device loading unit at a position on the outer periphery of the rotating shaft and facing the holding means of the semiconductor device holding unit,
A semiconductor device measuring unit and a semiconductor device take-out unit are arranged respectively.

F. Action The semiconductor device measuring apparatus according to the present invention suction-holds the semiconductor device loaded from the semiconductor device loading unit in the holding means of the semiconductor device holding unit. The rotation shaft is rotated while the semiconductor device is suction-held by the holding unit, and the semiconductor device suction-held by the holding unit is opposed to the semiconductor-device measuring unit. Where the semiconductor device is opposed to the semiconductor device measuring unit, the reciprocating member is operated to advance the holding means to the semiconductor device measuring unit side, and the semiconductor device sucked and held by the holding means is brought into pressure contact with the semiconductor device measuring unit, The electrical characteristics of this semiconductor device are measured. After the measurement by the semiconductor device measuring unit is completed, the reciprocating member is operated to move the holding unit out of the semiconductor device measuring unit, and the semiconductor device suction-held by the holding unit is separated from the semiconductor device measuring unit.
Next, when the semiconductor device held by the holding means by suction is opposed to the semiconductor device taking-out unit by rotating the rotary shaft, the semiconductor device is taken out by the semiconductor device taking-out unit by releasing the suction of the semiconductor device.

Here, in comparison with a conventional measuring apparatus for semiconductor devices, in the apparatus shown in FIG. 4, a linear translation operation is performed, so that the transfer arm 10 is used for at least one cycle.
Although 3 must reciprocate and an arm for clamping is also required, the semiconductor device measuring device of the present invention realizes smooth transfer, especially by rotating a single rotating shaft in one direction. It Therefore, it is advantageous in terms of positioning and transport speed, and the transport time is greatly shortened.

G. Embodiment A preferred embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view for explaining an outline of a measuring device 1 for a semiconductor device according to an embodiment of the present invention. A holding unit 3 that is a semiconductor device holding means is radially arranged at four points around a rotation axis 2 as a center. Around the rotation shaft 2, a loading unit 4, which is a semiconductor device loading unit, a measurement unit 5, which is a semiconductor device measuring unit, and a semiconductor device unloading unit, are located around the rotary shaft 2 at positions that can face the holding unit 3, respectively. The take-out units 6 are respectively provided.

The rotary shaft 2 rotates a holding unit 3 radially attached to the rotary shaft 2 to rotate each of the units 4, 5, and 6.
It is for transporting between, and transmits the rotational movement thereof. In the case of this embodiment, the rotary shaft 2 is
By repeating 0 ° rotation, stop, 90 ° rotation, stop, etc., it smoothly rotates in a certain direction without any complicated operation such as reverse rotation. Further, such smooth rotation can shorten the transportation time.

Further, the rotating shaft 2 has a built-in mechanism for operating the holding unit 3, and further has a built-in mechanism for sucking the semiconductor device to be measured on the holding unit 3. FIG. 2 is a cross-sectional view of such a rotating shaft 2 and the like. The rotating shaft 2 is composed of a cylindrical cylinder portion 21 and a reciprocating member 22 having a substantially conical portion. The cylinder portion 21 has a function of sliding the reciprocating member 22 on the inner wall and disposing the holding unit 3 at four locations on the outer periphery thereof in a direction perpendicular to the axial direction of the rotating shaft 2. ing. The reciprocating member 22 reciprocates by sliding on the inner wall of the cylinder portion 21 by air pressure, and the reciprocating action causes the pressing portion 24 of the holding unit 3 to reciprocate in a direction perpendicular to the axial direction. To do. That is, the pressing portion 24 of the holding unit 3 protruding and attached inside the cylinder portion 21 is constantly pressed against the reciprocating member 22, and the reciprocating member 22 reciprocates to move the reciprocating member 22. Peripheral surface 23 of operation member 22 having a triangular cross section
The pressing portion 24, which comes into contact with, reciprocates in the direction perpendicular to the axial direction of the rotary shaft 2. Then, by such a reciprocating operation, a predetermined pressing can be performed at the time of measurement, and accurate measurement data can be easily obtained.

The reciprocating motion of the reciprocating member 22 of the rotary shaft 2 is performed by the pressure of the air that is taken in and out through the air holes 25 and 26.
Further, the rotary shaft 2 is also provided with suction air discharge holes 27 for carrying out a suction operation of a semiconductor device, which will be described later, at four positions corresponding to each holding unit 3.

Further, as will be described later, when a set of holding units 3 composed of a plurality of holding units 3 is provided at two or more places, the peripheral surface 23 of the reciprocating member 22 having a triangular cross section is correspondingly provided. May be provided by the corresponding number.

The holding unit 3 is provided with an engaging member 31 as a holding means for receiving the semiconductor devices sequentially fed from the feeding unit 4 and sucking and holding the semiconductor devices on the tip side. The engagement member 31 sucks and holds the semiconductor device through the suction hole 31 formed in the bottom. Therefore, the engaging member 31
Even if the holding unit 3 rotates integrally with the rotary shaft 5, the semiconductor device sucked and held by the device is prevented from coming off from the engaging member 31. In the measuring device for a semiconductor device of this embodiment, the holding units 3 are provided at four locations on the circumference of the rotary shaft 2, but are not particularly limited, and a plurality of holding units other than four may be provided. The holding unit 3 can be provided. Further, there may be a plurality of sets of holding units 3 which are arranged on one circumference of the rotary shaft 2 and are composed of four or more holding units 3, and in this case, the processing capacity is doubled. I will go.

Here, the engaging member 31 attached to the tip portion of the holding unit 3 will be briefly described. As shown in FIG. 3, for example, the semiconductor device 30 inserted from above the engaging member 31 is provided with pins 32 on each side. The package portion 36 of the semiconductor device 30 is located on the upper surface 34 of the protruding portion 33 of the member 31 and, at the same time, is displaced along the protruding portion 33 along the inclined portion 35 of the protruding portion 33 even when the position is displaced by a minute distance. Alternatively, the bent portion of the pin 32 of the semiconductor device is fitted. For this reason, the semiconductor device 30 is promptly and reliably engaged with the engaging member 31 by the insertion, and further the suction hole is formed.
By 37, it will be held from measurement to delivery. Then, at the time of measurement, the pins 32 of the semiconductor device 30 are pressed against the measurement unit 5 by the upper surface 34 of the projecting portion 33 with a pressure necessary for measurement (for example, 100 g per pin).

The loading unit 4 is means for guiding the semiconductor device to the holding unit 3 arranged on the rotating shaft 2, and the discharging portion of the loading unit 4 is provided so as to face the holding unit 3, and the semiconductor unit is provided. The devices can be delivered sequentially. A slit substantially corresponding to the planar shape of the semiconductor device can be provided between the loading unit 4 and the holding unit 3 to ensure the loading of the semiconductor device. In the semiconductor device measuring apparatus according to the present embodiment, the charging unit 4 is formed on the upper portion of the rotary shaft 2, but is not particularly limited. In addition, in the input unit 4,
The semiconductor device is transported with the pins facing upward. Further, the pin can be made to face downward depending on the shape of the engaging member 31.

The measuring unit 5 is for measuring the electrical characteristics and the like of the semiconductor device held by the holding unit 3 facing each other by the rotation of the rotating shaft 2, and the test package 7 supporting the non-operation is attached. ing. When pressing the semiconductor device to the measuring unit 5, a clamp lever different from the conventional transfer arm was used, but in the present embodiment, the reciprocating member 22 in the rotary shaft 2 is used.
The reciprocating movement of the engaging member 31 allows the engaging member 31 to freely move in and out from the center of the shaft. For this reason, the pressing operation can be performed on the measurement unit 5 without providing any separate arm or the like, so that reliable measurement can be performed and the space required for the measurement can be a small space, which is so-called space saving. Is.

The take-out unit 6 is a unit for taking out and carrying out the semiconductor device after measurement, and the suction hole 37
The semiconductor device sucked by the sucking operation is opened at a position facing the takeout unit 6 and is carried out by the takeout unit 6.

Next, the operation of the semiconductor device measuring apparatus according to the present embodiment will be described.

First, semiconductor devices to be measured are sequentially sent by the charging unit 4 of the semiconductor device measuring apparatus of the present embodiment,
The holding unit 3 located above the rotary shaft 2 receives one semiconductor device loaded from the loading unit 4. At this time, the engaging member 31 is arranged at the tip of the holding unit 3 as described above, the semiconductor device can be easily engaged by the engaging member 31, and the engaging member 31 is attracted. The semiconductor device is engaged by the hole 37.
It can be adsorbed on 31 and held stably. When the semiconductor device is dropped from the loading unit 4, the holding unit 3 located above the rotary shaft 2 is also reciprocating member in synchronization with the pressing operation for measuring another semiconductor device. It operates by the operation of 22, and the distance of free fall of the semiconductor device becomes short.

When the measurement of the semiconductor device measured in advance is completed, the rotary shaft 2 of the measuring device turns 90 °. At this time, the holding unit 3 is rotated in the retracted state by the operation of the reciprocating member 22, and the semiconductor device is loaded into the loading unit 4.
When the holding unit 3 received from the unit faces the measuring unit 5, the rotation operation is stopped.

The rotation is stopped, and the semiconductor device is pressed against the measuring portion of the measuring unit 5 again by the operation of the reciprocating member 22 of the rotary shaft 2, so that the measurement is performed. At this time, the upper surface of the protruding portion 33 of the engaging member 31
34 comes into close contact with the measurement terminal of the measurement unit 5, and a reliable electrical connection is made. At the same time, the semiconductor device is heated to a predetermined temperature (for example, 100 ° C.) and tested, but there is no problem in measurement because the engaging member 31 is made of heat-resistant resin. When the measurement is completed,
The engaging member 31 of the holding unit 3 is retracted, and further, the same holding unit 3 is used to turn 90 ° in the same direction as the turning from the loading unit 4 to the measuring unit 5 described above. In addition, at the time of this measurement, the suction holes of the engaging member 31.
Even if the vacuum suction is continuously performed at 37 and the semiconductor device is moved in parallel in the lateral direction, no positional displacement or the like occurs. In addition, the reciprocating motion of the engaging member 31 of the holding unit 3 is the same as the other
The operation is common to the one holding unit 3.

The rotation of the rotary shaft 2 is stopped by the rotation of the rotary shaft 2 at a rotation of 90 °, and the holding unit 3 faces the take-out unit 6. Then, at such a position where the semiconductor device is adsorbed, the semiconductor device that has been adsorbed is released from turning off the adsorption operation of the adsorption hole 37, and the semiconductor device is dropped into the take-out unit 6 and taken out. You can

The holding unit 3 with the semiconductor device opened is further rotated by 90 ° to be in a waiting state at a position opposite to the holding unit 3 which is facing the measuring unit 5 and is measuring the semiconductor device, and the engaging member 31 Air blowing or preheating can be performed, and in the next 90 ° turn, it faces the charging unit 4 as described above.

Although the above description has been made mainly by focusing on one holding unit 3, such an operation can be continuously performed by all the holding units 3 to realize a smooth measurement operation.

With such a mechanism, first, it is possible to significantly reduce the time. That is, since the single holding unit 3 is rotated and conveyed in the same direction, it is advantageous in terms of the accuracy of the supporting position of the semiconductor device, the feed distance, and the like, and reliable conveyance can be realized without taking time. It Regarding the example of the transport time realized here, the figure shows that the transport time is about 2.0 seconds, which is significantly shorter than the conventional mechanism of 3.6 seconds.

In addition, the conventional clamp lever for pressing is no longer necessary, and the mechanism for pressing is built in the rotating shaft, so the occupied space is small overall and space saving can be facilitated easily. You can

H. Effect of the Invention In the semiconductor device measuring apparatus of the present invention, smooth transport is realized by the single rotating shaft rotating intermittently in one direction.
Therefore, it is advantageous in terms of positioning and transport speed, and the transport time is greatly shortened. Further, the occupied space can be reduced, which is also advantageous in saving space.

In particular, the semiconductor device held by the semiconductor device holding unit can be pressed into contact with the semiconductor device measuring unit for accurate electrical measurement, and further, the attachment / detachment of the semiconductor device suction-held by the semiconductor device holding unit can be performed. Since this can be easily performed by controlling the suction operation of the semiconductor device holding unit, it is possible to smoothly perform a series of operations from suction holding of the semiconductor device to measurement and unloading.

[Brief description of drawings]

FIG. 1 is a perspective view for explaining a schematic structure of a semiconductor device measuring apparatus of the present invention, FIG. 2 is a cross-sectional view of an example of a rotation shaft thereof, and FIG. 3 is a perspective view of an example of an engaging member thereof. Is. FIG. 4 is a perspective view showing an example of a conventional measuring apparatus for semiconductor devices. 2 ... Rotating shaft 3 ... Holding unit (semiconductor device holding means) 4 ... Loading unit (semiconductor device loading means) 5 ... Measuring unit (semiconductor device measuring means) 6 ... Ejecting unit (semiconductor device unloading means)

Claims (1)

[Claims] 1. A plurality of semiconductor device holding units, each of which has a holding means for reciprocating in a direction orthogonal to the axial direction of the rotating shaft and which has a holding means for sucking and holding the semiconductor device and which is rotated integrally with the rotating shaft. A reciprocating member which is disposed in the rotating shaft and reciprocates the holding means by reciprocating in the axial direction of the rotating shaft; A semiconductor device measuring apparatus, comprising a semiconductor device loading unit, a semiconductor device measuring unit, and a semiconductor device removing unit, which are arranged at positions facing the holding means.