JPH0711872B2 - Pickup mechanism light receiving element fixing structure - Google Patents
Pickup mechanism light receiving element fixing structureInfo
- Publication number
- JPH0711872B2 JPH0711872B2 JP63182575A JP18257588A JPH0711872B2 JP H0711872 B2 JPH0711872 B2 JP H0711872B2 JP 63182575 A JP63182575 A JP 63182575A JP 18257588 A JP18257588 A JP 18257588A JP H0711872 B2 JPH0711872 B2 JP H0711872B2
- Authority
- JP
- Japan
- Prior art keywords
- light receiving
- receiving element
- flexible substrate
- conductor pattern
- pickup mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 claims description 60
- 239000004020 conductor Substances 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 230000003287 optical effect Effects 0.000 claims description 17
- 230000003014 reinforcing effect Effects 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 239000011888 foil Substances 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Landscapes
- Light Receiving Elements (AREA)
- Optical Head (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、光ディスクにおけるピックアップ機構の受光
素子固定構造に関するものである。The present invention relates to a structure for fixing a light receiving element of a pickup mechanism in an optical disc.
従来のピックアップ機構は、第５図に示すように、フレ
キシブル基板52の端子部に端子が接続され固定された受
光素子53を用意し、フレキシブル基板52を基体51の開口
部51a周辺に接続剤等により接着することにより、受光
素子53を開口部51aに固定している。In the conventional pickup mechanism, as shown in FIG. 5, a light receiving element 53 having terminals connected to and fixed to a terminal portion of a flexible substrate 52 is prepared, and the flexible substrate 52 is connected to the periphery of the opening 51a of the base 51 with a connecting agent or the like. The light receiving element 53 is fixed to the opening 51a by being adhered by.
上記構成のピックアップ機構において、半導体レーザ54
から発射される光l1は、コリメータ・レンズ及び偏光ビ
ームスプリッタ等からなる光学系55、対物レンズ56を通
ってディスク57に照射し、該ディスク57の凹凸面により
反射された光l2は光学系55を通って基体51の開口部51a
から受光素子53に受光され、電気信号に変換され、フレ
キシブル基板52の導電パターンを通ってピックアップ機
構外の装置に導かれる。In the pickup mechanism having the above structure, the semiconductor laser 54
The light l 1 emitted from the optical system 55 including a collimator lens and a polarization beam splitter and an objective lens 56 is applied to a disk 57, and the light l 2 reflected by the uneven surface of the disk 57 is optical. Opening 51a of substrate 51 through system 55
The light is received by the light receiving element 53, converted into an electric signal, and guided to a device outside the pickup mechanism through the conductive pattern of the flexible substrate 52.
上記構成のピックアップ機構においては、受光素子53を
基板51に固定する位置精度は高い精度を必要とする。ま
た、温度の変化による基体51及び光学経路の寸法変化・
歪みで光軸ズレを起こさないようにする必要もある。し
かしながら、従来のようにフレキシブル基板52を接着剤
で基体51の開口部51aの周辺に接着して受光素子53を固
定する方法では、高い位置精度を得ることが困難である
と共に、接着剤で接着するため基体51との間に温度によ
り歪みが発生し、光軸ズレを起こすという問題もあっ
た。In the pickup mechanism having the above structure, the positional accuracy of fixing the light receiving element 53 to the substrate 51 requires high accuracy. In addition, the dimensional changes of the substrate 51 and the optical path due to changes in temperature
It is also necessary to prevent optical axis shift due to distortion. However, in the conventional method of fixing the light receiving element 53 by adhering the flexible substrate 52 to the periphery of the opening 51a of the base 51 with an adhesive, it is difficult to obtain high positional accuracy, and the adhesive is adhered with an adhesive. Therefore, there is also a problem in that distortion occurs due to temperature between the base 51 and the optical axis, which causes optical axis misalignment.
本発明は上述の点に鑑みてなされたもので、受光素子を
高度の位置精度で固定できる共に、温度の変化による基
体及び光学経路の寸法変化・歪みで光軸ズレを起こさ
ず、且つ組み立ての容易なピックアップ機構の受素子固
定構造を提供することにある。The present invention has been made in view of the above-mentioned points, and the light receiving element can be fixed with a high degree of positional accuracy, and the optical axis shift does not occur due to the dimensional change and distortion of the substrate and the optical path due to the temperature change, and An object is to provide a receiving element fixing structure of an easy pickup mechanism.
上記問題点を解決するため本発明は、ピックアップ機構
の基体と該基体に装着される受光素子を具備し、発光素
子から発射され、光ディスク面により反射される光を前
記受光素子により受光し電気信号に変換するピックアッ
プ機構の受光素子固定構造において、第１図及び第２図
に示すように、受光素子３の端子3a,3bを樹脂フィルム
に導電体パターン10を形成してなるフレキシブル基板２
の導電体パターン10の端部に接続して該受光素子３を該
フレキシブル基板２に実装し、該実装体の受光素子３の
少なくとも受光面を除く部分とフレキシブル基板２の一
部に樹脂モールドを施し、該樹脂モールド部で基板１の
形状にすると共に、該受光素子３の受光面を除く部分と
該フレキシブル基板２の一部を該基体１に固定したこと
を特徴とする。In order to solve the above problems, the present invention comprises a base of a pickup mechanism and a light receiving element mounted on the base, and the light emitted from the light emitting element and reflected by the optical disk surface is received by the light receiving element and an electric signal is received. In the structure for fixing the light receiving element of the pickup mechanism for converting into the flexible substrate 2, as shown in FIGS. 1 and 2, the flexible substrate 2 is formed by forming the conductor pattern 10 on the terminals 3a and 3b of the light receiving element 3 with the resin film.
The light receiving element 3 is mounted on the flexible substrate 2 by being connected to the end of the conductor pattern 10 of, and a resin mold is formed on a portion of the flexible substrate 2 except at least the light receiving surface of the light receiving element 3 of the mounted body. The resin mold portion is formed into the shape of the substrate 1, and a portion of the light receiving element 3 excluding the light receiving surface and a portion of the flexible substrate 2 are fixed to the base 1.
また、第３図（ｂ）に示すように、受光素子３の端子3
a,3bとフレキシブル基板２の導電体パターン10の端部の
接続部は、該導電体パターン10の端部と該受光素子３の
端子3a,3bを接続し、その上に該フレキブル基板２と同
質の樹脂材からなる補強フィルム７を載置し、該導電体
パターン10の端部を除く部分のフレキシブル基板２と該
補強フィルム７を局部的に溶着し、該補強フィルム７で
該受光素子３の端子3a,3bと該導電体パターン10の端部
の接続を補強していることを特徴とする。In addition, as shown in FIG.
The connecting portions between a and 3b and the end portion of the conductor pattern 10 of the flexible substrate 2 connect the end portion of the conductor pattern 10 and the terminals 3a and 3b of the light receiving element 3, on which the flexible substrate 2 and the flexible substrate 2 are connected. A reinforcing film 7 made of a resin material of the same quality is placed, and the flexible substrate 2 and the reinforcing film 7 in a portion other than the end portion of the conductor pattern 10 are locally welded, and the light receiving element 3 is formed by the reinforcing film 7. It is characterized in that the connection between the terminals 3a, 3b and the end of the conductor pattern 10 is reinforced.
また、第３図（ｃ）に示すように、フレキシブル基板２
の基体１に固定されない他方の端部の導電体パターン10
上には金属端子片４を接続し、その上に該フレキシブル
基板２と同質の樹脂材からなる補強フィルム９を載置
し、該導電体パターン10の端部を除く部分のフレキシブ
ル基板２と該補強フィルム９を局部的に溶着し、該補強
フィルム９で該金属端子片４と導電体パターン10の端部
の接続を補強した構造の端子が設けたことを特徴とす
る。Further, as shown in FIG. 3 (c), the flexible substrate 2
Conductor pattern 10 at the other end that is not fixed to the base body 1 of
A metal terminal piece 4 is connected on top of which a reinforcing film 9 made of a resin material of the same quality as that of the flexible board 2 is placed, and the flexible board 2 and the flexible board 2 in the portion excluding the end portion of the conductor pattern 10 A reinforcing film 9 is locally welded, and a terminal having a structure in which the connection between the metal terminal piece 4 and the end of the conductor pattern 10 is reinforced by the reinforcing film 9 is provided.
本発明はピックアップ機構の受光素子固定構造に上記構
成を採用することにより、受光素子３の端子3a,3bをフ
レキシブル基板２の導電体パターン10の端部に接続して
なる受光素子３をフレキシブル基板２に実装体の受光素
子３の少なくとも受光面を除く部分とフレキシブル基板
２の一部に樹脂モールドを施し、該樹脂モールド部で基
体１の形状にすると共に、該受光素子３の受光面を除く
部分と該フレキシブル基板２の一部を該基体１に固定し
たので、基体１を固定するだけで受光素子３の固定位置
が決まり、受光素子３の固定位置精度が向上する。According to the present invention, by adopting the above-described structure in the light receiving element fixing structure of the pickup mechanism, the light receiving element 3 formed by connecting the terminals 3a and 3b of the light receiving element 3 to the end of the conductor pattern 10 of the flexible substrate 2 is a flexible substrate. 2, a part of the light receiving element 3 of the mounting body excluding at least the light receiving surface and a part of the flexible substrate 2 are resin-molded to form the base 1 in the resin mold portion, and the light receiving surface of the light receiving element 3 is removed. Since the portion and a part of the flexible substrate 2 are fixed to the base 1, the fixing position of the light receiving element 3 is determined only by fixing the base 1, and the fixing position accuracy of the light receiving element 3 is improved.
また、従来のように接着剤を用いて受光素子３を固定す
るのではなく、熱膨張率及び吸収膨張率の小さい高機能
樹脂材、例えばポリフェニレンスルフイドや液晶ポリマ
ー等を使用して一体成形されるので、温度の変化による
基体及び光学経路の寸法変化・歪みで光軸ズレを起さな
い。Further, instead of fixing the light receiving element 3 by using an adhesive as in the conventional case, it is integrally molded using a high-performance resin material having a small coefficient of thermal expansion and absorption expansion, such as polyphenylene sulfide or liquid crystal polymer. Therefore, the optical axis shift does not occur due to the dimensional change / distortion of the substrate and the optical path due to the temperature change.
以下、本発明の一実施例を図面に基づいて説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第１図乃至第２図は本発明に係るピックアップ機構の受
光素子固定構造を示す図、第１図は受光素子固定構造の
外観斜視図、第２図（ａ）は受光素子固定構造の平面
図、第２図（ｂ）は同図（ａ）の矢印Ａ方向から見た側
面図、第２図（ｃ）は同図（ａ）の矢印Ｂ方向から見た
側面図、第２図（ｄ）は受光素子固定構造の底面図、第
２図（ｅ）は同図（ｄ）のＥ−Ｅ断面図、第２図（ｆ）
は同図（ｄ）のＣ−Ｃ断面図、第２図（ｇ）は同図
（ｄ）のＤ−Ｄ断面図である。図において、１はピック
アップ機構の基体１であり（第５図の光学系55から上部
の基体部分に相当する）、該基体１は合成樹脂材で構成
され、その下部側部には基体１を固定するための固定部
材1aが設けられている。1 and 2 are views showing a light receiving element fixing structure of a pickup mechanism according to the present invention, FIG. 1 is an external perspective view of the light receiving element fixing structure, and FIG. 2 (a) is a plan view of the light receiving element fixing structure. 2 (b) is a side view seen from the direction of arrow A in FIG. 2 (a), FIG. 2 (c) is a side view seen from the direction of arrow B in FIG. 2 (a), and FIG. ) Is a bottom view of the light receiving element fixing structure, FIG. 2 (e) is a sectional view taken along line EE of FIG. 2 (d), and FIG. 2 (f).
FIG. 2D is a sectional view taken along line CC of FIG. 2D, and FIG. 2G is a sectional view taken along line DD of FIG. In the figure, reference numeral 1 denotes a base body 1 of the pickup mechanism (corresponding to an upper base portion from the optical system 55 in FIG. 5), the base body 1 is made of a synthetic resin material, and the base body 1 is provided on a lower side portion thereof. A fixing member 1a for fixing is provided.
また、固定部材1a,1aのそれぞれには取付用穴1c,1cが設
けられ、一方にはピックアップ機構に組込む場合のガイ
ド穴1dが設けられている。受光素子３は市販の受光素子
であり、該受光素子３の側部から外部に突出する端子3
a,3bは、後に詳述するように樹脂フィルムからなるフレ
キシブル基板２導電パターンの端部に半田付け又は導電
性接着剤で接続され、更に、フレキシブル基板２の導電
パターンの他方の端部には金属端子片４が半田付け又は
導電性接着剤で接続されている。Further, the fixing members 1a, 1a are provided with mounting holes 1c, 1c, respectively, and one of them is provided with a guide hole 1d for incorporation into a pickup mechanism. The light receiving element 3 is a commercially available light receiving element, and the terminal 3 protruding from the side of the light receiving element 3 to the outside.
The a and 3b are connected to the end of the conductive pattern of the flexible substrate 2 made of a resin film by soldering or a conductive adhesive as described later in detail, and further, to the other end of the conductive pattern of the flexible substrate 2. The metal terminal pieces 4 are connected by soldering or a conductive adhesive.
上記の如く基体１を合成樹脂材でモールド形成する際、
端子3a,3bをフレキシブル基板２の導電パターンの端子
部に接続固定し、受光素子３とフレキシブル基板２と一
体となったもののフレキシブル基板２の一部をインサー
トして固定する。このとき受光素子３の受光面はピック
アップ機構の図示しない光学系からの光が通る空洞1bに
面している。When the base 1 is molded with a synthetic resin material as described above,
The terminals 3a and 3b are connected and fixed to the terminal portions of the conductive pattern of the flexible substrate 2, and a part of the flexible substrate 2 which is integrated with the light receiving element 3 and the flexible substrate 2 is inserted and fixed. At this time, the light receiving surface of the light receiving element 3 faces the cavity 1b through which light from an optical system (not shown) of the pickup mechanism passes.
第３図は受光素子３をフレキシブル基板２に実装した状
態を示す図で、第３図（ａ）は平面図、第３図（ｂ）は
同図（ａ）のＦ−Ｆ断面図、第３図（ｃ）は同図（ａ）
のＧ−Ｇ断面図である。フレキシブル基板２は熱可塑性
の耐熱性フィルム（例えばポリパラバン酸、ポリエーテ
ルイミド、ポリエチレンテレフタレート等）からなる合
成樹脂フィルムの面上に導電体パターン10が形成され、
更にその上に絶縁用の樹脂材をラミネートして形成され
たものである。この導電体パターン10は銀ペースト等の
導電性ペーストを印刷して形成してもよく、或いは金属
箔が上面に形成されている合成樹脂フィルムの該金属箔
をエッチング処理して形成したものでもよい。特に合成
樹脂フィルムの上面にアルミニウム箔を形成し、該アル
ミニウム箔をエッチング処理して形成したものが好適で
ある。フレキシブル基板２の端部に形成された端子部５
は第３図（ｂ）に示すように、受光素子３の端子3aを導
電体パターン10の端部に半田付け或いは導電性接着剤で
接続した後、該フレキシブル基板２と同質の補強フィル
ムを端子3aの上から載置し、導電体パターン10を除く部
分を局部的に超音波等により溶着した構造のものであ
る。なお、端子部６の構造も端子部５と略同じ構造であ
るからその説明は省略する。また、フレキシブル基板２
の他端部に形成された端子部８は導電体パターン10の端
部に金属端子片４を半田付け或いは導電性接着剤で接続
した後、該フレキシブル基板２と同質の補強フィルム９
を金属端子片４の上から載置し、導電体パターン10を除
く部分を局部的に超音波等により溶着した構造のもので
ある。端子部5,6,8を上記の如く構成とすることによ
り、これら端子部は極めて薄い構造となる。次に、受光
素子３の実装されたフレキシブル基板２を基体１内にイ
ンサートする方法について説明する。FIG. 3 is a view showing a state in which the light receiving element 3 is mounted on the flexible substrate 2. FIG. 3 (a) is a plan view, FIG. 3 (b) is a sectional view taken along the line FF of FIG. Figure 3 (c) is the same figure (a)
FIG. The flexible substrate 2 has a conductor pattern 10 formed on the surface of a synthetic resin film made of a thermoplastic heat-resistant film (eg, polyparabanic acid, polyetherimide, polyethylene terephthalate, etc.).
Further, it is formed by laminating an insulating resin material thereon. The conductor pattern 10 may be formed by printing a conductive paste such as silver paste, or may be formed by etching a metal foil of a synthetic resin film on which a metal foil is formed. . In particular, it is preferable that an aluminum foil is formed on the upper surface of a synthetic resin film and the aluminum foil is subjected to an etching treatment. Terminal part 5 formed at the end of the flexible substrate 2
As shown in FIG. 3 (b), after the terminal 3a of the light receiving element 3 is soldered to the end of the conductor pattern 10 or connected with a conductive adhesive, a reinforcing film of the same quality as the flexible substrate 2 is connected to the terminal. It has a structure in which it is placed from above 3a, and the portion excluding the conductor pattern 10 is locally welded by ultrasonic waves or the like. Note that the structure of the terminal portion 6 is substantially the same as that of the terminal portion 5, and therefore its description is omitted. In addition, the flexible substrate 2
The terminal portion 8 formed on the other end portion of the flexible substrate 2 is formed by connecting the metal terminal piece 4 to the end portion of the conductor pattern 10 by soldering or a conductive adhesive, and then forming a reinforcing film 9 of the same quality as the flexible substrate 2.
Is placed on the metal terminal piece 4 and the portion excluding the conductor pattern 10 is locally welded by ultrasonic waves or the like. By configuring the terminal portions 5, 6, 8 as described above, these terminal portions have an extremely thin structure. Next, a method of inserting the flexible substrate 2 on which the light receiving element 3 is mounted into the base 1 will be described.
第４図は基体１を樹脂モールド成形するための金型と構
造を示す図で、第４図（ａ）は下金型21の平面図、第４
図（ｂ）は下金型21と上金型22とを組合わせた組合体の
側断面図｛同図（ａ）のＨ−Ｈ位置に相当する側断面
図｝、第４図（ｃ）は組合体の断面図｛同図（ａ）のＩ
−Ｉ位置に相当する断面図｝、第４図（ｄ）は組合体の
断面図｛同図（ａ）のＪ−Ｊ位置に相当する断面図｝で
ある。図示するように、下金型21には受光素子３及びフ
レキシブル基板２を支持する支持面（点線の斜線を施し
た部分）を有する支持材21a,21b,21cが形成されてお
り、中央部の支持材21aは受光素子３を支持するもので
あり、該支持部材21aの中央部には溶融樹脂材を射出す
る際、該溶融樹脂材が受光素子３の光受面に浸入しない
ように空洞21hが形成されている。下金型21の左右両端
部は後述する上金型22の上面に当接する側壁部材21f,21
gが形成されている。なお、支持材21aの両側には受光素
子３を挾み込むような位置にそれぞれ位置決用の支持ピ
ン21dと支持ピン21eが設けられており、該支持ピン21d
と支持ピン21eはそれぞれ下金型に設けられた位置決用
穴に挿入されるようになっている。また、支持材21a,21
b,21cの上面には複数の細溝21jが形成されている。FIG. 4 is a view showing a mold and a structure for resin-molding the base body 1. FIG. 4 (a) is a plan view of the lower mold 21,
FIG. 4B is a side sectional view of a combined body in which the lower die 21 and the upper die 22 are combined {a side sectional view corresponding to the position H-H in FIG. 4A}, and FIG. 4C. Is a cross-sectional view of the combination {I in FIG.
FIG. 4D is a cross-sectional view of the combination {a cross-sectional view corresponding to the JJ position in FIG. 4A}. As shown in the figure, the lower mold 21 is provided with supporting members 21a, 21b, 21c having a supporting surface (portion shaded with dotted lines) for supporting the light receiving element 3 and the flexible substrate 2, and the supporting member 21a, 21b, 21c The supporting member 21a supports the light receiving element 3, and when the molten resin material is injected into the central portion of the supporting member 21a, the cavity 21h is formed so that the molten resin material does not enter the light receiving surface of the light receiving element 3. Are formed. The left and right ends of the lower mold 21 are in contact with the upper surface of the upper mold 22, which will be described later, and are side wall members 21f, 21
g is formed. A support pin 21d and a support pin 21e for positioning are provided on both sides of the support member 21a at positions where the light receiving element 3 is sandwiched, respectively.
The support pin 21e and the support pin 21e are respectively inserted into the positioning holes provided in the lower mold. In addition, the support members 21a, 21
A plurality of narrow grooves 21j are formed on the upper surfaces of b and 21c.
また、上金型22には前記下金型21の支持材21a,21b,21c
が挿入される凹部22aが形成され、その前後両側には前
記下金型21の下面に当接する面を有する壁部材22b,22c
が形成されている。また、該壁部材22b,22cの下部には
それぞれ前記基体１の固定部材1aを形成するための凹部
22d,22eが形成されている。また、上金型22の中央部分
には溶融樹脂材で射出するためのピンゲート22fが形成
されている。In addition, the upper mold 22 has a support member 21a, 21b, 21c for the lower mold 21.
Wall members 22b, 22c each having a concave portion 22a formed therein and having a surface abutting against the lower surface of the lower mold 21 on both front and rear sides thereof.
Are formed. Also, recesses for forming the fixing members 1a of the base 1 are formed in the lower portions of the wall members 22b and 22c, respectively.
22d and 22e are formed. Further, a pin gate 22f for injecting a molten resin material is formed in the central portion of the upper mold 22.
下金型21の支持材21aの上面に受光素子３の受光面側が
位置するようにフレキシブル基板２に実装された受光素
子３を配置して（支持ピン21dと支持ピン21eの間に受光
素子３が位置する）、下金型21の支持ピン21d,21eを上
金型22の位置決用穴に挿入して、下金型21に上金型22を
組み込むことにより、フレキシブル基板２の側部は第４
図（ｃ），（ｄ）に示すように、壁部材22cの壁面に沿
って折り曲がる。この状態で上金型22のピンゲート22f
から溶融樹脂材を射出し、下金型21と上金型22で形成さ
れる空隙を該溶融樹脂材により満たし、硬化させること
により、第１図及び第２図に示すピックアップ機構の受
素子固定構造が完成する。即ち、溶融樹脂材を射出する
ことにより、支持部材21b,21cの上面に位置するフレキ
シブル基板２は支持材21b,21cの上面形成され複数の細
溝21jに浸入する溶融樹脂材と、上金型22の底部空隙に
浸入する溶融樹脂材とに挾み込まれた状態となると同時
に、支持材21a,21b,21cの側部にはみでたフレキシブル
基板２の一部2aは基体１の内壁面垂直にインサートされ
ることになる。The light receiving element 3 mounted on the flexible substrate 2 is arranged so that the light receiving surface side of the light receiving element 3 is located on the upper surface of the support material 21a of the lower mold 21 (the light receiving element 3 is provided between the support pin 21d and the support pin 21e). Is located), and the support pins 21d and 21e of the lower mold 21 are inserted into the positioning holes of the upper mold 22, and the upper mold 22 is incorporated into the lower mold 21, so that the side portions of the flexible substrate 2 Is the fourth
As shown in FIGS. (C) and (d), it is bent along the wall surface of the wall member 22c. In this state, the upper mold 22 pin gate 22f
A molten resin material is injected from the mold, and the gap formed by the lower mold 21 and the upper mold 22 is filled with the molten resin material and cured to fix the receiving element of the pickup mechanism shown in FIGS. 1 and 2. The structure is completed. That is, by injecting the molten resin material, the flexible substrate 2 located on the upper surfaces of the support members 21b, 21c is melted to penetrate into the plurality of narrow grooves 21j formed on the upper surfaces of the support materials 21b, 21c, and the upper mold. At the same time as being in a state of being sandwiched by the molten resin material that penetrates into the bottom void of 22, the part 2a of the flexible substrate 2 that is flanked by the side portions of the support members 21a, 21b, 21c is perpendicular to the inner wall surface of the base 1. Will be inserted.
上記溶融樹脂材としては、例えばポリフェニレンスルフ
イド、ポリエチレンテレフタレート、液晶ポリマー等を
用いる。As the molten resin material, for example, polyphenylene sulfide, polyethylene terephthalate, liquid crystal polymer or the like is used.
なお、上記実施例においては、フレキシブル基板２の一
部が受光素子３に対して直角下方に折り曲げた状態で基
体１内にインサートされているが、これはディスクから
反射され光を受光素子３で電気信号に変換し、該電気信
号を外部装置に導くための都合であり、外部装置の配置
位置等によっては適宜にインサートすることが可能であ
る。In the above embodiment, a part of the flexible substrate 2 is inserted into the base 1 in a state of being bent downward at a right angle to the light receiving element 3, but this is reflected by the disc and the light is received by the light receiving element 3. It is convenient for converting the electric signal into an electric signal and guiding the electric signal to an external device, and can be appropriately inserted depending on the arrangement position of the external device.
以上、説明したように本発明によれば、受光素子をフレ
キシブル基板を実装し、この受光素子とフレキシブル基
板の一部を、基体を合成樹脂材でモールド成形する際、
該基体の所定部にインサートするので下記のような優れ
た効果が得られる。As described above, according to the present invention, a light receiving element is mounted on a flexible substrate, and when the light receiving element and a part of the flexible substrate are molded with a base material by a synthetic resin material,
Since it is inserted into a predetermined portion of the base, the following excellent effects can be obtained.
受光素子の固定位置精度を向上させることができる。It is possible to improve the fixed position accuracy of the light receiving element.
従来のように、接着剤を用いて受光素子を固定するの
でないから、温度の変化による基体及び光学経路の寸法
変化・歪みで光軸ズレを起さない。Since the light receiving element is not fixed with an adhesive as in the conventional case, the optical axis is not displaced due to the dimensional change and distortion of the substrate and the optical path due to the temperature change.
フレキシブル基板、受光素子及び基体を一体的に形成
するから、受光素子固定構造組み立てが極めて簡単とな
る。Since the flexible substrate, the light receiving element and the base are integrally formed, the assembly of the light receiving element fixing structure becomes extremely easy.
第１図乃至第２図は本発明に係るピックアップ機構の受
光素子固定構造を示す図で、第１図は受光素子固定構造
の外観図、第２図（ａ）は受光素子固定構造の平面図、
第２図（ｂ）は同図（ａ）の矢印Ａ方向から見た側面
図、第２図（ｃ）は同図（ａ）の矢印Ｂ方向から見た側
面図、第２図（ｄ）は受光素子固定構造の底面図、第２
図（ｅ）は同図（ｄ）のＥ−Ｅ断面図、第２図（ｆ）は
同図（ｄ）のＣ−Ｃ断面図、第２図（ｇ）は同図（ｄ）
のＤ−Ｄ断面図、第３図は受光素子をフレキシブル基板
に実装した状態を示す図で、第３図（ａ）は平面図、第
３図（ｂ）は同図（ａ）のＦ−Ｆ断面図、第３図（ｃ）
は同図（ａ）のＧ−Ｇ断面図、第４図は基体１を樹脂モ
ールド成形するための金型の構造を示す図で、第４図
（ａ）は上金型を下から見た図、第４図（ｂ）は上金型
と下金型を組み合わせた状態の側断面図｛同図（ａ）の
Ｈ−Ｈ断面に相当｝、第４図（ｃ）はその断面図｛同図
（ａ）のＩ−Ｉ断面に相当｝、第４図（ｄ）はその断面
図｛同図（ａ）のＪ−Ｊ断面に相当｝、第５図は従来の
ピックアップ機構を示す図である。 図中、１……基体、２……フレキシブル基板、３……受
光素子、４……金属端子片、5,6,8……端子部、7,9……
補強フィルム、10……導電体パターン。1 and 2 are views showing a light receiving element fixing structure of a pickup mechanism according to the present invention, FIG. 1 is an external view of the light receiving element fixing structure, and FIG. 2 (a) is a plan view of the light receiving element fixing structure. ,
2 (b) is a side view seen from the direction of arrow A in FIG. 2 (a), FIG. 2 (c) is a side view seen from the direction of arrow B in FIG. 2 (a), and FIG. 2 (d). Is a bottom view of the light-receiving element fixing structure, second
2E is a sectional view taken along the line EE of FIG. 2D, FIG. 2F is a sectional view taken along the line CC of FIG. 2D, and FIG.
3 is a cross-sectional view taken along line D-D of FIG. 3, and FIG. 3 is a view showing a state in which the light receiving element is mounted on a flexible substrate. FIG. 3 (a) is a plan view and FIG. 3 (b) is F- of FIG. F sectional view, FIG. 3 (c)
FIG. 4A is a sectional view taken along line GG in FIG. 4A, and FIG. 4 is a view showing the structure of a mold for resin-molding the base body 1. FIG. 4A is a top view of the mold as seen from below. Fig. 4 (b) is a side sectional view of a state in which an upper die and a lower die are combined {corresponding to a section H-H in Fig. 4 (a)}, and Fig. 4 (c) is a sectional view thereof. FIG. 4 (d) is a sectional view thereof (corresponding to JJ section of FIG. 4 (a)), and FIG. 5 is a view showing a conventional pickup mechanism. Is. In the figure, 1 ... Base, 2 ... Flexible substrate, 3 ... Light receiving element, 4 ... Metal terminal piece, 5,6,8 ... Terminal part, 7,9 ...
Reinforcement film, 10 ... Conductor pattern.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 加来 泰俊 神奈川県川崎市中原区苅宿335番地 帝国 通信工業株式会社内 (72)発明者 水野 伸二 神奈川県川崎市中原区苅宿335番地 帝国 通信工業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasutoshi Karai, 335, Kayajuku, Nakahara-ku, Kawasaki-shi, Kanagawa Imperial Telecommunications Industry Co., Ltd. (72) Shinji Mizuno, 335, Kayajuku, Nakahara-ku, Kanagawa Prefecture Within the corporation
Claims (3)
れる受光素子を具備し、発光素子から発射され、光ディ
スク面により反射される光を前記受光素子により受光し
電気信号に変換するピックアップ機構の受光素子固定構
造において、 前記受光素子の端子を樹脂フィルムに導電体パターンを
形成してなるフレキシブル基板の該導電体パターン端部
に接続して該受光素子を該フレキブル基板に実装し、 前記実装体の前記受光素子の少なくとも受光面を除く部
分と前記フレキシブル基板の一部に樹脂モールドを施
し、該樹脂モールド部で前記基体の形状にすると共に、
該受光素子の受光面を除く部分と該フレキシブル基板の
一部を該基体に固定したことを特徴とするピックアップ
機構の受光素子固定構造。1. A pickup mechanism comprising a base of a pickup mechanism and a light receiving element mounted on the base, wherein light emitted from the light emitting element and reflected by an optical disk surface is received by the light receiving element and converted into an electric signal. In the light receiving element fixing structure, a terminal of the light receiving element is connected to an end portion of the conductor pattern of a flexible substrate formed by forming a conductor pattern on a resin film, and the light receiving element is mounted on the flexible substrate. A part of the flexible substrate and at least a part of the light receiving element excluding the light receiving surface is resin-molded, and the shape of the base is formed by the resin-molded part,
A light receiving element fixing structure of a pickup mechanism, characterized in that a part of the light receiving element excluding a light receiving surface and a part of the flexible substrate are fixed to the base.
板の導電体パターン端部の接続部は、該導電体パターン
端部と該受光素子の端子を接続し、その上に該フレキシ
ブル基板と同質の樹脂材からなる補強フイルムを載置
し、該導電体パターン端部を除く部分のフレキシブル基
板と該補強フィルムを局部的に溶着し、該補強フィルム
で該受光素子の端子と該導電体パターン端部の接続を補
強していることを特徴とする請求項（１）に記載のピッ
クアップ機構の受光素子固定構造。2. A connecting portion between a terminal of the light receiving element and an end portion of a conductor pattern of the flexible substrate connects the end portion of the conductor pattern and a terminal of the light receiving element, and has the same quality as the flexible substrate. A reinforcing film made of a resin material is placed, the flexible substrate of the portion excluding the end portion of the conductor pattern and the reinforcing film are locally welded, and the terminal of the light receiving element and the end portion of the conductor pattern are formed by the reinforcing film. The light receiving element fixing structure of the pickup mechanism according to claim 1, wherein the connection is reinforced.
れない他方の端部の導電体パターン上には金属端子片を
接続し、その上に該フレキシブル基板と同質の樹脂材か
らなる補強フィルムを載置し、該導電体パターン端部を
除く部分のフレキシブル基板と該補強フィルムを局部的
に溶着し、該補強フィルムで該金属端子片と該導電体パ
ターン端部の接続を補強した構造の端子が設けられてい
ることを特徴とする請求項（１）又は（２）に記載のピ
ックアップ機構の受光素子固定構造。3. A metal terminal piece is connected on a conductor pattern at the other end of the flexible substrate which is not fixed to the substrate, and a reinforcing film made of the same resin material as that of the flexible substrate is placed thereon. Then, the flexible substrate of the portion excluding the conductor pattern end is locally welded to the reinforcing film, and a terminal having a structure in which the connection between the metal terminal piece and the conductor pattern end is reinforced by the reinforcing film is provided. The light receiving element fixing structure of the pickup mechanism according to claim 1, wherein the light receiving element fixing structure is provided.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63182575A JPH0711872B2 (en) | 1988-07-21 | 1988-07-21 | Pickup mechanism light receiving element fixing structure |
| EP89201520A EP0347974B1 (en) | 1988-06-23 | 1989-06-12 | Mount for electronic parts |
| DE68918995T DE68918995T2 (en) | 1988-06-23 | 1989-06-12 | Assembly of electronic components. |
| US07/365,116 US5111363A (en) | 1988-06-23 | 1989-06-12 | Mount for electronic parts |
| KR1019890008678A KR950008430B1 (en) | 1988-06-23 | 1989-06-23 | Mount for electronic parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63182575A JPH0711872B2 (en) | 1988-07-21 | 1988-07-21 | Pickup mechanism light receiving element fixing structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0231342A JPH0231342A (en) | 1990-02-01 |
| JPH0711872B2 true JPH0711872B2 (en) | 1995-02-08 |
Family
ID=16120677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63182575A Expired - Fee Related JPH0711872B2 (en) | 1988-06-23 | 1988-07-21 | Pickup mechanism light receiving element fixing structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0711872B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006176047A (en) * | 2004-12-24 | 2006-07-06 | Denso Corp | Vehicle heat exchange device |
| JP5531650B2 (en) * | 2010-01-29 | 2014-06-25 | 富士通オプティカルコンポーネンツ株式会社 | Optical receiver device |
| CN106711731B (en) * | 2016-12-23 | 2023-01-10 | 广东锦润电子股份有限公司 | Automatic cover and ground plate insertion equipment and automatic assembly method thereof |
-
1988
- 1988-07-21 JP JP63182575A patent/JPH0711872B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0231342A (en) | 1990-02-01 |
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