JPH07119276B2 - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPH07119276B2 JPH07119276B2 JP2070862A JP7086290A JPH07119276B2 JP H07119276 B2 JPH07119276 B2 JP H07119276B2 JP 2070862 A JP2070862 A JP 2070862A JP 7086290 A JP7086290 A JP 7086290A JP H07119276 B2 JPH07119276 B2 JP H07119276B2
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- parts
- weight
- resin composition
- heat cycle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 29
- 229920000647 polyepoxide Polymers 0.000 title claims description 29
- 239000000203 mixture Substances 0.000 title claims description 23
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 9
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 8
- 239000003085 diluting agent Substances 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 8
- 229930185605 Bisphenol Natural products 0.000 claims description 7
- 150000008065 acid anhydrides Chemical class 0.000 claims description 7
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 claims description 6
- 238000004062 sedimentation Methods 0.000 description 8
- 230000009477 glass transition Effects 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 2
- 239000004727 Noryl Substances 0.000 description 2
- 229920001207 Noryl Polymers 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 150000008064 anhydrides Chemical class 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- -1 phosphorus compound Chemical class 0.000 description 2
- 229920006380 polyphenylene oxide Polymers 0.000 description 2
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- HZCUTIRDDAYWBB-UHFFFAOYSA-N 2-benzyl-4,5-dimethyl-1h-imidazole Chemical compound N1C(C)=C(C)N=C1CC1=CC=CC=C1 HZCUTIRDDAYWBB-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004902 Softening Agent Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 1
- ZWRDBWDXRLPESY-UHFFFAOYSA-N n-benzyl-n-ethylethanamine Chemical compound CCN(CC)CC1=CC=CC=C1 ZWRDBWDXRLPESY-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は，高圧トランスの絶縁材料として，耐サイクル
性に優れたエポキシ樹脂組成物に関する。TECHNICAL FIELD The present invention relates to an epoxy resin composition having excellent cycle resistance as an insulating material for a high voltage transformer.
（従来の技術） エポキシ樹脂は，電気特性，機械特性，耐湿性および耐
クラツク性に優れ，しかも各種材料との接着性に優れて
おり，このエポキシ樹脂に，例えば希釈剤，酸無水物，
充てん剤等を含有させたエポキシ樹脂組成物は，絶縁
性，高電圧特性（耐アーク性，耐トラツキング性），耐
クラツク性および接着性をさらに向上させることが知ら
れている。(Prior Art) Epoxy resin has excellent electrical properties, mechanical properties, moisture resistance and crack resistance, and also has excellent adhesiveness with various materials. For example, diluents, acid anhydrides,
It is known that an epoxy resin composition containing a filler and the like further improves insulation, high-voltage characteristics (arc resistance, tracking resistance), crack resistance and adhesion.
近年，これらのエポキシ樹脂組成物は，電子部品等の性
能および信頼性の向上に対応して耐ヒートサイクル性に
優れることが要求されている。In recent years, these epoxy resin compositions have been required to have excellent heat cycle resistance in response to improvements in performance and reliability of electronic parts and the like.
高圧トランスは，一般に，変性ポリフエニレンオキサイ
ド（例えばGE社製商品名ノリルGFN2）で成型された分割
ボビンにウレタンエナメルワイヤを巻いたコイルをエポ
キシ樹脂組成物で絶縁処理して得られる。The high-voltage transformer is generally obtained by insulating a coil of urethane enamel wire wound on a split bobbin molded of modified polyphenylene oxide (for example, GE's trade name Noryl GFN2) with an epoxy resin composition.
該エポキシ樹脂組成物には，作業性向上の点から希釈剤
が配合されるため，硬化中に充てん剤の沈降が大きくな
り，上部と下部の熱膨張率が異なり，歪んだ硬化物とな
る欠点がある。また，生産性の向上を目的に，硬化時間
が短縮されるため収縮も起こり，これらの現象は，エポ
キシ樹脂組成物の耐ヒートサイクル性の低下の原因とな
つている。Since a diluent is added to the epoxy resin composition from the viewpoint of improving workability, sedimentation of the filler increases during curing, and the coefficient of thermal expansion of the upper and lower parts is different, resulting in a distorted cured product. There is. Further, for the purpose of improving productivity, shrinkage occurs due to shortening of curing time, and these phenomena are the cause of deterioration of heat cycle resistance of the epoxy resin composition.
（発明が解決しようとする課題） 本発明の目的は，前記の従来技術の欠点を解決し，硬化
中の充てん剤の沈降が少なくかつ，硬化収縮の少ない硬
化物の耐ヒートサイクル性に優れたエポキシ樹脂組成物
を提供することにある。(Problems to be Solved by the Invention) An object of the present invention is to solve the above-mentioned drawbacks of the prior art and to provide a cured product having less sedimentation of the filler during curing and less curing shrinkage, and excellent heat cycle resistance. An object is to provide an epoxy resin composition.
（課題を解決するための手段） 本発明は，エポキシ樹脂，希釈剤，酸無水物，硬化促進
剤および充てん剤を含有するエポキシ樹脂組成物におい
て，希釈剤としてビスフエノールＡ−アルキレンオキサ
イド付加物のグリシジルエーテルをエポキシ樹脂100重
量部に対して５〜30重量部および硬化促進剤としてベン
ジルジメチルアミンを酸無水物100重量部に対して0.1〜
5.0重量部用いてなるエポキシ樹脂組成物に関する。(Means for Solving the Problems) The present invention relates to an epoxy resin composition containing an epoxy resin, a diluent, an acid anhydride, a curing accelerator and a filler, and a bisphenol A-alkylene oxide adduct as a diluent. Glycidyl ether is 5 to 30 parts by weight with respect to 100 parts by weight of epoxy resin, and benzyldimethylamine as a curing accelerator is 0.1 to 100 parts by weight with respect to 100 parts by weight of acid anhydride.
The present invention relates to an epoxy resin composition containing 5.0 parts by weight.
本発明に用いられるエポキシ樹脂としては,1分子中に少
なくとも１個のエポキシ基を有するもの，例えばビスフ
エノールＡ型エポキシ樹脂，ビスフエノールＦ型エポキ
シ樹脂，ビスフエノールAD型エポキシ樹脂，多価アルコ
ールのポリグリシジルエステルなどが挙げられ，これら
のうち特に常温で液状のものが好ましい。これらは１種
または２種以上併用して用いられる。The epoxy resin used in the present invention has at least one epoxy group in one molecule, such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol AD type epoxy resin and polyhydric alcohol. Examples thereof include polyglycidyl ester, and among these, those that are liquid at room temperature are particularly preferable. These are used alone or in combination of two or more.
本発明に用いられる希釈剤は，ビスフエノールＡ−アル
キレンオキサイド付加物のグリシジルエーテルとされ，
商品としては例えば旭電化工業（株）製 EP-4000など
がある。その配合量は，エポキシ樹脂100重量部に対し
て５〜30重量部とされる。この配合量が５重量部未満で
は，粘度が高くまた耐ヒートサイクル性に劣り,30重量
部を起えると硬化中の充てん剤の沈降が大きく，また，
ガラス転移温度も低くなる。The diluent used in the present invention is a glycidyl ether of a bisphenol A-alkylene oxide adduct,
Examples of products include EP-4000 manufactured by Asahi Denka Kogyo Co., Ltd. The compounding amount is 5 to 30 parts by weight with respect to 100 parts by weight of the epoxy resin. If the blending amount is less than 5 parts by weight, the viscosity is high and the heat cycle resistance is poor, and if the blending amount is 30 parts by weight, sedimentation of the filler during curing is large, and
The glass transition temperature is also low.
本発明に用いられる充てん剤は，結晶性シリカ，溶融シ
リカ，水和アルミナ，炭酸カルシウム，タルク，酸化マ
グネシウムなどがある。The filler used in the present invention includes crystalline silica, fused silica, hydrated alumina, calcium carbonate, talc, magnesium oxide and the like.
本発明に用いられる酸無水物としては，例えばメチルテ
トラヒドロ無水フタル酸，メチルヘキサヒドロ無水フタ
ル酸，メチルエンドメチレン無水フタル酸，ドデセニル
無水フタル酸等が挙げられ，これらは特に常温で液状の
ものが好ましい。これらは１種または２種以上併用して
用いることができる。この配合量はエポキシ樹脂100重
量部に対して50〜150重量部であることが好ましい。Examples of the acid anhydride used in the present invention include methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, methylendomethylenephthalic anhydride, dodecenylphthalic anhydride, and the like. preferable. These can be used alone or in combination of two or more. This compounding amount is preferably 50 to 150 parts by weight with respect to 100 parts by weight of the epoxy resin.
硬化促進剤としては，ベンジルジメチルアミンが用いら
れ，その配合量は，酸無水物100重量部に対して0.1〜5.
0重量部とされる。この配合量が0.1重量部未満では，耐
ヒートサイクル性に劣り,5.0重量部を起えると可使時間
が短く作業性に劣る。Benzyldimethylamine is used as a curing accelerator, and its amount is 0.1 to 5 parts by weight per 100 parts by weight of acid anhydride.
It is 0 parts by weight. If this amount is less than 0.1 part by weight, heat cycle resistance is poor, and if it is 5.0 parts by weight, the pot life is short and workability is poor.
前記エポキシ樹脂組成物には，特性を向上するために可
とう化剤，カツプリング剤，難燃性を付与するため，ハ
ロゲン化合物，リン化合物等の難燃剤，カーボン，チタ
ン等の着色剤などを配合することもできる。The epoxy resin composition contains a softening agent, a coupling agent to improve the properties, a flame retardant such as a halogen compound or a phosphorus compound for imparting flame retardancy, and a coloring agent such as carbon or titanium. You can also do it.
（実施例） 以下，本発明を実施例により詳しく説明する。実施例
中，部および％は特に断らないかぎり，それぞれ重量
部，重量％を意味する。第１表に示す配合でエポキシ樹
脂組成物を得た。配合は重量部で示す。なお，可使時
間，ガラス転移温度，硬化中の沈降性，モデルコイルの
耐ヒートサイクル性は次の方法で測定した。(Examples) Hereinafter, the present invention will be described in detail with reference to Examples. In the examples, parts and% mean parts by weight and% by weight, respectively, unless otherwise specified. An epoxy resin composition was obtained with the composition shown in Table 1. The formulations are shown in parts by weight. The pot life, glass transition temperature, sedimentation during curing, and heat cycle resistance of the model coil were measured by the following methods.
（１）可使時間:150gのエポキシ樹脂組成物を40℃の恒
温槽中に放置し，初期粘度の２倍になる時間を測定し
た。(1) Pot life: 150 g of the epoxy resin composition was left in a constant temperature bath at 40 ° C., and the time at which the initial viscosity was doubled was measured.
（２）ガラス転移温度:100gのエポキシ樹脂組成物を100
℃で３時間，さらに120℃で３時間で硬化し,5mm×5mm×
2mmの試験片を切り出し，熱物理試験機（パーキンエル
マー社製）で測定した。(2) Glass transition temperature: 100 g of 100 g of epoxy resin composition
Cured in 3 hours at ℃, then 3 hours at 120 ℃, 5mm × 5mm ×
A 2 mm test piece was cut out and measured with a thermophysical tester (manufactured by Perkin Elmer).
（３）硬化中の沈降性：直径18mmのポリエチレン製試験
管に130mm高さまでエポキシ樹脂組成物を注入し，
（１）と同じ条件で硬化させた後，硬化物の上端および
下端から各1cm部分の灼熱残査を測定し，上下間の差を
求めた。差が大きいほど，硬化中の沈降が大きいことを
示す。(3) Sedimentation during curing: Inject the epoxy resin composition to a height of 130 mm into a polyethylene test tube with a diameter of 18 mm,
After curing under the same conditions as in (1), the burning residue of each 1 cm portion from the upper and lower ends of the cured product was measured, and the difference between the upper and lower sides was obtained. The larger the difference, the greater the sedimentation during curing.
（４）モデルコイルの耐ヒートサイクル性：変性ポリフ
エニレンオキサイド（GE社製商品名ノリルGFN-2）で成
型された分割ボビン（15スリツト）に，直径0.05mmのウ
レタンエナメルワイヤーを各500ターン巻き付けてモデ
ルコイルを作製し，これをプラスチツクケースに入れて
120℃で２時間予熱後，予め2mmHgの減圧下40℃で脱泡し
て充分に気泡を除いたエポキシ樹脂組成物を約30秒で注
入し，その後常圧に戻して80℃で３時間,80〜140℃で30
分，次いで140℃３時間加熱硬化し，モデルコイルを作
製した。(4) Heat cycle resistance of model coil: Divided bobbin (15 slits) molded with modified polyphenylene oxide (GE's trade name Noryl GFN-2), each with a urethane enamel wire of 0.05 mm diameter for 500 turns Wrap it to make a model coil and put it in a plastic case.
After preheating at 120 ° C for 2 hours, defoaming at 40 ° C under a reduced pressure of 2 mmHg and defoaming sufficiently to inject the epoxy resin composition in about 30 seconds, and then returning to normal pressure for 3 hours at 80 ° C. 30 at 80 to 140 ° C
Min, and then heat-cured at 140 ° C for 3 hours to produce a model coil.
得られたモデルコイルの耐ヒートサイクル試験（−30℃
で２時間と120℃で２時間を１サイクルとした）を行な
い,10サイクル毎に動作テストを行ない，動作する場合
はOK,作動しない場合はNGとして，その動作サイクル回
数を示した。Heat cycle resistance test of the obtained model coil (-30 ℃
2 hours and 120 hours at 120 ° C for 1 cycle), and an operation test was performed every 10 cycles. If it works, it is OK, and if it does not work, it is NG and the number of operation cycles is shown.
以上の結果から，実施例１〜６で得られた組成物は，い
ずれも可使時間が長く，ガラス転移温度高く，硬化中の
沈降性も少なく，また，この組成物を用いて得たモデル
コイルは，耐ヒートサイクル性に優れている。From the above results, the compositions obtained in Examples 1 to 6 all had a long pot life, a high glass transition temperature, and a small settling property during curing, and the models obtained by using this composition The coil has excellent heat cycle resistance.
比較例１は，ビスフエノールＡ−アルキレンオキサイド
付加物のグリシジルエーテル（旭電化工業（株）EP-400
0）を,5部以下としたため，ガラス転移温度が高くなり
モデルコイルの耐ヒートサイクル性も劣つている。Comparative Example 1 is a glycidyl ether of bisphenol A-alkylene oxide adduct (EP-400, Asahi Denka Co., Ltd.).
Since 0) is less than 5 parts, the glass transition temperature is high and the heat resistance of the model coil is poor.
比較例２は，ビスフエノールＡ−アレキレンオキサイド
付加物のグリシジルエーテル（旭電化工業（株）製EP-4
000）を30部以上としたため，ガラス転移温度が低く硬
化中の沈降性も大きくなつている。Comparative Example 2 is a glycidyl ether of a bisphenol A-alkylene oxide adduct (EP-4 manufactured by Asahi Denka Co., Ltd.).
000) is more than 30 parts, the glass transition temperature is low and the sedimentation property during curing is large.
比較例３は，ベンジルジメチルアミン（花王（株）製BD
MA）を0.1部以下としたため，硬化が十分でないことか
ら，ガラス転移温度が低く，モデルコイルの耐ヒートサ
イクル性も劣つている。Comparative Example 3 is benzyldimethylamine (BD manufactured by Kao Corporation)
Since the MA) is less than 0.1 part, the curing is not sufficient, so the glass transition temperature is low and the heat resistance of the model coil is poor.
比較例４は，ベンジルジメチルアミン（花王製,BDMA）
を,5.0部以上としたため可使時間が短く，作業性に劣り
また，硬化が著しく速いため不均一となり，モデルコイ
ルの耐ヒートサイクル性も劣つている。Comparative Example 4 is benzyldimethylamine (Bao, manufactured by Kao)
Since it is more than 5.0 parts, the work life is short and the workability is poor, and the curing is extremely fast, resulting in non-uniformity, and the model coil has poor heat cycle resistance.
比較例5,6は，希釈剤にビスフエノールＡ−アルキレン
オキサイド付加物のグリシジルエーテル（旭電化工業
（株）EP-4000）を使用せず，エチレングリコールジグ
リシジルエーテル（DY-022），フエニルグリシジルエー
テル（PGE）を用いているため耐ヒートサイクル性に劣
つている。In Comparative Examples 5 and 6, ethylene glycol diglycidyl ether (DY-022) and phenyl were used as diluent without using glycidyl ether of bisphenol A-alkylene oxide adduct (Asahi Denka Kogyo EP-4000). Since it uses glycidyl ether (PGE), it has poor heat cycle resistance.
比較例7,8は，硬化促進剤にベンジルジエチルアミン
（花王社製BDMA）ではなく,2エチル４メチルイミダゾー
ル（四国化成社製2E4MZ）１ベンジルジメチルイミダゾ
ール（四国化成社製1B2MZ）を用いているため耐ヒート
サイクル性に劣つていた。Comparative Examples 7 and 8 use 2 ethyl 4-methyl imidazole (2E4MZ manufactured by Shikoku Kasei) 1 benzyl dimethyl imidazole (1B2MZ manufactured by Shikoku Kasei) instead of benzyldiethylamine (BDMA manufactured by Kao) as a curing accelerator. It was inferior in heat cycle resistance.
（発明の効果） 本発明になるエポキシ樹脂組成物は，硬化中の充てん剤
の沈降および硬化収縮が少なく，硬化物の耐ヒートサイ
クル性に優れる。 (Effect of the Invention) The epoxy resin composition according to the present invention has less sedimentation and shrinkage of the filler during curing, and is excellent in heat cycle resistance of the cured product.
Claims (1)
進剤および充てん剤を含有するエポキシ樹脂組成物にお
いて，希釈剤として，ビスフエノールＡ−アルキレンオ
キサイド付加物のグリシジルエーテルをエポキシ樹脂10
0重量部に対して５〜30重量部および硬化促進剤として
ベンジルジメチルアミンを酸無水物100重量部に対して
0.1〜5.0重量部用いてなるエポキシ樹脂組成物。1. An epoxy resin composition containing an epoxy resin, a diluent, an acid anhydride, a curing accelerator and a filler, wherein the glycidyl ether of a bisphenol A-alkylene oxide adduct is used as the diluent.
5 to 30 parts by weight to 0 parts by weight and benzyldimethylamine as a curing accelerator to 100 parts by weight of acid anhydride
An epoxy resin composition containing 0.1 to 5.0 parts by weight.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2070862A JPH07119276B2 (en) | 1990-03-20 | 1990-03-20 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2070862A JPH07119276B2 (en) | 1990-03-20 | 1990-03-20 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03273022A JPH03273022A (en) | 1991-12-04 |
| JPH07119276B2 true JPH07119276B2 (en) | 1995-12-20 |
Family
ID=13443797
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2070862A Expired - Lifetime JPH07119276B2 (en) | 1990-03-20 | 1990-03-20 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07119276B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001302759A (en) * | 2000-04-25 | 2001-10-31 | Matsushita Electric Works Ltd | Liquid epoxy resin composition for sealing and semiconductor device |
| JP2011079968A (en) * | 2009-10-07 | 2011-04-21 | Uniplus Electronics Co Ltd | High thermal conductivity and low loss factor build-up material |
| JP6576004B2 (en) * | 2016-03-22 | 2019-09-18 | 田岡化学工業株式会社 | Epoxy resin composition comprising an epoxy resin having a cyclic hydrocarbon skeleton |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63159426A (en) * | 1986-12-23 | 1988-07-02 | Sumitomo Bakelite Co Ltd | Flexible epoxy resin composition |
-
1990
- 1990-03-20 JP JP2070862A patent/JPH07119276B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03273022A (en) | 1991-12-04 |
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