JPH07120683B2 - Method for manufacturing semiconductor device - Google Patents

Description

The present invention relates to a method for manufacturing a semiconductor device using a film carrier.

[Prior Art] In a semiconductor device, a semiconductor chip is generally attached to a die pad provided on a lead frame, and an external electrode of the semiconductor chip and a terminal of the lead frame are connected by wires, respectively. The part is packaged with thermosetting resin or ceramic, cut at the terminal portion, and the terminal is bent appropriately for manufacture. For this reason,
The package is thicker and overall is larger.

By the way, recently, with the miniaturization and thinning of electronic equipment, the semiconductor devices used for this are also mounted at high density.
A small and thin product is required.

To meet these demands, a semiconductor chip is placed in the device hole of the insulating resin film, and the semiconductor device (TAB mounting method) that connects this semiconductor chip and the finger that overhangs the device hole is sealed with liquid resin. The method of doing has been put to practical use.

FIG. 6 shows an example of conventional TAB mounting. First,
(A) As shown in the figure, the semiconductor chip 5 is arranged in the device hole 2 of the film carrier 1 and
And the finger 3 overhanging in the device hole 2 of the film carrier 1 are connected. In this state, a liquid resin is applied to the film carrier 1 including the semiconductor chip 5 and the fingers 3 with a brush or the like to be cured, or, as shown in FIG. 2B, a liquid contained in a resin supply device 17 such as an injection cylinder. Pressure is applied to the resin 16 to make it drop from the nozzle 18, and the semiconductor chip 5 and the fingers 3 are covered and cured as shown in FIG.

Further, as shown in FIG. 7, a method using a mask 22 having a window 21 having a size and shape corresponding to a range 20 for sealing the semiconductor chip 5 including the fingers 3 has been proposed and put into practical use. There is. In this method, as shown in FIGS. 8A and 8B, a mask 22 is superposed on the film carrier 1 to which the semiconductor chip 5 is attached so that the semiconductor chip 5 fits in the window 21, and the mask 22 The liquid resin 16 placed on top is moved in the direction of the arrow with a squeegee 23, for example, to fill the window 21, and the mask 22 is removed and cured as shown in FIG. It was done.

[Problems to be Solved by the Invention] The TAB mounting shown in FIG. 6 is extremely troublesome and enormous because it is manually or robotically used to seal the semiconductor chips one by one according to the shape of the semiconductor chip. It takes man-hours and it is difficult to perform potting (shape control) according to the shape of the semiconductor chip. Furthermore, it is difficult to make the potting thin because the center of the potting tends to rise and become high, and sometimes the top surface is scraped.

Further, in the TAB mounting described in FIG. 8, when the window is filled with the liquid sealing material, the liquid resin intrudes from the lower portion of the window between the substrate and the mask due to the capillary phenomenon, and the mask is removed. As shown in the figure, there is a problem that not only the sealing area is increased by drawing the hem 19a in a burr shape on the outer periphery of the sealed resin 19, but also the shape is irregular and the appearance is not good.

Further, it is particularly important that in any case, the moisture resistance and the thermal shock resistance are inferior and the reliability is lacking.

The present invention has been made to solve the above problems, and is a method of manufacturing a semiconductor device capable of automatically sealing a semiconductor chip and obtaining a semiconductor device excellent in moisture resistance and thermal shock resistance. The purpose is to realize the method.

[Means for Solving the Problems] A method of manufacturing a semiconductor device according to the present invention is directed to a strip-shaped film carrier tape for a semiconductor chip, which has fingers arranged to match the electrodes of the semiconductor chip and is supported by the fingers. Mounted at equal intervals, a predetermined number of the semiconductor chips are intermittently sequentially transferred into the injection molding machine, and the individual semiconductor chips transferred to the injection molding machine are the upper mold and the lower mold of the injection molding machine. And a predetermined number of recesses provided corresponding to each of them are sealed, and a plurality of resin injection holes are provided in the recesses of the lower mold in a direction perpendicular to the tape in the injection molding machine. The semiconductor chip is resin-sealed with the resin thus formed, and the resin-sealed semiconductor chip is sequentially transferred to a reel for winding.

[Embodiment of the Invention] FIG. 1 is a plan view showing a state in which a semiconductor chip is mounted on a film carrier embodying the present invention, and FIG.
FIG. In the figure, 1 is a strip-shaped film carrier (hereinafter referred to as a film) made of a polyimide film in which a large number of device holes 2, 2a, 2b, ... Are provided at equal intervals in the length direction. Reference numeral 3 designates a large number of fingers made of a metal having a good conductivity such as copper provided on the film 1, and the tips thereof respectively project into the device holes 2, 2a, 2b, ... And overhang. Reference numeral 4 is a sprocket hole for transporting the film 1. 5, 5a, 5b, ... are semiconductor chips arranged in the device holes 2, 2a, 2b, .. The fingers 3 are directly connected to their external electrodes.

The film 1 on which the above semiconductor chips 5, 5a, 5b, ... Are mounted is wound around, for example, a reel 12 and is disposed on one side of the injection molding machine 8 as shown in FIG. Reference numeral 13 is a take-up reel provided on the other side of the injection molding machine 8.

Next, the film 1 is sent out in the direction of the arrow, and the upper mold 9 and the lower mold are provided with a plurality of recesses matching the package shape
When the semiconductor chips 5, 5a, 5b, ... Are fed in between 10 and 10, the feeding of the film 1 is stopped. Then, as shown in FIG. 4, the upper mold 9 is lowered and the lower mold 10 is raised to seal the film 1 including the semiconductor chips 5, 5a, 5b, ... Between the recesses 9a, 10a. In this state, a plurality of injection holes are provided in the recess of the lower mold in the direction perpendicular to the carrier tape.
Inject thermoplastic resin from 11 into each recess 9a, 10a at high pressure,
The periphery of the semiconductor chip 5 excluding the lower surface and a part of the fingers 3 are sealed, and the packages 6, 6a, 6b, ... Are molded.

When the packages 6, 6a, 6b are solidified, the upper mold 9 and the lower mold 10
Is opened and the take-up reel 13 is rotated to move the molded packages 6, 6a, 6b, ... to the outside of the upper mold 9 and the lower mold 10,
The next semiconductor chip is placed between the upper mold 9 and the lower mold 10.
Similarly, one or a plurality of semiconductor chips 5 are packaged and sequentially wound on the winding reel 13. In this way, the band-shaped film 1 on which the semiconductor chips 5, 5a, 5b, ... Are mounted is intermittently sent and all the semiconductor chips 5, 5a, 5
b, ... Are packaged and wound on the take-up reel 13.

When the packaged semiconductor device 7 is mounted on the substrate, the film 1 is rewound from the take-up reel 13 and the finger 3 is cut at the position of the chain line C of the package 6 as shown in FIG. In addition, a small semiconductor device 7 can be obtained. Next, as shown in FIG. 5, the semiconductor device 7 is brought into contact with the surface of the substrate 14 and each finger 3 is connected to the wiring pattern 15 provided on the substrate 14, whereby the mounting is completed.

In the method of manufacturing a semiconductor device as described above, the thermoplastic resin used for the package may be a resin having a small linear expansion coefficient such as liquid crystal polymer or polyphenyl sulfone (PPS) in which molecules are oriented in one direction, and a filler ( Use a material that has a linear expansion coefficient of 2 x 10 ^-5 or less mixed with silica, etc. and that does not undergo thermal deformation even at the solder heat resistance test temperature (260 ° C). As a result, even when a large semiconductor chip (6 × 9 mm) is packaged, cracks do not occur.

A semiconductor device manufactured as described above and a TAB-mounted semiconductor device sealed using a conventional liquid sealing agent are
℃ (30 minutes), room temperature (10 minutes), 150 ℃ (30 minutes), room temperature (10 minutes)
Table 1 shows the results obtained by repeating the temperature test in a cycle of 80 minutes.

As is clear from Table 1, in the conventional TAB-mounted semiconductor device, about 13% of defective products were generated in 250 cycles, and all were defective in 1,000 cycles. Only about 3% of defective products were generated in 1,000 cycles.

In addition, Table 2 shows the results of conducting a humidity resistance test by placing the semiconductor device in an atmosphere having a temperature of 85 ° C. and a humidity of 85% and applying a voltage of 6V.

As described above, in the conventional TAB-mounted semiconductor device, defective products started to occur in 500 hours, and 40% or more of defective products occurred in 2000 hours, but the semiconductor device according to the present invention generated defective products in 1,500 hours. Even at 2000 hours, it was only 6-7%.

As is clear from Table 1 and Table 2, the semiconductor device manufactured according to the present invention has a conventional sealing method using a liquid sealing agent.
It has become clear that it is far superior to TAB-mounted semiconductor devices in terms of reliability.

In the production of the semiconductor device according to the present invention, when a thermoplastic resin is used for the package, the resin (20 to 30%) that has been dropped in the molding yield at the time of molding can be regenerated, so that the material cost can be reduced. Further, since the cooling time after molding is extremely short, the molding time can be greatly shortened as a whole, and the productivity can be improved.

In the above description, the band-shaped film to which the semiconductor chip is attached is wound around the reel and is arranged in the vicinity of the injection molding machine, and the case where the film is intermittently sent to the injection molding machine for packaging is explained. It is not necessary to wind, and it may be fed into the injection molding machine in a strip shape.
Although the case of molding a package with a thermoplastic resin has been described, the package may be molded with a thermosetting resin, although there is a drawback that the efficiency is slightly low and the molding yield cannot be used.

[Effects of the Invention] As described above, according to the present invention, a semiconductor chip is attached to a film carrier, and a small and thin semiconductor device is formed by molding a package in a band-like shape by resin-sealing with an injection molding machine. In manufacturing, the lower mold of the injection molding machine 1
By providing a plurality of injection holes per recess, it is possible to soften the contact of the injected resin to the semiconductor chip and the fingers, as compared with the case where the resin is injected from the upper mold.

In addition, when a plurality of injection holes are provided in the direction perpendicular to the tape, the resin can be uniformly injected into the mold, and the resin injection pressure applied to the semiconductor chip and the fingers can be obtained with one injection hole. There is an effect that it can be made more uniform. Furthermore, this homogenization allows the injection without gaps, thus achieving a reduction in the injection time.

Therefore, as compared with the conventional method of manufacturing a semiconductor device of the TAB mounting method using a liquid encapsulant, the productivity is significantly improved, and the thermal shock resistance and the moisture resistance are significantly improved, and the reliability is improved. The implementation effect is great.

[Brief description of drawings]

FIG. 1 is a plan view showing an example in which a semiconductor chip is mounted on a film carrier according to the present invention, FIG. 2 is a sectional view taken along line AA, FIG. 3 is a schematic view showing a molded state of a package, and FIG.
FIG. 5 is a sectional view for explaining molding of a package by an injection molding machine, FIG. 5 is a sectional view showing an embodiment of a semiconductor device manufactured by the present invention, and FIGS. 6 (a) to 6 (c) are conventional potting. FIG. 7 is an explanatory view of an example of a TAB according to FIG. 7, FIG. 7 is an explanatory view of an example of a printing mask, and FIGS. 8A to 8C are explanatory views of a TAB embodiment by conventional printing. 1: Film, 2, 2a, 2b: Device hole, 3: Finger,
5,5a, 5b: semiconductor chip, 6,6a, 6b: package, 7: semiconductor device, 8: injection molding machine.

Claims (1)

[Claims] 1. A semiconductor chip, which has fingers arranged according to electrodes of a semiconductor chip and is supported by the fingers, is mounted on a strip-shaped film carrier tape at equal intervals, and a predetermined number of the semiconductor chips are The semiconductor chips transferred to the injection molding machine are sequentially transferred intermittently, and the individual semiconductor chips transferred to the injection molding machine are provided in correspondence with the upper mold and the lower mold of the injection molding machine, respectively. The semiconductor chip is sealed with a recess, and the semiconductor chip is sealed with resin injected from a plurality of resin injection holes provided in the recess of the lower mold in a direction perpendicular to the tape in the injection molding machine. A method of manufacturing a semiconductor device, wherein the stopped semiconductor chips are sequentially transferred to a reel for winding.