JPH07120855B2 - Multilayer wiring board - Google Patents
Multilayer wiring boardInfo
- Publication number
- JPH07120855B2 JPH07120855B2 JP62100814A JP10081487A JPH07120855B2 JP H07120855 B2 JPH07120855 B2 JP H07120855B2 JP 62100814 A JP62100814 A JP 62100814A JP 10081487 A JP10081487 A JP 10081487A JP H07120855 B2 JPH07120855 B2 JP H07120855B2
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- resin
- circuit
- multilayer wiring
- inner layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims description 18
- 229920005989 resin Polymers 0.000 claims description 18
- 239000011347 resin Substances 0.000 claims description 18
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 229920005992 thermoplastic resin Polymers 0.000 claims description 15
- 239000011888 foil Substances 0.000 claims description 14
- 229920006230 thermoplastic polyester resin Polymers 0.000 claims description 4
- 239000004744 fabric Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 238000005530 etching Methods 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000004745 nonwoven fabric Substances 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000012209 synthetic fiber Substances 0.000 description 2
- 229920002994 synthetic fiber Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- -1 Alternatively Polymers 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 238000009824 pressure lamination Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】 （技術分野） この発明は、多層配線板に関するものである。さらに詳
しくは、この発明は、可撓性のある、Ｌ型配線等の立体
配線可能な多層配線板に関するものである。TECHNICAL FIELD The present invention relates to a multilayer wiring board. More specifically, the present invention relates to a flexible multilayer wiring board capable of three-dimensional wiring such as L-shaped wiring.
（背景技術） 電気・電子機器、通信機器、計算機器等にプリント配線
板は広く用いられてきている。これらのプリント配線板
については、電子機器、通信機器等の小型化、薄型化、
あるいは複雑化に対応するためにプリント配線板の基板
に可撓性のある樹脂を用いたフレキシブルプリント配線
板や、高密度配線を可能とする多層配線板が開発され、
実用化されてきている。(Background Art) Printed wiring boards have been widely used in electric / electronic devices, communication devices, computing devices, and the like. For these printed wiring boards, downsizing and thinning of electronic devices, communication devices, etc.
Or in order to cope with the complexity, a flexible printed wiring board using a flexible resin for the substrate of the printed wiring board and a multilayer wiring board that enables high-density wiring have been developed.
It has been put to practical use.
しかしながら、従来のフレキシブルプリント配線板につ
いては、基板そのものの可撓性はあまり大きなものでは
なく、また、その多層化による配線の高密度化も進んで
いないのが現状である。しかも、これまでのフレキシブ
ルプリント配線板は、その製造が特殊加工メーカーに限
定されていた。However, in the conventional flexible printed wiring board, the flexibility of the substrate itself is not so great, and the density of the wiring is not advanced due to the multilayer structure. Moreover, until now, the production of flexible printed wiring boards was limited to special processing manufacturers.
このため、カード化等の超薄型化や小型化、さらに複雑
化が進んでいる電気・電子機器などに用いることのでき
る高密度化フレキシブルプリント配線板はいまだに実現
されてきていない。For this reason, a high-density flexible printed wiring board that can be used in electric / electronic devices and the like, which have become ultra-thin and compact such as cards, and are becoming more complicated, has not yet been realized.
（発明の目的） この発明は、以上の通りの事情を鑑みてなされたもので
あり、これまでには実現されてきていない、可撓性が大
きく立体配線にも用いることのできる、連続生産可能な
高密度化多層フレキシブルプリント配線板を提供するこ
とを目的としている。(Object of the Invention) The present invention has been made in view of the above circumstances and has not been realized so far, has a large flexibility and can be used for three-dimensional wiring, and can be continuously manufactured. An object of the present invention is to provide a high-density multi-layer flexible printed wiring board.
（発明の開示） この発明の多層配線板は、上記の目的を実現するため
に、JIS・Ｋ・7201の規格に該当する連続耐熱温度77.8
℃以上の熱可塑性ポリエステル樹脂から形成される熱可
塑性樹脂層表面に回路が形成された内層材の上面、下面
のいずれか一方または両方に、内層材表面の回路が露出
するように所要部内に樹脂層を介して金属箔が配設一体
化されたことを特徴としている。DISCLOSURE OF THE INVENTION In order to achieve the above object, the multilayer wiring board of the present invention has a continuous heat resistance temperature of 77.8 which corresponds to the standard of JIS K7201.
Thermoplastic resin layer made of thermoplastic polyester resin with a temperature of ℃ or above. A resin is provided in the required area so that the circuit on the surface of the inner layer material is exposed on either or both of the upper surface and the lower surface of the inner layer material with the circuit formed on the surface. It is characterized in that the metal foil is disposed and integrated through the layers.
添付した図面に沿ってこの発明の多層配線板について次
に説明する。The multilayer wiring board of the present invention will be described below with reference to the accompanying drawings.
第１図および第２図は、この発明の多層配線板の例を示
したものである。第１図の断面図に示したように、この
例においては、後述するような熱可塑性樹脂から形成さ
れる可撓性を有する熱可塑性樹脂層１の表面に回路２を
形成している。この熱可塑性樹脂層１と回路２とからな
る内層材３の上面および下面には、樹脂層４を介して金
属箔５を、所要部分A,Bにのみ配設一体化している。こ
の多層配線板を平面図として示したものが、第２図であ
る。1 and 2 show examples of the multilayer wiring board of the present invention. As shown in the cross-sectional view of FIG. 1, in this example, the circuit 2 is formed on the surface of a flexible thermoplastic resin layer 1 formed of a thermoplastic resin as described later. On the upper and lower surfaces of the inner layer material 3 composed of the thermoplastic resin layer 1 and the circuit 2, a metal foil 5 is disposed and integrated only in the required portions A and B via a resin layer 4. FIG. 2 shows a plan view of this multilayer wiring board.
部分Ｃには樹脂層４および金属箔５は配設されていな
い。この例においては、内層材３の回路２が、この部分
Ｃにおいて露出している。The resin layer 4 and the metal foil 5 are not provided in the portion C. In this example, the circuit 2 of the inner layer material 3 is exposed at this portion C.
また、第３図は、この発明の多層配線板の他の例をＬ型
の立体配線に用いた場合を示している。この例において
は、内層材３の片面にのみ、樹脂層４を介して金属箔５
を部分的に配設一体化している。Further, FIG. 3 shows a case where another example of the multilayer wiring board of the present invention is used for L-type three-dimensional wiring. In this example, the metal foil 5 is provided only on one side of the inner layer material 3 with the resin layer 4 interposed therebetween.
Are partially arranged and integrated.
内層材３の回路２が露出している部分Ｃは、この第３図
に示したように、Ｌ型配線等の立体配線時の屈曲部とし
て有効であり、この露出部分Ｃを設けることによって、
最外表面の金属箔５およびそれをエッチング加工して形
成した回路が立体配線時に剥離することを防止し、しか
も配線板の屈曲性を向上させる。The portion C of the inner layer material 3 where the circuit 2 is exposed is effective as a bent portion during three-dimensional wiring such as L-shaped wiring as shown in FIG. 3, and by providing this exposed portion C,
This prevents the metal foil 5 on the outermost surface and the circuit formed by etching the metal foil from peeling off during three-dimensional wiring, and further improves the flexibility of the wiring board.
また、この露出部分Ｃは、その両側部分A,Bを接続する
コネクターの機能を兼ねることもできる。The exposed portion C can also function as a connector that connects both side portions A and B to each other.
この露出部分Ｃは、内層材（３）の基材層（１）のみか
らなるようにしてもよい。The exposed portion C may be composed of only the base material layer (1) of the inner layer material (3).
このような、この発明の多層配線板に用いる可撓性に優
れた熱可塑性樹脂層１の樹脂としては、連続耐熱温度7
7.8℃以上の熱可塑性ポリエステル樹脂が用いられる。
この熱可塑性ポリエステル樹脂が有する連続耐熱温度の
範囲はJIS・Ｋ・7201の規格に該当するものである。こ
の熱可塑性樹脂は、シートまたは板状体等として用いる
ことができる。また、この熱可塑性樹脂からなる層１
は、樹脂含浸基材層であってもよい。この場合、含浸
は、溶媒、溶剤に溶解または分散させた樹脂ワニスを、
紙、織布（ガラス布、合成繊維布等）、不織布、マット
などの基材に含浸させ、必要に応じて乾燥させることに
より行うことができる。Such a resin of the thermoplastic resin layer 1 having excellent flexibility used for the multilayer wiring board of the present invention has a continuous heat resistance temperature of 7
A thermoplastic polyester resin having a temperature of 7.8 ° C or higher is used.
The continuous heat resistant temperature range of this thermoplastic polyester resin corresponds to the standard of JIS K7201. This thermoplastic resin can be used as a sheet or a plate-shaped body. In addition, the layer 1 made of this thermoplastic resin
May be a resin-impregnated base material layer. In this case, the impregnation is a solvent, a resin varnish dissolved or dispersed in the solvent,
It can be carried out by impregnating a base material such as paper, woven cloth (glass cloth, synthetic fiber cloth, etc.), non-woven cloth, mat, etc., and drying if necessary.
あるいはまた、熱可塑性樹脂シート、フィルムをこれら
の基材にラミネートし、基材繊維の間に熱可塑性樹脂を
溶融含浸させてもよい。Alternatively, a thermoplastic resin sheet or film may be laminated on these substrates, and the thermoplastic resin may be melt-impregnated between the substrate fibers.
熱可塑性樹脂層は、所要の枚数を重ねて使用することが
できる。たとえば第１図および第３図の例の場合には３
枚用いている。この樹脂層１の表面には、銅、アルミニ
ウム、ニッケル、亜鉛、鉄、スレンテス等の金属または
合金の回路２を形成するが、これは、樹脂層１の上面お
よび下面、または、いずれかの片面のみとしてもよい。The required number of thermoplastic resin layers can be stacked and used. For example, in the case of the example of FIG. 1 and FIG.
I'm using one. On the surface of the resin layer 1, a circuit 2 of metal or alloy such as copper, aluminum, nickel, zinc, iron, and Slenthes is formed. This is the upper surface and the lower surface of the resin layer 1 or one of them. May be only.
回路２の形成に際しては、上記した通りの金属または合
金の箔を、必要に応じて接着剤を塗布して熱可塑性樹脂
層１に配設一体化し、次いでエッチング等によって回路
形成することができる。回路の厚さは、好ましくは0.01
8〜0.07mm程度とする。When the circuit 2 is formed, the metal or alloy foil as described above may be coated with an adhesive as needed to be disposed and integrated on the thermoplastic resin layer 1, and then the circuit may be formed by etching or the like. The thickness of the circuit is preferably 0.01
It is about 8 to 0.07 mm.
回路２の上には、さらに樹脂層４と金属箔５とを配設す
るが、この樹脂層４としては、上記した熱可塑性樹脂、
あるいはエポキシ樹脂、フェノール樹脂、不飽和ポリエ
ステル樹脂、熱硬化性ポリイミド樹脂等の熱硬化性樹脂
を液状物として塗布したものや、紙、織布（ガラス布、
合成繊維布等）、不織布、マットなどに含浸させてなる
樹脂含浸基材層、樹脂シート層、樹脂フィルム層、もし
くはこれらを組み合わせた樹脂層とすることができる。A resin layer 4 and a metal foil 5 are further arranged on the circuit 2. As the resin layer 4, the above-mentioned thermoplastic resin,
Alternatively, epoxy resin, phenol resin, unsaturated polyester resin, thermosetting polyimide resin or other thermosetting resin applied as a liquid material, paper, woven cloth (glass cloth,
A synthetic fiber cloth or the like), a non-woven fabric, a resin-impregnated base material layer obtained by impregnating a mat, a resin sheet layer, a resin film layer, or a resin layer combining these.
金属箔５については、上記の回路２と同様に、好ましく
は、0.018〜0.7mm厚程度に配設することができる。この
金属箔についても、エッチング等によって、第２図にも
例示したように回路形成することができる。The metal foil 5 can be preferably arranged to have a thickness of about 0.018 to 0.7 mm, like the circuit 2 described above. With respect to this metal foil as well, a circuit can be formed by etching or the like as illustrated in FIG.
内層材として可撓性、屈曲性のある熱可塑性樹脂層を用
い、しかも、この内層材の上に配設する樹脂層および金
属箔は、所要の部分に限って行うため、Ｌ型配線等の立
体配線による複雑形状、複雑構造への対応も容易であ
り、しかも多層配線板としていることから、配線の高密
度化も実現される。また、多層配線板として連続成形が
可能であり、一般の加工メーカーによっても、外表面の
金属箔のエッチング等によって容易にフレキシブルプリ
ント配線板の回路形成が可能となる。A flexible and bendable thermoplastic resin layer is used as the inner layer material, and the resin layer and the metal foil disposed on the inner layer material are limited to the required portions. It is easy to deal with complicated shapes and structures by three-dimensional wiring, and since it is a multilayer wiring board, high density wiring can be realized. Further, it is possible to continuously form a multilayer wiring board, and even a general processing maker can easily form a circuit of a flexible printed wiring board by etching the metal foil on the outer surface.
次に、実施例を示して、さらに詳しくこの発明の多層配
線板について説明する。Next, the multilayer wiring board of the present invention will be described in more detail with reference to examples.
実施例 １ 厚さ0.5mmのポリエステルフィルムの上下の面に、厚さ
0.018mmの銅箔を接着し、次いでエッチング処理して回
路を形成した。Example 1 On the upper and lower surfaces of a 0.5 mm-thick polyester film,
A 0.018 mm copper foil was adhered and then etched to form a circuit.
この表面回路形成したポリエステルフィルムからなる内
層材の上下の両面に第１図および第２図に示したように
厚さ0.1mmのエポキシ樹脂含浸ガラス布を各々２枚づつ
重ねて配設し、さらにその上に厚さ0.018mmの銅箔を配
設した積層体を成形圧力40kg/cm2、温度160℃で、20分
間加圧成形して、多層配線板を製造した。As shown in FIGS. 1 and 2, two epoxy resin-impregnated glass cloths each having a thickness of 0.1 mm are placed on each of the upper and lower surfaces of the inner layer material formed of the polyester film on which the surface circuit is formed. A multilayer body having a copper foil having a thickness of 0.018 mm disposed thereon was pressure-molded at a molding pressure of 40 kg / cm 2 and a temperature of 160 ° C. for 20 minutes to manufacture a multilayer wiring board.
立体配線が可能な可撓性に優れた多層配線板を得た。A multi-layer wiring board having three-dimensional wiring and excellent flexibility was obtained.
実施例 ２ 厚さ0.2mmの不織布にポリエステル樹脂を含浸させたポ
リエステル含浸不織布を２枚重ね、その上下の面に厚さ
0.02mmの銅箔を接着し、次いでエッチング処理して回路
を形成した。この内層材の上下の両面に、実施例１と同
様に、厚さ0.1mmのエポキシ樹脂含浸ガラス布を各々２
枚づつ重ねて配設し、さらにその上に厚さ0.018mmの銅
箔を配設して、成形圧力40kg/cm2、温度160℃で、20分
間加圧積層成形した。Example 2 Two polyester-impregnated non-woven fabrics in which a 0.2-mm-thick non-woven fabric is impregnated with a polyester resin are stacked, and the upper and lower surfaces thereof have thickness
A 0.02 mm copper foil was adhered and then etched to form a circuit. On each of the upper and lower surfaces of this inner layer material, in the same manner as in Example 1, two epoxy resin-impregnated glass cloths each having a thickness of 0.1 mm were formed.
The sheets were stacked one by one, and a copper foil having a thickness of 0.018 mm was further arranged thereon, and pressure-lamination molding was performed for 20 minutes at a molding pressure of 40 kg / cm 2 and a temperature of 160 ° C.
立体配線が可能な、可撓性に優れた多層配線板を得た。A multi-layer wiring board having three-dimensional wiring and excellent flexibility was obtained.
（発明の効果） この発明の多層配線板により、小型化、薄型化、複雑化
が進む電気・電子機器等に用いることのできる立体配線
が可能な、高密度フレキシブルプリント配線板が実現さ
れる。(Effect of the Invention) The multilayer wiring board of the present invention realizes a high-density flexible printed wiring board capable of three-dimensional wiring that can be used in electric / electronic devices and the like, which are becoming smaller, thinner, and more complicated.
しかも、この発明の多層配線板は、連続成形、エッチン
グ等により加工も容易で、生産性に優れてもいる。Moreover, the multilayer wiring board of the present invention is easy to process by continuous molding, etching, etc. and has excellent productivity.
第１図は、この発明の一例を示した断面図であり、また
第２図は、その平面図である。第３図は、Ｌ型配線に用
いた他の例を示した断面図である。 １……熱可塑性樹脂層 ２……回路 ３……内層材 ４……樹脂層 ５……金属箔。FIG. 1 is a sectional view showing an example of the present invention, and FIG. 2 is a plan view thereof. FIG. 3 is a cross-sectional view showing another example used for the L-type wiring. 1 ... Thermoplastic resin layer 2 ... Circuit 3 ... Inner layer material 4 ... Resin layer 5 ... Metal foil
Claims (1)
温度77.8℃以上の熱可塑性ポリエステル樹脂から形成さ
れる熱可塑性樹脂層表面に回路が形成された内層材の上
面、下面のいずれか一方または両方に、内層材表面の回
路が露出するように所要部分に樹脂層を介して金属箔が
配設一体化されたことを特徴とする多層配線板。[Claim 1] Either the upper surface or the lower surface of an inner layer material having a circuit formed on the surface of a thermoplastic resin layer formed of a thermoplastic polyester resin having a continuous heat-resistant temperature of 77.8 ° C or higher, which corresponds to the JIS / K7201 standard. A multilayer wiring board, characterized in that a metal foil is disposed and integrated on a required portion through a resin layer on one or both sides so that the circuit on the surface of the inner layer material is exposed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62100814A JPH07120855B2 (en) | 1987-04-23 | 1987-04-23 | Multilayer wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62100814A JPH07120855B2 (en) | 1987-04-23 | 1987-04-23 | Multilayer wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63265495A JPS63265495A (en) | 1988-11-01 |
| JPH07120855B2 true JPH07120855B2 (en) | 1995-12-20 |
Family
ID=14283819
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62100814A Expired - Lifetime JPH07120855B2 (en) | 1987-04-23 | 1987-04-23 | Multilayer wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07120855B2 (en) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54157271A (en) * | 1978-06-02 | 1979-12-12 | Tokyo Shibaura Electric Co | Rigid flexible compound printed circuit board and method of producing same |
| JPS59125698A (en) * | 1983-01-06 | 1984-07-20 | 松下電工株式会社 | Method of producing multilayer printed circuit board |
-
1987
- 1987-04-23 JP JP62100814A patent/JPH07120855B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63265495A (en) | 1988-11-01 |
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