JPH07120877B2 - Electronic component mounting equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting device for electronic components, and more particularly to a mounting technique for automatically inserting lead terminals of electronic components into terminal holes of a printed circuit board for mounting.

(Prior Art) To mount an electronic component such as an IC having a plurality of lead terminals by automatically inserting it into a terminal hole provided on a printed circuit board with an automatic insertion tool (hereinafter referred to as “tool”), Conventionally, as shown in, for example, FIGS. 5A and 5B, the electronic component 1 is vacuum-sucked by the tip of the tool 2, and in this state, the electronic component 1 is moved above the printed circuit board 4 to lead terminals. 3 and the terminal hole 5 are aligned, and then the tool 2 is lowered so that a plurality of pairs of lead terminals 3-1, 3-2 ,. It was inserted into 2, and so on at the same time.

In this case, due to the positioning accuracy of the tool 2, a positional deviation easily occurs between the lead terminal 3 and the terminal hole 5, and since the positional deviation makes it difficult to insert, the tip of the lead terminal 3 has hitherto been. The portion 3a is formed to be elongated, and a certain amount of clearance (clearance) is provided for the terminal hole 5.

(Problem to be Solved by the Invention) However, even if a dimensional tolerance (clearance) is provided between the lead terminal 3 and the terminal hole 5 as in the above-described conventional means, Since the adjacent pitch is set to about 1/10 inch (2.54 mm), for example, there is a limit in providing a dimensional tolerance. In the end, high positioning accuracy is required for the tool 2 when mounting components. Was there.

The present invention has been made to solve the above problems,
An object of the present invention is to provide an electronic component mounting apparatus that can easily insert lead terminals of electronic components into terminal holes on the printed circuit board side.

(Means for Solving the Problems) In order to achieve the above object, an electronic component mounting apparatus according to the present invention automatically mounts a lead terminal of an electronic component by pressing and inserting it into a terminal hole of a printed circuit board. In an electronic component mounting apparatus, a cylinder tool that is urged in one direction so as to be able to advance and retreat to a main body side sleeve, and a cylinder tool that is urged in the same direction as that of the cylinder tool. A cylinder tool includes a slide tool that can move forward and backward independently, and the cylinder tool has a lower surface that presses an electronic component at a lower portion thereof. A taper surface for pressing is formed, and the electronic components vacuum-adsorbed on the taper surface are pressed and inserted into the terminal hole in order from the lead terminal close to the printed circuit board. Characterize.

(Operation) According to the present invention, due to the above configuration, the electronic component is attached while being inclined in the alignment direction of the lead terminals by the taper surface of the tip of the slide tool, and in this state, the alignment between the electronic component and the printed circuit board is performed. After that, the electronic parts descend toward the printed circuit board together with the slide tool. Then, when the inclined lowermost lead terminal reaches the printed circuit board, the lowermost lead terminal is first inserted into the terminal hole by the pressing force of the slide tool.

Then, when the tool body further descends, the tip of the slide tool presses the electronic component with a constant pressure, and the reaction itself causes the slide tool to gradually enter the cylinder tool. Rotate in a certain direction around the lead terminal inserted in the hole as the center of rotation,
Other lead terminals are sequentially inserted into the corresponding terminal holes. In the above, the lead terminal is inserted in a state of being inclined with respect to the opening axis of the terminal hole when it is inserted.
Therefore, the lead terminal has an advantage that the corner portion at the tip thereof does not contact the opening portion of the terminal hole and is smoothly inserted.

In addition, even if the insertion resistance of the lead terminals into the terminal holes is larger than expected and the slide tool gets into the cylinder tool before all lead terminals are completely inserted, the tool body consists of two stages. Since two types of biasing pressures can be set, the electronic component can be finally pressed by the larger biasing pressure. Therefore, all the lead terminals are surely inserted into the terminal holes.

(Embodiment) A preferred embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows a state before electronic components are mounted on a printed circuit board. In the figure, an electronic component 11 such as an IC includes a plurality of lead terminal pairs 13-1, 13-2, ... Arranged in line, and the package surface 11 of such electronic component 11 is
After a is adsorbed by the tool body 12, the tool body 12 is lowered and the lead terminal pairs 13-1, 13-2, ...
Component mounting is completed by inserting into 14 corresponding terminal holes 15-1, 15-2, ... And soldering on the pattern surface.

FIG. 2 shows the structure of the tool body 12 used for mounting the above components.

A characteristic of the present invention is that the cylinder tool is fitted in the main body side sleeve so as to be able to move forward and backward while being biased in one direction, and the cylinder tool is biased in the cylinder tool while being biased in the same direction as the cylinder tool. The cylinder tool includes a slide tool that can move forward and backward independently of the cylinder tool.The cylinder tool has a lower surface that presses electronic components, and the slide tool has a tapered attachment surface at the tip. It is that you are.

In FIG. 2, the tool body 12 includes a cylinder tool 16 and a slide tool 17, the cylinder tool 16 is fitted in a sleeve hole 18a formed in a body side sleeve 18 so as to be movable in the axial direction, and the slide tool 17 is Cylinder tool 16
It is fitted in a cylinder hole 16a formed in the cylinder so as to be movable in the axial direction. That is, the tool body 12 is configured as a two-step tool by the cylinder tool 16 and the slide tool 17.

A spring (compression) 19 is mounted between the sleeve 18 and the cylinder tool 16 at the upper part of the sleeve hole 18a, and the spring 19 constantly causes the cylinder tool 16 to always face the printed circuit board 14 (downward in the drawing). Bombing has been activated. A spring (compression) 20 having a smaller spring constant than the spring 19 is mounted between the cylinder tool 16 and the slide tool 17 at the upper part of the cylinder hole 16a. It is always elastically urged in the same direction as the cylinder tool 16. The tip of the slide tool 17 is projected from the cylinder tool 16 by the spring 20 except when the components are mounted.

Along the axial direction of the slide tool 17, a long groove 21 is formed.
And a pin 22 planted on the inner wall of the cylinder hole 16a is loosely fitted in the long groove 21 to prevent the slide tool 17 from coming off the cylinder tool 16.
Further, the tip of the slide tool 17 is formed with a taper surface 17a having a taper angle of about 15 ° with respect to the horizontal plane. As will be described later, the tapered surface 17a is mirror-finished so as not to damage the surface of the electronic component 11 during component mounting.

Further, air ducts 23a and 23b are concentrically formed through the inside of the cylinder tool 16 and the slide tool 17, and the air duct 23 is formed by the operation of a compressor (not shown).
The insides of a and 23b are made to be in a vacuum state.

The operation of the tool body having the above configuration will be described. When a constant external force is applied to the taper surface 17a of the slide tool 17 from below in the drawing along the axial direction, the slide tool 17 moves upward in the cylinder hole 16a against the urging force of the spring 20, and the amount of movement is When reaching a certain value 1, slide tool 17
Is in a state of completely entering the cylinder tool 16 (broken line state). From this state, continue to the cylinder tool 16
When an external force is applied to the lower surface 16b of the cylinder tool (and the slide tool) 16, the cylinder tool (and the slide tool) 16 moves upward in the sleeve hole 18 against the urging force of the spring 19 larger than the urging force described above. .

Therefore, according to this embodiment, two kinds of different biasing pressures can be set by appropriately selecting the spring constants of the two springs 19 and 20. The problem of defects is definitely solved.

Next, a component mounting method using the tool body will be described.

Mounting of electronic components by the electronic component mounting apparatus according to the present invention is performed as follows. The electronic component 11 is attached to the tip of the tool by inclining it in the alignment direction of the lead terminal, positioning is performed between the lead terminal and the terminal hole, and then the tool is lowered to bring the electronic component closer to the printed circuit board and incline it. The lower lead terminal is first inserted into the terminal hole, and the inserted lead terminal is rotated while pressing the electronic component while pressing the electronic component, and other lead terminals are sequentially inserted.

As shown in FIG. 3 (a), the electronic component 11 is moved above the printed circuit board 14 by vacuum suction of the package surface 11 a of the electronic component 11 by the tapered surface 17 a of the slide tool 17. That is, the electronic component 11 is adsorbed in a state of being inclined in the alignment direction of the lead terminals 13, and the positioning between the terminal holes 15 provided in the printed board 14 and the lead terminals 13 is performed above the printed board 14.

Next, as shown in FIG. 3B, the tool body 12 descends and the electronic component 11 approaches the printed circuit board 14 while being sucked, and the tool body 12 descends to lower the inclined lead terminal pairs 13 -1 is pressed by the slide tool 17 and is first inserted into the terminal hole 15-1. At this time, as shown in FIG. 3C, since the lead terminal 13 is inserted in a state of being inclined with respect to the opening axis of the terminal hole 15, the tip corner portion 13b of the lead terminal 13 surrounds the terminal hole 15. Never come into contact with. That is, the lead terminal 13 is guided to the opening 15a of the terminal hole 15 and smoothly introduced in a so-called jigging state.

Subsequently, as shown in FIG. 3 (d), as the tool body 12 is further lowered, the electronic component 11 is further pressed by the slide tool 17, but as a reaction thereof, the slide tool 17 itself also begins to contract. Then, the electronic component 11 is driven by the pressing force of the slide tool 17 and the lead terminal pair inserted first is inserted.
13-1 is rotated in the direction of arrow A about the rotation center, whereby the lead terminal pair 13-2, which is close to the lead terminal pair 13-1,
13-3, ... are sequentially inserted into the corresponding terminal holes 15-2, 15-3 ,. At this time, the package surface 11a moves away from the taper surface 17a of the slide tool 17 due to the rotational movement of the electronic component 11, and the tip 17b of the taper surface 17a has the package surface 11a.
Press this so that it slides on 11a.

Thus, as shown in FIG. 3 (e), all lead terminals 13
Is inserted into the terminal hole 15, and the insertion work is completed.

In the above, as shown in FIG. 3 (f), all lead terminals 13 may not be completely inserted only by the biasing pressure of the slide tool 17 because of the large insertion resistance of the lead terminals 13. Therefore, as shown in FIG. 3 (g),
In the tool body 12, the lower surface of the cylinder tool 16 is the package surface
It is designed to descend to a position where it comes into contact with 11a, whereby the electronic component 11 can be reliably inserted with a larger biasing pressure.

By the way, the electronic component 11 inserted as described above has a clearance provided between the lead terminal 13 and the terminal hole 15 as described above. is there.

Therefore, as shown in FIG. 4 (a), before insertion, the lead terminal 13
The dimensional relationship between the terminal hole 15 and the terminal hole 15 is set as a> A, b> B.

Here, a is the width of the lead terminal pair at the position where the lower surface of the package of the electronic component 11 is located, b is the width of the tip of the lead terminal pair, and A is the width between the centers of the pair of terminal holes 15 plus the diameter of the terminal hole 15. Similarly, B is the width obtained by subtracting the diameter of the terminal hole 15 from the lateral width between the centers of the terminal holes 15.

By doing so, the lead terminal 13 is deformed by the insertion pressure of the lead terminal 15 , and the lead terminal 13 is deformed as shown in FIG. 4 (b).
And the terminal hole 15 have a dimensional relationship of a '= A, b'<B, and the tip of the lead terminal 13 holds the terminal hole 15, so that the electronic component 111 does not come out of the printed board 14.

Further, even if the above conditions are not satisfied due to the length of the lead terminal 13, the size of the terminal hole 15, the pitch, etc., the tip of the lead terminal 13 should be bent inward as described above. As a result, a frictional force acts between the lead terminal 13 and the terminal hole 15 due to the pressing force at the time of insertion, and it is possible to prevent the lead terminal 13 from coming off. For this reason, there is no need to clinching the lead terminal after insertion as in the conventional case, and there is an advantage that the process can be simplified.

(Effects of the Invention) As described above, the electronic component mounting apparatus according to the present invention is
In an electronic component mounting apparatus that automatically presses and inserts a lead terminal of an electronic component into a terminal hole of a printed circuit board to mount the electronic component, while being biased in one direction, the main body side sleeve is fitted in a retractable manner. The cylinder tool includes a cylinder tool and a slide tool that is fitted into the cylinder tool in a state of being biased in the same direction as the cylinder tool and that can slide forward and backward independently of the cylinder tool. Is formed, the slide tool has a tapered surface for vacuum-adsorbing the electronic component at the tip thereof and pressing the electronic component, and the electronic component vacuum-adsorbed on the taper surface is a lead terminal close to the printed circuit board. By sequentially pressing and inserting into the terminal hole from the above, there is an advantage that the positioning accuracy of the tool body does not need to be as high as the conventional one.

Further, the tool body includes a cylinder tool and a slide tool, and has a so-called two-stage configuration, and two different types of insertion pressures can be set. Therefore, even if the insertion resistance is larger than expected, the larger one is inserted. The component can be reliably inserted by pressure.

[Brief description of drawings]

FIG. 1 is a diagram showing a state before an electronic component is mounted on a printed circuit board, FIG. 2 is a vertical sectional view of a tool body, and FIGS. 3 (a) to (g) are diagrams showing a mounting method of the electronic component. 4 (a) and 4 (b) are views showing a method of inserting lead terminals, FIG.
(A), (b) is a figure which shows the mounting method of the conventional electronic component. 1, 11 …… Electronic parts 12 …… Tool body 3,13 …… Lead terminals 4,14 …… Printed circuit board 5,15 …… Terminal hole 16 …… Cylinder tool 17 …… Slide tool 17a …… Tapered surface 19, 20 ... spring

Continuation of the front page (56) Reference JP-A-49-52978 (JP, A) Actually opened 58-146689 (JP, U) Actually opened 62-192646 (JP, U)

Claims (1)

[Claims] 1. A mounting device for an electronic component, which automatically presses and inserts a lead terminal of an electronic component into a terminal hole of a printed circuit board for mounting, and is capable of advancing and retreating to a main body side sleeve while being urged in one direction. A cylinder tool internally fitted to the cylinder tool, and a slide tool internally fitted to the cylinder tool in a state of being urged in the same direction as the cylinder tool and capable of advancing and retracting independently of the cylinder tool. A lower surface that presses a component is formed, and the slide tool has a taper surface that vacuum-adsorbs an electronic component on the tip and presses the electronic component. The electronic component that is vacuum-adsorbed on the taper surface is printed. A mounting device for electronic parts, characterized in that lead terminals close to the board are pressed and inserted into the terminal holes in order.