JPH07122599B2 - Weight sensor element - Google Patents
Weight sensor elementInfo
- Publication number
- JPH07122599B2 JPH07122599B2 JP1097134A JP9713489A JPH07122599B2 JP H07122599 B2 JPH07122599 B2 JP H07122599B2 JP 1097134 A JP1097134 A JP 1097134A JP 9713489 A JP9713489 A JP 9713489A JP H07122599 B2 JPH07122599 B2 JP H07122599B2
- Authority
- JP
- Japan
- Prior art keywords
- sensor element
- weight sensor
- alumina
- conductive plate
- plate body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 34
- 239000003822 epoxy resin Substances 0.000 claims description 24
- 229920000647 polyepoxide Polymers 0.000 claims description 24
- 239000012790 adhesive layer Substances 0.000 claims description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000011521 glass Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 11
- 239000011347 resin Substances 0.000 claims description 11
- 230000002209 hydrophobic effect Effects 0.000 claims description 8
- 239000000945 filler Substances 0.000 claims description 7
- 239000010419 fine particle Substances 0.000 claims description 5
- 239000000377 silicon dioxide Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000005388 borosilicate glass Substances 0.000 claims description 2
- 229910000833 kovar Inorganic materials 0.000 claims description 2
- 239000010935 stainless steel Substances 0.000 claims description 2
- 229910001220 stainless steel Inorganic materials 0.000 claims description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 2
- 229910002065 alloy metal Inorganic materials 0.000 claims 2
- 239000000919 ceramic Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 125000006850 spacer group Chemical group 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 230000005494 condensation Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000004043 responsiveness Effects 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000007257 malfunction Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 1
- 206010049040 Weight fluctuation Diseases 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010411 cooking Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、電子レンジなどのに用いられることができる
重量センサ素子、特に静電容量型重量センサ素子に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a weight sensor element that can be used in a microwave oven or the like, and particularly to a capacitance type weight sensor element.
従来の技術 従来、この種の重量センサ素子は、例えば、特開昭60−
288616号公報に示されているように第６図のような構成
になっていた。2. Description of the Related Art Conventionally, a weight sensor element of this type has been disclosed in, for example, JP-A-60-
As shown in Japanese Patent No. 288616, the structure was as shown in FIG.
即ち、一対のアルミナ平板１、２を、一定の間隔をあけ
て、互いに平行になるようにその周辺部を、ガラスなど
のスペーサ３で固着していた。一対のアルミナ平板１、
２の内面に円形の電極４、５を設けコンデンサとしてい
た。アルミナ平板１の中央部に砲弾型の荷重点６を固定
し、荷重点６に荷重を印可し、アルミナ平板１をダイア
フラムとして動作させ、電極４、５からなるコンデンサ
の静電容量の値から荷重を検知する重量センサ素子とし
ていた。尚、この時大気圧の変動によるダイアフラムの
変形を避けるために、ダイアフラム（アルミナ平板１）
もしくは、基台（アルミナ平板２）に貫通孔７もしくは
８を設けていた。That is, a pair of alumina flat plates 1 and 2 are fixed to each other with a constant interval, and their peripheral portions are fixed to each other by a spacer 3 such as glass so as to be parallel to each other. A pair of alumina flat plates 1,
Circular electrodes 4 and 5 were provided on the inner surface of 2 to form a capacitor. A bullet-shaped load point 6 is fixed to the central part of the alumina flat plate 1, a load is applied to the load point 6, the alumina flat plate 1 is operated as a diaphragm, and the load is calculated from the capacitance value of the capacitor composed of the electrodes 4 and 5. Was used as the weight sensor element. At this time, in order to avoid the deformation of the diaphragm due to the fluctuation of the atmospheric pressure, the diaphragm (alumina flat plate 1)
Alternatively, the through hole 7 or 8 was provided in the base (alumina flat plate 2).
発明が解決しようとする課題 しかし、このような構成のものでは、２枚のアルミナ平
板をガラスなどのスペーサを用いて固着していたため、
600℃以上もの高温で処理する必要があるため、生産性
が著しく低くなるという課題があった。更に、チップ部
品などを用いるハイブリッドICなどとの一体化において
は、製造プロセスの自由度が大幅に制限されるなどの課
題があった。また600℃以上もの高温で、アルミナ平板
とガラスなどのスペーサとを固着していたため、用いる
材料の熱膨張計数を正確に一致させる必要があり、重量
センサ素子としての温度計数をある程度自由に設計する
ことが実現不可能であった。DISCLOSURE OF INVENTION Problems to be Solved by the Invention However, in such a structure, since two alumina flat plates are fixed by using a spacer such as glass,
Since it has to be processed at a temperature as high as 600 ° C. or higher, there is a problem that the productivity is significantly reduced. Further, in the integration with a hybrid IC or the like using chip parts, there is a problem that the degree of freedom of the manufacturing process is significantly limited. Further, since the alumina flat plate and the spacer such as glass were fixed at a high temperature of 600 ° C. or more, it is necessary to exactly match the thermal expansion coefficient of the material used, and the temperature coefficient as a weight sensor element can be freely designed to some extent. That was impossible.
また、ダイアフラムもしくは基台に貫通孔７もしくは８
を設けて用いるため、水蒸気などの混入による結露が発
生し、誤動作が生じやすいという課題もあった。Further, the diaphragm or the base is provided with a through hole 7 or 8
Since it is provided and used, there is also a problem that dew condensation occurs due to mixing of water vapor or the like, and malfunction easily occurs.
そこで、本発明の第１の目的は、アルミナ平板の固着時
の処理温度を大幅に下げ、生産性を向上することにあ
る。第２の目的は、前記処理温度を大幅に下げ得た結
果、用いる材料の熱膨張計数の選択の自由度を拡げ、延
いては重量センサ素子の温度計数をある程度自由に設計
することを可能にすることにある。第３の目的は、前記
処理温度を大幅に下げ得た結果、重量センサ素子内部
に、疎水性樹脂被覆を可能にし、素子内部での水蒸気な
どの結露による誤動作のない重量センサ素子を提供する
ことにある。Therefore, a first object of the present invention is to significantly reduce the processing temperature when fixing the alumina flat plate and improve the productivity. A second object is that, as a result of being able to significantly lower the processing temperature, it is possible to expand the degree of freedom in selecting the thermal expansion coefficient of the material to be used, and in turn, it is possible to freely design the temperature coefficient of the weight sensor element to some extent. To do. A third object is to provide a weight sensor element which can be coated with a hydrophobic resin inside the weight sensor element as a result of being able to significantly lower the treatment temperature and which does not malfunction due to dew condensation such as water vapor inside the element. It is in.
課題を解決するための手段 第１の目的を達成するために、本発明は、ガラスなどの
スペーサによる固着にかえて、シリカ、アルミナなどの
無機微粒子からなるフィラーを25wt％以上含有するエポ
キシ樹脂系接着層による固着とし、処理温度を大幅に低
下させ、生産性の向上を図る。第２の目的を達成するた
めに、処理温度の大幅な低下により、エポキシ樹脂系接
着層の熱膨張計数の選択の幅が拡がり、重量センサ素子
としての温度計数をある程度自由に設計することを可能
とした。第３の目的を達成するために、予め電極表面上
に疎水性樹脂被膜を形成したあと、エポキシ樹脂系接着
層により固着し、素子内面への水蒸気などによる結露を
防ぐ構造とした。Means for Solving the Problems In order to achieve the first object, the present invention is an epoxy resin system containing 25 wt% or more of a filler made of inorganic fine particles such as silica and alumina instead of being fixed by a spacer such as glass. Adhesion layer is used for fixing, and the processing temperature is significantly lowered to improve productivity. In order to achieve the second object, a large reduction in the processing temperature expands the range of selection of the thermal expansion coefficient of the epoxy resin adhesive layer, and it is possible to freely design the temperature coefficient as a weight sensor element to some extent. And In order to achieve the third object, a structure in which a hydrophobic resin film is formed on the surface of the electrode in advance and then fixed by an epoxy resin adhesive layer to prevent dew condensation on the inner surface of the element due to water vapor or the like.
作用 本発明の重量センサ素子は、一対の平面をエポキシ樹脂
系接着層による固着とするため、従来のガラスなどによ
る固着の処理温度が600℃〜800℃もの高温を必要として
いたものに比べ、150℃〜200℃もの低温で可能となっ
た。このように、処理温度を著しく低下させることが出
来たため、重量センサ素子の生産性が大幅に向上した。
従って、チップ部品などを用いるハイブリッドICなどと
の一体化においても、その製造プロセスの自由度が大幅
に拡大する。また、エポキシ系接着層には、シリカ、ア
ルミナなどのフィラーを、25wt％以上含有しているた
め、外部からの機械的な変化、即ち、重量変化を、応答
性よく検知することができた。Action Since the weight sensor element of the present invention has the pair of flat surfaces fixed by the epoxy resin adhesive layer, the processing temperature for fixing by conventional glass or the like is 150 ° C as compared with the one requiring a high temperature of 600 ° C to 800 ° C. It became possible at temperatures as low as ℃ -200 ℃. In this way, the processing temperature could be significantly lowered, and the productivity of the weight sensor element was significantly improved.
Therefore, even when integrated with a hybrid IC using chip parts, the degree of freedom in the manufacturing process is greatly expanded. Moreover, since the epoxy adhesive layer contains 25 wt% or more of filler such as silica and alumina, it is possible to detect mechanical change from the outside, that is, weight change with good responsiveness.
また、アルミナ平板をガラスなどのシールと固着する場
合、その処理温度が高温であるため、その熱膨張係数の
差は、一般に0.5×10-6/℃以下でないと固着できないと
言われている。しかし、エポキシ樹脂系接着層の場合、
その処理温度が低いためもあり、その熱膨張係数の差
が、５×10-6/℃程度までなら固着可能であると言われ
ている。従って、エポキシ系樹脂接着層のより幅広い熱
膨張係数を選択することによって、重量センサ素子の温
度計数をある程度幅広く設計することが可能となる。Further, when fixing an alumina flat plate to a seal such as glass, the processing temperature is high, so that it is generally said that the difference in the coefficient of thermal expansion cannot be fixed unless it is 0.5 × 10 −6 / ° C. or less. However, in the case of an epoxy resin adhesive layer,
Due to the low processing temperature, it is said that fixing is possible if the difference in the coefficient of thermal expansion is up to about 5 × 10 −6 / ° C. Therefore, by selecting a wider thermal expansion coefficient of the epoxy resin adhesive layer, it is possible to design the temperature coefficient of the weight sensor element to be wider to some extent.
また、エポキシ樹脂系接着層による固着時の処理温度が
低いため、予め、電極面に疎水性樹脂を被覆したあとで
も、固着可能となり、水蒸気などが素子内部に侵入して
も結露しにくくなり、誤動作が発生しにくくなる。Further, since the processing temperature at the time of fixing by the epoxy resin adhesive layer is low, it becomes possible to fix even after coating the electrode surface with the hydrophobic resin in advance, and it becomes difficult for dew condensation even if water vapor or the like enters the inside of the element, Malfunctions are less likely to occur.
実施例 以下、本発明の一実施例を添付図面により説明する。第
１図において、11、12は一対の被導電性平板としての板
厚0.63t大のアルミナ平板、13は、11、12を平行に固着
保持するための有機接着層でその内径はφ24、外径φ2
8、高さ約50μｍ、14、15はアルミナ平板の内面に形成
されたφ12の円形電極、14′、15′はそれぞれの取り出
しリード電極を示す。16は、アルミナ平板の中央部に固
定されたφ４の砲弾型荷重点、17は11に設けられた貫通
孔を示す。有機接着層13として、重量センサ素子の実用
上重要な特性を満足し、且つ、大幅な生産性の向上を達
成できるものとして、エポキシ系樹脂を用いた。前記重
要な特性として接着強度、接着強度の耐湿特性および応
答性を選んだ。Embodiment An embodiment of the present invention will be described below with reference to the accompanying drawings. In FIG. 1, 11 and 12 are 0.63t-thick alumina flat plates as a pair of conductive flat plates, and 13 is an organic adhesive layer for fixing and holding 11 and 12 in parallel, the inner diameter of which is φ24, the outer part. Diameter φ2
8. Approximately 50 .mu.m in height, 14 and 15 are .phi.12 circular electrodes formed on the inner surface of an alumina flat plate, and 14 'and 15' are respective lead electrodes. Reference numeral 16 is a bullet-shaped load point of φ4 fixed to the central portion of the alumina plate, and 17 is a through hole provided in 11. As the organic adhesive layer 13, an epoxy resin was used as a material that satisfies the practically important characteristics of the weight sensor element and can achieve a significant improvement in productivity. Adhesive strength, moisture resistance of adhesive strength, and responsiveness were selected as the important characteristics.
エポキシ樹脂として、一般によく知られているビスフェ
ノール型エポキシレジンとヘキサヒドロ無水フタル酸を
主成分とするものを用いた。接着強度は、100kg/cm2以
上得られ、実用上充分であった。またその耐湿劣化特性
は、60℃、95％RH雰囲気中に500時間放置し、接着強度
劣化を測定したが、初期値の10％以下程度、即ち90kg/c
m2以上の接着強度を示し、実用上問題とならない値であ
った。応答性は、5kg荷重のON−OFF30秒後から４分間の
重量変動で評価した。その結果、約5g以内であった。こ
の値は通常電子レンジなどの食品重量検知に用いられる
重量センサ素子の値としては実用許容される値であっ
た。しかし、より応答度の要求される用途、例えば調理
中の食品の重量変化を検知するような場合、実用上やや
不充分である。応答度はエポキシ樹脂にフィラーを混入
させることにより改善することが出来た。第２図にその
結果を示す。同図において、横軸は、アルミナ（Al
O3）、シリカ（SiO2）などの微粒子（直径40μｍ以下の
球形）の含有量を、縦軸に前記重量変動を示す。同図よ
り、フィラーを25wt％以上に含有させることにより、実
用上充分な応答度2g以下を達成することが出来た。尚、
この際接着強度も第３図に示すように、10％〜30％向上
することが認められた。次に重量センサ素子の温度特性
について説明する。センサ素子の静電容量Ｃは、電極面
積をＳ、エポキシ樹脂系接着層の高さをｄとし、真空の
誘電率をε０とすると、 で示される。As the epoxy resin, a well-known bisphenol type epoxy resin and hexahydrophthalic anhydride as main components were used. An adhesive strength of 100 kg / cm 2 or more was obtained, which was practically sufficient. Regarding its moisture resistance deterioration characteristics, the adhesive strength deterioration was measured by leaving it in an atmosphere of 60 ° C and 95% RH for 500 hours. It was about 10% or less of the initial value, namely 90kg / c.
It showed an adhesive strength of m 2 or more and was a value that did not pose a problem in practical use. Responsiveness was evaluated by weight fluctuation for 4 minutes after 30 seconds from ON-OFF of 5 kg load. As a result, it was within about 5 g. This value is a value that is practically acceptable as the value of a weight sensor element normally used for detecting the weight of food such as a microwave oven. However, it is slightly insufficient in practical use in applications requiring more responsiveness, for example, in detecting the weight change of food during cooking. The responsivity could be improved by mixing a filler in the epoxy resin. The results are shown in FIG. In the figure, the horizontal axis is alumina (Al
The content of fine particles (spherical shape with a diameter of 40 μm or less) such as O 3 ) and silica (SiO 2 ) is shown, and the vertical axis shows the weight variation. From the figure, it was possible to achieve a practically sufficient response of 2 g or less by including the filler in an amount of 25 wt% or more. still,
At this time, it was confirmed that the adhesive strength was also improved by 10% to 30% as shown in FIG. Next, the temperature characteristics of the weight sensor element will be described. The capacitance C of the sensor element is S, where the electrode area is S, the height of the epoxy resin adhesive layer is d, and the vacuum dielectric constant is ε 0 . Indicated by.
重量センサ素子、即ち前記静電容量の温度係数 はアルミナ基板およびエポキシ樹脂系接着層の熱膨張係
数をそれぞれαＡおよびαＥとすると、電極面積Ｓの熱
膨張係数が２αＡとなるため、温度変化を△Ｔとする
と、（１）式は次式（２）のようになる。Weight sensor element, that is, temperature coefficient of the capacitance If the thermal expansion coefficients of the alumina substrate and the epoxy resin adhesive layer are α A and α E , respectively, the thermal expansion coefficient of the electrode area S is 2α A , so if the temperature change is ΔT, equation (1) becomes It becomes like the following formula (2).
従って、 となる。 Therefore, Becomes
アルミナ基板の熱膨張係数がαＡが７×10-6/℃とする
と、従来の600〜800℃でのガラス固着の場合、その熱膨
張係数が（6.5〜7.5）×10-6/℃以内でなければ固着で
きないため従来の重量センサ素子の温度計数 は（7.5〜6.5）×10-6/℃であった。しかしながら、本
発明の処理温度が低温であるエポキシ樹脂系接着層の場
合、その熱膨張係数が（２〜12）×10-6/℃と広い範囲
で固着することが出来るため、重量センサ素子の温度係
数は、（12〜２）×10-6/℃と幅広く実現可能であるこ
とがわかった。尚、本実施例に用いたエポキシ樹脂の熱
膨張係数は、（６±１）×10-6/℃であり、重量センサ
素子の温度計数の測定値は−（４±1.5）×10-6/℃が得
られ、前記（３）式と良い一致を得た。If the thermal expansion coefficient of the alumina substrate is α A of 7 × 10 -6 / ° C, the coefficient of thermal expansion is (6.5 to 7.5) × 10 -6 / ° C in the case of conventional glass fixation at 600 to 800 ° C. The temperature of the conventional weight sensor element cannot be fixed unless it is fixed. Was (7.5-6.5) × 10 -6 / ° C. However, in the case of the epoxy resin-based adhesive layer having a low processing temperature of the present invention, the thermal expansion coefficient thereof can be fixed in a wide range of (2 to 12) × 10 −6 / ° C. It was found that the temperature coefficient can be widely realized as (12 to 2) × 10 -6 / ° C. The coefficient of thermal expansion of the epoxy resin used in this example is (6 ± 1) × 10 −6 / ° C., and the measured value of the temperature coefficient of the weight sensor element is − (4 ± 1.5) × 10 −6. / ° C was obtained, which was in good agreement with the above formula (3).
更に、ダイアフラムとして動作するアルミナ平板と対向
する平板を、導電性平板、即ち金属板にすることによ
り、より一層生産性が向上した。Further, by using a conductive flat plate, that is, a metal plate, as the flat plate facing the alumina flat plate that operates as a diaphragm, the productivity is further improved.
第４図に非導電性平板と導電平板からなる重量センサの
断面図を示す。アルミナ平板11が、導電性平板即ち金属
平板18とが、シリカあるいはアルミナなどの無機微粒子
からなるフィラーを25wt％以上60wt％以下含有するエポ
キシ樹脂系接着層13で固着された重量センサ素子を示
す。同図に見られるように、導電性平板18上には第１図
で示した電極15およびリード部15′を形成する必要がな
く、導電性平板18を電極およびリード部として用いるこ
とが出来る。従って、電極形成が不要になるばかりでな
く、上下電極の位置合わせも不要となり、製造プロセス
コストが大幅に減少するばかりか、上下電極の位置ずれ
による歩留りの低下もなくなるという利点もあり生産性
が大幅に向上した。更に、一方を金属板にすることによ
り生産性の向上も得られた。FIG. 4 shows a cross-sectional view of a weight sensor including a non-conductive flat plate and a conductive flat plate. 1 shows a weight sensor element in which an alumina flat plate 11 is fixed to a conductive flat plate, that is, a metal flat plate 18 by an epoxy resin adhesive layer 13 containing 25 wt% or more and 60 wt% or less of a filler made of inorganic fine particles such as silica or alumina. As shown in the figure, it is not necessary to form the electrode 15 and the lead portion 15 'shown in FIG. 1 on the conductive flat plate 18, and the conductive flat plate 18 can be used as the electrode and the lead portion. Therefore, not only the electrode formation is unnecessary, but also the alignment of the upper and lower electrodes is not necessary, which not only significantly reduces the manufacturing process cost but also reduces the yield due to the displacement of the upper and lower electrodes, which is advantageous in productivity. Greatly improved. Further, by using one of them as a metal plate, the productivity can be improved.
即ち、第１図において、上下の平板を平行に保持するた
め、上下平板平面度が、接着層13の約1/10要求されるた
め、（本実施例の場合、約５μｍ程度）アルミナ平板を
研磨仕上げしていたが、金属板の場合、研磨仕上げに要
する工数が、アルミナ基板の場合の約1/10程度となり、
大幅に製造プロセス・コストが低下し、予期せぬ生産性
の向上が得られた。That is, in FIG. 1, in order to keep the upper and lower flat plates parallel to each other, the flatness of the upper and lower flat plates is required to be about 1/10 of that of the adhesive layer 13. It was polished and finished, but in the case of a metal plate, the number of man-hours required for polishing and finishing is about 1/10 that of an alumina substrate,
The manufacturing process cost has been drastically reduced and the productivity has been unexpectedly improved.
尚、非導電性平板として、前記実施例において、アルミ
ナ平板を用いたが、弾性点特性に優れ、薄く且つ良好な
平面度の得られるものならばよく、例えば、強靭な特性
を持つ、ジルコニアなどの でも良い。更に平面度の得られやすい石英ガラス、硼珪
酸ガラスなどのガラス板でも良い。As the non-conductive flat plate, an alumina flat plate was used in the above-mentioned embodiment, but any plate having excellent elastic point characteristics and being thin and having good flatness may be used. of But good. Further, a glass plate such as quartz glass or borosilicate glass which can easily obtain flatness may be used.
尚、有機接着層としては、前記実施例において、エポキ
シ系樹脂を用いたが、フェノール系、尿素系などの硬化
温度の低い熱硬化性樹脂でも良い。Although the epoxy resin is used as the organic adhesive layer in the above-mentioned embodiment, a thermosetting resin having a low curing temperature such as phenol or urea may be used.
尚、金属平板の材料としては、加工性、コスト、耐湿特
性、熱膨張係数、エポキシ樹脂系接着層との接着性、非
導電性平板との相性などの点から、ステンレス（SU
S）、コバール、426合金などが適している。The material of the metal flat plate is stainless steel (SU) in view of workability, cost, moisture resistance, thermal expansion coefficient, adhesiveness with epoxy resin adhesive layer, compatibility with non-conductive flat plate, etc.
S), Kovar, 426 alloy, etc. are suitable.
アルミナを非導電性平板として用いる場合は、前記金属
の中でも、426合金の熱膨張係数が最もアルミナの近
く、426合金を前記金属平板として用いることが最も適
している。When alumina is used as the non-conductive flat plate, among the above metals, the 426 alloy has the thermal expansion coefficient closest to that of alumina, and it is most suitable to use the 426 alloy as the metal flat plate.
更に、アルミナダイアフラムと金属平板とを組み合わせ
ることにより以下に示す新たな生産性の向上も得られ
た。即ち、第１図において、取り出しリード電極14′、
15′へリード線などを半田付けする場合、上下ともアル
ミナ平板から成るセンサ素子であれば、リード毎に素子
を反転させ半田付けする必要があったが、第３図に示す
素子の場合金属平板18から成るため、素子を反転するこ
となく、例えば18の裏面に一方のリード線を接続するこ
とが出来た。Furthermore, the following new improvement in productivity was obtained by combining the alumina diaphragm and the metal flat plate. That is, in FIG. 1, the extraction lead electrode 14 ',
When soldering a lead wire etc. to 15 ', if it was a sensor element consisting of an alumina flat plate both up and down, it was necessary to invert the element for each lead and solder it, but in the case of the element shown in Fig. 3, it is a metal flat plate. Since it consists of 18, it was possible to connect one lead wire to the back surface of 18, for example, without inverting the element.
本発明の第２の実施例を第５図（ａ）、（ｂ）を用いて
説明する。A second embodiment of the present invention will be described with reference to FIGS. 5 (a) and 5 (b).
第５図（ａ）は、第１図と同じ構成であるが、エポキシ
樹脂系接着層13で上下11、12のアルミナ平板を、第５図
（ｂ）は、アルミナ平板11と金属平板18とを固着する前
に疎水性樹脂膜20を形成した。従来のガラスなどのスペ
ーサによる固着では、処理温度が600〜800℃もの高温で
あるため、このような樹脂膜を素子内面に形成すること
は不可能であった。尚、21は素子外面に形成された疎水
性樹脂膜を示し、上下平板を固着後形成した。FIG. 5 (a) has the same structure as FIG. 1, but the epoxy resin adhesive layer 13 is used for upper and lower alumina flat plates 11 and 12, and FIG. 5 (b) is for the alumina flat plate 11 and the metal flat plate 18. The hydrophobic resin film 20 was formed before fixing. With conventional fixing using a spacer such as glass, the processing temperature is as high as 600 to 800 ° C., so it is impossible to form such a resin film on the inner surface of the element. Reference numeral 21 denotes a hydrophobic resin film formed on the outer surface of the element, which was formed after fixing the upper and lower flat plates.
疎水性樹脂膜20として、ポリイミドアミド系あるいはフ
ロン系樹脂を、0.2〜５μｍ程度被覆したときの耐湿特
性の結果を第６図に示す。同図において横軸は、30℃に
おけるエポキシ樹脂系接着層の相対湿度、縦軸は相対湿
度40％のときを零点としたときの容量変化率 を示す。従来のガラス固着による従来の重量センサ素子
の結果を×印で、本発明による重量センサ素子の結果を
○印で示した。同図より、結露寸前の95％領域において
耐湿特性が大幅に改善されていることがわかる。FIG. 6 shows the result of the moisture resistance property when the hydrophobic resin film 20 is coated with a polyimideamide-based or freon-based resin to a thickness of about 0.2 to 5 μm. In the figure, the horizontal axis is the relative humidity of the epoxy resin adhesive layer at 30 ° C, and the vertical axis is the rate of change in capacity when the relative humidity is 40% as the zero point. Indicates. The result of the conventional weight sensor element by the conventional glass fixing is shown by X, and the result of the weight sensor element according to the present invention is shown by O. From the figure, it can be seen that the moisture resistance is significantly improved in the 95% region just before dew condensation.
発明の効果 以上のように本発明は、一対の平板をガラスなどのスペ
ーサによる固着にかえ、エポキシ樹脂系接着層を用いる
ため、その処理温度が600〜800℃もの高温から、150〜2
00℃もの低温にすることが出来、製造プロセスコストな
どの生産性を大幅に向上することが出来た。As described above, the present invention, instead of fixing a pair of flat plates with a spacer such as glass, uses an epoxy resin-based adhesive layer, so that the processing temperature is as high as 600 to 800 ° C., 150 to 2
The temperature could be as low as 00 ℃, and the productivity such as manufacturing process cost could be greatly improved.
また、エポキシ樹脂系接着層による固着の場合、幅広い
熱膨張係数の材料を用いることが可能となり、温度係数
をある程度自由に設計することが可能となった。Further, in the case of fixing with an epoxy resin adhesive layer, it is possible to use a material having a wide thermal expansion coefficient, and it is possible to freely design the temperature coefficient to some extent.
更に、センサ素子内面に、疎水性樹脂被膜を形成するこ
とが出来、耐湿特性の良好な重量センサ素子を提供する
ことが出来た。Furthermore, a hydrophobic resin film can be formed on the inner surface of the sensor element, and a weight sensor element having good moisture resistance can be provided.
第１図は本発明の一実施例に基づく重量センサ素子の断
面図、第２図、第３図は同重量センサ素子の特性図、第
４図は同他の実施例の重量センサ素子の断面図、第５図
（ａ）（ｂ）は、さらに他の実施例に基づく重量センサ
素子の断面図、第６図は第５図（ａ）（ｂ）の素子の特
性図、第７図は従来の重量センサ素子の一部破断斜視図
である。 11、12……アルミナ平板、14、15……電極、13……有機
接着層、16……荷重点、18……金属平板。FIG. 1 is a sectional view of a weight sensor element according to an embodiment of the present invention, FIGS. 2 and 3 are characteristic diagrams of the same weight sensor element, and FIG. 4 is a sectional view of a weight sensor element of the other embodiment. FIGS. 5 (a) and 5 (b) are sectional views of a weight sensor element according to still another embodiment, FIG. 6 is a characteristic diagram of the element of FIGS. 5 (a) and 5 (b), and FIG. It is a partially broken perspective view of the conventional weight sensor element. 11, 12 …… Alumina flat plate, 14,15 …… Electrode, 13 …… Organic adhesive layer, 16 …… Load point, 18 …… Metal flat plate.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 植田 茂樹 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (56)参考文献 特開 昭56−147310（ＪＰ，Ａ) 実開 昭64−44440（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shigeki Ueda 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) Reference JP-A-56-147310 (JP, A) (JP, U)
Claims (6)
板体が、一定の空間をあけて互いに平行に配置され、且
つ、その周辺部をシリカ、アルミナなどの無機微粒子か
らなるフィラーを25wt％以上60wt％以下含有してなるエ
ポキシ樹脂系接着層で固定され、且つ、前記平行に配置
された板体の互いに向い合う平面に、電極を備え静電容
量を形成するとともに、前記板体の少なくとも一方が重
量に応じ、弾性ダイアフラムとして動作してなる重量セ
ンサ素子。1. A filler composed of a pair of non-conductive plate bodies, wherein the pair of plate bodies are arranged in parallel with each other with a certain space therebetween, and a peripheral portion thereof is made of inorganic fine particles such as silica and alumina. Is fixed by an epoxy resin adhesive layer containing 25 wt% or more and 60 wt% or less, and electrodes are formed on the mutually facing flat surfaces of the parallelly arranged plate bodies to form a capacitance, and the plate is A weight sensor element in which at least one of the bodies operates as an elastic diaphragm according to the weight.
からなり、前記一対の板体が、一定の空間をあけて互い
に平行に配置され、且つ、その周辺部をシリカ、アルミ
ナなどの無機微粒子からなるフィラーを25wt％以上60wt
％以下含有してなるエポキシ樹脂系接着層で固定され、
且つ、前記平行に配置された非導電性板体の、導電性板
体に向かい合う平面に電極を備え、前記電極と、導電性
板体との間に静電容量を形成するとともに、前記板体の
少なくとも一方が重量に応じ、弾性ダイヤフラムとして
動作してなる重量センサ素子。2. A pair of plate bodies, a non-conductive plate body and a conductive plate body, wherein the pair of plate bodies are arranged in parallel to each other with a certain space therebetween, and the peripheral portion thereof is silica. 25wt% or more and 60wt of filler consisting of inorganic fine particles such as alumina
Fixed with an epoxy resin adhesive layer containing less than or equal to
Further, the non-conductive plate bodies arranged in parallel are provided with electrodes on a plane facing the conductive plate body, and a capacitance is formed between the electrode and the conductive plate body, and the plate body is formed. A weight sensor element in which at least one of them operates as an elastic diaphragm according to the weight.
樹脂を被覆してなる特許請求の範囲第１項または第２項
記載の重量センサ素子。3. The weight sensor element according to claim 1, wherein the outer surface and the inner surface of the pair of plate bodies are coated with a hydrophobic resin.
アなどの磁器もしくは石英ガラス、硼珪酸ガラスなどの
ガラスからなる特許請求の範囲第１項または第２項記載
の重量センサ素子。4. The weight sensor element according to claim 1, wherein the non-conductive plate is made of a ceramic such as alumina or zirconia or a glass such as quartz glass or borosilicate glass.
ル、426合金系金属からなる特許請求の範囲第２項記載
の重量センサ素子。5. The weight sensor element according to claim 2, wherein the conductive plate is made of stainless steel, Kovar, or 426 alloy metal.
つ、前記導電性板体が426合金系金属からなる特許請求
の範囲第２項記載の重量センサ素子。6. The weight sensor element according to claim 2, wherein the non-conductive plate body is made of alumina, and the conductive plate body is made of 426 alloy metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1097134A JPH07122599B2 (en) | 1989-04-17 | 1989-04-17 | Weight sensor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1097134A JPH07122599B2 (en) | 1989-04-17 | 1989-04-17 | Weight sensor element |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02275331A JPH02275331A (en) | 1990-11-09 |
| JPH07122599B2 true JPH07122599B2 (en) | 1995-12-25 |
Family
ID=14184099
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1097134A Expired - Lifetime JPH07122599B2 (en) | 1989-04-17 | 1989-04-17 | Weight sensor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07122599B2 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4627612B2 (en) * | 2001-08-29 | 2011-02-09 | グンゼ株式会社 | Fingerprint detection sensor and manufacturing method thereof |
| JP6252241B2 (en) | 2014-02-27 | 2017-12-27 | セイコーエプソン株式会社 | Force detection device and robot |
| JP6477843B2 (en) * | 2017-11-28 | 2019-03-06 | セイコーエプソン株式会社 | Force detection device and robot |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56147310A (en) * | 1980-04-16 | 1981-11-16 | Hitachi Ltd | Conductive adhesive |
| JPS6444440U (en) * | 1987-09-14 | 1989-03-16 |
-
1989
- 1989-04-17 JP JP1097134A patent/JPH07122599B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02275331A (en) | 1990-11-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5076147A (en) | Pressure sensor including a diaphragm having a protective layer thereon | |
| US5001595A (en) | Capacitive pressure sensor and method of manufacturing same | |
| EP0252929B1 (en) | Electrically variable piezoelectric hybrid capacitor | |
| US4786887A (en) | Thin-film strain gauge system and method of manufacturing same | |
| US4581676A (en) | Electrical contact coating for silicon pressure transducers | |
| US20030107096A1 (en) | Combined absolute differential transducer | |
| US4437228A (en) | Method of mounting a silicon pellet on a ceramic substrate | |
| JPH09145489A (en) | Resistance thermometer | |
| NO854029L (en) | TRANSDUCES FOR ABSOLUTE PRESSURE. | |
| JPH0324793B2 (en) | ||
| JPH08193897A (en) | Semiconductor pressure sensor | |
| US5317922A (en) | Capacitance transducer article and method of fabrication | |
| JPH0583854B2 (en) | ||
| JPS5846059B2 (en) | semiconductor equipment | |
| JP2008527313A (en) | Force measuring device, in particular pressure gauge and associated manufacturing method | |
| JPH07122599B2 (en) | Weight sensor element | |
| EP0855584B1 (en) | Method for making a pressure transducer | |
| JPS61181103A (en) | Platinum temperature measuring resistor | |
| JPH10208906A (en) | Temperature sensor | |
| GB2304903A (en) | An electromechanical sensor device and a method of manufacturing it | |
| JP3061249B2 (en) | Capacitive pressure sensor and method of manufacturing the same | |
| JPH05231975A (en) | Electrostatic capacitive pressure sensor | |
| WO2021126261A1 (en) | Strain gages and methods for manufacturing thereof | |
| JPH081400B2 (en) | Weight sensor element | |
| JPS6325512B2 (en) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071225 Year of fee payment: 12 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081225 Year of fee payment: 13 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091225 Year of fee payment: 14 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091225 Year of fee payment: 14 |