JPH0712698B2 - Thermal print head device - Google Patents
Thermal print head deviceInfo
- Publication number
- JPH0712698B2 JPH0712698B2 JP23687485A JP23687485A JPH0712698B2 JP H0712698 B2 JPH0712698 B2 JP H0712698B2 JP 23687485 A JP23687485 A JP 23687485A JP 23687485 A JP23687485 A JP 23687485A JP H0712698 B2 JPH0712698 B2 JP H0712698B2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- heat generating
- leads
- head
- common
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000004020 conductor Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/345—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads characterised by the arrangement of resistors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Electronic Switches (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） この発明はサーマルプリントヘッド装置に関する。TECHNICAL FIELD The present invention relates to a thermal print head device.
（従来の技術） 周知のようにこの種サーマルプリントヘッド装置は、セ
ラミック製の基板の表面に設けられた発熱部と、これか
ら導出されてあるリードとよりなるヘッドと、フレキシ
ブルプリント配線板（以下単にFP配線板）とによって構
成される。そしてヘッドのリードをFP配線板のリードと
を接続することによって、前記リードを外部に導出する
ようにしている。(Prior Art) As is well known, a thermal print head device of this type includes a heating portion provided on a surface of a ceramic substrate, a head including leads extending from the heating portion, and a flexible printed wiring board (hereinafter, simply referred to as a head). FP wiring board) and. Then, by connecting the lead of the head to the lead of the FP wiring board, the lead is led to the outside.
第４図は一般のこの種ヘッドを示し、１はセラミックな
どからなる基板、２はその表面に設けられた発熱部で、
図では例として６箇の発熱部を備えたものを示してい
る。３は各発熱部２の一方の端部に接続されてある個別
リード、４は他方の各端部に共通に接続されてある統一
共通リードである。５はFP配線板で、その樹脂製のベー
ス６の一方の面に、前記各個別リード３に接続される個
別リード７と、統一共通リード４に接続される統一共通
リード８とを備えている。FIG. 4 shows a general head of this type, 1 is a substrate made of ceramic or the like, 2 is a heat generating portion provided on the surface thereof,
In the figure, as an example, one having six heat generating parts is shown. Reference numeral 3 is an individual lead connected to one end of each heat generating portion 2, and 4 is a unified common lead commonly connected to each of the other ends. Reference numeral 5 denotes an FP wiring board, which has an individual lead 7 connected to each of the individual leads 3 and an integrated common lead 8 connected to the integrated common lead 4 on one surface of a resin base 6. .
実際にはヘッド１上のリードとFP配線板５上のリードと
は互いに重ね合せてから、半田によって接続されるのが
一般的である。そのためにFP配線板５にはヘッド１の表
面と向い合う面、すなわち図では裏側の面に各リード7,
8が現れるようにし、これをそのままヘッド１の表面に
重ね合わすようにしている。In practice, the leads on the head 1 and the leads on the FP wiring board 5 are generally superposed on each other and then connected by soldering. Therefore, the FP wiring board 5 has the leads 7, 7 on the surface facing the surface of the head 1, that is, the back surface in the figure.
8 is made to appear, and this is directly laminated on the surface of the head 1.
ところでこのような構成は発熱部２の列がヘッド１のほ
ぼ中央あるいは端部からある程度離れたところに設置さ
れてあって、その列の一方の側に統一共通リード４が設
置できる余裕のある空間が存在しているときに限って製
作できる。しかしヘッドの種類によっては発熱部をヘッ
ドの一方の側縁に近接して設置することが要求されるこ
とがある。このような場合は発熱部の列の一方の側とヘ
ッドの側縁との間の空間が狭くなりすぎてしまい、そこ
に前記したような統一共通リードを設置することができ
ないようになる。By the way, in such a structure, the row of the heat generating portions 2 is installed at a position apart from the center or the end of the head 1 to some extent, and there is a space in which the unified common lead 4 can be installed on one side of the row. Can be made only when is present. However, depending on the type of the head, it may be required to install the heat generating portion close to one side edge of the head. In such a case, the space between one side of the row of heat generating portions and the side edge of the head becomes too narrow, and it becomes impossible to install the unified common lead as described above.
これを解決しようとしたのが第５図に示す構成である。
これは各発熱部の２箇を１群としその各群に属する２個
の発熱部2A,2Bの一方の端部を短絡導体９によって短絡
しておき、またひとつの群のひとつの発熱部2Aと、これ
に隣接する他の群に属する他のひとつの発熱部2Bとに共
通する共通リード10を設けたものである。The structure shown in FIG. 5 is intended to solve this problem.
This is because two heat generating parts are set as one group and one end of two heat generating parts 2A and 2B belonging to each group is short-circuited by a short-circuit conductor 9 and one heat generating part 2A of one group is also formed. And a common lead 10 that is common to the other heat generating portion 2B belonging to another group adjacent thereto.
これによれば発熱部の列の一方の側とヘッドの側縁との
間には、幅が狭くてよい短絡導体９を設置するだけの空
間が確保されるだけでよいので、発熱部をヘッドの側縁
に可及的に近接して設置できるようになって都合がよ
い。なおこの構成ではひとつの個別リードとこれに隣合
う共通リードとの間に電圧を印加すれば、両リード間に
ある２箇の発熱部が同時に発熱するようになっている。According to this, a space for installing the short-circuit conductor 9, which may have a small width, may be secured between one side of the row of heat generating parts and the side edge of the head. This is convenient because it can be installed as close as possible to the side edge of the. In this configuration, if a voltage is applied between one individual lead and the common lead adjacent to the individual lead, the two heat generating portions between both leads generate heat at the same time.
しかしこのような構成のヘッドに連なるFP配線板のリー
ドは、ヘッドのリードパターンと合致させなければなら
ない。そのためFP配線板の共通リードは個別リードの間
に点在するようになり、第４図に示すようにすべてを一
括したものにはならない。したがってこのFP配線板に接
続される他の回路との接続作業が極めて煩雑となる。However, the leads of the FP wiring board connected to the head having such a structure must be matched with the lead pattern of the head. Therefore, the common leads of the FP wiring board are scattered between the individual leads, and not all are integrated as shown in FIG. Therefore, the connection work with other circuits connected to this FP wiring board becomes extremely complicated.
（発明が解決しようとする問題点） この発明は発熱部の列をヘッドの側縁に接近して設置し
ても、FP配線板では全ての共通リードを統一して一括す
ることを目的とする。(Problems to be Solved by the Invention) An object of the present invention is to unify and integrate all common leads in an FP wiring board even if a row of heat generating parts is installed close to a side edge of a head. .
（問題点を解決するための手段） この発明はFP配線板として、その一方の面にヘッドの個
別リードおよび共通リードのそれぞれに接続される個別
リードおよび共通リードと、この個別リードの群の少な
くとも一方の側に並設される統一共通リードとを、また
他方の面には前記統一共通リードに電気的に接続されて
ある接続リードとを設け、このFP配線板をヘッドに重ね
てそれぞれの個別リードと、それぞれの共通リードとを
互いに接続するとともに、FP配線板の各共通リードを前
記接続リードに電気的に接続したことを特徴とする。(Means for Solving Problems) The present invention provides an FP wiring board, on one surface of which at least an individual lead and a common lead connected to an individual lead and a common lead of a head, and at least a group of the individual leads. A unified common lead arranged side by side on one side and a connection lead electrically connected to the unified common lead on the other surface are provided, and the FP wiring board is overlaid on the head to separate the individual leads. The lead and each common lead are connected to each other, and each common lead of the FP wiring board is electrically connected to the connection lead.
（実施例） この発明の実施例を第１図乃至第３図によって説明す
る。ここに使用するヘッドは第５図に示したものと同じ
で、これに図のようなFP配線板５を使用する。このFP配
線板５はリードがその表裏両面に設けてある２層構造と
されてある。(Embodiment) An embodiment of the present invention will be described with reference to FIGS. The head used here is the same as that shown in FIG. 5, and the FP wiring board 5 as shown is used for this. The FP wiring board 5 has a two-layer structure in which leads are provided on both front and back surfaces thereof.
すなわち一方の面にはヘッド１の個別リード３に接続さ
れる個別リード７と、共通リード10に接続される共通リ
ード11と、前記個別リード７の群の少なくとも一方の側
に並設される統一共通リード12とが設けられてある。ま
た他方の面には前記統一共通リード12に電気的にたとえ
ばスルーホール13によって接続されてある接続リード14
が設けてある。That is, on one surface, the individual lead 7 connected to the individual lead 3 of the head 1, the common lead 11 connected to the common lead 10, and the unified lead arranged in parallel on at least one side of the group of the individual leads 7 A common lead 12 is provided. On the other surface, a connection lead 14 electrically connected to the unified common lead 12 by, for example, a through hole 13.
Is provided.
そしてこのFP配線板５をヘッド１に重ねて両個別リード
3,7と、両共通リード10,11とを互いに接続するととも
に、FP配線板５の統一共通リード12に電気的に接続され
てある接続リード14に、共通リード11を電気的にたとえ
ばスルーホール15によって接続されてある。Then, the FP wiring board 5 is placed on the head 1 and both individual leads are formed.
3, 7 and both common leads 10, 11 are connected to each other, and the common lead 11 is electrically connected to, for example, a through hole to the connection lead 14 electrically connected to the unified common lead 12 of the FP wiring board 5. Connected by 15.
なお図では統一共通リード12は個別リード７の群の一方
の側にのみ設けているが、これに代えて両側に設けるよ
うにしてもよい。またリード7,11はリード3,10に接する
ことができるようにベース６の端部から露出しておく必
要があるが、統一共通リード12はヘッド１の各リードに
接することのないようにするために、絶縁性のカバーレ
イ16で覆っておくとよい。なおリード14もカバーレイ16
で覆っておく。Although the unified common lead 12 is provided only on one side of the group of individual leads 7 in the drawing, it may be provided on both sides instead of this. Further, the leads 7 and 11 need to be exposed from the ends of the base 6 so as to be able to come into contact with the leads 3 and 10, but the unified common lead 12 should not come into contact with each lead of the head 1. Therefore, it is preferable to cover it with an insulating cover lay 16. The lead 14 is also a coverlay 16
Cover with.
以上の構成において、ヘッド１の端部にFP配線板５の端
部を重ねて、リード3,7同志およびリード10,11同志を互
いに接触させて半田などにより接続する。そして共通リ
ード11、統一共通リード12に接続リード14をスルーホー
ル13,15によって電気的に接続する。In the above configuration, the end of the FP wiring board 5 is overlapped with the end of the head 1, and the leads 3 and 7 and the leads 10 and 11 are brought into contact with each other and connected by soldering or the like. Then, the connection lead 14 is electrically connected to the common lead 11 and the unified common lead 12 through the through holes 13 and 15.
このようにすれば、ヘッド１の表面において個別リード
３、共通リード10が入り乱れて存在していても、共通リ
ード10はFP配線板５の共通リード11および接続リード14
を介して統一共通リード12に一括接続されるようにな
る。したがってFP配線板としては第４図に示したと同様
に、個別リードの一括された群と、その一方の側に並設
される統一共通リードとによって構成することができる
ようになる。By doing so, even if the individual leads 3 and the common leads 10 are present on the surface of the head 1 in a disordered manner, the common leads 10 can be the common leads 11 and the connection leads 14 of the FP wiring board 5.
It will be collectively connected to the unified common lead 12 via. Therefore, as shown in FIG. 4, the FP wiring board can be constituted by a group of individual leads and a unified common lead arranged in parallel on one side thereof.
（発明の効果） 以上詳述したようにこの発明によれば、発熱部の列をヘ
ッドの側縁に接近して設置しても、FP配線板では全ての
共通リードを統一して一括することができるとともに、
統一共通リードを個別リードの群のいずれかの側に並設
することができるといった効果を奏する。(Effects of the Invention) As described in detail above, according to the present invention, it is possible to unify all common leads in the FP wiring board even if the row of the heat generating portion is installed close to the side edge of the head. As well as
It is possible to arrange the unified common lead side by side on either side of the group of individual leads.
第１図はこの発明の実施例を示す平面図、第２図は同正
面図、第３図は同断面図、第４図は従来例の平面図、第
５図はヘッドの平面図である。 １……ヘッド、2A,2B……発熱部、３……個別リード、
５……FP配線板、７……個別リード、９……短絡導体、
10……共通リード、１……共通リード、12……統一共通
リード、14……接続リード、1 is a plan view showing an embodiment of the present invention, FIG. 2 is a front view thereof, FIG. 3 is a cross-sectional view thereof, FIG. 4 is a plan view of a conventional example, and FIG. 5 is a plan view of a head. . 1 ... Head, 2A, 2B ... Heating part, 3 ... Individual lead,
5 ... FP wiring board, 7 ... individual lead, 9 ... short-circuit conductor,
10 …… Common lead, 1 …… Common lead, 12 …… Unified common lead, 14 …… Connection lead,
Claims (1)
の複数の発熱部につき、隣合う２個の第１および第２の
発熱部をもって１群とする複数の群に分ち、前記各群に
属する前記第１および第２の発熱部の各一方の端部を短
絡導体によって短絡し、また前記複数の群のうちのひと
つの群に属する第２の発熱部の他方の端部と、前記ひと
つの群に隣合う他の群に属し、かつ前記ひとつの群に属
している第２の発熱部と隣合っている第１の発熱部の他
方の端部とに共通する共通リードを設け、前記ひとつの
群に属する第１の発熱部の他方の端部と、前記ひとつの
群に隣合う他の群の第２の発熱部の他方の端部とにそれ
ぞれ個別リードを設けてなり、 またフレキシブルプリント配線板の一方の面には、前記
ヘッドの共通リードならびに個別リードに接続される共
通リードならびに個別リードと、この個別リードの群の
少なくとも一方の側に並設される統一共通リードとを設
け、また他方の面には前記統一共通リードに電気的に接
続されてある接続リードを設け、前記フレキシブルプリ
ント配線板を前記ヘッドに重ね合せて、前記ヘッドと前
記フレキシブルプリント配線板の各個別リードと、各共
通リードとを互いに接続するとともに、前記フレキシブ
ルプリント配線板の各共通リードを前記接続リードに電
気的に接続してなるサーマルプリントヘッド装置。1. A plurality of heat generating parts for printing provided on the surface of a head are divided into a plurality of groups each having two adjacent first and second heat generating parts, and each of the groups is divided into groups. One end of each of the first and second heat generating parts belonging to the above is short-circuited by a short-circuit conductor, and the other end of the second heat generating part belonging to one of the plurality of groups, and A common lead that belongs to another group adjacent to one group and that is common to the other end of the first heat generating section that is adjacent to the second heat generating section that belongs to the one group, Individual leads are provided on the other end of the first heat generating portion belonging to the one group and on the other end of the second heat generating portion of the other group adjacent to the one group, respectively. On one side of the flexible printed wiring board, the common lead of the head and the individual lead A common lead and individual leads to be connected and a unified common lead arranged side by side on at least one side of the group of individual leads are provided, and the other surface is electrically connected to the unified common lead. Connection leads are provided, the flexible printed wiring board is overlaid on the head, the individual leads of the head and the flexible printed wiring board, and the common leads are connected to each other, and the common of the flexible printed wiring board is provided. A thermal print head device comprising a lead electrically connected to the connection lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23687485A JPH0712698B2 (en) | 1985-10-22 | 1985-10-22 | Thermal print head device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23687485A JPH0712698B2 (en) | 1985-10-22 | 1985-10-22 | Thermal print head device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6295248A JPS6295248A (en) | 1987-05-01 |
| JPH0712698B2 true JPH0712698B2 (en) | 1995-02-15 |
Family
ID=17007068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23687485A Expired - Fee Related JPH0712698B2 (en) | 1985-10-22 | 1985-10-22 | Thermal print head device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0712698B2 (en) |
-
1985
- 1985-10-22 JP JP23687485A patent/JPH0712698B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6295248A (en) | 1987-05-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |