JPH07130609A - Method of changing dimension of plotting pattern - Google Patents

Abstract

(57) [Abstract] [Purpose] The drawing data of the drawing pattern 10 including the scribe line pattern portion SP and the main circuit pattern portion CP is not changed to CAD data, but the dimensions are changed at different scales. Obtaining drawing data of the drawing pattern 40. [Structure] An intermediate frame pattern 16 of an intermediate frame pattern between a scribe line pattern portion SP and a main circuit pattern portion CP is generated, and an AND processing and an ANDNOT processing of this and a drawing pattern 10 are performed, and the scribe line pattern portion SP and the main circuit pattern are formed. A method for obtaining drawing data of the size-changed drawing pattern 40 whose size has been changed at different scales by separating the part CP from each other, performing size change processing at different scales, and then synthesizing them.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for changing the size of a drawing pattern when drawing a pattern such as a photomask or reticle with an electron beam drawing apparatus, and more specifically to a photomask which has already been created. If the drawing pattern consists of a scribe line pattern part and a main circuit pattern part, the main circuit pattern part and / or
Alternatively, the present invention relates to a method for obtaining a drawing pattern having a changed size by changing the size of the scribe line pattern portion.

[0002]

2. Description of the Related Art Conventionally, an electron beam drawing apparatus is known, and it is known that such an electron beam drawing apparatus is used to draw a precise pattern such as a photomask or a reticle used for manufacturing a semiconductor integrated circuit. With such an electron beam drawing device, C
When drawing the AD data, the CAD data is converted into drawing data which is data of the electron beam drawing apparatus, and the obtained drawing data is drawn by the electron beam drawing apparatus. By the way, there are cases where a drawing pattern such as a photomask that has already been created is composed of a scribe line pattern portion and a main circuit pattern portion. The scribe line pattern is a target line for cutting a silicon wafer in order to cut individual integrated circuits formed on the silicon wafer in multiple directions. The main circuit pattern is a pattern that forms a circuit that actually operates electrically. The scribe line normally has a so-called cross-shaped shape in which a plurality of straight lines cross each other in the vertical and horizontal directions, and the main circuit pattern exists in an area surrounded by scribe lines. In recent years, the scribe line pattern and the main circuit pattern are often subjected to different dimension changing processes. For example, a process of reducing the size of the main circuit pattern is performed without changing the width of the scribe line pattern. The reason is that, for example, due to the progress of the wafer manufacturing process, it has become possible to form a line pattern having a narrower width than the conventional one on a silicon wafer, but it is troublesome to newly redesign the main circuit pattern. Since it is easy to induce a design error, the dimension change processing is performed on the drawing data of the conventional pattern. However, if the width of the scribe line is also made thin at the same time, it becomes difficult to cut the silicon wafer, and therefore the width of the scribe line is generally not changed. In the case of the above,
That is, without changing the width of the scribe line pattern,
In the case of reducing the size of the main circuit pattern, the conventional method converts the drawing data into CAD data and
While observing the CRT with the system, it is separated into a scribe line pattern part and a main circuit pattern part, and the main circuit pattern part is subjected to size change processing, and the scribe line pattern that does not change size and the size-changed main circuit pattern are OR-processed. The CAD data obtained was converted into drawing data. However, the above-described processing includes a conversion processing from drawing data to CAD data and an inverse conversion processing thereof, which is very complicated and takes a processing time.

[0003]

SUMMARY OF THE INVENTION According to the present invention, in the case where a drawing pattern such as a photomask which has already been formed is composed of a scribe line pattern portion and a main circuit pattern portion, the main circuit pattern portion and / or the scribe line pattern is formed. A method for obtaining a dimension-changed drawing pattern by subjecting a portion to a dimension change, in particular, processing the original drawing data to obtain the dimension-changed pattern drawing data, in other words, converting into CAD data,
The present invention relates to a drawing pattern dimension changing method that does not require reverse conversion.

[0004]

The present invention achieves the above object. In the first and second inventions, the dimensions of the scribe line pattern portion (SP) are the same, and the main circuit pattern portion (CP) is maintained. ) Is subjected to dimension change processing. In the first invention, the drawing is performed by changing the dimension from the drawing data of the drawing pattern (10) including the scribe line pattern part (SP) and the main circuit pattern part (CP). A method for changing the dimension of a drawing pattern for obtaining drawing data for changing the dimension of a drawing pattern, which is characterized in that the dimension changing drawing data is obtained from the drawing data by the following processing steps. Black-and-white reversal processing is performed on the drawing pattern (10), and the reversal drawing pattern (1
Black-and-white reversal processing step for obtaining 2). A plus resizing process for obtaining a plus resizing pattern (14) in which the contour of the reverse drawing pattern (12) is extended by performing a plus resizing process for extending the contour of the reverse drawing pattern (12). The plus resize pattern (14) is subjected to a minus resize process for reducing the contour of the pattern existing portion,
A minus resizing process step of obtaining an intermediate frame pattern (16) of a frame pattern between the scribe line pattern portion (SP) and the main circuit pattern portion (CP). An AND processing step of obtaining the main circuit pattern (20) of the pattern of the main circuit pattern portion (CP) by the AND processing of the drawing pattern (10) and the intermediate frame pattern (16). Dimension change processing is performed on the main circuit pattern (20) to obtain a dimension-changed main circuit pattern (22) of the pattern in which the dimension of the main circuit pattern portion (CP) is changed.
Dimension change process. ANDNOT processing is performed on the drawing pattern (10) and the intermediate frame pattern (16) to create a scribe line pattern (3) of the scribe line pattern portion (SP).
ANDNOT processing step of obtaining 0). Dimension change The main circuit pattern (22) and the scribe line pattern (30) are OR-processed, and the dimension of the main circuit pattern section (CP) is changed while the dimension of the scribe line pattern section (SP) remains unchanged. An OR processing step for obtaining a drawing pattern (40). It is what

According to the second aspect of the invention, the drawing data of the drawing pattern whose size is changed from the drawing data of the drawing pattern (10) including the scribe line pattern portion (SP) and the main circuit pattern portion (CP). In the drawing pattern dimension changing method,
A drawing pattern size changing method characterized by obtaining size change drawing data by the following processing steps. Black-and-white reversal processing is performed on the drawing pattern (10), and the reversal drawing pattern (1
Black-and-white reversal processing step for obtaining 2). A plus resizing process for obtaining a plus resizing pattern (14) in which the contour of the reverse drawing pattern (12) is extended by performing a plus resizing process for extending the contour of the reverse drawing pattern (12). Here, when the amount of expansion of the contour of the pattern is X, X ≧ + MAX (C1 / 2, C2 / 2) plus resizing The minus resizing process for reducing the contour of the existing portion of the pattern (14) is performed,
A minus resizing process step of obtaining an intermediate frame pattern (16) of a frame pattern between the scribe line pattern portion (SP) and the main circuit pattern portion (CP). Here, when the amount of reducing the contour of the pattern is Y,-[X + MIN {(B1-C1) / 2, (B2-C2
) / 2}] ≦ Y ≦ −X An AND processing step of obtaining the main circuit pattern (20) of the pattern of the main circuit pattern portion (CP) by the AND processing of the drawing pattern (10) and the intermediate frame pattern (16). Dimension change processing is performed on the main circuit pattern (20) to obtain a dimension-changed main circuit pattern (22) of the pattern in which the dimension of the main circuit pattern portion (CP) is changed.
Dimension change process. ANDNOT processing is performed on the drawing pattern (10) and the intermediate frame pattern (16) to create a scribe line pattern (3) of the scribe line pattern portion (SP).
ANDNOT processing step of obtaining 0). Dimension change The main circuit pattern (22) and the scribe line pattern (30) are OR-processed, and the dimension of the main circuit pattern section (CP) is changed while the dimension of the scribe line pattern section (SP) remains unchanged. An OR processing step for obtaining a drawing pattern (40). It is what

In the third and fourth inventions, the dimensions of the scribe line pattern portion (SP) and the main circuit pattern portion (CP) are subjected to a dimension changing process. In the third invention, the scribe line pattern portion ( Drawing pattern (10) including SP) and main circuit pattern portion (CP)
In the drawing pattern dimension changing method for obtaining the size-changed drawing data of the drawing pattern whose size has been changed, the drawing pattern characterized by obtaining the size-changed drawing data from the drawing data by the following processing steps How to change dimensions. Black-and-white reversal processing is performed on the drawing pattern (10), and the reversal drawing pattern (1
Black-and-white reversal processing step for obtaining 2). A plus resizing process for obtaining a plus resizing pattern (14) in which the contour of the reverse drawing pattern (12) is extended by performing a plus resizing process for extending the contour of the reverse drawing pattern (12). The plus resize pattern (14) is subjected to a minus resize process for reducing the contour of the pattern existing portion,
A minus resizing process step of obtaining an intermediate frame pattern (16) of a frame pattern between the scribe line pattern portion (SP) and the main circuit pattern portion (CP). An AND processing step of obtaining the main circuit pattern (20) of the pattern of the main circuit pattern portion (CP) by the AND processing of the drawing pattern (10) and the intermediate frame pattern (16). Dimension change processing is performed on the main circuit pattern (20) to obtain a dimension-changed main circuit pattern (22) of the pattern in which the dimension of the main circuit pattern portion (CP) is changed.
Dimension change process. ANDNOT processing is performed on the drawing pattern (10) and the intermediate frame pattern (16) to create a scribe line pattern (3) of the scribe line pattern portion (SP).
ANDNOT processing step of obtaining 0). The scribe line pattern (30) is subjected to a size change process to change the size of the scribe line pattern (30) whose size has been changed.
To obtain the scribe line pattern dimension change processing step. The dimension change main circuit pattern (22) and the dimension change scribe line pattern (32) are OR-processed to change the dimension of the scribe line pattern portion (SP) and the main circuit pattern portion (CP). OR processing step for obtaining (40). It is what

According to the fourth aspect of the invention, the drawing data of the drawing pattern whose size is changed from the drawing data of the drawing pattern (10) including the scribe line pattern portion (SP) and the main circuit pattern portion (CP) is used. In the drawing pattern dimension changing method,
A drawing pattern size changing method characterized by obtaining size change drawing data by the following processing steps. Black-and-white reversal processing is performed on the drawing pattern (10), and the reversal drawing pattern (1
Black-and-white reversal processing step for obtaining 2). A plus resizing process for obtaining a plus resizing pattern (14) in which the contour of the reverse drawing pattern (12) is extended by performing a plus resizing process for extending the contour of the reverse drawing pattern (12). Here, when the amount of expansion of the contour of the pattern is X, X ≧ + MAX (C1 / 2, C2 / 2) plus resizing The minus resizing process for reducing the contour of the existing portion of the pattern (14) is performed,
A minus resizing process step of obtaining an intermediate frame pattern (16) of a frame pattern between the scribe line pattern portion (SP) and the main circuit pattern portion (CP). Here, when the amount of reducing the contour of the pattern is Y,-[X + MIN {(B1-C1) / 2, (B2-C2
) / 2}] ≦ Y ≦ −X An AND processing step of obtaining the main circuit pattern (20) of the pattern of the main circuit pattern portion (CP) by the AND processing of the drawing pattern (10) and the intermediate frame pattern (16). Dimension change processing is performed on the main circuit pattern (20) to obtain a dimension-changed main circuit pattern (22) of the pattern in which the dimension of the main circuit pattern portion (CP) is changed.
Dimension change process. ANDNOT processing is performed on the drawing pattern (10) and the intermediate frame pattern (16) to create a scribe line pattern (3) of the scribe line pattern portion (SP).
ANDNOT processing step of obtaining 0). The scribe line pattern (30) is subjected to a size change process to change the size of the scribe line pattern (30) whose size has been changed.
To obtain the scribe line pattern dimension change processing step. The dimension change main circuit pattern (22) and the dimension change scribe line pattern (32) are OR-processed to change the dimension of the scribe line pattern portion (SP) and the main circuit pattern portion (CP). OR processing step for obtaining (40).

In the fifth and sixth aspects of the present invention, the scribe line pattern portion (SP) is subjected to a dimension processing, and the main circuit pattern portion (CP) is left as it is.
In the fifth invention, the scribe line pattern portion (SP)
In the drawing pattern dimension changing method for obtaining the dimension change drawing data of the drawing pattern having the changed size from the drawing data of the drawing pattern (10) including the main circuit pattern portion (CP), the following processing is performed from the drawing data. A drawing pattern dimension changing method characterized by obtaining dimension change drawing data depending on the process. Black-and-white reversal processing is performed on the drawing pattern (10), and the reversal drawing pattern (1
Black-and-white reversal processing step for obtaining 2). A plus resizing process for obtaining a plus resizing pattern (14) in which the contour of the reverse drawing pattern (12) is extended by performing a plus resizing process for extending the contour of the reverse drawing pattern (12). The plus resize pattern (14) is subjected to a minus resize process for reducing the contour of the pattern existing portion,
A minus resizing process step of obtaining an intermediate frame pattern (16) of a frame pattern between the scribe line pattern portion (SP) and the main circuit pattern portion (CP). An AND processing step of obtaining the main circuit pattern (20) of the pattern of the main circuit pattern portion (CP) by the AND processing of the drawing pattern (10) and the intermediate frame pattern (16). ANDNOT processing is performed on the drawing pattern (10) and the intermediate frame pattern (16) to create a scribe line pattern (3) of the scribe line pattern portion (SP).
ANDNOT processing step of obtaining 0). The scribe line pattern (30) is subjected to a size change process to change the size of the scribe line pattern (30) whose size has been changed.
To obtain the scribe line pattern dimension change processing step. The main circuit pattern (20) and the dimension change scribe line pattern (32) are OR-processed to change the dimension of the scribe line pattern portion (SP) and leave the dimension of the main circuit pattern portion (CP) unchanged. OR process to obtain pattern (40). It is what

According to the sixth aspect of the invention, the drawing data of the drawing pattern (10) including the scribe line pattern portion (SP) and the main circuit pattern portion (CP) is changed in size from the drawing data of the drawing pattern. In the drawing pattern dimension changing method,
A drawing pattern size changing method characterized by obtaining size change drawing data by the following processing steps. Black-and-white reversal processing is performed on the drawing pattern (10), and the reversal drawing pattern (1
Black-and-white reversal processing step for obtaining 2). A plus resizing process for obtaining a plus resizing pattern (14) in which the contour of the reverse drawing pattern (12) is extended by performing a plus resizing process for extending the contour of the reverse drawing pattern (12). Here, when the amount of expansion of the contour of the pattern is X, X ≧ + MAX (C1 / 2, C2 / 2) plus resizing The minus resizing process for reducing the contour of the existing portion of the pattern (14) is performed,
A minus resizing process step of obtaining an intermediate frame pattern (16) of a frame pattern between the scribe line pattern portion (SP) and the main circuit pattern portion (CP). Here, when the amount of reducing the contour of the pattern is Y,-[X + MIN {(B1-C1) / 2, (B2-C2
) / 2}] ≦ Y ≦ −X An AND processing step of obtaining the main circuit pattern (20) of the pattern of the main circuit pattern portion (CP) by the AND processing of the drawing pattern (10) and the intermediate frame pattern (16). ANDNOT processing is performed on the drawing pattern (10) and the intermediate frame pattern (16) to create a scribe line pattern (3) of the scribe line pattern portion (SP).
ANDNOT processing step of obtaining 0). The scribe line pattern (30) is subjected to a size change process to change the size of the scribe line pattern (30) whose size has been changed.
To obtain the scribe line pattern dimension change processing step. The main circuit pattern (20) and the dimension change scribe line pattern (32) are OR-processed to change the dimension of the scribe line pattern portion (SP) and leave the dimension of the main circuit pattern portion (CP) unchanged. OR process to obtain pattern (40). It is what

[0010]

In the present invention, when changing the size of the pattern of the drawing data of the electron beam drawing apparatus for the pattern of the photomask created in advance, all the processing steps of the present invention can be processed with the drawing data as it is. Therefore, it is not necessary to convert the data into CAD data, perform the size change processing, and then reversely convert into the drawing data.

[0011]

The present invention will be described in detail with reference to the following examples.
(See FIGS. 1 and 2) This embodiment shows an embodiment in which the dimension change drawing data of the drawing pattern in which both the dimensions of the scribe line pattern portion and the dimensions of the main circuit pattern portion are changed is obtained. The drawing pattern (10) already created includes a scribe line pattern portion (SP) and a main circuit pattern portion (CP). This drawing pattern (1
The following image processing is sequentially applied to the drawing data of 0). First, the drawing pattern (10) is subjected to black-and-white reversal processing so that the reversed drawing pattern (1
2) is obtained. Next, the obtained reverse drawing pattern (12)
Then, a plus resizing process for expanding the contour of the pattern is performed to obtain a plus resizing pattern (14) in which the contour of the reverse drawing pattern (12) is expanded. Here, when the amount of expansion of the contour of the pattern is X, X ≧ + MAX (C1 / 2, C2 / 2) MAX (C1 / 2, C2 / 2) is C1 / 2, C2 /
It is the larger value of two. Drawing pattern (1
0) is a pattern already created, so C1, C2
Is a known value, and therefore the amount X of expansion of the contour of the pattern can be appropriately determined. Next, the plus resizing pattern (14) obtained as described above is subjected to a minus resizing process for reducing the contour of the existing portion of the pattern, so that the middle of the scribe line pattern portion (SP) and the main circuit pattern portion (CP) is obtained. An intermediate frame pattern (16) of the frame pattern of is obtained. Here, when the amount of reducing the contour of the pattern is Y,-[X + MIN {(B1-C1) / 2, (B2-C2
) / 2}] ≤Y≤-X MIN [(B1-C1) / 2, (B2-C2) / 2]
Is the smaller of (B1 -C1) / 2 and (B2 -C2) / 2. Since the drawing pattern (10) is a pattern that has already been created, B1, C1, B2, C2
, Is a known value, and therefore the amount Y of reducing the contour of the pattern can be appropriately determined. In the frame pattern of the intermediate frame pattern (16), the frame line is located between the scribe line pattern portion (SP) and the main circuit pattern portion (CP) by the processing steps as described above.

Then, the main circuit pattern (20) of the pattern of the main circuit pattern portion (CP) is obtained by ANDing the drawing pattern (10) and the intermediate frame pattern (16) obtained as described above. . Next, the main circuit pattern (20) is subjected to a size reduction process of a desired scale to obtain a size-changed main circuit pattern (22) of the pattern in which the size of the main circuit pattern portion (CP) is changed.

Then, ANDNO is applied to the drawing pattern (10) and the intermediate frame pattern (16) obtained as described above.
T processing [drawing pattern (10) and intermediate frame pattern (1
AND processing with the NOT pattern of 6)] is performed to obtain a scribe line pattern (30) of the scribe line pattern portion (SP). Next, the scribe line pattern (30) is subjected to size change processing of a desired scale to change the size of the scribe line pattern (30) whose size has been changed.
To get

Next, the dimension change main circuit pattern (2
2) and the dimension change scribe line pattern (32) are OR-processed to obtain the dimension change drawing pattern (40) of the pattern whose dimension is changed in both the scribe line pattern portion (SP) and the main circuit pattern portion (CP). obtain.

In the above-mentioned embodiment, the dimension change drawing data of the drawing pattern in which both the size of the scribe line pattern part and the size of the main circuit pattern part are changed is obtained, but the size of the scribe line pattern part is obtained. Alternatively, when only one of the dimensions of the main circuit pattern portion is changed, the final OR processing may be performed for each pattern whose dimension is not changed.

[0016]

Since the present invention is constructed as described above,
It has excellent practical effects as shown below. That is, according to the present invention, when a drawing pattern such as a photomask that has already been formed is composed of a scribe line pattern portion and a main circuit pattern portion, the main circuit pattern portion and / or the scribe line pattern portion are dimensionally changed. If you want to obtain a drawing pattern with a changed size, use CAD
It is not necessary to convert the data into data and vice versa, and it is possible to obtain the drawing data of the dimension-changed pattern by processing the drawing data. Therefore, it is possible to obtain drawing data of a pattern whose size has been changed in a short time, and it is not necessary to use an expensive CAD system, and further, processing can be performed without error.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a processing step, showing an embodiment of the present invention.

FIG. 2 is a flowchart of the same embodiment of the present invention.

[Explanation of symbols]

 Scribe line pattern ・ ・ ・ SP main circuit pattern ‥ CP drawing pattern ‥ 10 Reverse drawing pattern ‥ 12 Plus resizing pattern ‥ 14 Middle frame pattern ‥ 16 Main circuit pattern ‥ 20 Dimension change main circuit pattern ‥‥ 22 Scribe line pattern ・ ・ ・ 30 Dimension change scribe line pattern ・ ・ ・ 32 Dimension change drawing pattern ・ ・ ・ 40

Claims (6)

[Claims] 1. A drawing pattern (1) including a scribe line pattern portion (SP) and a main circuit pattern portion (CP).
In the drawing pattern size changing method for obtaining the size change drawing data of the drawing pattern whose size has been changed from the drawing data of 0), the drawing data is changed from the drawing data by the following process steps.
Dimension change Method for changing the dimension of a drawing pattern, which is characterized by obtaining drawing data. A black-and-white reversal processing step of performing black-and-white reversal processing on the drawing pattern (10) to obtain a reversal drawing pattern (12) of the reversed drawing pattern (10). A plus resizing process for obtaining a plus resizing pattern (14) in which the contour of the reverse drawing pattern (12) is extended by performing a plus resizing process for extending the contour of the reverse drawing pattern (12). The plus resize pattern (14) is subjected to a minus resize process for reducing the contour of the pattern existing portion,
A minus resizing process step of obtaining an intermediate frame pattern (16) of a frame pattern between the scribe line pattern portion (SP) and the main circuit pattern portion (CP). An AND processing step of obtaining the main circuit pattern (20) of the pattern of the main circuit pattern portion (CP) by the AND processing of the drawing pattern (10) and the intermediate frame pattern (16). Dimension change processing is performed on the main circuit pattern (20) to obtain a dimension-changed main circuit pattern (22) of the pattern in which the dimension of the main circuit pattern portion (CP) is changed.
Dimension change process. ANDNOT processing is performed on the drawing pattern (10) and the intermediate frame pattern (16) to create a scribe line pattern (3) of the scribe line pattern portion (SP).
ANDNOT processing step of obtaining 0). Dimension change The main circuit pattern (22) and the scribe line pattern (30) are OR-processed, and the dimension of the main circuit pattern section (CP) is changed while the dimension of the scribe line pattern section (SP) remains unchanged. An OR processing step for obtaining a drawing pattern (40). 2. A drawing pattern (1) including a scribe line pattern portion (SP) and a main circuit pattern portion (CP).
In the drawing pattern size changing method for obtaining the size change drawing data of the drawing pattern whose size has been changed from the drawing data of 0), the drawing data is changed from the drawing data by the following process steps.
Dimension change Method for changing the dimension of a drawing pattern, which is characterized by obtaining drawing data. Black-and-white reversal processing is performed on the drawing pattern (10), and the reversal drawing pattern (1
Black-and-white reversal processing step for obtaining 2). A plus resizing process for obtaining a plus resizing pattern (14) in which the contour of the reverse drawing pattern (12) is extended by performing a plus resizing process for extending the contour of the reverse drawing pattern (12). Here, when the amount of expansion of the contour of the pattern is X, X ≧ + MAX (C1 / 2, C2 / 2) plus resizing The minus resizing process for reducing the contour of the existing portion of the pattern (14) is performed,
A minus resizing process step of obtaining an intermediate frame pattern (16) of a frame pattern between the scribe line pattern portion (SP) and the main circuit pattern portion (CP). Here, when the amount of reducing the contour of the pattern is Y,-[X + MIN {(B1-C1) / 2, (B2-C2
) / 2}] ≦ Y ≦ −X An AND processing step of obtaining the main circuit pattern (20) of the pattern of the main circuit pattern portion (CP) by the AND processing of the drawing pattern (10) and the intermediate frame pattern (16). Dimension change processing is performed on the main circuit pattern (20) to obtain a dimension-changed main circuit pattern (22) of the pattern in which the dimension of the main circuit pattern portion (CP) is changed.
Dimension change process. ANDNOT processing is performed on the drawing pattern (10) and the intermediate frame pattern (16) to create a scribe line pattern (3) of the scribe line pattern portion (SP).
ANDNOT processing step of obtaining 0). Dimension change The main circuit pattern (22) and the scribe line pattern (30) are OR-processed, and the dimension of the main circuit pattern section (CP) is changed while the dimension of the scribe line pattern section (SP) remains unchanged. An OR processing step for obtaining a drawing pattern (40). 3. A drawing pattern (1) including a scribe line pattern portion (SP) and a main circuit pattern portion (CP).
In the drawing pattern size changing method for obtaining the size change drawing data of the drawing pattern whose size has been changed from the drawing data of 0), the drawing data is changed from the drawing data by the following process steps.
Dimension change Method for changing the dimension of a drawing pattern, which is characterized by obtaining drawing data. Black-and-white reversal processing is performed on the drawing pattern (10), and the reversal drawing pattern (1
Black-and-white reversal processing step for obtaining 2). A plus resizing process for obtaining a plus resizing pattern (14) in which the contour of the reverse drawing pattern (12) is extended by performing a plus resizing process for extending the contour of the reverse drawing pattern (12). The plus resize pattern (14) is subjected to a minus resize process for reducing the contour of the pattern existing portion,
A minus resizing process step of obtaining an intermediate frame pattern (16) of a frame pattern between the scribe line pattern portion (SP) and the main circuit pattern portion (CP). An AND processing step of obtaining the main circuit pattern (20) of the pattern of the main circuit pattern portion (CP) by the AND processing of the drawing pattern (10) and the intermediate frame pattern (16). Dimension change processing is performed on the main circuit pattern (20) to obtain a dimension-changed main circuit pattern (22) of the pattern in which the dimension of the main circuit pattern portion (CP) is changed.
Dimension change process. ANDNOT processing is performed on the drawing pattern (10) and the intermediate frame pattern (16) to create a scribe line pattern (3) of the scribe line pattern portion (SP).
ANDNOT processing step of obtaining 0). The scribe line pattern (30) is subjected to a size change process to change the size of the scribe line pattern (30) whose size has been changed.
To obtain the scribe line pattern dimension change processing step. The dimension change main circuit pattern (22) and the dimension change scribe line pattern (32) are OR-processed to change the dimension of the scribe line pattern portion (SP) and the main circuit pattern portion (CP). OR processing step for obtaining (40). 4. A drawing pattern (1) including a scribe line pattern portion (SP) and a main circuit pattern portion (CP).
In the drawing pattern size changing method for obtaining the size change drawing data of the drawing pattern whose size has been changed from the drawing data of 0), the drawing data is changed from the drawing data by the following process steps.
Dimension change Method for changing the dimension of a drawing pattern, which is characterized by obtaining drawing data. Black-and-white reversal processing is performed on the drawing pattern (10), and the reversal drawing pattern (1
Black-and-white reversal processing step for obtaining 2). A plus resizing process for obtaining a plus resizing pattern (14) in which the contour of the reverse drawing pattern (12) is extended by performing a plus resizing process for extending the contour of the reverse drawing pattern (12). Here, when the amount of expansion of the contour of the pattern is X, X ≧ + MAX (C1 / 2, C2 / 2) plus resizing The minus resizing process for reducing the contour of the existing portion of the pattern (14) is performed,
A minus resizing process step of obtaining an intermediate frame pattern (16) of a frame pattern between the scribe line pattern portion (SP) and the main circuit pattern portion (CP). Here, when the amount of reducing the contour of the pattern is Y,-[X + MIN {(B1-C1) / 2, (B2-C2
) / 2}] ≦ Y ≦ −X An AND processing step of obtaining the main circuit pattern (20) of the pattern of the main circuit pattern portion (CP) by the AND processing of the drawing pattern (10) and the intermediate frame pattern (16). Dimension change processing is performed on the main circuit pattern (20) to obtain a dimension-changed main circuit pattern (22) of the pattern in which the dimension of the main circuit pattern portion (CP) is changed.
Dimension change process. ANDNOT processing is performed on the drawing pattern (10) and the intermediate frame pattern (16) to create a scribe line pattern (3) of the scribe line pattern portion (SP).
ANDNOT processing step of obtaining 0). The scribe line pattern (30) is subjected to a size change process to change the size of the scribe line pattern (30) whose size has been changed.
To obtain the scribe line pattern dimension change processing step. The dimension change main circuit pattern (22) and the dimension change scribe line pattern (32) are OR-processed to change the dimension of the scribe line pattern portion (SP) and the main circuit pattern portion (CP). OR processing step for obtaining (40). 5. A drawing pattern (1) including a scribe line pattern portion (SP) and a main circuit pattern portion (CP).
In the drawing pattern size changing method for obtaining the size change drawing data of the drawing pattern whose size has been changed from the drawing data of 0), the drawing data is changed from the drawing data by the following process steps.
Dimension change Method for changing the dimension of a drawing pattern, which is characterized by obtaining drawing data. Black-and-white reversal processing is performed on the drawing pattern (10), and the reversal drawing pattern (1
Black-and-white reversal processing step for obtaining 2). A plus resizing process for obtaining a plus resizing pattern (14) in which the contour of the reverse drawing pattern (12) is extended by performing a plus resizing process for extending the contour of the reverse drawing pattern (12). The plus resize pattern (14) is subjected to a minus resize process for reducing the contour of the pattern existing portion,
A minus resizing process step of obtaining an intermediate frame pattern (16) of a frame pattern between the scribe line pattern portion (SP) and the main circuit pattern portion (CP). An AND processing step of obtaining the main circuit pattern (20) of the pattern of the main circuit pattern portion (CP) by the AND processing of the drawing pattern (10) and the intermediate frame pattern (16). ANDNOT processing is performed on the drawing pattern (10) and the intermediate frame pattern (16) to create a scribe line pattern (3) of the scribe line pattern portion (SP).
ANDNOT processing step of obtaining 0). The scribe line pattern (30) is subjected to a size change process to change the size of the scribe line pattern (30) whose size has been changed.
To obtain the scribe line pattern dimension change processing step. The main circuit pattern (20) and the dimension change scribe line pattern (32) are OR-processed to change the dimension of the scribe line pattern portion (SP) and leave the dimension of the main circuit pattern portion (CP) unchanged. OR process to obtain pattern (40). 6. A drawing pattern (1) including a scribe line pattern portion (SP) and a main circuit pattern portion (CP).
In the drawing pattern size changing method for obtaining the size change drawing data of the drawing pattern whose size has been changed from the drawing data of 0), the drawing data is changed from the drawing data by the following process steps.
Dimension change Method for changing the dimension of a drawing pattern, which is characterized by obtaining drawing data. Black-and-white reversal processing is performed on the drawing pattern (10), and the reversal drawing pattern (1
Black-and-white reversal processing step for obtaining 2). A plus resizing process for obtaining a plus resizing pattern (14) in which the contour of the reverse drawing pattern (12) is extended by performing a plus resizing process for extending the contour of the reverse drawing pattern (12). Here, when the amount of expansion of the contour of the pattern is X, X ≧ + MAX (C1 / 2, C2 / 2) plus resizing The minus resizing process for reducing the contour of the existing portion of the pattern (14) is performed,
A minus resizing process step of obtaining an intermediate frame pattern (16) of a frame pattern between the scribe line pattern portion (SP) and the main circuit pattern portion (CP). Here, when the amount of reducing the contour of the pattern is Y,-[X + MIN {(B1-C1) / 2, (B2-C2
) / 2}] ≦ Y ≦ −X An AND processing step of obtaining the main circuit pattern (20) of the pattern of the main circuit pattern portion (CP) by the AND processing of the drawing pattern (10) and the intermediate frame pattern (16). ANDNOT processing is performed on the drawing pattern (10) and the intermediate frame pattern (16) to create a scribe line pattern (3) of the scribe line pattern portion (SP).
ANDNOT processing step of obtaining 0). The scribe line pattern (30) is subjected to a size change process to change the size of the scribe line pattern (30) whose size has been changed.
To obtain the scribe line pattern dimension change processing step. The main circuit pattern (20) and the dimension change scribe line pattern (32) are OR-processed to change the dimension of the scribe line pattern portion (SP) and leave the dimension of the main circuit pattern portion (CP) unchanged. OR process to obtain pattern (40).