JPH0716834B2 - Parts mounting method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method for picking up a component from a feeder supplying the component and mounting it on the substrate in an automatic assembly apparatus for mounting the component on the substrate. Is.

[Prior Art] Generally, when automatically mounting an electronic component on a substrate, the component is taken out from a feeder that supplies the component, and the component is carried to a predetermined position on the substrate for mounting (for example, (See Japanese Patent Publication No. 51-32865).

When the component is taken out from the feeder, the component is gripped and moved upward. As shown in FIG. 6 (b),
After being raised to a predetermined height that does not interfere with the feeder 2, the component 1 is placed on the substrate 3 by tracing a path P in which the component 1 is horizontally moved above the position where the component 1 is mounted on the substrate 3 and then moved downward. It is mounted at a predetermined position.

[Problems to be Solved by the Invention] In the above method, all the components 1 from the feeder 2 to the substrate 3 are conveyed by the same path P. Therefore, when components 1 having different heights are mounted on the substrate 3, in order to prevent the component 1 to be newly mounted from interfering with the component 1 already mounted on the substrate 3, it is mounted on the substrate 3. It is necessary to raise the component 1 to a position higher than the component 1 having the maximum height among the components 1. That is, even when the short component 1 is mounted, it is conveyed along the same path P as the tall component 1. Therefore, when the short component 1 is conveyed, the movement distance is wasted, resulting in an assembling time. The problem of becoming long occurs.

SUMMARY OF THE INVENTION The present invention is intended to solve the above problems, and an object of the present invention is to provide a component mounting method that reduces waste of movement distance and shortens assembly time.

[Means for Solving the Problems] In the present invention, in order to achieve the above object, in the process of transporting a component from above a feeder to above a component mounting position on a substrate, the component is moved horizontally above the component mounting position. In addition, a process of descending to a predetermined height position is provided, and the lower limit position at the time of descending is changed according to the height that does not interfere with the components already mounted on the board.

[Operation] According to the above configuration, in the moving process from the upper side of the feeder to the upper side of the board, the lower limit position of the descending height of the component is already mounted on the board, which was conventionally only horizontal movement. Since the height is changed according to the height that does not interfere with the components, the transportation route of the components is shortened and the assembly time is shortened.

[Embodiment] As shown in FIG. 1 and FIG. 6 (a), the component 1 is sucked and taken out from a feeder 2 which supplies the component 1 by a component transfer device (not shown), and a conveyor (not shown). The component transfer apparatus, which was used to mount the component 1 at a predetermined position on the substrate 3 placed on the substrate, is numerically controlled.

This component transfer device basically comprises a feeder 2 to a component 1
Is picked up and taken out, and the first step of moving upward to a predetermined height without interfering with the feeder 2, the second step of moving above the component mounting position on the board 3, and moving downward to place the component 1 on the board 3 It is provided with an operation process including a third process of mounting. If you divide it further, first, in the first process,
The component 1 is picked up and the feeder 2 rises to a height where it does not interfere (A). Next, in the second step, following the first step, the centering height is raised, and at the same time, the horizontal movement is performed (A → B). Here, since the component 1 has risen to a height where it does not interfere with the feeder 2 in the first process, the horizontal movement until reaching the centering section (B → C) is not restricted, and the centering section is not restricted. The shortest path can be taken during the journey to. That is, the centering section can be reached in a shorter time than when the component 1 is picked up and then moved to the centering height and then moved in the horizontal direction. In the second process, the upward movement is stopped when the centering section is reached, and the movement is continued only in the horizontal direction for a predetermined centering time t _c . In this centering section, horizontal positioning is performed according to the central position of the component 1, and the orientation of the component 1 is adjusted. Centering time t _C
After the passage of time, it continues to move in the horizontal direction and descends above the substrate 3 (C → D or C → D ′), and then moves horizontally above the component mounting position on the substrate 3 if necessary ( D '→ E'). Here, the lower limit height position when descending from the centering section to above the board 3 is, as will be described later, among the components 1 existing in the movement path from the centering section to the component mounting position of the board 3. It is set so as not to interfere with the component 1 having the maximum height. Further, when the component mounting position is close to the component transfer device, it moves almost linearly from the centering section to above the component mounting position (C → D), but when the component mounting position is far from the component transfer device, the centering section. It is set so as to descend from above to above the substrate 3 and then move horizontally to reach above the component mounting position (C → D ′ →
E '). When the component mounting position is reached above, the component 1 is moved downward and the component 1 is mounted on the substrate 3 in the third step.

In order to realize the above operation, the component carrying device is numerically controlled by the following parameters as shown in FIG. That is, the machine-specific parameters that have constant values regardless of the type of the component 1 include the height Z _F of the feeder 2, the height Z _{C of the} conveyor, the centering time t _C , and the centering height Z ₃ . In the first process, first, in order to take out the component 1, the component suction height Z ₁ (= Z _F + h _P ) that is the height Z _F of the feeder 2 plus the height h _P of the component ₁ is required as a parameter. is there. Further, since it is necessary to raise the component 1 picked up by the component conveying device to a height that does not interfere with the feeder 2, a value obtained by adding the component pickup height Z ₁ to the height h _P of the component 1 and the margin α. A certain component transportable height Z ₂ (= Z _F + h _P + α) is required. In the margin α, the component 1 that has been sucked is the feeder 2
Since it suffices to set it so that it does not interfere with, set it as small as possible. As described above, if the component 1 is sucked based on the component suction height Z ₁ and the component transportable height Z ₂ and the suctioned component 1 rises to a height at which it does not interfere with the feeder 2, a preset centering height is set. The centering operation in the second process is performed based on the length Z ₃ and the centering time t _C.

In the second process, in order to reach above the component mounting position after the centering work, in order to reach the component mounting position, the horizontal position coordinate (X ₀ , Y ₀ ) and the orientation R _{0 of the} component 1 and the component 3 are already mounted on the substrate 3. The component mounting preparation height Z ₄ is required as the lower limit position at which the component 1 sucked by the component transfer device does not interfere with the existing component 1. Component mounting height
The setting of Z ₄ will be described later.

In the third step, the conveyor height Z _C in substrate height plus the thickness S of the substrate _{3 Z P (= Z C +} S), was added height h _P of the component 1 to the substrate height Z _P The component mounting height Z ₀ (= Z _P + h _P ) is required.

For each of the above-mentioned parameters, the data that the operator actually inputs are the horizontal coordinates (X ₀ , Y ₀ ) and the orientation R ₀ that are parameters relating to the component mounting position, and the height of the component 1 that is a parameter unique to the component 1. h _P and the size of the component 1 in the horizontal plane (X _P , Y _P ), and the thickness S of the substrate 3 that is a parameter related to the substrate 3, and other parameters except machine-specific parameters are automatically set by calculation. To be done.

The component mounting preparation height Z ₄ is set by the following procedure. That is, first, the horizontal coordinates (X ₀ , Y ₀ ) of the mounting position of the component, the direction R ₀ , the height h _P , and the size (X _P , Y _P ) are input. In addition, the mounting order of each component 1 is also set. next,
The component mounting preparation height Z ₄ is calculated in the order of mounting for each component 1. For the component 1 to be mounted first, the board 3
Since there are no interfering parts, the component mounting preparation height
Z ₄ is given as the sum of the component mounting height Z ₀ , the component height h _P and the margin β. In this way, for the component 1 that is first mounted on the board 3, the occupied area and the component mounting preparation height
Z ₄ and are written as an implementation map. Here, part 1
The horizontal coordinate (X ₀ , Y ₀ ) of the mounting position is set corresponding to one point at the center position of the component 1, and the orientation R ₀ of the component 1 is set as shown in FIG. 1 longitudinal direction and substrate 3
It is set by the relationship with. For the component 1 to be mounted thereafter, whether or not the component 1 already mounted on the substrate 3 exists between the centering section and the component mounting position is checked based on the mounting map. That is, as shown in FIG. 4 (b), if the mounted component 1 exists on the path P to the component mounting position, the component 1 that is being transported with respect to the mounted component 1 is since must be such that no interference, the component mounting preparation height Z ₄ are the component mounting preparation height Z ₄ for component 1 is first mounted, already mounted components are present on the conveying path 1
Of these, the height h _P of the component 1 having the maximum height is set as a value added. If set in this way, the movement locus of the component in the second process is variable such that the lower limit position of the descending height of the component changes according to the height that does not interfere with the component already mounted on the board. Therefore, the lower limit of the descending height of each component in each moving path of the component in the second process is targeted for the individual components already mounted on the board, so that the height of the components already mounted is increased. Even when the components 1 are different from each other, the component 1 newly mounted does not interfere with the component 1 already mounted on the substrate 3 when the component 1 is transported. Further, as shown in FIG. 4A, if there is no mounted component 1 on the conveyance path P, the mounting preparation height Z ₄ is set to the same value as that of the component 1 to be mounted first. It As described above, the mounting map is completed according to the mounting order of the components 1, and the component mounting preparation height Z ₄ for each component 1 is calculated. If this calculation is sequentially performed during the mounting of the component 1, the component 1 can be processed during the calculation time.
In order to prevent such an inconvenience, the calculation is performed prior to the mounting of the component 1 by batch processing, and the component 1 is mounted on the substrate 3 according to the completed mounting map. .

FIG. 5 is a diagram in which an operation of the component transfer device is described based on a change in a parameter and an operation of the component transfer device corresponding to each routine of the flowchart are associated with each other, and X, Y, R axes are shown. Is an axis for moving the component 1 in the horizontal direction and adjusting the orientation of the component 1, and the Z axis is an axis for moving the component 1 in the height direction. First, in the first step of sucking the component 1, if it has reached the part transportable height Z ₂ on the way upward movement is determined, the parts can be conveyed reaches the height Z _2, while continuing to rise A horizontal movement toward the component mounting position is added, and the orientation of the component 1 is set. When the height reaches the centering height Z ₃ during this operation, the movement in the height direction is stopped for the centering time t _C , and then the descent is started. When the height reaches the component mounting preparation height Z ₄ set by the above calculation due to the descent, the downward movement is stopped and the component mounting position (X ₀ , Y ₀ , R ₀ ) is reached at that point. Then, the component mounting height Z _{0 is} lowered and the component 1 is mounted on the substrate 3. If the component mounting position (X ₀ , Y ₀ , R ₀ ) is not reached when the component mounting preparation height Z ₄ is reached, the horizontal movement is continued and the component mounting position (X ₀ , Y ₀ , R ₀ ), and then the component mounting height
The component 1 is lowered to Z ₀ and the component 1 is mounted on the substrate 3.

The component 1 is taken out from the feeder 2 and mounted on the substrate 3 on the conveyor by the above-described operation. In the conventional case, the movement in the height direction and the movement in the horizontal direction are completely independent of each other. Since the movement in the direction and the movement in the horizontal direction are partially overlapped, the route P for conveying the component 1 is shortened as compared with the conventional route (broken line) as shown by the solid line in FIG. 6 (a). The time required for mounting the component 1 in the automatic assembly can be shortened as compared with the conventional case. Furthermore, each part 1
Since the parameter is set so as to have the optimum value for each component, the time required for mounting the component 1 is shortened as compared with the case where the component 1 is transported on the same route as in the conventional case. Of.

[Effects of the Invention] According to the present invention, as described above, in the process of transporting a component from above the feeder to above the component mounting position on the board, the component is lowered horizontally above the component mounting position to a predetermined height position simultaneously with the horizontal direction. A process is provided, and the lower limit position of the descending height of the component in this process is changed according to the height that does not interfere with the component already mounted on the board. In the above, since only the horizontal movement is conventionally performed, the horizontal movement is performed, and the descending movement is performed. Therefore, the component transport path is shortened as compared with the conventional one, and there is an advantage that the assembly time is shortened. In addition, since the descending distance is set to a height that does not interfere with the components already mounted on the board, the optimal transport route is set for each component, thus making the transport route uniform. It has an advantage that work efficiency is further improved as compared with the conventional method.

[Brief description of drawings]

FIG. 1 is an explanatory view showing a basic operation of the present invention, FIG. 2 is an explanatory view showing each parameter in the same as above, FIG. 3 is an explanatory view showing an example of component mounting positions in the same as above, and FIG. 4 (a).
(B) is explanatory drawing which shows an example of the conveyance path at the time of mounting a component respectively in the same as FIG. 5, FIG.
FIGS. 6 (a) and 6 (b) are respectively a perspective view showing a component conveyance path in the present invention and a perspective view showing a component conveyance path in a conventional example. 1 ... Component, 2 ... Feeder, 3 ... Substrate.

Claims (1)

[Claims] 1. A first process of gripping a component on a feeder for supplying the component and moving the component upward to a position where it does not interfere with the feeder, and a component mounting position on a substrate arranged separately from the feeder. In a component mounting method comprising a second step and a third step of moving the component downward to mount the component on the substrate, the second step is a predetermined height while moving horizontally above the component mounting position. A component mounting method, including a step of descending to a position, and changing a lower limit position of the descending height of the component in the second step according to a height that does not interfere with a component already mounted on the substrate.