JPH071774B2 - Semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Outline] A semiconductor device in which an element and a package are connected using a conductive rubber connector (hereinafter, referred to as a conductive connector) arranged in a radial pattern.

[Industrial application field]

The present invention relates to a semiconductor device, and more particularly, to a package in which elements are connected without using a wire, whereas a conventional semiconductor integrated circuit (IC) package uses a wire.

[Conventional technology]

For example, a ceramic package shown in a sectional view in FIG. 6 is known. In FIG. 6, 31 is a semiconductor chip on which an IC is formed (hereinafter referred to as a semiconductor element), 32 is an electrode of the element 31 and metallization. Wires connecting layers 33, 33 metallization layers on ceramic package 30, 34
Is a lead connected to the metallization layer 33, 35 is a cap,
Are shown respectively.

[Problems to be solved by the invention]

The wire 32 described above is for taking out a signal between the semiconductor element 31 and the package 30, and a thin wire of gold (Au) or aluminum (Al) is used for it. In the conventional package, it is necessary to connect wires one by one, and there is a problem in that the production efficiency decreases as the number of electrodes and pins increases.

As a solution to the above-mentioned problems, a batch connection method such as flip chip, beam lead, and spider bonding has been proposed, but there is a problem such as matching between patterns and it is not versatile, and either of them is generally adopted. I haven't arrived.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a semiconductor IC package that enables easy connection between a semiconductor element and a lead.

[Means for solving problems]

1 (a) and 1 (b) are a sectional view and a plan view of an embodiment of the present invention, and FIGS. 1 (c), (d), (e) and (f) are the same (a).
FIG. 2 is a diagram showing the parts constituting the package of FIG. 2, and FIG. 2 is a diagram showing the principle of connection in the embodiment of the present invention.

In the embodiment of the present invention, the conductive connector 13 in which the metal foil connecting electrodes 19 are radially arranged on the elastic insulating member such as the rubber member 18 is arranged between the semiconductor element 12 and the package 11.

[Action]

Referring to FIG. 2, conductive members (for example, Al) are geometrically and radially arranged on the conductive connector 13. On the other hand, the electrode arrangement of each of the semiconductor element 12 and the package 11 is changed to the radiation (l,
m) on _{(c, c 2 ...... c n} ), (p, by placing a p ₂ ...... p _n), an electrical connection between the semiconductor element 12 and the package 11 via the conductive connector 13 Is what you can get.

〔Example〕

 Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 1 (a), a semiconductor IC package 10 according to the present invention comprises a package 11, a semiconductor element 12, a conductive connector 13, a conductive connector holding plate 14, and a sealing cap 15, and electrodes of the semiconductor element 12 are Conductive connector 13, package
It is connected to the lead 17 via 11 metallized layers 16.

The conductive connector 13 has the structure shown in FIG. 1 (c), and the connection electrodes 19 of Al, for example, are formed on the hollow columnar rubber member 18 in a uniform radial pattern.

In FIG. 1 (c), the package 11 is shown in cross section, and the lower metallization layer 16 and the lead 17 are connected.

The conductive connector holding plate 14 is made of an elastic insulating plate having a shape as shown in FIG. 1 (e). The shape may be B-type, C-type, etc. depending on the level difference between the element and the package.

The sealing cap 15 shown in FIG. 1 (f) is the same as the conventional cap, and is made of, for example, ceramic or metal.

In order to make the semiconductor IC package 10 shown in FIG. 1 (a), the semiconductor element 11 is placed or adhered to the package cavity 36 in the package 11, and then the conductive connector 13 is placed on the semiconductor element 11 and further conductive. A connector holding plate is placed, and finally the sealing cap 15 is sealed by electric welding or an adhesive. The conductive connector holding plate is for further strengthening the electrical connector, but can be omitted when the sealing cap is made of an insulating material such as ceramic.

Another embodiment of the present invention is shown in the sectional view of FIG. 3, in which the semiconductor element 12 is turned upside down from that of FIG. 1, that is, the circuit diagram of the semiconductor element 12 is shown in the drawing. And the alignment ring 20 is used for aligning the semiconductor element 12. The other points are the same as the embodiment of FIG.

The conductive connector 13 may be formed as shown in FIG. 4 to improve the connection (contact). The same figure (a)
As shown in FIG. 3, when the connection electrode 19 is formed on the rubber member 18 and then the rubber is etched to expose the connection electrode 19 (see (b) and (c) of the same figure), the connection with the metallization layer 16 is made easier. You can take

When the electrode positions of the semiconductor element 12 and the package 11 are designed according to the principle described with reference to FIG. 2, even if the dimensions of the semiconductor element 12 mounted in a certain package are changed, the connection can be made by one kind of conductive connector. It is possible to improve the versatility in manufacturing semiconductor IC packages. In designing the conductive connector, as shown in FIG. 5, the connection electrodes 19 having a plurality of patterns are brought into contact with the semiconductor element 19 and the electrodes 21 and 22 of the package, respectively, in consideration of mounting accuracy.

〔The invention's effect〕

As described above, according to the present invention, in the manufacture of the semiconductor IC package, the assembly is performed within a short time, which is effective in reducing the assembly processing cost.

[Brief description of drawings]

1A is a sectional view of the embodiment of the present invention, FIG. 1B is a plan view of the embodiment of the present invention, FIG. 1C is a perspective view of a conductive connector, and FIG. 1D is a sectional view of the package. (E) is a sectional view of a conductive connector, (f) is a sectional view of a sealing cap, FIG. 2 is a view showing the principle of the present invention, FIG. 3 is a sectional view of another embodiment of the present invention, and FIG. FIG. 7A is a partial perspective view of an improved conductive connector, FIGS. 8B and 8C are sectional views taken along the line AA 'in FIG. 5A, and FIG. FIG. 6 is a plan view showing the connection, and FIG. 6 is a sectional view of a conventional example. In FIGS. 1 to 5, 10 is a semiconductor IC package, 11 is a package, 12 is a semiconductor element, 13 is a conductive connector, 14 is a conductive connector holding plate, 15 is a sealing cap, 16 is a metallized layer, and 17 is a lead. , 18 is a rubber member, 19 is a connecting electrode, 20 is an alignment ring, 21 is a semiconductor element electrode, 22 is a package electrode, and 36 is a package cavity.

Claims (1)

[Claims] 1. An electrode (21) of a semiconductor element and an electrode (22) of a package are electrically connected by a conductive connector in which a connecting member (19) is radially formed on a rubber member (18). A semiconductor device characterized in that