JPH0725995B2 - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPH0725995B2 JPH0725995B2 JP7502886A JP7502886A JPH0725995B2 JP H0725995 B2 JPH0725995 B2 JP H0725995B2 JP 7502886 A JP7502886 A JP 7502886A JP 7502886 A JP7502886 A JP 7502886A JP H0725995 B2 JPH0725995 B2 JP H0725995B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- condensed polycyclic
- resin composition
- thermosetting resin
- phenols
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920001187 thermosetting polymer Polymers 0.000 title claims description 23
- 239000011342 resin composition Substances 0.000 title claims description 9
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 31
- 150000002989 phenols Chemical class 0.000 claims description 18
- 239000004312 hexamethylene tetramine Substances 0.000 claims description 17
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims description 16
- 125000005575 polycyclic aromatic hydrocarbon group Chemical group 0.000 claims description 14
- 150000001491 aromatic compounds Chemical class 0.000 claims description 9
- 125000000524 functional group Chemical group 0.000 claims description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000003377 acid catalyst Substances 0.000 claims description 6
- XMUZQOKACOLCSS-UHFFFAOYSA-N [2-(hydroxymethyl)phenyl]methanol Chemical group OCC1=CC=CC=C1CO XMUZQOKACOLCSS-UHFFFAOYSA-N 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 31
- 239000011347 resin Substances 0.000 description 31
- 239000003431 cross linking reagent Substances 0.000 description 14
- 125000003367 polycyclic group Chemical group 0.000 description 11
- BWVAOONFBYYRHY-UHFFFAOYSA-N [4-(hydroxymethyl)phenyl]methanol Chemical compound OCC1=CC=C(CO)C=C1 BWVAOONFBYYRHY-UHFFFAOYSA-N 0.000 description 10
- 125000003118 aryl group Chemical group 0.000 description 10
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 4
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 4
- 238000013329 compounding Methods 0.000 description 4
- 238000006482 condensation reaction Methods 0.000 description 4
- GVEPBJHOBDJJJI-UHFFFAOYSA-N fluoranthrene Natural products C1=CC(C2=CC=CC=C22)=C3C2=CC=CC3=C1 GVEPBJHOBDJJJI-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- BBEAQIROQSPTKN-UHFFFAOYSA-N pyrene Chemical compound C1=CC=C2C=CC3=CC=CC4=CC=C1C2=C43 BBEAQIROQSPTKN-UHFFFAOYSA-N 0.000 description 4
- 238000005979 thermal decomposition reaction Methods 0.000 description 4
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- KJIFKLIQANRMOU-UHFFFAOYSA-N oxidanium;4-methylbenzenesulfonate Chemical compound O.CC1=CC=C(S(O)(=O)=O)C=C1 KJIFKLIQANRMOU-UHFFFAOYSA-N 0.000 description 3
- 238000006068 polycondensation reaction Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- QPUYECUOLPXSFR-UHFFFAOYSA-N 1-methylnaphthalene Chemical compound C1=CC=C2C(C)=CC=CC2=C1 QPUYECUOLPXSFR-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- -1 alkylphenol Chemical compound 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 125000006839 xylylene group Chemical group 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- WHOZNOZYMBRCBL-OUKQBFOZSA-N (2E)-2-Tetradecenal Chemical compound CCCCCCCCCCC\C=C\C=O WHOZNOZYMBRCBL-OUKQBFOZSA-N 0.000 description 1
- JIRHAGAOHOYLNO-UHFFFAOYSA-N (3-cyclopentyloxy-4-methoxyphenyl)methanol Chemical compound COC1=CC=C(CO)C=C1OC1CCCC1 JIRHAGAOHOYLNO-UHFFFAOYSA-N 0.000 description 1
- XOJWBPXKYGHCLN-UHFFFAOYSA-N 1,1'-biphenyl;methanol Chemical compound OC.OC.C1=CC=CC=C1C1=CC=CC=C1 XOJWBPXKYGHCLN-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 229930040373 Paraformaldehyde Natural products 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- CWRYPZZKDGJXCA-UHFFFAOYSA-N acenaphthene Chemical compound C1=CC(CC2)=C3C2=CC=CC3=C1 CWRYPZZKDGJXCA-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 238000003763 carbonization Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000011280 coal tar Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- GSBKQLXNLYEUMK-UHFFFAOYSA-N methanol;naphthalene Chemical compound OC.OC.C1=CC=CC2=CC=CC=C21 GSBKQLXNLYEUMK-UHFFFAOYSA-N 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 229920002866 paraformaldehyde Polymers 0.000 description 1
- GKROKAVBUIADBS-UHFFFAOYSA-N phenanthrene-2-carbaldehyde Chemical compound C1=CC=C2C3=CC=C(C=O)C=C3C=CC2=C1 GKROKAVBUIADBS-UHFFFAOYSA-N 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 229940044654 phenolsulfonic acid Drugs 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 150000008442 polyphenolic compounds Chemical class 0.000 description 1
- 235000013824 polyphenols Nutrition 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 1
- 229960001755 resorcinol Drugs 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010189 synthetic method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 230000004580 weight loss Effects 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 この発明は、易成形硬化性で、かつ、耐酸化性、耐熱分
解性の非常に優れた熱硬化性樹脂組成物に関する。TECHNICAL FIELD The present invention relates to a thermosetting resin composition which is easily moldable and hardenable, and has excellent oxidation resistance and thermal decomposition resistance.
従来技術 熱硬化性樹脂としては、フェノール樹脂、尿素樹脂、メ
ラミン樹脂、エポキシ樹脂、不飽和ポリエステル樹脂、
ポリイミド樹脂等が知られている(昭和60年6月15日、
(株)新技術開発センター発行、「エンジニアリングプ
ラスチック便覧」第149〜151頁参照)。Prior art Thermosetting resins include phenolic resins, urea resins, melamine resins, epoxy resins, unsaturated polyester resins,
Polyimide resin is known (June 15, 1985,
Published by New Technology Development Center Co., Ltd., "Engineering Plastic Handbook", pp. 149-151).
一般にこれらの樹脂は、熱可塑性樹脂に比べて優れた耐
熱性を有しているが、それでもポリイミド樹脂を除け
ば、長期使用可能温度は最高150〜200℃程度である。Generally, these resins have excellent heat resistance as compared with thermoplastic resins, but even if polyimide resins are excluded, the long-term usable temperature is about 150 to 200 ° C. at maximum.
一方、ポリイミド樹脂は、長期使用可能温度が250〜300
℃と非常に優れた耐熱性を有するが、半面、成形加工性
に劣る欠点がある。On the other hand, polyimide resin has a long-term usable temperature of 250 to 300.
It has a very high heat resistance of ℃, but on the other hand, it has the drawback of poor moldability.
最近、新規の熱硬化性樹脂として、縮合多環多核芳香族
樹脂が注目されている。Recently, a condensed polycyclic polynuclear aromatic resin has been attracting attention as a novel thermosetting resin.
縮合多環多核芳香族樹脂は、縮合多環芳香族炭化水素と
して、ピレン、フェナントレン、ナフタリン、アントラ
セン、それらを含有するピッチ等を単独または混合物で
用い、架橋剤としてp−キシリレングリコール、酸触媒
としてp−トルエンスルホン酸等を用い、不活性ガス雰
囲気下、重縮合させることにより得られる(昭和60年10
月3日開催の第51回日本化学会秋季年会の講演要旨集、
第539〜541頁、および昭和60年12月11〜13日開催、炭素
材料学会第12回年会の要旨集、第183頁参照)。The condensed polycyclic polynuclear aromatic resin includes pyrene, phenanthrene, naphthalene, anthracene, pitches containing them as a condensed polycyclic aromatic hydrocarbon, used alone or in a mixture, and p-xylylene glycol as an crosslinking agent, an acid catalyst. It can be obtained by polycondensation using p-toluenesulfonic acid or the like as an inert gas atmosphere (1960, 1985).
Of the 51st Annual Meeting of the Chemical Society of Japan, held on March 3rd,
(See pages 539-541 and December 11-13, 1960, Abstracts of the 12th Annual Meeting of the Carbon Material Society of Japan, page 183).
この縮合多環多核芳香族樹脂は、Bステージ状態の樹脂
を100〜300℃で加熱することにより三次元化し、その硬
化物は、非常に優れた耐酸化性および耐熱分解性を示
す。This condensed polycyclic polynuclear aromatic resin is three-dimensionalized by heating the B-stage resin at 100 to 300 ° C., and the cured product thereof exhibits extremely excellent oxidation resistance and thermal decomposition resistance.
しかるにこの縮合多環多核芳香族樹脂は、フェノール樹
脂、エポキシ樹脂等他の汎用熱硬化性樹脂に比べて硬化
速度が遅く、その成形加工性対策が重要な課題である。However, this condensed polycyclic polynuclear aromatic resin has a slower curing rate than other general-purpose thermosetting resins such as phenol resin and epoxy resin, and its processability is an important issue.
また、架橋剤として、通常p−キシリレングリコールが
使用されるが、高耐熱性を実現するためには、架橋密度
を上げる必要があるため、一定量以上の架橋剤を使用す
る必要がある。しかし、p−キシリレングリコールは、
現在、工業的に有利な生産技術が確立されておらず、経
済性を満足する合成法の確立や、代替品の開発が重要な
課題となっている。Further, p-xylylene glycol is usually used as a cross-linking agent, but in order to realize high heat resistance, it is necessary to increase the cross-linking density, so it is necessary to use a certain amount or more of cross-linking agent. However, p-xylylene glycol is
At present, industrially advantageous production techniques have not been established, and establishment of synthetic methods that satisfy economic efficiency and development of alternative products have become important issues.
解決しようとする問題点 この発明は、上記縮合多環多核芳香族樹脂において成形
硬化性を改善し、また、架橋剤として、ヘキサメチレン
テトラミンが使用できる熱硬化性樹脂組成物を提供する
ものである。DISCLOSURE OF THE INVENTION The present invention provides a thermosetting resin composition in which the above-mentioned condensed polycyclic polynuclear aromatic resin has improved moldability and hexamethylenetetramine can be used as a crosslinking agent. .
発明の詳細 本発明者等は、種々試験研究の結果、原料として多環芳
香族炭化水素と共に、フェノール類を用いると、硬化時
に架橋剤としてヘキサメチレンテトラミンが使用できる
こと、および前記縮合多環多核芳香族樹脂の耐熱性を損
なうことなく、硬化性が大きく向上することを見い出
し、この発明を完成した。DETAILED DESCRIPTION OF THE INVENTION As a result of various tests, the present inventors have found that when polyphenols are used together with polycyclic aromatic hydrocarbons as a raw material, hexamethylenetetramine can be used as a cross-linking agent during curing, and the condensed polycyclic polynuclear aroma is used. The inventors have found that the curability is greatly improved without impairing the heat resistance of the group resin and completed the present invention.
すなわちこの発明は、縮合多環芳香族炭化水素、フェノ
ール類、一般式−CH2X(ただし、X=OH、Cl、Br)で表
される官能基を2個以上有する芳香族化合物を、酸触媒
の存在下、加熱せしめてなる重縮合物とヘキサメチレン
テトラミンとからなる熱硬化性樹脂組成物である。That is, the present invention provides a condensed polycyclic aromatic hydrocarbon, a phenol, and an aromatic compound having two or more functional groups represented by the general formula —CH 2 X (where X═OH, Cl, Br) as an acid compound. A thermosetting resin composition comprising a polycondensate which is heated in the presence of a catalyst and hexamethylenetetramine.
従来の縮合多環多核芳香族樹脂は、架橋剤として通常p
−キシリレングリコールを用いるが、架橋剤が被架橋原
料に対し、モル比で0.8以下の場合、生成する樹脂は一
般に熱硬化性を示さない。それに対して本発明の樹脂
は、樹脂骨格にフェノール核を有しているため、従来の
縮合多環多核芳香族樹脂にはない特性、すなわち、硬化
時に架橋剤として、ヘキサメチレンテトラミンを添加し
て熱処理することにより、容易に熱硬化体を与えるとい
う特性を有する。A conventional condensed polycyclic polynuclear aromatic resin is usually used as a crosslinking agent.
-Xylylene glycol is used, but when the cross-linking agent is 0.8 or less in molar ratio with respect to the material to be cross-linked, the resulting resin generally does not show thermosetting property. On the other hand, since the resin of the present invention has a phenol nucleus in the resin skeleton, it has a property that conventional condensed polycyclic polynuclear aromatic resins do not have, that is, hexamethylenetetramine is added as a crosslinking agent during curing. It has the characteristic that a heat-cured product can be easily obtained by heat treatment.
したがって、p−キシリレングリコールを縮合多環芳香
族炭化水素に対し、多量に添加して熱硬化体とすること
なく、安価なヘキサメチレンテトラミンを添加して熱処
理することにより、p−キシリレングリコールを多量に
使用したと同様の熱硬化体を得ることができるのであ
る。Therefore, without adding a large amount of p-xylylene glycol to the condensed polycyclic aromatic hydrocarbon to form a thermosetting product, inexpensive hexamethylenetetramine is added and heat treatment is performed to obtain p-xylylene glycol. When a large amount of is used, the same thermosetting body can be obtained.
また、本発明の樹脂は、縮合反応性の高いフェノール核
を有しているため、従来の縮合多環多核芳香族樹脂に比
較し、硬化性が大きく向上する。Moreover, since the resin of the present invention has a phenol nucleus having high condensation reactivity, curability is greatly improved as compared with the conventional condensed polycyclic polynuclear aromatic resin.
さらに、得られる熱硬化体は、従来の縮合多環多核芳香
族樹脂の優れた耐熱性を引き継いでおり、一般のフェノ
ール樹脂に比べ、非常に優れた耐酸化性、耐熱分解性を
有している。Furthermore, the resulting thermosetting product inherits the excellent heat resistance of conventional condensed polycyclic polynuclear aromatic resins, and has extremely excellent oxidation resistance and thermal decomposition resistance as compared with general phenol resins. There is.
この発明における縮合多環芳香族炭化水素としては、ナ
フタリン、フェナントレン、アントラセン、ピレン、フ
ルオランテン、アセナフテン、メチルナフタレン、それ
らの誘導体、またはそれらを含有するコールタール分留
留分の単独または混合物が使用できる。As the condensed polycyclic aromatic hydrocarbon in the present invention, naphthalene, phenanthrene, anthracene, pyrene, fluoranthene, acenaphthene, methylnaphthalene, derivatives thereof, or coal tar fractionated fraction containing them can be used alone or in a mixture. .
また、フェノール類としては、フェノール、アルキルフ
ェノール、レゾルシン、ナフトール等の1価または多価
の単核フェノール、あるいはフェノール、アルキルフェ
ノールで代表されるフェノール類とホルムアルデヒド、
パラホルムアルデヒド、または、アセトンのごときケト
ンとの酸触媒による縮合で得られる架橋基を介して結合
する多核フェノールであって、未だフエノール核中に活
性反応水素を有するものが使用できる。Examples of phenols include monovalent or polyvalent mononuclear phenols such as phenol, alkylphenol, resorcin, and naphthol, or phenols represented by phenol and alkylphenol, and formaldehyde,
It is possible to use a polynuclear phenol bonded via a bridging group obtained by condensation with paraformaldehyde or a ketone such as acetone by an acid catalyst, and having a reactive hydrogen in the phenol nucleus.
一般式−CH2X(ただし、X=OH,Cl,Br)で表される官能
基を2個以上有する芳香族化合物としては、キシリレン
グリコール、ナフタリンジメタノール、ビフェニルジメ
タノール、キシリレンジクロライド、キシリレンジブロ
マイド等が使用できる。As the aromatic compound having two or more functional groups represented by the general formula —CH 2 X (where X = OH, Cl, Br), xylylene glycol, naphthalene dimethanol, biphenyl dimethanol, xylylene dichloride, Xylylene range bromide etc. can be used.
酸触媒としては、トルエンスルホン酸、フェノールスル
ホン酸、キシレンスルホン酸、硫酸、塩化錫、塩化アル
ミニウム、塩化亜鉛等の各種有機酸、無機酸、ルイス酸
を使用することができる。As the acid catalyst, various organic acids such as toluenesulfonic acid, phenolsulfonic acid, xylenesulfonic acid, sulfuric acid, tin chloride, aluminum chloride and zinc chloride, inorganic acids and Lewis acids can be used.
本発明における、縮合多環芳香族炭化水素及びフェノー
ル類と一般式−CH2X(ただし、X=OH,Cl,Br)で表され
る官能基を2個以上有する芳香族化合物との重縮合物に
おいては、フェノール類/(縮合多環芳香族炭化水素+
フェノール類)の配合比がモル比で0.2以上、特に0.2〜
0.8が望ましい。0.2未満になると、ヘキサメチレンテト
ラミンとの活性点が乏しくなり硬化性が不十分になる。
また0.8を越えると耐熱特性の点でやや低下が認められ
る。Polycondensation of condensed polycyclic aromatic hydrocarbons and phenols of the present invention with an aromatic compound having two or more functional groups represented by the general formula —CH 2 X (where X = OH, Cl, Br). In products, phenols / (condensed polycyclic aromatic hydrocarbons +
The compounding ratio of (phenols) is 0.2 or more in molar ratio, especially 0.2 to
0.8 is preferable. If it is less than 0.2, the active sites with hexamethylenetetramine become poor and the curability becomes insufficient.
On the other hand, if it exceeds 0.8, a slight decrease in heat resistance is observed.
また、一般式−CH2X(ただし、X=OH,Cl,Br)で表され
る官能基を2個以上有する芳香族化合物の配合比は、被
架橋原料であるフェノール類と縮合多環芳香族炭化水素
の合計量に対して、モル比で0.3〜5.0特に0.3〜1.0が好
ましい。より好ましい範囲としては、0.4〜0.9である。
モル比が0.3以下であると、ヘキサメチレンテトラミン
を多配合しても、充分な熱硬化性を示さず、逆に1.0を
越えると、重縮合反応時に系内でゲル化を起こし易くな
る。また経済的にも高価な架橋剤である一般式−CH2X
(ただし、X=OH,Cl,Br)で表される官能基を2個以上
有する芳香族化合物の使用量が増えて好ましくない。In addition, the compounding ratio of the aromatic compound having two or more functional groups represented by the general formula —CH 2 X (where X = OH, Cl, Br) is such that the raw materials to be crosslinked are phenols and condensed polycyclic aromatic compounds. A molar ratio of 0.3 to 5.0, particularly 0.3 to 1.0, is preferable with respect to the total amount of group hydrocarbons. A more preferable range is 0.4 to 0.9.
If the molar ratio is 0.3 or less, even if a large amount of hexamethylenetetramine is added, sufficient thermosetting property will not be exhibited. On the contrary, if it exceeds 1.0, gelation tends to occur in the system during the polycondensation reaction. In addition, it is an economically expensive crosslinking agent of the general formula --CH 2 X.
(However, the amount of the aromatic compound having two or more functional groups represented by X = OH, Cl, Br) increases, which is not preferable.
酸触媒の添加量は、原料物質と架橋剤との合計重量に対
して、好ましくは0.05〜20重量%、特に好ましくは0.2
〜10重量%の範囲である。The addition amount of the acid catalyst is preferably 0.05 to 20% by weight, particularly preferably 0.2, with respect to the total weight of the raw material and the crosslinking agent.
Is in the range of up to 10% by weight.
前記の縮合多環芳香族炭化水素およびフェノール類と架
橋剤である一般式−CH2X(ただし、X=OH,Cl,Br)で表
される官能基を2個以上有する芳香族化合物の反応は、
酸触媒を所定の割合で添加し、50〜200℃で加熱反応せ
しめることにより容易に重縮合物を得ることが出来る。
この反応を行う際、縮合多環芳香族炭化水素と架橋剤を
あらかじめ反応させた後に、フェノール類を添加し更に
反応を進めることが望ましい。フェノール類を最初から
添加すると、架橋剤がフェノール類と選択的に反応する
ため、縮合多環芳香族炭化水素が未反応物として重縮合
物中に残ったり、分子中にフェノール核を持たないオリ
ゴマーが生成しやすいため好ましくない。Reaction of the above-mentioned condensed polycyclic aromatic hydrocarbon and phenol with an aromatic compound having two or more functional groups represented by the general formula --CH 2 X (where X = OH, Cl, Br) which is a cross-linking agent. Is
A polycondensate can be easily obtained by adding an acid catalyst in a predetermined ratio and heating and reacting at 50 to 200 ° C.
When carrying out this reaction, it is desirable that the condensed polycyclic aromatic hydrocarbon and the cross-linking agent are reacted in advance and then phenols are added to further advance the reaction. When phenols are added from the beginning, the cross-linking agent selectively reacts with phenols, so that condensed polycyclic aromatic hydrocarbons remain in the polycondensate as unreacted products, or oligomers that do not have a phenol nucleus in the molecule. Is easily generated, which is not preferable.
本発明の熱硬化性樹脂組成物は、前記の重縮合物とヘキ
サメチレンテトラミンとから構成される。ヘキサメチレ
ンテトラミンの前記重縮合物に対する配合比は、重縮合
物中の縮合多環芳香族炭化水素に対するフェノール類の
比や種類によって異なるが、通常は前記重縮合物100重
量部に対しヘキサメチレンテトラミンを3〜20重量部の
範囲で添加するのが好ましい。3重量部未満では充分な
熱硬化性を示さず、逆に20重量部を越えると未反応のヘ
キサメチレンテトラミンやその分解物(たとえば、アン
モニアなど)が系内に残り好ましくない。The thermosetting resin composition of the present invention is composed of the above polycondensate and hexamethylenetetramine. The compounding ratio of hexamethylenetetramine to the polycondensate varies depending on the ratio and type of the phenols to the condensed polycyclic aromatic hydrocarbons in the polycondensate, but usually hexamethylenetetramine to 100 parts by weight of the polycondensate. Is preferably added in the range of 3 to 20 parts by weight. If it is less than 3 parts by weight, sufficient thermosetting property is not exhibited, and if it exceeds 20 parts by weight, unreacted hexamethylenetetramine and its decomposition products (for example, ammonia) remain in the system, which is not preferable.
この発明により得られる樹脂は、高耐熱性を有してお
り、従来の縮合多環多核芳香族樹脂に比較し、易成形硬
化性で、かつ、コスト的にも有利であり、耐熱性の要求
される構造材料、電子材料として極めて価値の高いもの
と判断される。The resin obtained by the present invention has high heat resistance, is easily moldable and curable as compared with the conventional fused polycyclic polynuclear aromatic resin, and is also advantageous in terms of cost. It is judged to be extremely valuable as a structural material and electronic material.
以下実施例を示すが、本発明は何らこれらに限定される
ものではない。Examples will be shown below, but the present invention is not limited thereto.
実施例 フェナントレン44.6重量部(以下重量部を単に部と記載
する)[0.25mol]、p−キシリレングリコール51.8部
[0.375mol]、p−トルエンスルホン酸(1水和物)6
部をガラス製反応器に仕込み、窒素気流中、撹拌しなが
ら120℃で15分間反応させたのち、フェノール23.5部
[0.25mol]を投入してさらに105分間縮合反応させ、第
1表試料1の樹脂を得た。Example Phenanthrene 44.6 parts by weight (hereinafter, parts by weight are simply referred to as parts) [0.25 mol], p-xylylene glycol 51.8 parts [0.375 mol], p-toluenesulfonic acid (monohydrate) 6
Parts were charged into a glass reactor and reacted in a nitrogen stream at 120 ° C. for 15 minutes while stirring, then 23.5 parts of phenol [0.25 mol] were added and the condensation reaction was continued for another 105 minutes. A resin was obtained.
次に、フェナントレン30.3部[0.17mol]、p−キシリ
レングリコール34.5部[0.25mol]、p−トルエンスル
ホン酸(1水和物)4.8部をガラス製反応器に仕込み、
窒素気流中、120℃で15分間反応させたのち、フェノー
ル31.0部[0.33mol]を投入し、さらに105分間縮合反応
させ、第1表試料2の樹脂を得た。Next, 30.3 parts [0.17 mol] of phenanthrene, 34.5 parts [0.25 mol] of p-xylylene glycol and 4.8 parts of p-toluenesulfonic acid (monohydrate) were charged into a glass reactor,
After reacting at 120 ° C. for 15 minutes in a nitrogen stream, 31.0 parts [0.33 mol] of phenol was added and the condensation reaction was continued for 105 minutes to obtain a resin of Sample 2 in Table 1.
得られた各樹脂は、200℃で何分間熱処理しても硬化せ
ず流動点も変わらなかった。Each of the obtained resins was not cured and the pour point did not change even if heat-treated at 200 ° C. for several minutes.
前記試料1、2の樹脂にそれぞれヘキサメチレンテトラ
ミンを15重量%添加し、160℃でフローテスター(ノズ
ル直径1mm、長さ1mm、圧力10kgf/cm2)のノズルから流
出がなくなることを硬化とする硬化特性を測定したとこ
ろ、それぞれ5分間、4分間で硬化した。Hexamethylenetetramine (15% by weight) was added to each of the resins of Samples 1 and 2, and curing at 160 ° C where no outflow from the nozzle of the flow tester (nozzle diameter 1 mm, length 1 mm, pressure 10 kgf / cm 2 ) was achieved. When the curing characteristics were measured, it was cured in 5 minutes and 4 minutes, respectively.
これをさらに200℃で180分間ポストキュアすると、さら
に硬化が進み、黒色の熱硬化体となった。When this was post-cured at 200 ° C. for 180 minutes, curing proceeded further, and a black thermosetting body was obtained.
ポストキュア後の熱硬化体を空気中、常圧下、5℃/min
で加熱昇温し、10%重量減少時の温度を測定した。その
結果を第2表に示す。The post-cure thermoset is in air at atmospheric pressure, 5 ℃ / min
The temperature was raised by heating at, and the temperature when the weight was reduced by 10% was measured. The results are shown in Table 2.
なお、比較のため市販のフェノール・ノボラック−ヘキ
サミン系樹脂の熱硬化体(平均分子量600、ヘキサミン8
wt%、高炭化収率グレード、 硬化条件200℃−180分間)を前記と同条件で加熱昇温
し、10%重量減少時の温度を測定した。その結果を第2
表に示す。For comparison, a commercially available phenol-novolak-hexamine resin thermoset (average molecular weight 600, hexamine 8
wt%, high carbonization yield grade, The curing conditions (200 ° C.-180 minutes) were heated and heated under the same conditions as above, and the temperature at the time of 10% weight loss was measured. The result is the second
Shown in the table.
第1表および第2表から明らかなとおり、p−キシリレ
ングリコールの配合量が少量で熱硬化しない試料1およ
び2の樹脂の場合でも、ヘキサメチレンテトラミンを架
橋剤として添加することにより、容易に熱硬化体とな
る。 As is clear from Tables 1 and 2, even in the case of the resins of Samples 1 and 2 in which the compounding amount of p-xylylene glycol was small and which was not heat-cured, it was easy to add hexamethylenetetramine as a crosslinking agent. It becomes a thermoset.
しかも、得られる熱硬化体は、耐酸化性、耐熱分解性が
従来のフェノール樹脂の硬化体に比べ、非常に優れてい
る特徴を有する。Moreover, the thermosetting product obtained is characterized in that its oxidation resistance and thermal decomposition resistance are far superior to those of conventional phenol resin cured products.
比較例1 フェナントレン89.3部[0.5mol]、p−キシリレングリ
コール51.8部[0.375mol]、p−トルエンスルホン酸
(1水和物)7部をガラス製反応器に仕込み、窒素気流
下、撹拌しながら120℃で120分間縮合反応させ、第3表
に示す性状の樹脂を得た。得られた樹脂は200℃で何分
間熱処理をしても硬化せず、流動点も変わらなかった。Comparative Example 1 Phenanthrene 89.3 parts [0.5 mol], p-xylylene glycol 51.8 parts [0.375 mol], and p-toluenesulfonic acid (monohydrate) 7 parts were charged into a glass reactor and stirred under a nitrogen stream. While carrying out a condensation reaction at 120 ° C. for 120 minutes, a resin having the properties shown in Table 3 was obtained. The obtained resin did not cure even if heat-treated at 200 ° C. for several minutes, and the pour point did not change.
また、ヘキサメチレンテトラミンを15重量%添加し、16
0℃で30分間の熱処理を行ったが、流動点113℃の熱可塑
性であり、硬化体とはならなかった。これをさらに200
℃で180分間熱処理したが、同様であった。Hexamethylenetetramine was added at 15% by weight,
When heat-treated at 0 ° C for 30 minutes, it was thermoplastic with a pour point of 113 ° C and did not become a cured product. 200 more
The heat treatment was carried out at 180 ° C. for 180 minutes, but the same result was obtained.
比較例2 フェナントレン89.3部[0.5mol]、p−キシリレングリ
コール69.1部[0.5mol]、p−トルエンスルホン酸(1
水和物)7.9部をガラス製反応器に仕込み、窒素気流
下、撹拌しながら120℃で120分間縮合反応させ、第3表
に示す性状の樹脂を得た。得られた樹脂を実施例と同条
件で硬化特性を測定したところ、硬化には15分間必要で
あった。Comparative Example 2 Phenanthrene 89.3 parts [0.5 mol], p-xylylene glycol 69.1 parts [0.5 mol], p-toluenesulfonic acid (1
7.9 parts of a hydrate) was placed in a glass reactor and subjected to a condensation reaction at 120 ° C. for 120 minutes while stirring under a nitrogen stream to obtain a resin having the properties shown in Table 3. When the curing characteristics of the obtained resin were measured under the same conditions as in the examples, 15 minutes were required for curing.
Claims (4)
一般式−CH2X(ただし、X=OH、Cl、Br)で表される官
能基を2個以上有する芳香族化合物を、酸触媒の存在
下、加熱せしめてなる重縮合物とヘキサメチレンテトラ
ミンとからなる熱硬化性樹脂組成物。1. A condensed polycyclic aromatic hydrocarbon, a phenol,
Hexamethylenetetramine and a polycondensate obtained by heating an aromatic compound having two or more functional groups represented by the general formula —CH 2 X (where X = OH, Cl, Br) in the presence of an acid catalyst. A thermosetting resin composition comprising:
フェノール類との合計モルに対し、モル比で0.2以上で
ある特許請求の範囲第1項記載の熱硬化性樹脂組成物。2. The thermosetting resin composition according to claim 1, wherein the phenols are in a molar ratio of 0.2 or more with respect to the total moles of the condensed polycyclic aromatic hydrocarbon and the phenols.
で表される官能基を2個以上有する芳香族化合物が、縮
合多環芳香族炭化水素とフェノール類の合計モルに対
し、モル比で0.3〜5.0である特許請求の範囲第1〜2項
記載の熱硬化性樹脂組成物。3. The general formula --CH 2 X (where X = OH, Cl, Br).
The aromatic compound having two or more functional groups represented by: is a molar ratio of 0.3 to 5.0 with respect to the total moles of the condensed polycyclic aromatic hydrocarbon and the phenols. The thermosetting resin composition.
で表される官能基を2個以上有する芳香族化合物がキシ
リレングリコールである特許請求の範囲第1〜3項記載
の熱硬化性樹脂組成物。4. The general formula --CH 2 X (where X = OH, Cl, Br).
The thermosetting resin composition according to any one of claims 1 to 3, wherein the aromatic compound having two or more functional groups represented by is xylylene glycol.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7502886A JPH0725995B2 (en) | 1986-03-31 | 1986-03-31 | Thermosetting resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7502886A JPH0725995B2 (en) | 1986-03-31 | 1986-03-31 | Thermosetting resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62230842A JPS62230842A (en) | 1987-10-09 |
| JPH0725995B2 true JPH0725995B2 (en) | 1995-03-22 |
Family
ID=13564314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7502886A Expired - Lifetime JPH0725995B2 (en) | 1986-03-31 | 1986-03-31 | Thermosetting resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0725995B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5998566A (en) * | 1994-12-05 | 1999-12-07 | Mitsubishi Gas Chemical Company, Inc. | Phenol derivatives and process for their production |
-
1986
- 1986-03-31 JP JP7502886A patent/JPH0725995B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62230842A (en) | 1987-10-09 |
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