JPH0727790B2 - IC package carrier - Google Patents

Description

DETAILED DESCRIPTION [Table of Contents] Outline Industrial field of application Conventional technology (Figs. 13 to 18) Problem to be solved by the invention Means for solving the problem Action Example 1st Example (FIGS. 1 to 4) Second Embodiment (FIGS. 5 to 8) Third Embodiment (FIGS. 9 to 12) Effect of the Invention [Outline] In a container for an IC package With respect to the structure of a certain carrier, the IC package housing portion and the at least one corner or side edge of the housing portion are opposed to each other for the purpose of ensuring the holding of the IC package and facilitating the operation of housing and removing the IC package. The IC package includes a main body component provided with a latch component insertion portion and a latch component that is inserted into the insertion portion and clamps an IC package accommodated in the accommodation portion between the main body portion and the IC package. That makes the main body part contact with An elastically deformable arm projecting to at least one side of the projecting piece, wherein the insertion part into which the latch part is slidably inserted toward the accommodating part is inserted into the inserted latch part. It is characterized in that it comprises means for restraining the tip end portion of the arm in the moving direction when the arm is moved in a direction away from the accommodating portion.

[Industrial application field]

The present invention relates to a structure of a carrier that is a container for an IC package, and more particularly to a structure that allows easy accommodation and removal of the IC package and ensures holding of the accommodated IC package.

The lead terminals led out from the main body of the IC package, for example, a large number of lead terminals led out from the main body at a pitch of 0.5 mm have a width of about 0.3 mm. In order to carry such an IC package and insert it into a socket, a carrier that protects a lead terminal having weak mechanical strength and has a positioning means for the IC socket is widely used.

A carrier that houses almost the entire IC package in an exposed state and a socket contact can be contacted with each lead terminal is generally a main body part that houses the IC package,
There are a latch component that holds the IC package between the main component and the main component, and the latch component is integrally formed, and the main component and the latch component are separately formed.

[Conventional technology]

 FIG. 13 is a diagram showing a configuration example of an IC package.

In FIG. 13 (a), the IC package 1 has a plurality of lead terminals 3 led out from the respective side surfaces of the main body 2 accommodating the elements.

In FIG. 13 (b), in the IC package 5, a plurality of lead terminals 7 are respectively led out from the upper surface of the main body portion 6 accommodating the elements in two directions (left direction and right direction) of the main body portion 6, A radiator 8 is provided on the upper surface of the main body 6.

14 to 18 are schematic configuration diagrams showing a conventional carrier that accommodates an IC package.

FIG. 14 is a plan view of the first carrier in which the main body part (main body part) and the latch part (latch part) are integrally formed (a).
3 is a sectional view (B) taken along the line AA in which the IC package is housed in the carrier, and the carrier 11 includes a main body portion 12 and a pair of latch portions 13.

The body portion 12 defines a housing portion 14 for housing the body portion 18 of the IC package 17 in the center, and the housing portion 14 is provided on the left and right sides of the housing portion 14.
A plurality of grooves 15 for individually accommodating the lead terminals 19 of the IC package 17 are provided, and a cantilever-shaped latch portion 13 is provided in front of and behind the accommodating portion 14.

The pair of elastically deformable latch portions 13 are projecting pieces that project inward from the tips to hold the IC package 17 in the housing portion 14.
The protrusion 16 is provided with 16 and is rotatable in the front-back and up-down directions by elastic deformation of the latch portion 13.

The IC package 17 in which the main body 18 is housed in the housing 14 and the lead terminals 19 are fitted in the facing grooves 15 is held by the carrier 11 by the elastic force of the latch 13.

FIG. 15 is a plan view of the second carrier in which the main body part (main body part) and the latch part (latch part) are integrally formed (a).
FIG. 3 is a sectional view (b) taken along the line BB in which the IC package is housed in the carrier, and the carrier 21 includes a main body portion 22 and a pair of latch portions 23.

The main body part 22 defines a housing part 24 for housing the main body part 18 of the IC package 17 in the center, and the left and right sides of the housing part 24 define the housing part 24.
A plurality of grooves 25 for individually accommodating the lead terminals 19 of the IC package 17 are provided, and a latch portion 23 having both ends supporting shape is provided in front of and behind the accommodating portion 24.

The pair of elastically deformable latch portions 23 are projecting pieces that project inward from the center and hold the IC package 17 in the accommodating portion 24.
The projecting piece 26 is provided with 26 and is rotatable in the vertical direction by elastic deformation of the latch portion 23.

The IC package 17 in which the main body 18 is accommodated in the accommodating portion 24 and the lead terminals 19 are fitted in the opposing grooves 25 is held by the carrier 21 by the elastic force of the latch portion 23.

FIG. 16 shows a third carrier in which a main body part (main body part) and a latch part (latch part) are integrally formed (JP-A-58-5644).
No. 4) plan view (a) and its cross-sectional view taken along the line C-C (b)
The carrier 31 is composed of a main body 32 and a pair of latches 33.

The main body portion 32 defines a housing portion 34 for housing the main body portion of the IC package in the center, and a plurality of grooves 35 for individually housing the lead terminals of the IC package are provided on the left side and the right side of the housing portion 34, respectively. The latch portion 33 projects inward from the center of the front side and the rear side of the housing portion 34.

The latch portion 33 includes a protruding piece 36 that protrudes inward from the tip and holds the IC package in the accommodating portion 34, and is rotatable by a groove 37 formed in the root portion of the latch portion 33.
Can be rotated in the vertical direction by the rotation of the latch portion 33.

Groove 35 in which the main body is accommodated in accommodating portion 34 and each lead terminal faces
The IC package (not shown) that fits into the carrier is held by the carrier 31 by the elastic force of the latch portion 33.

FIG. 17 shows a fourth carrier in which a main body part (main body part) and a latch part (latch part) are integrally formed (JP-A-58-5644).
FIG. 4 is a plan view (No. 4) of FIG. 4A and a cross-sectional view of the latch portion accommodating the IC package in the carrier taken along the line DD (b), in which the carrier 41 includes a main body portion 42 and four latch portions 43. .

The main body part 42 defines a housing part 44 for housing the main body part 49 of the IC package 48 in the center, and the IC package 48 is provided on four sides of the housing part 44.
A plurality of grooves 45 for individually accommodating the lead terminals are provided, and a latch portion 43 is provided at each of the four corners of the accommodating portion 44.

Each latch portion 43 that is elastically rotatable by forming the groove 47
Is provided with a projecting piece 46 that projects from the tip toward the housing section 44 and holds the IC package 48 in the housing section 44.
It can be turned up and down by the elastic turning force of 43.

The main body 49 is housed in the housing 44 and each lead terminal (not shown)
The IC package 48 that fits in the groove 45
The elastic force of 43 holds the carrier 41.

FIG. 18 is a side sectional view showing a fifth carrier (Actual No. Sho 60-81654) in which the main body component and the latch component are not integrated,
The carrier 51 is formed by inserting two latch parts 53 into a main body part 52.

The main body part 52 defines a housing portion 54 for housing a main body portion of an IC package (not shown) in the center, and the IC is provided on four sides of the housing portion 54.
Groove 55 for accommodating the lead terminal of the package is provided
Latch parts 53 rotatably supported by shafts 57 are provided outside the four corners 54.

In the illustrated pair of latch components 53, the left side is a state when the IC package is accommodated, and the right side is a state when the IC package is not accommodated. The latch component 53 when the IC package is not housed includes the protruding piece 56 extending above the shaft 57 and the shaft 57.
The IC package having the operation portion 58 extending further downward is rotated so that the latch component 53 is accommodated in the main body component 52, and the IC package accommodated in the accommodating portion 54 is locked at the intermediate portion of the latch component 53. When the projecting projection 59 is adapted to be fitted in the locking recess 60 formed in the main body part 52, it is held by the carrier 51.

[Problems to be Solved by the Invention]

As described above, the conventional IC package carrier is integrally formed with the main body component that defines the housing portion of the IC package and the latch component for holding the IC package between the main body component. Some of them are formed separately from the other, and the protrusions of the latch component that bring the IC package into contact with the main component with an appropriate pressing force are configured to rotate.

The conventional carrier in which the main body component and the latch component are integrally formed has a problem that when repeatedly used, the connecting portion between the main body component and the latch component is gradually plastically deformed and the holding force of the IC package is reduced.

On the other hand, in the conventional carrier in which the main body component and the latch component are separately formed, the one in which the latch component is attached to the main body component and the one in which the main body component and the latch component are separable as described in the section of the prior art. The carrier that holds the IC package due to the rotation of the inserted latch component may fall out of the latch component when it is dropped. There is a problem that the removal operation is troublesome.

Furthermore, all of the conventional carriers except those in which the main body component and the latch component are separated are configured to hold the IC package by rotating the latch portion or the protruding piece formed on the latch component. Lead terminal is derived
The conventional carrier for accommodating the IC package cannot be made long so as not to be disturbed by the lead terminals or disturb the lead terminals, and there is a problem that the holding of the IC package easily becomes unstable.

An object of the present invention is to make the accommodation of the IC package more reliable than before, and to facilitate the accommodation and removal operations of the IC package.

[Means for Solving the Problems]

The present invention which solves the above-mentioned problems provides an IC package accommodating portion (6
4,74,84) and the latch component insertion portion (66,76,
86) provided with a body part (63, 73, 83) and a latch part (63, 73, 83) for inserting into the insertion part and sandwiching the IC package housed in the housing part with the body part The latch component is provided with a protruding piece (63b, 73b, 83d) for bringing the IC package into contact with the main body, and an elastically deformable arm (63e, 63e, protruding at least to one side of the protruding piece). 73e, 83b), the insertion part into which the latch part is slidably inserted toward the accommodating part, the arm when the inserted latch part is moved in a direction away from the accommodating part. Is a carrier for an IC package, characterized in that it is provided with means (66b, 76b, 88) for controlling the front end portion of the above in the moving direction.

[Action]

According to the above means, the projecting piece formed on the latch component for inserting the latch component into the main component and holding the IC package accommodated in the accommodating portion of the main component extends inside and outside the defined area of the accommodating portion. By holding the IC package housed in the carrier by dropping the carrier, the latch component is provided with an arm that moves linearly and urges the protruding piece from the outside to the inside of the defined area. It is not released even if it is released, and it has resistance to repeated use, and for the accommodation and removal operation of the IC package (opening and closing operation of the latch part), for example, a through hole into which a linearly operating pin is fitted is provided in the latch part. It can be automated easily and easily.

〔Example〕

Hereinafter, the IC package carrier according to the present invention will be described with reference to the drawings.

FIG. 1 is a plan view (a) of the carrier according to the first embodiment of the present invention and its rear view (b), and FIG. 2 is an enlarged perspective view of the latch component shown in FIG.

In FIG. 1 and FIG. 2, a carrier 61 for sandwiching an IC package at its four corners is composed of a main body part 62 defined by an IC package accommodating part and a latch part insertion part, and four latch parts 63. It

A main body part 62 formed by molding plastic defines a through hole (accommodation part) 64 for accommodating the main part of the IC package in the center of the upper surface, and the lead terminals of the IC package are fitted to the four sides of the accommodating part 64. The groove 65 is formed, and the insertion portion 66 into which the latch component 63 is inserted is defined outside the four corners of the accommodating portion 64.

The latch part 63 formed by molding plastic is
A sliding portion 63a formed in a rectangular cross section, a projecting piece 63b projecting upward and forward from the front end of the sliding portion 63a, a through hole 63c for operation formed in an intermediate portion of the sliding portion 63a, and a through hole. A pin-shaped protrusion 63d protruding upward from a position rearward of 63c is provided, and a pair of arms 63e protruding forward from the portion where the protrusion 63d is formed in both left and right directions at appropriate inclination angles.

The insertion portion 66, which communicates with the accommodating portion 64 by the groove (guide) 66a into which the sliding portion 63a of the latch component 63 is slidably fitted, has a pair of recesses 66b into which the tips of the arms 63e are fitted.
(A means for suppressing the tip of the arm 63e) and a shelf board member 66c on which the lower surface of the rear end of the latch component 63 slides.
Is provided with a groove 66d into which the projection 63d of the latch part 63 is fitted and slid, and the recess 66b which penetrates the main body part 62 in its thickness direction and whose outer wall surface is inclined with respect to the accommodating portion 64 is A part is covered with the shelf board member 66e.

In the carrier 61 configured as described above, when the latch component 63 is inserted into the insertion portion 66, the protrusion 63b for holding the accommodated IC package in the main body component 62 protrudes into the area of the accommodation portion 64, and the latch component The upper surface of 63 contacts the shelf plate member 66c and the bottom surface of the groove 66a, and the lower surface of the latch component 63 contacts the shelf member 66e at the tip of the arm 63e.

Therefore, when the operation pin is hooked on the through hole 63c and the latch component 63 is pulled in the direction opposite to the center of the accommodating portion 64, the amount of movement of the tip of the arm 63e in the pulling direction is suppressed by the recess 66b. It becomes smaller than that of 63b, and the arm 63e elastically deforms in an arc shape toward the accommodation portion 64.

Then, when the pulling force is removed, the latch component 63 returns to its shape by the elastic restoring force of the arm 63e and advances toward the accommodating portion 64, and the tip of the arm 63e abuts on the innermost portion of the recess 66b and projects. The piece 63b stops in a state where the piece 63b has entered the area of the accommodating portion 64.

The pair of recesses 67 formed in the side ends of the main body component 62 in FIG. 1 are for positioning the carrier 61.

3 is a plan view of the carrier shown in FIG. 1 with the latch component opened, and FIG. 4 is a plan view of the carrier shown in FIG.

In FIG. 3, such a device is fitted in the through hole 63c 4
Using the device that the book pin automatically opens and closes, each latch part
When the 63 is opened outward, the protrusion 63b of each latch component 63 is located outside the accommodating portion 64.

Therefore, the main body 90 of the IC package is housed in the housing 64,
After the lead terminals 91 of the IC package are brought into contact with the bottom surface of the groove 65, the four pins are advanced toward the center of the accommodating portion 64. As shown in FIG.
63b presses the main body portion 90 of the IC package with the lead terminals 91 protruding in all directions toward the main body component 62 with an appropriate pressing force, and the lead terminals 91 are in contact with the bottom surface of the groove 65.
The package is held by the carrier 61.

5 is a plan view (a) of the carrier according to the second embodiment of the present invention and its rear view (b), FIG. 6 is an enlarged perspective view of the latch component shown in FIG. 5, and FIG. FIG. 5 is a plan view of the carrier shown in FIG. 5 with the latch component opened, and FIG. 8 is a plan view of the IC package housed in the carrier shown in FIG.

In FIG. 5 and FIG. 6, a carrier 71 for sandwiching an IC package at its four corners is composed of a main body part 72 defined by an IC package accommodating part and a latch part insertion part, and four latch parts 73. It

A main body part 72 formed by molding plastic defines a through hole (accommodation part) 74 for accommodating the main part of the IC package in the center of the upper surface, and the lead terminals of the IC package are fitted to the four sides of the accommodation part 74. The groove 75 is formed to define the insertion portion 76 into which the latch component 73 is inserted, outside the four corners of the accommodation portion 74.

The latch part 73 formed by molding plastic is
A sliding portion 73a having a rectangular cross section, a protruding piece 73b projecting upward and forward from the front end of the sliding portion 73a, a through hole 73c for operation formed in an intermediate portion of the sliding portion 73a, and a through hole. A pin-shaped protrusion 73d protruding upward from a position rearward of 73c is provided, and an arm 73e protruding forward from one side of the portion where the protrusion 73d is formed is protruded forward at an appropriate inclination angle.

The insertion portion 76, which communicates with the accommodating portion 74 by the groove (guide) 76a into which the sliding portion 73a of the latch component 73 is slidably fitted, has a recess (the tip portion of the arm 73e) into which the tip portion of the arm 73e fits. 76b) and a shelf plate member 76c on which the lower surface of the rear end of the latch part 73 slides, and the shelf plate member 76c is provided with a groove 76d on which the projection 73d of the latch part 73 fits and slides. A recess 76b, which penetrates the main body part 72 in its thickness direction and whose outer wall surface is inclined with respect to the accommodating portion 74, is formed such that a part of its tip is covered with the shelf plate member 76e.

In the carrier 71 configured as described above, when the latch component 73 is inserted into the insertion portion 76, the protruding piece 73b for holding the accommodated IC package in the main body component 72 protrudes into the area of the accommodation portion 74, and the latch component 73 The upper surface of 73 contacts the shelf member 76c and the bottom surface of the groove 76a, and the lower surface of the latch component 73 contacts the shelf member 76e at the tip of the arm 73e.

Therefore, when an operation pin is hooked on the through hole 73c and the latch component 73 is pulled in the direction opposite to the center of the accommodating portion 74, the movement amount of the tip of the arm 73e in the pulling direction is suppressed by the recess 76b. It becomes smaller than that of 73b, and the arm 73e elastically deforms in an arc shape toward the accommodation portion 74.

Then, when the pulling force is removed, the latch component 73 returns to its shape by the elastic restoring force of the arm 73e and advances toward the accommodating portion 74, and the tip of the arm 73e abuts on the innermost portion of the recess 76b to project. The piece 73b stops in a state where the piece 73b has entered the area of the housing portion 74.

In FIG. 5, a pair of recesses 77 formed at the side end portions of the main body part 62 are for positioning the carrier 71.

In FIG. 7, when each latch part 73 is opened outward by using an appropriate device, for example, a device in which four pins fitted into the through holes 73c are automatically opened and closed, the protruding pieces 73b of each latch part 73 are It comes to be located outside the housing portion 74.

Therefore, the main body 90 of the IC package is housed in the housing 74,
After the lead terminals 91 of the IC package are brought into contact with the bottom surface of the groove 75, the four pins are advanced toward the center of the accommodating portion 74. As shown in FIG.
73b presses the main body portion 90 of the IC package with the lead terminals 91 protruding in all directions toward the main body component 72 with an appropriate pressing force, and the lead terminals 91 are in contact with the bottom surface of the groove 75.
The package is held by the carrier 71.

FIG. 9 is a plan view (a) of the carrier according to the third embodiment of the present invention, its rear view (b) and EE cross sectional view (c),
FIG. 10 is an enlarged perspective view of the latch component shown in FIG.

In FIG. 9 and FIG. 10, a carrier 81 for sandwiching the IC package between two side edge portions of its main body portion is a main body component 82 defined by an IC package accommodating portion and a latch component insertion portion.
And a pair of latch parts 83.

The latch component 83 formed by molding plastic is
A pair of arms 83b extend toward the left side and the right side from the rectangular central portion 83a, and a projecting piece 83d is provided above and through the central portion 83a having a through hole 83c for operation formed in the center. Each arm 83b is provided with a projecting piece 83e projecting rearward at the tip thereof, and a pair of notches 83f are formed on the upper surface of the tip of the central portion 83a along the opposing sides thereof.

A main body part 82 formed by molding plastic defines an accommodating part (through hole) 84 for accommodating the main part of the IC package in the center of the upper surface, and the lead terminals of the IC package are provided in front of and behind the accommodating part 84. Is formed to define a pair of insertion portions 86 which are separated from each other in the left-right direction by a bar-shaped portion 87, and recesses 89 for positioning the carrier 81 are provided at three positions.

The central portion 83 of the latch component 83 is slidably fitted in the left-right direction, and the insertion portion 86 that linearly guides the latch component 83 toward the accommodating portion 84 has front and rear portions (upper portion in FIG. 9). And a pair of through holes 88 through which the protruding pieces 83e of the arm 83b project, and the insertion portion 86 has a pair of shelf plate members 86a with which the lower surface of the central portion 83a of the latch component contacts, and a cutout portion of the latch component 83. The shelf plate member 86b is fitted in the 83f, and a part of the upper surface of each through hole 88 is covered by the shelf plate member 88a.

In the carrier 81 configured as described above, when the central portion 83a of the latch component 83 is inserted into the insertion portion 86, the projecting piece 83d for holding the accommodated IC package in the main body component 82 is the accommodation portion 84.
Of the shelf part 86b.
And 86a are slidable in a state of being sandwiched between them, and the protruding piece 83e which is provided at the tip of the arm 83b and protrudes into the through hole (a restraining means of the tip of the arm 83b) 88 is a shelf plate for preventing the pulling out. Member 88a
Engage with.

Therefore, when an operating pin is hooked in the through hole 83c and the latch component 83 is pulled in the direction opposite to the center of the housing portion 84, the amount of movement of the tip of the arm 83b in the pulling direction is suppressed by the through hole 88, and the protruding piece Arm 83b because it is smaller than that of 83d
Is elastically deformed in a bow shape with respect to the accommodating portion 84.

Next, when the pulling force is removed, the latch component 83 returns to its shape by the elastic restoring force of the arm 83b, and the projecting piece 83d advances toward the accommodating portion 84 and the latch component central portion 83a.
Stops with the tip of the abutting contact with the bar 87.

FIG. 11 is a plan view of the carrier shown in FIG. 9 with the latch component opened, and FIG. 12 is a plan view of the carrier shown in FIG.

In FIG. 11, an appropriate device, for example, a device that automatically opens and closes two pins fitted into the through holes 83c is used, and when the pair of latch parts 83 is opened to the outside, the protruding pieces 83d of each latch part 83 are accommodated. It comes to be located outside the portion 84.

Therefore, the main body 92 of the IC package is housed in the housing 84,
After the lead terminals 93 of the IC package are brought into contact with the bottom surface of the groove 85, and then the latch component 83 is closed, as shown in FIG.
The IC package is held by the carrier 81 in a state in which 2 is pressed against the main body part 82 with an appropriate pressing force and the lead terminal 93 contacts the bottom surface of the groove 85.

〔The invention's effect〕

As described above, in the carrier of the present invention, the latch component is inserted into the main body component, and the projecting piece formed on the latch component for holding the IC package accommodated in the main body component accommodating portion is the definition area of the accommodating portion. Of the IC package accommodated in the carrier by being provided with an arm for urging the protrusion from the outside of the defined region toward the inside of the defined region. The holding of the IC is reliable even if the carrier is dropped, and it has resistance to repeated use, and the operation of accommodating and ejecting the IC package (operation of opening and closing the latch parts) is performed by, for example, a pin that operates linearly. There is an effect that it is easy and can be automated by providing a through hole into which the above-mentioned is fitted in the latch component.

[Brief description of drawings]

1 is a carrier according to a first embodiment of the present invention, FIG. 2 is a perspective view of the latch component shown in FIG. 1, and FIG. 3 is a plan view of the latch component of the carrier shown in FIG. 4 is a plan view of the IC package housed in the carrier shown in FIG. 1, FIG. 5 is a carrier according to a second embodiment of the present invention, FIG. 6 is a perspective view of the latch component shown in FIG. 5, and FIG. 5 is a plan view of the carrier shown in FIG. 5 with the latch component opened, FIG. 8 is a plan view of the IC package housed in the carrier shown in FIG. 5, and FIG. 9 is a carrier according to a third embodiment of the present invention. Fig. 10 is a perspective view of the latch part shown in Fig. 9, Fig. 11 is a plan view of the carrier shown in Fig. 9 with the latch part opened, and Fig. 12 is an IC package for the carrier shown in Fig. 9. The housed plan view, Fig. 13 is an example of IC package structure, Fig. 14 is the conventional first carrier, 15 Figure conventional second carrier, FIG. 16 third conventional carrier, Figure 17 is a conventional fourth carrier, FIG. 18 is a conventional fifth carrier. In the figure, 61, 71, 81 are carriers, 62, 72, 82 are body parts, 63, 73, 83 are latch parts, 63b, 73b, 83d are protrusions, 63e, 73e, 83b are arms, 64, 74 , 84 is the IC package housing part, 66, 76, 86 is the latch part insertion part, 66a, 76a is a groove for guiding the latch part, 66b, 76b is a recess for restraining the arm tip part, and 88 is the arm tip part. A through hole for suppression is shown.

Claims (1)

[Claims] 1. A main body component having an IC package accommodating portion and a latch component insertion portion facing at least at one corner or side edge of the accommodating portion, and an IC inserted in the insertion portion and accommodated in the accommodating portion. A latch part for sandwiching the package between the main body part and the latch part, the latch part projecting the IC package against the main body part, and projecting at least to one side of the projecting part and elastically deforming. A movable arm, wherein the insertion part, into which the latch component is slidably inserted toward the accommodation part, moves when the inserted latch component moves away from the accommodation part. A carrier for an IC package, comprising a means for controlling a tip portion in the moving direction.