JPH0727806B2 - Thick film printing method on substrate - Google Patents

Description

Detailed Description of the Invention [Industrial applications]

According to the present invention, when a large number of thick film elements for a unit electronic device are collectively formed by printing on a substrate for an electronic device, the thick film element is formed at an extremely accurate position in each area for the unit electronic device on the substrate. It relates to an improved device capable of printing.

[Prior art]

For example, an electronic device such as a chip resistor adopted as a component of a hybrid electronic device is manufactured by forming a large number of electronic devices on a ceramic substrate by a thick film printing method and dividing the electronic devices into individual electronic devices. The approach is taken. That is, first, V-groove-shaped split grooves are formed at equal intervals in the X and Y directions by a blade on the surface of a semi-dried ceramic substrate material before sintering. Then, when this is sintered in a furnace, as shown in FIG. 8, a ceramic substrate 3 having lattice-shaped split grooves is obtained. By applying a thick film forming method by screen printing to this substrate, the resistive coating 11 is formed in each unit region A ... Enclosed by the lattice-shaped dividing grooves on the surface of the substrate.
The electrode coating 12 is formed (see FIG. 7). Then,
It is possible to obtain an assembly of unit chip resistors in a plurality of rows and a plurality of columns formed on the surface of the ceramic substrate 3. Finally, the ceramic substrate is divided by the dividing grooves and the electrode portions are solder-plated to obtain the separated chip resistors C as shown in FIG. By the way, when the resistance coating 11 and the electrode coating 12 are printed on the ceramic substrate, the relative positions of the print pattern on the printing mask and the grid-shaped dividing grooves on the ceramic substrate are defined by rectangular areas A surrounded by grids. It is necessary to position the thick film element so that the thick film element can be accurately printed at a predetermined portion of. Conventionally, as shown in FIG. 8, this positioning is performed by bringing the end edges of the ceramic substrate 3 into contact with a plurality of positioning pins 2 ... It was just positioning. However, the ceramic substrate 3 often has burrs on its edges when it is formed, and the burrs cannot accurately position the ceramic substrate 3, resulting in misalignment of the thick film element. There was a problem of causing. Further, even if the above-mentioned burr does not occur, the above-mentioned misalignment of the split groove may occur. In this case, even if the position of the ceramic substrate is determined, the grid-shaped Print displacement of the thick film element with respect to the split groove will occur. In any case, if the above-mentioned print misalignment occurs, all electronic devices that should be obtained from the ceramic substrate become defective. In addition, since electronic devices that undergo such manufacturing processes are often extremely small, it is very difficult to perform the above-described inspection of print misregistration without error, and an inspection person is required. There were many disadvantages to him. The present invention was devised under the circumstances as described above, and it is possible to always perform accurate thick film element printing irrespective of the outer shape of the substrate and the deviation in the formation of the grid-shaped split grooves. The task is to provide a method.

[Means for solving the problem]

In order to solve the above problems, the present invention takes the following technical means. That is, the method of the present invention is a method in which a substrate provided with a print position pattern is sequentially transferred from a recognition position for recognizing the print pattern to a print position, and thick film printing is performed on the substrate with a predetermined print mask. The mask is provided with a recognition target pattern in which a predetermined positional relationship is determined with respect to the printing pattern for printing the thick film, and it is possible to reciprocate a predetermined distance between the recognition position and the printing position, and X A support table capable of controlling the postures in the Y direction and the θ direction is provided, and (a) the first substrate is placed on the support table at the recognition position, and the support table is moved to the printing position to move the substrate. Printing on the substrate and returning the support table to the recognition position as it is, (b) a step of recognizing the recognition mark printed on the substrate and detecting the posture of the printing pattern. After the preparatory process consisting of the following steps, the second and subsequent substrates are: (c) Detecting the posture of the substrate by recognizing the printing position pattern of the substrate placed on the support table at the recognition position, (D) Comparing the posture of the substrate detected in step (c) with the posture of the print pattern obtained in step (b), the support table is set so that the print position pattern corresponds to the print pattern. XY direction and θ
Position control in the direction, (e) printing a predetermined thick film element on the substrate that has been position-controlled and moved to the printing position with the above print mask, (d) discharging the substrate after thick film printing The feature is that it is repeated.

[Action]

In steps (a) and (b), a thick film is trial-printed on the first substrate. The process from the recognition position of the support table to the printing position is determined, and at least two recognition marks printed with the thick film are formed on the support table that has returned to the recognition position. Since the positional relationship with the thick film is determined in a predetermined manner, by recognizing this recognition target, the posture of the printing pattern of the mask for printing the thick film in the printing apparatus, that is, It is possible to detect the position in the X and Y directions and the rotation direction (θ direction). θ
The position in the direction can also be detected because the inclination of the line segment connecting the two recognition targets can be measured. The print pattern position detection data is stored in a predetermined storage device. For the second and subsequent substrates, the orientation of the printing position pattern, which is formed on the grid-like split grooves as shown in FIG.
For example, it is detected by recognizing the recognition target provided at the same time when this is formed. That is, the positions of the grid-shaped split grooves in the X and Y directions and the rotation direction (θ direction) are detected. From the above, the postures of the print pattern in the X, Y and θ directions and the postures of the print position pattern on the substrate in the X, Y and θ directions when the print pattern is placed on the support table and moved to the print position as it is are known. Therefore, in order to make the print position pattern correspond to the print pattern, it is possible to naturally define how much the print position pattern should be moved in the X / Y direction and the θ direction. In this way, the support table is controlled in the X and Y directions and the θ direction so that the printing position pattern of the substrate corresponds to the printing pattern while moving to the printing position. Therefore, the thick film is printed on the substrate on the support table that has been moved to the printing position, at the printing position pattern, that is, at the correct position within each area surrounded by the split groove.

【effect】

As described above, in the thick film printing method for a substrate of the present invention, the mutual positional relationship between the print pattern of the printing mask and the print position pattern on the substrate is adjusted so that the thick film is printed on the substrate. Therefore, as compared with the conventional method in which the board is positioned based on the outer shape of the board, the printing accuracy is significantly improved, and the occurrence rate of defective products can be suppressed as much as possible. As a result, an inspection staff or the like for inspecting the print misalignment becomes unnecessary, which greatly contributes to the reduction of the manufacturing cost of the electronic device. Moreover, in the present invention, since the posture of the print pattern of the mask is detected each time by test printing,
There is no need to determine the position of the print pattern with respect to the printing machine. As a result, it becomes easy to manufacture the mask and attach the mask to the printing machine. Further, even if some burrs are generated on the edge portion of the substrate, the accuracy of thick film printing is not adversely affected, so that the manufacturing thereof becomes easy.
Further, regarding this substrate as well, the posture of the print position pattern formed on the surface is detected for each, and the print position pattern thus detected is adapted to the posture of the print pattern of the mask. Even when the substrate is transferred to the support table, the precision is not so required, and as a result, the substrate handling becomes very easy. By integrating such things, the manufacturing efficiency and the quality improvement of the electronic device of this kind are achieved.

[Explanation of Examples]

Hereinafter, embodiments of the present invention will be specifically described with reference to the drawings. It should be noted that the examples relate to the printing method of the thick film element in the manufacturing process of the chip resistor. First, the substrate 3 used in the method of the present invention is manufactured as follows. As shown in FIGS. 1 and 2, on the surface of the ceramic substrate material 4 placed in a semi-dry state, a predetermined interval is provided in the X direction by a blade 5 connected to an external drive mechanism (not shown), Further, first split grooves 6 having a V-shaped cross section are formed so as to extend in the Y direction. At that time, the ceramic substrate material 4
By forming a protrusion such as a pin in the peripheral marginal area of the, two through-hole-shaped first identification marks 7 and 7 having a fixed positional relationship with the first split groove 6 are formed. To be done.
Then, second split grooves 8 having a V-shaped cross section are formed at predetermined intervals in the Y direction and extend in the X direction in the same manner as the first split grooves. At that time, the ceramic substrate material 4
In the peripheral marginal area, two through hole-shaped second recognition marks 9 and 9 having a fixed relationship with the second dividing grooves 8 are formed in the same manner as the first recognition mark. In this way, on the upper surface of the substrate material 4, the lattice-shaped slits composed of the first slits 6 ... And the second slits 8, and the first identification marks 7, 7 and 7 associated with the first slits 6 ... A printing position pattern including the second recognition marks 9 and 9 associated with the second dividing grooves 8 is formed. Then, the substrate material 4 is fired and solidified in a heating furnace to obtain a ceramic substrate 3 to be used for thick film element printing described later. On the other hand, as shown in FIG. 3, the mask 10 mounted on the printing apparatus has an electrode coating 12 or a resistance coating 11 (see FIG. 5 and FIG. 5) at a predetermined position in each area A surrounded by the grid-like dividing grooves. A print pattern 13 for forming (see FIG. 7) by screen printing is formed. Fig. 3 shows the resistance film
The print pattern 13 for printing 11 is shown. And then
In addition to the print pattern 13, the mask 10 is provided with a recognition target pattern 15 for forming two third recognition targets 14 by printing in a predetermined positional relationship with the print pattern 13. . As a result, when the resistance coating 11 is printed on the ceramic substrate 3 using the mask 10, the third identification mark 14 is also printed and formed at the same time as shown in FIGS. 6 and 7. Support table 16 for sequentially receiving the above ceramic substrates 3
Is reciprocated between a recognition position indicated by a chain double-dashed line in FIG. 4 and a printing position indicated by a solid line, and is position-controlled in the X and Y directions and the rotation direction (θ direction). . In this example, as shown in FIG.
And the rotary table 18 are combined. Of the XY tables, the X-direction drive mechanism also has a function of reciprocating the support table 16 for a fixed distance between the recognition position and the printing position, and the Y-direction drive mechanism is
The support table 16 also has a function of reciprocating between the substrate receiving position indicated by the alternate long and short dash line in FIG. 4 for receiving the substrate from the substrate magazine 19 and performing temporary positioning, and the above-mentioned recognition position. Although not shown in FIG. 4, the mask 10 supported by the support mechanism of the printing apparatus stands by above the support table 16 at the printing position, and the support table 16 is When it reaches the printing position, the support table 16 rises or the mask 10 descends to place the mask 10 on the ceramic substrate 3 and the squeegee on the mask 10 moves to cause the ink for the resistance film on the mask to move. Print pattern
According to 13,15, the image is transferred onto the ceramic substrate and printed. As described above, the ceramic substrate 3 having the grid-shaped dividing grooves and the first recognition marks 7, 7 and the second recognition marks 9, 9 is formed with the printing pattern 13 and the printing pattern 15 of the third recognition mark in the printing device. The printing method for thick film elements according to the method of the present invention using the printed mask 10 and the supporting table 16 shown in FIG. 4 is performed as follows. In this case, for the substrate 3 on which the electrode coating 12 is already printed as shown in FIG. 5, the resistance coating 11 is formed by using the printing mask of FIG.
A case of printing will be described. In FIG. 4, first, the first ceramic substrate 3
The support table 16 that has received (from the state shown in FIG. 1) from the substrate magazine 19 is sequentially transferred from the substrate receiving position and the recognition position to the printing position, and trial printing with the mask 10 is performed. At this time, as shown in FIGS. 6 and 7, the resistance coating 11 and the third recognition mark 14 are printed on the ceramic substrate 3 and then returned to the recognition position as they are. In this case, in the XY table 17, only the X-direction driving device is reciprocally driven, and therefore the mask 10
The printed pattern 13 of 1 is reproduced on the ceramic substrate 3 at the recognition position which is apart from the mask 10 by a certain distance in the X direction. Here, the optical recognition device 20 recognizes the third recognition marks 14 and 14, and thereby the X of the print pattern 13 is detected.
-Detect the postures in the Y direction and the θ direction and store them in a predetermined storage device. Print pattern 13 because two points are recognized
It is possible to detect not only the position in the X and Y directions but also the position in the θ direction. This includes, for example, two third recognition marks.
The coordinates of the center of the line segment connecting 14 and 14 (for example, this is made to correspond to the centroid of the print pattern 13) and the inclination of the line segment connecting the two third recognition targets 14 and 14 with respect to the Y axis (θ ) May be calculated from the binarized image. The above-mentioned first ceramic substrate 3 has a printed pattern 13
It is used only for detecting the posture of the robot, and is discharged and discarded after the above recognition is performed. The printing of the resistance coating 11 on the second and subsequent ceramic substrates 3 is performed as follows. The second ceramic substrate 3 from the substrate magazine 19 (first
The support table 16 that has received (in the state shown in the figure)
Transferred to the recognition position. Here, the optical recognition device 20
Recognizes the first recognition marks 7 and 7 and the second recognition marks 9 and 9 on the ceramic substrate 3 to determine the positions of the grid-shaped slits formed on the ceramic substrate in the X, Y and θ directions. To detect. For this, for example, the following method is used. That is, the position in the X direction of the first split grooves 6 ... That extends in the Y direction is particularly problematic, and the position of the second split grooves 8 ... That extends in the X direction is particularly problematic in the Y direction. , 7 to detect the position of the first split groove 6 in the X direction, and the second recognition marks 9 to detect the position of the second split groove 8 in the Y direction to detect the grid-shaped split grooves, that is, First split groove 6a, 6
The centroid coordinates of the rectangular region B surrounded by b and the second split grooves 8a, 8b at both ends can be obtained. Then, for example, by detecting the inclination of the line segment connecting the two points of the first recognition target 7, 7, it is possible to detect the deviation of the grid-shaped dividing grooves in the θ direction. As a result, it is possible to detect the positions of the grid-shaped split grooves in the X and Y directions and the θ direction. As described above, the postures of the print pattern 13 in the X and Y directions and the θ direction at the print position, in other words, the coordinates of the centroid of the print pattern 13 and the rotational deviation of the print pattern (the θ direction position).
Therefore, in order to make the grid-shaped dividing grooves on the substrate 3 moved from the recognition position to the printing position correspond to the printing pattern 13, the support table 16 is moved in the XY directions and θ.
You can see how to move in the direction. To this end, while the support table 16 shifts from the recognition position to the printing position, the center of the rectangular area B forming the grid-shaped dividing groove is aligned with the center of the printing pattern 13 by X.
After driving the Y table, the inclination of the area B (θ)
However, the rotary table 18 may be driven so as to match the inclination (θ) of the print pattern 13. When printing is performed after controlling the support table 16 in this way, the grid pattern formed by the dividing grooves and the printing pattern are accurately matched, and therefore, in the unit area A surrounded by each dividing groove, The resistance coating 11 is printed and formed at the correct position. After printing, the printed substrate 3 (in the state shown in FIGS. 6 and 7) is discharged by a predetermined discharging means, and the third and subsequent ceramic substrates 3 are discharged.
Are sequentially printed in the same manner as the above procedure. The electrode coating 12 has already been printed before printing the resistance coating 11. The same method as described above is applied to the printing of the electrode coating 12, and the identification mark 14 'in FIGS. 5 to 7 indicates the posture of the print pattern of the mask when the electrode coating 12 is printed. It is a recognition target for detection. Since the identification mark 14 'on the ceramic substrate 3 on which the electrode coating 12 is normally printed should have a fixed relationship with the pattern of the grid-shaped dividing grooves, therefore, when the resistance coating 11 is printed. It is also possible to use this recognition mark 14 'in place of the above-mentioned first and second recognition marks 7, 7, 9, 9 when detecting the attitude of the lattice-shaped dividing grooves of the ceramic substrate. Of course, the scope of the present invention is not limited to the above embodiments. The electronic device is not limited to a chip-type resistor, and can be applied to all electronic device manufacturing processes in which a thick film element is formed by a printing unit on a chip-type substrate to be manufactured. Further, in the embodiment, the X-direction drive mechanism of the X / Y table also has a function of reciprocating the support table 16 from the recognition position to the printing position by a predetermined distance.
The Y table or the rotary table may be reciprocally conveyed by a predetermined distance on a feeder that directly reciprocates. Further, in the embodiment, each recognition mark is formed at two locations. However, if the number of recognition marks is increased, for example, even variations in shrinkage during sintering of the ceramic substrate 3 itself are detected, and this substrate is further detected. It is also possible to increase the positioning accuracy of the printing pattern with respect to the.

BRIEF DESCRIPTION OF THE DRAWINGS The drawings show an embodiment of the present invention. FIG. 1 is a plan view of a ceramic substrate used in the method of the present invention, and FIG. 2 is II- of FIG.
FIG. 3 is an enlarged sectional view taken along line II, FIG. 3 is a plan view of a printing mask for printing a resistance film, FIG. 4 is a schematic perspective view of an example of a ceramic substrate supporting table used in the method of the present invention, and FIG. 5 is an electrode film. FIG. 6 is an enlarged view of the ceramic substrate in the state in which is printed, FIG. 6 is a plan view of the ceramic substrate in which the electrode coating and the resistance coating are printed, FIG. 7 is an enlarged view of FIG. 6, and FIG. FIG. 9 is an explanatory view of a conventional method, and FIG. 9 is an overall enlarged perspective view of a chip resistor which is an example of an electronic component manufactured by applying the method of the present invention. 3 ... Substrate, 6,7,8,9 ...... Printing position pattern (6 ... First split groove, 7 ... First recognition mark, 8 ... Second split groove, 9 ...
… Second recognition mark), 10 …… Print mask, 13 …… Print pattern, 14 …… (Third) recognition mark, 16 …… Support table, 20…
… Optical recognition device.

Claims (1)

[Claims] 1. A method of sequentially transferring a substrate provided with a print position pattern from a recognition position for recognizing the print pattern to a print position and performing thick film printing on the substrate with a predetermined print mask, wherein the print mask is used. , A recognition target pattern in which a predetermined positional relationship is determined with respect to a printing pattern for printing a thick film is provided, the recognition position and the printing position can be reciprocally moved by a predetermined distance, and XY A support table that can control the orientation in the direction and the θ direction is provided, and (a) the first substrate is placed on the support table at the recognition position, the support table is moved to the printing position, and printing is performed on this substrate. And (b) recognizing the recognition mark printed on the substrate to detect the posture of the printing pattern, and returning the support table to the recognition position as it is. After the preliminary preparation, the second and subsequent substrates are (c) detecting the posture of the substrate by recognizing the printing position pattern of the substrate placed on the support table at the recognition position, (d) In comparison between the posture of the substrate detected in step (c) and the posture of the print pattern obtained in step (b), the support table is moved in the X and Y directions so that the print position pattern corresponds to the print pattern. And θ
Position control in the direction, (e) printing a predetermined thick film element on the substrate that has been position-controlled and moved to the printing position with the above print mask, (d) discharging the substrate after thick film printing A method for printing a thick film on a substrate, characterized in that the above steps are repeated.