JPH0727993B2 - Semiconductor chip carrier and semiconductor device - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a semiconductor chip carrier used for mounting a semiconductor, and more particularly to a surface mounting semiconductor chip carrier.

[Conventional technology]

As a semiconductor chip carrier composed of a printed wiring board, one shown in FIG. 5 is known. The semiconductor chip carrier C has a conductive pattern 2 at the peripheral portion of a printed wiring board in which the conductive pattern 2 is provided on the surface of the insulating layer 1.
And the external terminal 3 are joined together. This semiconductor chip carrier C has a semiconductor chip 7 mounted on the central portion thereof, is connected and assembled with the conductive pattern 2 by a wire 8, and is mounted on a mother board 6 as a semiconductor device having a resin sealing layer 9 for protecting the semiconductor chip 7. To be implemented. However, when the external terminal 3 of this semiconductor device is mounted on the mother board 6 by soldering, the conductive pattern 2 and the external terminal 3 are
In the semiconductor chip carrier C, which is joined by commonly used soldering, there is a problem that the soldered portion 4 is melted at the same time and the connection between the external terminal 3 and the conductive pattern 2 is broken. This phenomenon occurs in the case of the conventional insertion mounting in which a semiconductor device having pins vertically as an external terminal from an insulating layer is inserted into a through hole provided on a mother board and soldered.
Compared to the fact that the heat of soldering applied on the side opposite to the side on which the semiconductor device is mounted is blocked by a kind of heat insulating material called a motherboard, in the case of surface mounting the heat of soldering is applied from the same side as the semiconductor device. Therefore, the problem that the solder at the joint portion where the conductive pattern and the external terminal are connected and fixed by soldering is melted becomes more serious. Therefore,
In a semiconductor device used for surface mounting, it is necessary to avoid melting of the joint portion where the external terminal is connected and fixed to the conductive pattern.

[Problems to be Solved by the Invention]

It is an object of the present invention to provide a semiconductor chip carrier in which a conductor pattern on a surface of a printed wiring board of a semiconductor chip carrier and an external terminal are firmly joined to each other, and a semiconductor device including the semiconductor chip carrier can be surface-mounted by soldering to a motherboard. .

[Means for Solving the Problems]

In order to solve the above-mentioned problems, the present invention provides a peripheral portion of a printed wiring board in which a conductive pattern is provided on the surface of an insulating layer, and an external terminal joined to the conductive pattern and the joint portion are covered. Another object of the present invention is to provide a semiconductor chip carrier characterized by having an insulating band formed on the.

〔Example〕

A detailed description will be given below with reference to the drawings. FIG. 1 is a perspective view of a semiconductor chip carrier according to an embodiment of the present invention in which a semiconductor chip is mounted and wire-bonded.
The figure shows a state in which the semiconductor device having a structure in which the semiconductor chip carrier of FIG. 1 is sealed with a resin to protect the semiconductor chip is surface-mounted on the mother board in an X-Y sectional view of FIG. Is. Second embodiment according to the present invention
In the semiconductor chip carrier A shown in the figure, a portion 4 for joining the conductive pattern 2 and the external terminal 3 is formed in the peripheral portion of the printed wiring board consisting of the insulating layer 1 and the conductive pattern 2 provided on the surface thereof. An insulating band 5 is formed on the peripheral edge of the printed wiring board so as to cover and cover the joint portion 4, and an adhesive material having fluidity is hardened. Preferably, the insulating strip 5 is formed in a peripheral wall of the printed wiring board in the shape of a dam, and the insulating strip 5 forms a recess on the surface of the printed wiring board. A semiconductor device having a structure in which the semiconductor chip 7 is mounted inside the recess of the semiconductor chip carrier A, is connected and assembled with the conductive pattern 2 by the wire 8, and the resin sealing layer 9 is formed to protect the semiconductor chip 7. When this semiconductor device is mounted on the mother board 6 by soldering, even if the joint portion 4 between the conductive pattern 2 and the external terminal 3 is joined by soldering which is commonly used, Since the insulating band 5 formed by hardening the adhesive having fluidity is formed on the peripheral portion of the printed wiring board so as to cover the printed wiring board, the joint portion does not easily come off. It is to be noted that a semiconductor chip is mounted on a semiconductor chip carrier B showing another embodiment in which the insulating band 5 is formed of a heat conductive material, and the heat conductive band 10 is provided on the surface of the insulating band 5, and wire bonding is performed. 3 is a perspective view of FIG. 4 and FIG. 4 is a sectional view taken along the line XY of FIG. 3. The semiconductor chip carrier B of FIG. 4 is sealed with resin to protect the semiconductor chip. The semiconductor device configured as above is shown in a usage state in which the semiconductor device is surface-mounted on a motherboard. The semiconductor chip 7 is mounted inside the recess formed in the dam-like shape of the semiconductor chip carrier B, is connected and assembled with the conductive pattern 2 by the wire 8, and the resin sealing layer 9 is formed to protect the semiconductor chip 7. When the semiconductor device having the above-described configuration is obtained and the semiconductor device is mounted on the mother board 6 by soldering, the heat of the soldering on the mother board 6 causes the external terminal 3, the connecting portion 4 between the conductive pattern 2 and the external terminal 3, Next, the adhesive material having excellent thermal conductivity moves to the cured insulating band 5, and further moves to the thermal conductive band 10 which has excellent thermal conductivity and is formed like a dam in the peripheral portion of the printed wiring board. Dissipate heat. By this action, even if the joint portion 4 between the conductive pattern 2 and the external terminal 3 is connected and fixed by soldering, the mounting on the mother board 6 by soldering can be completed before the joint portion 4 melts. Therefore, the possibility that the external terminal 3 which has been connected and fixed by soldering first will be separated from the conductive pattern 2 is further reduced.

Next, materials used for the semiconductor chip carrier of the present invention will be described. As the insulating layer 1 of the printed wiring board constituting the semiconductor chip carrier of FIGS. 2 and 4, an insulating material obtained by curing a resin of a prepreg obtained by impregnating a base material with a resin and drying is used. Here, as the resin of the insulating layer 1, a resin having excellent heat resistance and moisture resistance and a resin purity, particularly a small amount of ionic impurities, is preferable. Specifically, resins such as epoxy resin, polyimide resin, unsaturated polyester resin, fluorine resin, and PPO resin are suitable. Insulation layer 1
As the base material of (1), an inorganic material such as glass fiber is preferable to paper because of its excellent heat resistance and moisture resistance.

The conductive pattern 2 provided on the surface of the insulating layer 1 can be appropriately selected and applied from copper, brass, aluminum, iron, stainless steel, etc. Among them, copper is particularly preferable because of its excellent conductivity. In forming the conductive pattern 2, various methods such as an additive method and a subtractive method are used.

As the external terminal 3, copper, phosphor bronze, aluminum,
Appropriately selected and applied from thin plates of metals such as iron and 42 alloy (Ni-42% Ni-Fe alloy) formed by pressing or etching. Among them, 42 alloy has a small thermal expansion coefficient and high strength. It is excellent and particularly preferable.

The joint portion 4 can be formed by tin-lead solder which is generally used for resin printed wiring boards. However, the solder composition is not particularly limited as long as it is a solder composition having a use temperature that does not damage the resin printed wiring board. Also,
A resin adhesive containing metal powder may be used, or the metal powder may be silver or copper, and the binder resin may be formed of a resin composition using an epoxy resin, a polyimide resin, or a modified resin thereof.

As the insulating band 5 which covers the joint portion 4 and is formed in a dam-like shape in the peripheral portion of the printed wiring board, a thermosetting resin or a thermoplastic resin having heat resistance is used, such as an epoxy resin in the former case.
A polyimide resin, an unsaturated polyester resin, a phenol resin, or the like, and the latter can be appropriately used from among polyimide resin, polyether ether ketone resin, polyphenylene sulfide resin, polyether sulfone resin, and the like. It is more preferable that the resin is composed of a cured product obtained by curing an adhesive material having excellent insulating properties and thermal conductivity, in which alumina, boron nitride, or alumina nitride is used as a filler with these resins as a binder.

Utilizing the adhesiveness of this adhesive material, the heat conduction band 10 formed in a dam-like shape at the peripheral portion of the printed wiring board is a ceramic such as alumina, boron nitride, or alumina nitride, or copper, brass, aluminum, iron, stainless steel. Can be appropriately selected and applied from metals such as aluminum, and among them, aluminum is particularly preferable because it is light and has excellent thermal conductivity.

The resin encapsulating layer 9 can be composed of a cured product obtained by curing an epoxy resin encapsulating molding material, a polyimide resin encapsulating molding material, a polyphenylene sulfide resin encapsulating molding material, or the like which is usually used for this purpose, and has a moisture resistance. An epoxy resin encapsulating molding material is particularly preferable in terms of excellent properties.

〔The invention's effect〕

As described above, according to the present invention, in a semiconductor chip carrier, an external terminal is bonded to a conductive pattern at a peripheral portion of a printed wiring board, and an insulating band, which is hardened by an adhesive material and covers the bonded portion, has a dam-like shape at the peripheral portion of the printed wiring board. As a result, the concave portion is formed on the surface of the printed wiring board. A semiconductor chip is mounted in the recess of such a semiconductor chip carrier, and is connected and assembled with a conductive pattern by wire bonding to form a semiconductor device having a resin sealing layer formed for protection of the semiconductor chip, and the semiconductor device is soldered to a mother board. Even when surface mounting is performed by attaching the semiconductor device to the printed wiring board, the conductor pattern and the external terminal are fixed by being covered with the resin-cured insulating band and fixed. It can be surface-mounted on the motherboard by soldering.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG.
Fig. 3 is a sectional view taken along line XY, Fig. 3 is a perspective view showing another embodiment of the present invention, Fig. 4 is a sectional view taken along line XY in Fig. 3, and Fig. 5 is a sectional view showing a conventional example. It is a figure. DESCRIPTION OF SYMBOLS 1 ... Insulating layer, 2 ... Conductive pattern 3 ... External terminal, 4 ... Junction part 5 ... Insulating band, 6 ... Motherboard 7 ... Semiconductor chip, 8 ... Wire 9 ... Resin sealing layer, 10 ... Thermal conduction band

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Koji Minami 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works, Ltd. (72) Kaoru Mukai 1048, Kadoma, Kadoma City, Osaka Matsushita Electric Works, Ltd. (72) Inventor Toru Higuchi 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works, Ltd. (56) References JP 59-168657 (JP, A) JP 51-90473 (JP, A)

Claims (8)

[Claims] 1. An insulating strip formed on a peripheral portion of a printed wiring board covering an external terminal joined to the conductive pattern and the joint portion at a peripheral portion of the printed wiring board having a conductive pattern arranged on a surface of an insulating layer. A semiconductor chip carrier having: 2. The semiconductor chip carrier according to claim 1, further comprising a heat conduction band formed on the surface of the insulating band. 3. The semiconductor chip carrier according to claim 1, wherein the insulating band is formed of a resin composition. 4. The semiconductor chip carrier according to claim 1, wherein the resin composition is formed of a heat conductor. 5. The semiconductor chip carrier according to claim 1, wherein the heat conduction band is made of metal. 6. The semiconductor chip carrier according to claim 1, wherein the heat conduction band is made of ceramic. 7. An outer terminal joined to a conductive pattern at a peripheral portion of a printed wiring board having a conductive pattern arranged on a surface of an insulating layer and a junction-shaped outer terminal formed in a dam-like shape at the peripheral portion of the printed wiring board. A semiconductor chip mounted inside the recess formed by the insulating band is protected by a resin sealing layer. 8. An outer terminal joined to a conductive pattern at a peripheral portion of a printed wiring board having a conductive pattern provided on a surface of an insulating layer, and a junction-shaped outer terminal formed in a dam-like shape at the peripheral portion of the printed wiring board. And a heat conduction band formed in the same shape on the surface of the insulation band, and the semiconductor chip mounted inside the recess formed by the insulation band and the heat conduction band is sealed with resin. A semiconductor device, which is protected by a stop layer.