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JPH0728367B2 - Reader - Google Patents
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JPH0728367B2 - Reader - Google Patents

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Publication number
JPH0728367B2
JPH0728367B2 JP61135195A JP13519586A JPH0728367B2 JP H0728367 B2 JPH0728367 B2 JP H0728367B2 JP 61135195 A JP61135195 A JP 61135195A JP 13519586 A JP13519586 A JP 13519586A JP H0728367 B2 JPH0728367 B2 JP H0728367B2
Authority
JP
Japan
Prior art keywords
light
substrate
reading device
light source
element array
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP61135195A
Other languages
Japanese (ja)
Other versions
JPS62291257A (en
Inventor
千秋 松山
啓徳 森田
泰夫 西口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP61135195A priority Critical patent/JPH0728367B2/en
Publication of JPS62291257A publication Critical patent/JPS62291257A/en
Publication of JPH0728367B2 publication Critical patent/JPH0728367B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Facsimile Heads (AREA)
  • Facsimile Scanning Arrangements (AREA)
  • Solid State Image Pick-Up Elements (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、例えばファクシミリ装置の小型化を目指した
もので、実質上原稿と寸法的に1:1に対応させた光電変
換素子アレイを配置して成る密着型イメージセンサなど
の読取り装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention is aimed at, for example, miniaturization of a facsimile apparatus, and a photoelectric conversion element array substantially corresponding to an original in a size of 1: 1 is arranged. The present invention relates to a reading device such as a contact image sensor.

〔先行技術及びその問題点〕[Prior art and its problems]

近時、密着型イメージセンサの開発が活発化しており、
このセンサは原稿からの反射光を集束性ロッド・レンズ
・アレイを介して検知する型式や、このアレイを用いな
いでも優れた光量伝達率、小型化を達成した型式なども
開発されている。
Recently, the development of contact image sensors has become active,
This sensor has been developed into a type that detects reflected light from a document through a converging rod lens array, and a type that achieves excellent light transmission rate and miniaturization without using this array.

第2図は集束性ロッド・レン・アレイを用いない密着型
読取り系を示した概略図であり、原稿1と寸法的に実質
上1:1に対応させた光検知部2が原稿1に密着し、発光
ダイオード3が原稿1を投光し、その反射光を光検知部
2で受光する。
FIG. 2 is a schematic diagram showing a close contact type reading system which does not use a converging rod lens array, in which the light detecting section 2 corresponding to the original 1 in size is substantially 1: 1 in close contact with the original 1. Then, the light emitting diode 3 projects the original 1 and the reflected light is received by the photodetector 2.

第3図及び第4図は光検知部2に相当する読取り装置で
あり、第4図は第3図中切断面線X-Xから見た断面図で
ある。
3 and 4 show a reading device corresponding to the light detecting section 2, and FIG. 4 is a sectional view taken along the section line XX in FIG.

即ち、ガラスなどから成る透光性基板4が金属フレーム
などで構成された基板支持体5に付設されており、基板
4上にはCr、Alなどを蒸着して共通電極6a,6b・・・が
形成され、共通電極6a、6b上にはアモルファスシリコン
などから成る光電変換部7が形成され、そして、この光
電変換部7上にはITOなどの透明材料から成る透明電極
8がスパッタリングまたは蒸着によって各々の光電変換
部7に形成される。更に、この透明電極8の一部を覆う
ようにCr、Alなどを蒸着させて引出し電極9が個別的に
接続され、最上部にはガラスなどから成る透明な保護層
10が形成され、また、共通電極6a、6b、光電変換部7及
び透明電極8には光通過孔11が形成される。基板支持体
5の背後には発光ダイオード3が配置され、保護層10の
上方には原稿1が配置されており、そして、発光ダイオ
ード3から投光される光は基板4、光通過孔11及び保護
層10を介して原稿1を照射し、その反射光は光通過孔11
付近の透明電極8を透過し、光電変換部7によって受光
される。また、光通過孔11は原稿1の幅方向(主走査方
向)、即ち、発光ダイオード3の軸線方向に沿って間隔
をあけて配置され、基板4上にはシフトレジスタなどの
駆動回路12が搭載される。
That is, a transparent substrate 4 made of glass or the like is attached to a substrate support 5 made of a metal frame or the like, and Cr, Al, etc. are vapor-deposited on the substrate 4 to form common electrodes 6a, 6b ... Is formed, a photoelectric conversion part 7 made of amorphous silicon or the like is formed on the common electrodes 6a, 6b, and a transparent electrode 8 made of a transparent material such as ITO is formed on the photoelectric conversion part 7 by sputtering or vapor deposition. It is formed in each photoelectric conversion part 7. Further, the extraction electrodes 9 are individually connected by vapor-depositing Cr, Al, etc. so as to cover a part of the transparent electrode 8, and a transparent protective layer made of glass or the like is provided on the uppermost part.
10 is formed, and a light passage hole 11 is formed in the common electrodes 6a and 6b, the photoelectric conversion section 7 and the transparent electrode 8. The light emitting diode 3 is arranged behind the substrate support 5, the document 1 is arranged above the protective layer 10, and the light emitted from the light emitting diode 3 is emitted from the substrate 4, the light passage hole 11 and The original 1 is irradiated through the protective layer 10, and the reflected light is transmitted through the light passage hole 11
The light passes through the transparent electrode 8 in the vicinity and is received by the photoelectric conversion unit 7. Further, the light passage holes 11 are arranged at intervals along the width direction (main scanning direction) of the original 1, that is, along the axial direction of the light emitting diode 3, and a drive circuit 12 such as a shift register is mounted on the substrate 4. To be done.

また、第5図は前記発光ダイオード3を示す。即ち、LE
D搭載用基板13上に複数のLEDチップ14が所定の間隔をと
りながらライン状に配列されており、このLEDチップア
レイの上には円柱形状の棒状レンズ15がその円柱の中心
軸がLEDチップアレイと平行に成るようにレンズ支持部
材16によって設置される。この棒状レンズ15はLEDチッ
プ14の照射光を集光させることができるので、原稿1を
その焦点距離付近に位置させると原稿1に対する照度を
著しく高めることができる。
Further, FIG. 5 shows the light emitting diode 3. That is, LE
A plurality of LED chips 14 are arranged in a line on a D mounting substrate 13 with a predetermined interval, and a cylindrical rod lens 15 is located on the LED chip array and the central axis of the cylinder is an LED chip. The lens support member 16 is installed so as to be parallel to the array. Since the rod-shaped lens 15 can collect the irradiation light of the LED chip 14, the illuminance on the original 1 can be remarkably increased when the original 1 is positioned near its focal length.

しかしながら、この読取り装置によれば、原稿1と棒状
レンズ15の間隔を棒状レンズ15のもつ焦点距離(通常約
6mm)の大きさにする必要があり、また、発光ダイオー
ド3の高さは約10mmあり、これにより、光検知部2及び
発光ダイオード3により構成された読取り装置の厚みを
最低約16mmの大きさにする必要があり、その結果、読取
り装置を更に一層小型化することが難しくなっている。
However, according to this reading device, the distance between the original 1 and the rod-shaped lens 15 is equal to the focal length of the rod-shaped lens 15 (usually about
6 mm), and the height of the light emitting diode 3 is about 10 mm, so that the thickness of the reading device composed of the light detecting section 2 and the light emitting diode 3 is at least about 16 mm. As a result, making it even more difficult to miniaturize the reader.

〔発明の目的〕[Object of the Invention]

従って本発明の目的は、LED光源の集光用レンズを用い
ないことによって小型化を達成した読取り装置を提供す
ることにある。
Therefore, it is an object of the present invention to provide a reading device which is downsized by not using a condenser lens of an LED light source.

本発明の他の目的はLED光源の集光用レンズを不要とし
たことによって低コスト化を達成した読取り装置を提供
することにある。
Another object of the present invention is to provide a reading device which achieves cost reduction by eliminating the condenser lens of the LED light source.

本発明の更に他の目的はLED光源の集光用レンズを不要
としても被検知体に対する光量伝達率を低下させないよ
うにした読取り装置を提供することにある。
Still another object of the present invention is to provide a reading device which does not reduce the light quantity transmissivity to the object to be detected even if the condenser lens of the LED light source is unnecessary.

〔問題点を解決するための手段〕 本発明によれば、基板の第1板面上に光電変換素子アレ
イを形成し、該基板の第2板面側の該素子アレイと対応
する部位に光源を備え、この光源が第1板面側の被検知
体を投光し、その反射光を光電変換素子アレイが受光
し、この素子アレイから順次時系列に読取り信号が得ら
れるようにした読取り装置において、基板の第2板面側
に長尺状凹部を有する光源支持部材を備えてこの凹部内
に前記光源を配置すると共に、該凹部の内面に、この光
源の照射光を反射させ且つこの反射光が被検知体を投光
し得るようにした反射手段を形成したことを特徴とする
読取り装置が提供される。
[Means for Solving Problems] According to the present invention, a photoelectric conversion element array is formed on a first plate surface of a substrate, and a light source is provided on a portion of the substrate corresponding to the element array on the second plate surface side. And a photoelectric conversion element array receives the reflected light from the object to be detected on the first plate surface side, and a reading signal is sequentially obtained from the element array in time series. The light source supporting member having an elongated concave portion is provided on the second plate surface side of the substrate, the light source is arranged in the concave portion, and the irradiation light of the light source is reflected on the inner surface of the concave portion. There is provided a reading device characterized in that a reflecting means is formed so that light can be projected onto an object to be detected.

〔実施例〕〔Example〕

次に本発明の実施例を第1図により説明する。 Next, an embodiment of the present invention will be described with reference to FIG.

第1図は第2図にて示した光検知部に相当する読取り装
置であり、第3図の切断面線X-Xから見た第4図に代わ
る断面図である。尚、第1図中第4図と同一箇所には同
一符号が付してある。
1 is a reading device corresponding to the photodetector shown in FIG. 2, and is a cross-sectional view taken along the section line XX of FIG. 3 in place of FIG. The same parts as those in FIG. 4 in FIG. 1 are designated by the same reference numerals.

即ち、透光性基板4が金属フレームなどで構成された基
板支持体17に付設されており、基板4上には共通電極6
a、6b・・・、光電変換部7、透明電極8、引出し電極
9及び保護層10が順次形成される。基板支持体17には長
尺状の凹部8が受光素子アレイと実質上平行に形成され
ており、この凹部18の底面に複数のLEDチップ19が所定
の間隔(ピッチ)をとりながら主走査方向に配列されて
いる。この凹部18の内部側壁には反射率が著しく大きい
銀色テープ18aを貼り付けており、そして、この凹部18
の底面を基板支持体17に付設されたプリント基板20(こ
の基板20にはLEDチップ19を駆動するための配線パター
ンが形成される)の板面により成しており、この板面に
Al、Cu、Au等から成る高反射性の金属薄膜18bを形成す
る。尚、21はLEDチップ19が駆動するのに伴って発生す
る熱を放出するための放熱用金属板である。
That is, the translucent substrate 4 is attached to the substrate support 17 composed of a metal frame or the like, and the common electrode 6 is provided on the substrate 4.
The photoelectric conversion part 7, the transparent electrode 8, the extraction electrode 9, and the protective layer 10 are sequentially formed. A long recess 8 is formed in the substrate support 17 substantially in parallel with the light receiving element array, and a plurality of LED chips 19 are provided on the bottom surface of the recess 18 at a predetermined interval (pitch) in the main scanning direction. Are arranged in. A silver tape 18a having a remarkably large reflectance is attached to the inner side wall of the recess 18, and the recess 18
Is formed by the plate surface of a printed circuit board 20 (a wiring pattern for driving the LED chip 19 is formed on this board 20) attached to the board support 17 on the board surface.
A highly reflective metal thin film 18b made of Al, Cu, Au or the like is formed. Reference numeral 21 is a heat-dissipating metal plate for releasing heat generated when the LED chip 19 is driven.

この読取り装置によれば、第2図にて示した光検知部2
及び発光ダイオード3が一体化しており、本発明者等の
実験によれば、LEDチップ19と原稿1との間隔を約6mm位
に設定すれば原稿1を十分な明るさで投光することがで
き、プリント基板20や放熱用金属板21の厚みを考慮して
もこの読取り装置の全体の厚みを約10mm以下に設定する
ことができる。
According to this reading device, the light detecting section 2 shown in FIG.
Further, the light emitting diode 3 is integrated, and according to the experiments by the present inventors, if the distance between the LED chip 19 and the manuscript 1 is set to about 6 mm, the manuscript 1 can be projected with sufficient brightness. Even if the thicknesses of the printed circuit board 20 and the heat-dissipating metal plate 21 are taken into consideration, the total thickness of the reading device can be set to about 10 mm or less.

更にこの読取り装置によれば、凹部18の全内周面及び底
面に高い反射率を有する銀色テープ18aや金属薄膜18bを
形成したためにLEDチップ19の照射光が凹部18によって
ほとんど吸収されなくなり、これにより、原稿1に対し
て無駄のない投光ができる。尚、LEDチップ19の投光波
長570mmに対する銀色テープ18a及び金属薄膜18bの反射
率はそれぞれ80%以上及び約90%であった。
Further, according to this reading device, since the silver tape 18a and the metal thin film 18b having high reflectance are formed on the entire inner peripheral surface and the bottom surface of the recess 18, the irradiation light of the LED chip 19 is hardly absorbed by the recess 18, and As a result, it is possible to project the original 1 without waste. The reflectances of the silver tape 18a and the metal thin film 18b with respect to the projected wavelength of 570 mm of the LED chip 19 were 80% or more and about 90%, respectively.

また本実施例においては、投光性基板4上にCr、Alなど
を蒸着して共通電極6a、6b・・・を形成するに当って、
この共通電極6a・6bの一部に非蒸着部分をつくり、これ
を光通過孔11と成している。従って、この共通電極は光
通過孔11に対する通路になると共にこの通路以外の蒸着
金属層に投光された光は反射されて再び凹部18へ戻り、
この戻り光が凹部18内の反射手段によって反射され、こ
れにより、原稿1に対する光量伝達率が著しく高められ
る。
Further, in the present embodiment, in forming Cr, Al, etc. on the light projecting substrate 4 to form the common electrodes 6a, 6b ...
A non-evaporated portion is formed in a part of the common electrodes 6a and 6b, and this is formed as a light passage hole 11. Therefore, this common electrode serves as a passage for the light passage hole 11, and the light projected on the vapor deposition metal layer other than this passage is reflected and returns to the concave portion 18 again.
This return light is reflected by the reflection means in the concave portion 18, whereby the light quantity transmissivity with respect to the document 1 is significantly increased.

本発明によれば、この反射手段を形成するに当ってそれ
がもつ反射率が所定の値以上にあることが望ましい。即
ち、本発明者等が種々の実験を繰り返し行った結果、通
常用いられる光源(波長は550〜660nmの範囲内にある)
であれば反射率60%以上あるのが望ましく、この範囲内
の反射率であれば、実用的な読取り信号強度が得られ、
好適な反射率は80%以上である。このように高い反射率
をもつ反射手段として、例えば基板支持体17をFeやAlな
どから成る金属フレームで作成した場合であれば、その
凹部の内面をバフ研磨、表面研削盤、サンドペーパー、
電解研磨等それ自体周知の方法によって研磨したり、或
いはその内面をメッキ処理すればよい。また、凹部内面
にAl、Ag、Au、Cu、Rhなどから成る蒸着金属層を形成し
たり、また、白い紙や布を張付けたり、或いは基板支持
体17自体を白色系プラスチックスにより製作することに
よって凹部内面をそのプラスチック白色面にしてもよ
い。
According to the present invention, it is desirable that the reflectance of the reflecting means in forming the reflecting means is equal to or more than a predetermined value. That is, as a result of repeated experiments by the present inventors, a light source that is normally used (wavelength is within the range of 550 to 660 nm)
If so, it is desirable that the reflectance is 60% or more. If the reflectance is within this range, a practical read signal strength can be obtained.
The preferred reflectance is 80% or more. As a reflection means having such a high reflectance, for example, when the substrate support 17 is made of a metal frame made of Fe or Al, the inner surface of the recess is buffed, a surface grinder, sandpaper,
It may be polished by a method known per se such as electrolytic polishing, or its inner surface may be plated. Also, forming a vapor-deposited metal layer made of Al, Ag, Au, Cu, Rh, etc. on the inner surface of the recess, sticking white paper or cloth, or manufacturing the substrate support 17 itself with white plastics. The inner surface of the recess may be made the plastic white surface.

〔発明の効果〕〔The invention's effect〕

以上の通り、本発明の読取り装置によれば、LEDアレイ
がもつ棒状レンズ(集光用レンズ)を不要とし、またこ
のレンズを用いないでも被検知体に対する光量伝達率が
低下せず、これにより、小型化且つ低コスト化が達成さ
れると共に読取り信号強度のSN比が向上して優れた解像
度が得られる。
As described above, according to the reading device of the present invention, the rod-shaped lens (condensing lens) of the LED array is not necessary, and even if this lens is not used, the light quantity transmissivity to the object to be detected does not decrease. In addition, miniaturization and cost reduction are achieved, and the signal-to-noise ratio of the read signal strength is improved to obtain excellent resolution.

尚、本発明は上記の実施例に限定されるものではなく、
本発明の要旨を逸脱しない範囲において種々の反射手段
を用いることができる。
The present invention is not limited to the above embodiment,
Various reflecting means can be used without departing from the scope of the present invention.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の読取り装置を示す断面図、第2図は読
取り装置に係る読取り系を示す概略図、第3図は従来の
読取り装置の斜視図、第4図は第3図中切断面線X-Xか
ら見た断面図、第5図は従来の読取り装置に用いられた
発光ダイオードを示す概略図である。 1……原稿、2……光検知部 3……発光ダイオード 5、17……基板支持体 14、19……LEDチップ 15……棒状レンズ、18……凹部 18a……銀色テープ、18b……金属薄膜
1 is a sectional view showing a reading device of the present invention, FIG. 2 is a schematic view showing a reading system relating to the reading device, FIG. 3 is a perspective view of a conventional reading device, and FIG. 4 is a cut in FIG. FIG. 5 is a schematic view showing a light emitting diode used in a conventional reading device, and FIG. 5 is a sectional view taken along the line XX. 1 ... manuscript, 2 ... light detection part 3 ... light emitting diode 5, 17 ... substrate support 14, 19 ... LED chip 15 ... rod lens, 18 ... recess 18a ... silver tape, 18b ... Metal thin film

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】基板の第1板面上に光電変換素子アレイを
形成し、該基板の第2板面側の該素子アレイと対応する
部位に光源を備え、この光源が第1板面側の被検知体を
投光し、その反射光を光電変換素子アレイが受光し、こ
の素子アレイから順次時系列に読取り信号が得られるよ
うにした読取り装置において、基板の第2板面側に長尺
状凹部を有する光源支持部材を備えてこの凹部内に前記
光源を配置すると共に、該凹部の内面に、この光源の照
射光を反射させ且つこの反射光が被検知体を投光し得る
ようにした反射手段を形成したことを特徴とする読取り
装置。
1. A photoelectric conversion element array is formed on a first plate surface of a substrate, and a light source is provided on a portion corresponding to the element array on the second plate surface side of the substrate, and the light source is on the first plate surface side. In the reading device in which the photoelectric conversion element array receives the reflected light and the read signals are sequentially obtained in time series from the element array, the long side is extended to the second plate surface side of the substrate. A light source support member having an elongated concave portion is provided, and the light source is arranged in the concave portion, and the irradiation light of the light source is reflected on the inner surface of the concave portion, and the reflected light can project the object to be detected. A reading device characterized in that the reflecting means is formed.
JP61135195A 1986-06-10 1986-06-10 Reader Expired - Lifetime JPH0728367B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61135195A JPH0728367B2 (en) 1986-06-10 1986-06-10 Reader

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61135195A JPH0728367B2 (en) 1986-06-10 1986-06-10 Reader

Publications (2)

Publication Number Publication Date
JPS62291257A JPS62291257A (en) 1987-12-18
JPH0728367B2 true JPH0728367B2 (en) 1995-03-29

Family

ID=15146066

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61135195A Expired - Lifetime JPH0728367B2 (en) 1986-06-10 1986-06-10 Reader

Country Status (1)

Country Link
JP (1) JPH0728367B2 (en)

Families Citing this family (1)

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JP5636664B2 (en) * 2009-10-22 2014-12-10 富士ゼロックス株式会社 Image reading apparatus and image forming apparatus

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