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JPH0731226B2 - Measuring device for electronic components - Google Patents
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JPH0731226B2 - Measuring device for electronic components - Google Patents

Measuring device for electronic components

Info

Publication number
JPH0731226B2
JPH0731226B2 JP60224128A JP22412885A JPH0731226B2 JP H0731226 B2 JPH0731226 B2 JP H0731226B2 JP 60224128 A JP60224128 A JP 60224128A JP 22412885 A JP22412885 A JP 22412885A JP H0731226 B2 JPH0731226 B2 JP H0731226B2
Authority
JP
Japan
Prior art keywords
electronic component
measuring
holder
lead
measuring device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP60224128A
Other languages
Japanese (ja)
Other versions
JPS6282365A (en
Inventor
進 神山
保一 近藤
Original Assignee
ロ−ム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ム株式会社 filed Critical ロ−ム株式会社
Priority to JP60224128A priority Critical patent/JPH0731226B2/en
Publication of JPS6282365A publication Critical patent/JPS6282365A/en
Publication of JPH0731226B2 publication Critical patent/JPH0731226B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Electric Properties And Detecting Electric Faults (AREA)

Description

【発明の詳細な説明】 産業上の利用分野 この発明は、先端が側方に突出したフラットタイプのリ
ードを備えた電子部品の諸特性を測定する測定装置に関
する。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a measuring device for measuring various characteristics of an electronic component including a flat type lead whose tip projects laterally.

従来の技術 ICやLSIチップ等をパッケージした組立終了後の電子部
品は、それぞれ異なる複数種類の測定器で多数回にわた
って種々な特性測定が行われている。ここで、従来の技
術として、フラットタイプと呼ばれる形状のリードを備
えた電子部品の諸特性を測定する場合を説明する。
2. Description of the Related Art Various characteristics of various types of measuring instruments are used to measure various characteristics of electronic components that have been assembled, such as IC and LSI chips, after assembly. Here, as a conventional technique, a case of measuring various characteristics of an electronic component having a lead of a shape called a flat type will be described.

上記した電子部品と信号のやりとりを行う測定器が適宜
に複数個配置されていて、これら測定器のソケットには
測定すべき電子部品のリードと対応した測定用端子を有
している。そこで、測定しようとする電子部品を1個ず
つ真空吸着器等で保持して、順次、適宜な測定器のソケ
ットの測定用端子に当該電子部品のリードを電気的に接
続させることにより、信号をやりとりさせる。
A plurality of measuring instruments for exchanging signals with the above-mentioned electronic components are appropriately arranged, and the sockets of these measuring instruments have measuring terminals corresponding to the leads of the electronic components to be measured. Therefore, by holding the electronic components to be measured one by one with a vacuum suction device or the like and sequentially electrically connecting the leads of the electronic components to the measurement terminals of the sockets of the appropriate measuring devices, the signal is transmitted. Let it interact.

発明が解決しようとする問題点 上記従来の方法では、真空吸着器等でもって電子部品を
保持して、これを複数の測定器に接続させる操作を各測
定器について行なうため、作業が煩わしく手間がかか
る。また、電子部品を保持する真空吸着器等の操作時
に、操作ミスを招くおそれがあると共に、真空吸着器が
当該電子部品のパッケージ部分のみを保持するため、リ
ードをソケットの測定用端子に接触させる際に当該リー
ドが折れ曲がるおそれがある。
Problems to be Solved by the Invention In the above conventional method, the electronic component is held by a vacuum suction device or the like, and the operation of connecting it to a plurality of measuring devices is performed for each measuring device, which is troublesome and troublesome. It takes. Also, when operating a vacuum suction device or the like that holds an electronic component, there is a risk of causing an operation error, and since the vacuum suction device holds only the package part of the electronic component, the lead is brought into contact with the measurement terminal of the socket. At that time, the lead may be bent.

そこで、この発明は、電子部品のリードと測定器の測定
用端子とを接続する操作が容易に行え、しかも前記両者
を接触させる際に電子部品のリードが損傷することのな
い電子部品の測定装置を提供することを目的としてい
る。
Therefore, the present invention is an apparatus for measuring an electronic component in which the operation of connecting the lead of the electronic component and the measuring terminal of the measuring instrument can be easily performed and the lead of the electronic component is not damaged when the two are brought into contact with each other. Is intended to provide.

問題点を解決するための手段 本発明に係る電子部品の測定装置は、パッケージ部と、
該パッケージ部から突出したリードとを備えた電子部品
の諸特性を測定する測定装置であって、 電子部品における前記パッケージ部を収納する収納部
と、前記リードを支持する支持部と、前記パッケージ部
を吸着保持する保持手段とを有する複数個のホルダー
と、 電子部品の諸特性を測定する縦横方向に配設された測定
器にそれぞれ取り付けられ、前記ホルダーで保持された
電子部品のリードに対応可能に配置された測定用端子を
有するソケットと、 前記ホルダーを前記ソケットに対して対応可能に取り付
けた搬送パレットと、 該搬送パレットを間欠搬送する搬送手段とを備えてい
る。
Means for Solving Problems A measuring device for electronic parts according to the present invention includes a package part,
A measuring device for measuring various characteristics of an electronic component including a lead projecting from the package part, the accommodating part accommodating the package part of the electronic component, a supporting part supporting the lead, and the package part. It can be attached to a plurality of holders that have holding means for adsorbing and holding, and measuring instruments that are arranged in the vertical and horizontal directions to measure various characteristics of electronic parts, and can correspond to the leads of electronic parts held by the holder. A socket having a measuring terminal disposed therein, a transfer pallet to which the holder is attached so as to correspond to the socket, and a transfer unit for intermittently transferring the transfer pallet.

作用 電子部品をホルダーに保持させたまま、当該電子部品が
規則正しく搬送され、電子部品のリードとソケットの測
定用端子とが正しく接触する位置関係が得られる。しか
も電子部品のリードがホルダーの支持部で支えられてい
るから、ソケットの測定用端子との接触時に当該リード
が損傷することはない。
Function While the electronic component is held in the holder, the electronic component is regularly conveyed, and the lead of the electronic component and the measuring terminal of the socket are in proper contact with each other. Moreover, since the lead of the electronic component is supported by the supporting portion of the holder, the lead is not damaged when it comes into contact with the measuring terminal of the socket.

また、ホルダーに保持された電子部品は、パッケージ部
が保持手段によって吸着保持される。
Further, the package part of the electronic component held by the holder is sucked and held by the holding means.

実施例 第1図はこの発明の一実施例を示す説明図である。Embodiment FIG. 1 is an explanatory view showing an embodiment of the present invention.

同図において、a〜nはそれぞれ異なる種類の測定器群
で、これらは取付台1に一定の間隔をもって縦横(ここ
で縦は紙面に対して左右方向、横は紙面に対して垂直方
向を言う)に配設されている。この取付台1は、図示し
ないが油圧またはエアーシリンダ等の昇降装置でもって
矢印Aのように昇降される。ところで、測定器群a〜n
には、測定しようとする電子部品2のリード21と対応し
て配設された測定用端子34を有するソケット3が複数個
それぞれ設けられている。
In the drawing, a to n are different kinds of measuring instrument groups, and these are vertically and horizontally (here, the vertical means the horizontal direction with respect to the paper surface, and the horizontal means the vertical direction with respect to the paper surface) at a fixed interval on the mounting base 1. ). Although not shown, the mounting base 1 is moved up and down as shown by an arrow A by an elevating device such as hydraulic pressure or an air cylinder. By the way, the measuring instrument groups a to n
Is provided with a plurality of sockets 3 each having a measuring terminal 34 arranged corresponding to the lead 21 of the electronic component 2 to be measured.

符号4は長尺な板状の搬送パレットで、この上面には電
子部品2を保持する複数のホルダー5が横一列(ここで
の横は紙面に対して垂直方向とする)に取付けられてい
る。この複数のホルダー5は、測定器群a〜nの横一列
のソケット配列状態とそれぞれ対応して配設されてい
る。つまり、ひとつの搬送パレット4上のホルダー5群
には、複数の電子部品2が保持されるようになってい
る。この搬送パレット4は、スプロケット6で回転駆動
される搬送コンベア7により前記した測定器a、測定器
b・・・測定器nの下方に順次間欠搬送されるようにな
っている。この実施例では、スプロケット6と搬送コン
ベア7とで搬送手段が構成されている。
Reference numeral 4 is a long plate-shaped carrier pallet, and a plurality of holders 5 for holding the electronic components 2 are attached in a horizontal row on the upper surface of the pallet (the horizontal direction here is perpendicular to the paper surface). . The plurality of holders 5 are arranged so as to correspond to the socket arrangement state of the measuring instrument groups a to n in a horizontal row. That is, a plurality of electronic components 2 are held in a group of holders 5 on one transfer pallet 4. The transport pallet 4 is intermittently transported below the measuring instrument a, the measuring instrument b ... Measuring instrument n by a transporting conveyor 7 which is rotated by a sprocket 6. In this embodiment, the sprocket 6 and the conveyor 7 constitute a conveyor.

この実施例において適用する電子部品2は、フラットタ
イプと呼ばれる形状のリード21が2方向から突出してい
るタイプとする(第2図参照)。この電子部品2を保持
するホルダー5について第3図を参照して説明する。側
ち、ホルダー5は、樹脂を略角柱体に成型加工して形成
されるものである。この上面には、その長手方向に延在
する凹溝51(収納部)が形成されていて、この凹溝51に
電子部品2のパッケージ部22が納まる。この凹溝51の両
側の立壁52の各端部上面には、凸部53が一定間隔をもっ
て2個ずつ形成されており、2個の凸部53の間の領域
が、電子部品2のリード21を支える支持部54とされてい
る。さらに、ホルダー5を保持させる治具57(第5図参
照)には部品に対向する電子部品2のパッケージ部22を
吸着保持する保持手段としての磁石55を内蔵させてお
り、間欠搬送の停止時におけるショックによって電子部
品2が位置ずれするのを防止させている。このようなホ
ルダー5は、2個の電子部品2を保持するようになって
いて、第3図矢印のように電子部品2はそれぞれ逆さに
してセットされるようになっている。符号56はホルダー
固定用ビス孔である。
The electronic component 2 applied in this embodiment is of a type in which leads 21 having a shape called a flat type project from two directions (see FIG. 2). The holder 5 for holding the electronic component 2 will be described with reference to FIG. On the other hand, the holder 5 is formed by molding a resin into a substantially prismatic body. A recessed groove 51 (a housing portion) extending in the longitudinal direction is formed on the upper surface, and the package portion 22 of the electronic component 2 is housed in the recessed groove 51. Two convex portions 53 are formed on the upper surface of each end of the standing wall 52 on both sides of the concave groove 51 at regular intervals, and the area between the two convex portions 53 is the lead 21 of the electronic component 2. It is supposed to be a support portion 54 for supporting the. Further, the jig 57 (see FIG. 5) for holding the holder 5 has a built-in magnet 55 as a holding means for attracting and holding the package portion 22 of the electronic component 2 facing the component. The electronic component 2 is prevented from being displaced due to the shock. Such a holder 5 holds two electronic components 2, and the electronic components 2 are set upside down as shown by arrows in FIG. Reference numeral 56 is a screw hole for fixing the holder.

さらに、測定器群a〜nに設けられるソケット3につい
て第4図(a)、(b)を参照して説明する。ソケット
3は樹脂を略長方体状に成型加工されたもので、その四
隅には測定器群a〜nへ取付けるためのねじ孔31が穿設
されている。このソケット3の中央部分には、その長手
方向に延在する凹溝32が形成されている。この凹溝32の
両側でソケット3の中央位置には、収納凹所33が複数形
成されており、この収納凹所33には、上端が露出するよ
うに測定用端子34が収納されている。
Further, the socket 3 provided in the measuring instrument groups a to n will be described with reference to FIGS. 4 (a) and 4 (b). The socket 3 is made by molding a resin into a substantially rectangular parallelepiped shape, and has screw holes 31 for attaching to the measuring instrument groups a to n at its four corners. A concave groove 32 extending in the longitudinal direction is formed in the central portion of the socket 3. A plurality of storage recesses 33 are formed at the center of the socket 3 on both sides of the recessed groove 32, and the measurement terminals 34 are stored in the storage recesses 33 so that the upper ends thereof are exposed.

次に動作を説明する。Next, the operation will be described.

まず、ホルダー5に電子部品2を第3図矢印のようにセ
ットする。このホルダー5が取り付けられた搬送パレッ
ト4を搬送コンベア7上に載せて、搬送コンベヤ7によ
り、搬送パレット4のホルダー5群を測定器a群の下方
に位置させるべく搬送パレット4を適宜なピッチで間欠
搬送させる。この間欠搬送の停止時に、取付台1を下降
させて、測定器aのソケット3の測定用端子34を電子部
品2のリード21にそれぞれ対応させて接触させる(第5
図参照)。これにより、測定器a群と複数の電子部品2
とをそれぞれ電気的に接続させて信号をやりとりさせ
る。測定が終了すると、取付台1を上昇させて、測定器
a群のソケット3の測定用端子34を電子部品2のリード
21から引き離す。その後、新たな電子部品2がセットさ
れた搬送パレット4を搬送コンベア7上に載せて、搬送
ベルト7により、前記測定した電子部品2がセットされ
た搬送パレット4を測定器b群の下に、また新たな電子
部品2がセットされた搬送パレット4を測定器a群の下
にそれぞれ位置させるべく間欠搬送する。そして、この
状態にて取付台1を下降させると、測定器a群の測定用
端子34と前記測定した電子部品2のリード21とを、また
測定器b群の測定用端子34と新たな電子部品2のリード
21とをそれぞれ電気的に接続させて信号をやりとりさせ
る。このようにして順次、新たな電子部品2がセットさ
れた搬送パレット4を搬送コンベヤ7上に載せて、間欠
搬送させることにより各電子部品2の測定を行う。
First, the electronic component 2 is set in the holder 5 as shown by the arrow in FIG. The carrier pallet 4 to which the holder 5 is attached is placed on the carrier conveyor 7, and the carrier pallet 4 is moved by the carrier conveyor 7 at an appropriate pitch so that the holder 5 group of the carrier pallet 4 is located below the measuring device a group. Allow intermittent transportation. When the intermittent conveyance is stopped, the mounting base 1 is lowered to bring the measuring terminals 34 of the socket 3 of the measuring device a into contact with the leads 21 of the electronic component 2 (fifth contact).
See figure). As a result, the measuring instrument a group and the plurality of electronic components 2
Signals are exchanged by electrically connecting and. When the measurement is completed, the mounting base 1 is raised to connect the measuring terminal 34 of the socket 3 of the measuring instrument a group to the lead of the electronic component 2.
Pull away from 21. Then, the transport pallet 4 on which the new electronic component 2 is set is placed on the transport conveyor 7, and the transport pallet 4 on which the measured electronic component 2 is set is placed under the measuring device group b by the transport belt 7. Further, the transfer pallet 4 on which the new electronic component 2 is set is intermittently transferred so as to be positioned under the measuring instrument a group. Then, when the mount 1 is lowered in this state, the measuring terminal 34 of the measuring device a group and the lead 21 of the measured electronic component 2 and the measuring terminal 34 of the measuring device b group and a new electronic device are measured. Lead of component 2
21 and each are electrically connected to exchange signals. In this way, the transport pallet 4 on which the new electronic components 2 have been set is sequentially placed on the transport conveyor 7 and intermittently transported to measure each electronic component 2.

なお、上記実施例において、測定器群a〜nは取付台1
によって全て同時に昇降されるように構成されている
が、それぞれ個別に昇降させるように構成することも可
能である。また、測定する電子部品2は第2図に示した
ものに限定されず、例えばフラットタイプのリード21が
4方向から突出しているタイプであっても測定できるよ
うにすることも可能である。但しこの場合電子部品2を
保持させるホルダー5の形状を変更する必要があること
は言うまでもない。さらに、上記実施例において、ホル
ダー5の治具57内部に位置ずれ防止用の保持手段として
の磁石55を設けているが、ホルダー5に内蔵させてもよ
い。
In the above embodiment, the measuring instrument groups a to n are the mounting bases 1.
However, it is also possible to individually raise and lower each. Further, the electronic component 2 to be measured is not limited to the one shown in FIG. 2, and it is also possible to make it possible to measure even a flat type lead 21 protruding from four directions. However, in this case, it goes without saying that it is necessary to change the shape of the holder 5 for holding the electronic component 2. Further, in the above embodiment, the magnet 55 is provided inside the jig 57 of the holder 5 as a holding means for preventing the positional deviation, but it may be built in the holder 5.

発明の効果 以上説明したように、この発明によれば、ホルダーに電
子部品を保持して、この電子部品のリードと測定用端子
とがそれぞれ対応する位置に搬送手段でもって間欠搬送
させて、複数個の電子部品と測定器とを電気的に接続さ
せるから、測定効率が良く、従来のような電子部品の操
作ミスが起こることはない。またホルダーを複数列に配
置しても搬送手段は1個ですむので設備費が低減でき
る。さらに、電子部品のリードがホルダーの支持部に支
えられているから、測定用端子に接触させる際に前記リ
ードが損傷することはない。
EFFECTS OF THE INVENTION As described above, according to the present invention, the electronic component is held in the holder, and the leads of the electronic component and the measuring terminals are intermittently transported by the transporting means to the corresponding positions. Since the individual electronic parts and the measuring device are electrically connected, the measurement efficiency is good, and there is no possibility of operating errors of the electronic parts as in the conventional case. Further, even if the holders are arranged in a plurality of rows, only one transportation means is required, so that the equipment cost can be reduced. Furthermore, since the leads of the electronic component are supported by the supporting portion of the holder, the leads are not damaged when they are brought into contact with the measuring terminals.

また、ホルダーに電子部品のパッケージ部を吸着保持す
る保持手段を設けているので、搬送パレットを間欠搬送
しても、停止時のショックによって電子部品の位置がず
れることはない。このため、電子部品のリードにソケッ
トと測定用端子を正確に接触させることができ、ひいて
はより確実に電子部品の諸特性を測定することができる
という効果を奏する。
Further, since the holder is provided with the holding means for sucking and holding the package part of the electronic component, even if the carrier pallet is intermittently transported, the position of the electronic component does not shift due to the shock at the time of stop. Therefore, there is an effect that the socket and the measuring terminal can be accurately brought into contact with the lead of the electronic component, and thus various characteristics of the electronic component can be measured more reliably.

【図面の簡単な説明】[Brief description of drawings]

第1図はこの発明の一実施例を示す説明図、第2図はこ
の実施例において適用する電子部品2を示す斜視図、第
3図は第2図に示した電子部品2を保持するホルダー5
を示す斜視図、第4図(a)は測定器に設けられるソケ
ット3を示す平面図、第4図(b)は第4図(a)のA
−A′矢視断面図、第5図はホルダー5に保持した電子
部品2と測定用端子34の接触状態を示す説明図である。 2……電子部品 21……リード 22……パッケージ部 3……ソケット 33……測定用端子 5……ホルダー 51……収納部 54……支持部。
FIG. 1 is an explanatory view showing an embodiment of the present invention, FIG. 2 is a perspective view showing an electronic component 2 applied in this embodiment, and FIG. 3 is a holder for holding the electronic component 2 shown in FIG. 5
FIG. 4 (a) is a plan view showing the socket 3 provided in the measuring instrument, and FIG. 4 (b) is A in FIG. 4 (a).
FIG. 5 is an explanatory view showing a contact state between the electronic component 2 held by the holder 5 and the measuring terminal 34, taken along the line A-A '. 2 ... Electronic parts 21 ... Lead 22 ... Package 3 ... Socket 33 ... Measuring terminal 5 ... Holder 51 ... Storage 54 ... Support.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】パッケージ部と、該パッケージ部から突出
したリードとを備えた電子部品の諸特性を測定する測定
装置であって、 電子部品における前記パッケージ部を収納する収納部
と、前記リードを支持する支持部と、前記パッケージ部
を吸着保持する保持手段とを有する複数個のホルダー
と、 電子部品の諸特性を測定する縦横方向に配設された測定
器にそれぞれ取り付けられ、前記ホルダーで保持された
電子部品のリードに対応可能に配置された測定用端子を
有するソケットと、 前記ホルダーを前記ソケットに対して対応可能に取り付
けた搬送パレットと、 該搬送パレットを間欠搬送する搬送手段とを備えたこと
を特徴とする電子部品の測定装置。
1. A measuring device for measuring various characteristics of an electronic component, which comprises a package portion and a lead projecting from the package portion, the storage portion containing the package portion of the electronic component, and the lead. A plurality of holders each having a supporting portion for supporting and a holding means for sucking and holding the package portion, and attached to a measuring device arranged in a vertical and horizontal direction for measuring various characteristics of an electronic component, and held by the holder. A socket having a measuring terminal arranged so as to correspond to the lead of the electronic component, a transfer pallet to which the holder is attached so as to correspond to the socket, and a transfer means for intermittently transferring the transfer pallet. A measuring device for electronic parts characterized by the above.
JP60224128A 1985-10-07 1985-10-07 Measuring device for electronic components Expired - Fee Related JPH0731226B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60224128A JPH0731226B2 (en) 1985-10-07 1985-10-07 Measuring device for electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60224128A JPH0731226B2 (en) 1985-10-07 1985-10-07 Measuring device for electronic components

Publications (2)

Publication Number Publication Date
JPS6282365A JPS6282365A (en) 1987-04-15
JPH0731226B2 true JPH0731226B2 (en) 1995-04-10

Family

ID=16808979

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60224128A Expired - Fee Related JPH0731226B2 (en) 1985-10-07 1985-10-07 Measuring device for electronic components

Country Status (1)

Country Link
JP (1) JPH0731226B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4375314B2 (en) 2005-09-26 2009-12-02 株式会社デンソー Starter
JP4544238B2 (en) 2006-11-01 2010-09-15 株式会社デンソー Starter

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5823460A (en) * 1981-08-05 1983-02-12 Toshiba Corp Handler for flat package
JPS59195740U (en) * 1983-06-15 1984-12-26 株式会社日立製作所 Leadless chip carrier test handler

Also Published As

Publication number Publication date
JPS6282365A (en) 1987-04-15

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