JPH0732221B2 - Integrated circuit cooling structure - Google Patents
Integrated circuit cooling structureInfo
- Publication number
- JPH0732221B2 JPH0732221B2 JP25353788A JP25353788A JPH0732221B2 JP H0732221 B2 JPH0732221 B2 JP H0732221B2 JP 25353788 A JP25353788 A JP 25353788A JP 25353788 A JP25353788 A JP 25353788A JP H0732221 B2 JPH0732221 B2 JP H0732221B2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- refrigerant
- substrate
- cooling plate
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title claims description 20
- 239000003507 refrigerant Substances 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 13
- 239000002826 coolant Substances 0.000 claims description 7
- 238000005192 partition Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は集積回路の冷却構造、特に集積回路素子で発生
した熱を集積回路素子の近傍に流す液体に効率的に伝播
させる集積回路の冷却構造に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for an integrated circuit, and more particularly to cooling an integrated circuit that efficiently transfers heat generated in the integrated circuit element to a liquid flowing in the vicinity of the integrated circuit element. Regarding the structure.
従来、この種の集積回路の冷却構造は、例えば特許公開
番号62−122156に示されているように、集積回路素子と
微小間隔を保って固定され、充填された熱伝導性コンパ
ウンドを介して熱伝導がはかられる伝熱板と、この伝熱
板に密着して設けられ、内部に冷媒を流す冷却容器とを
有している。Conventionally, this kind of integrated circuit cooling structure is fixed to an integrated circuit element with a minute gap, as shown in, for example, Japanese Patent Publication No. 62-122156, and is cooled by a heat-conductive compound filled therein. It has a heat transfer plate that conducts heat and a cooling container that is provided in close contact with the heat transfer plate and allows a refrigerant to flow inside.
上述した従来の冷却構造は、集積回路素子から発生する
熱が多くなる程、冷媒の流量を増大させて対応しなけれ
ばならないため、冷媒の供給装置が大型化し、また伝熱
板と冷媒を流す冷却容器とが別であるため、集積回路素
子と冷媒との熱抵抗を低くしにくいという欠点がある。In the conventional cooling structure described above, as the heat generated from the integrated circuit element increases, the flow rate of the refrigerant has to be increased to cope with the increase in the size of the refrigerant supply device, and the heat transfer plate and the refrigerant flow. Since it is separate from the cooling container, there is a drawback that it is difficult to reduce the thermal resistance between the integrated circuit element and the refrigerant.
本発明の集積回路の冷却構造は、複数の集積回路素子を
基板に実装した集積回路と、前記基板を保持する基板枠
と、この基板枠に密着して前記複数の集積回路素子の上
面と微小間隔を保って対向する外面を有し、前記集積回
路素子と対向する内面の底部に複数個の柱状突起を設け
た複数のざぐり穴とこれらのざぐり穴を連結する冷媒流
路とを有する冷却板と、この冷却板に密着して設けら
れ、冷媒の取込口と取出口とこの取入口に接続され冷媒
のタンク室となる吸入室と前記取入口と前記冷媒流路と
に接続された排出室と前記吸入室から前記ざぐり穴の底
部に向う複数個のノズルとを有する冷媒容器とを有する
ことにより構成される。An integrated circuit cooling structure according to the present invention includes an integrated circuit in which a plurality of integrated circuit elements are mounted on a substrate, a substrate frame that holds the substrate, and a top surface of the plurality of integrated circuit elements that are in close contact with the substrate frame and are small. A cooling plate having a plurality of counterbored holes having a plurality of columnar protrusions provided on the bottom of the inner surface facing the integrated circuit element and having an outer surface opposed to each other with a space therebetween, and a coolant channel connecting these counterbored holes. And a suction port and a discharge port for the refrigerant, which are provided in close contact with the cooling plate, are connected to the suction port and serve as a refrigerant tank chamber, and a discharge connected to the suction port and the cooling medium passage. A refrigerant container having a chamber and a plurality of nozzles facing the bottom of the counterbore from the suction chamber.
次に、本発明の実施例について図面を参照して説明す
る。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例の断面図、第２図は第１図の
部分詳細図である。第１図および第２図において、集積
回路素子２は、基板１に実装されて集積回路を構成して
いる。基板１の外周縁部は基板枠３に強固に固着されて
いる。集積回路素子２の上面には微小間隔を保って冷却
板５が設けられ、冷却板５の内面、即ち集積回路と反対
方向の底面に複数の柱状の突起物15を設けたざぐり穴４
と冷媒流路14とが設けられている。冷却板５の上には冷
媒の取入口８と取出口９とを有し、この両者間に仕切り
を入れるため、隔壁10を設けた冷媒容器11が密着されて
いる。また冷媒容器11にはざぐり穴４に冷媒６を吐出す
るノズル７が直向して設けられている。FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a partial detailed view of FIG. 1 and 2, the integrated circuit element 2 is mounted on the substrate 1 to form an integrated circuit. The outer peripheral edge of the substrate 1 is firmly fixed to the substrate frame 3. A cooling plate 5 is provided on the upper surface of the integrated circuit element 2 with a minute gap therebetween, and a counterbore 4 having a plurality of columnar protrusions 15 on the inner surface of the cooling plate 5, that is, the bottom surface in the direction opposite to the integrated circuit.
And a coolant channel 14. A cooling medium inlet 11 and a cooling medium outlet 9 are provided on the cooling plate 5, and a refrigerant container 11 provided with a partition wall 10 is in close contact with the cooling plate 5 in order to put a partition therebetween. Further, the refrigerant container 11 is provided with a nozzle 7 that discharges the refrigerant 6 directly into the counterbore hole 4.
いま冷媒６が冷媒容器11の取入口８から図中の矢印の方
向に流入されると、隔壁10で仕切られた吸入室12に充満
し、それぞれのノズル７からざぐり穴４の中の突起物15
にふきつけられる。ふきつけられた冷媒６は冷媒流路14
を通り排出室13へ集まり、取出口９から外部へ排出され
る。Now, when the refrigerant 6 is introduced from the inlet 8 of the refrigerant container 11 in the direction of the arrow in the figure, the refrigerant is filled in the suction chamber 12 partitioned by the partition wall 10, and the protrusions in the counterbore 4 from the respective nozzles 7. 15
Be wiped. The wiped refrigerant 6 is the refrigerant flow path 14
Through the outlet 9 to be discharged to the outside.
なお集積回路素子２の上面の微小間隔に、従来も用いら
れている熱伝導性コンパウンドを充填しても一向に拘わ
ない。It should be noted that there is no problem even if the minute gaps on the upper surface of the integrated circuit element 2 are filled with a heat conductive compound which has been used conventionally.
以上説明したように本発明は、集積回路素子の上面に微
小間隔を保って設けられた冷却板の内面に設けられた放
熱用の突起物に冷媒を噴流させることによって、冷媒と
冷却板との接触面積を広げ、また冷却板が一体構造であ
るため熱抵抗が小さく、ひいては集積回路素子と冷媒と
の間の熱抵抗が小さくなっているので、集積回路素子か
らの発熱を冷媒の流量を変えることなく効率的に機器外
部へ排出できる効果がある。INDUSTRIAL APPLICABILITY As described above, according to the present invention, the refrigerant is jetted to the heat-dissipating protrusions provided on the inner surface of the cooling plate provided on the upper surface of the integrated circuit element with a minute gap therebetween, so that the refrigerant and the cooling plate Since the contact area is widened and the cooling plate has an integrated structure, the thermal resistance is small, and therefore the thermal resistance between the integrated circuit element and the refrigerant is small, so the heat generated from the integrated circuit element changes the flow rate of the refrigerant. There is an effect that it can be efficiently discharged to the outside of the device.
第１図は本発明の一実施例の断面図、第２図は第１図の
部分詳細図である。 １…基板、２…集積回路、３…基板枠、４…ざぐり穴、
５…冷却板、６…冷媒、７…ノズル、８…取入口、９…
取出口、10…隔壁、11…冷媒容器、12…吸入室、13…排
出室、14…冷媒通路、15…突起物。FIG. 1 is a sectional view of an embodiment of the present invention, and FIG. 2 is a partial detailed view of FIG. 1 ... Substrate, 2 ... Integrated circuit, 3 ... Substrate frame, 4 ... Counterbore,
5 ... Cooling plate, 6 ... Refrigerant, 7 ... Nozzle, 8 ... Intake port, 9 ...
Outlet, 10 ... Partition wall, 11 ... Refrigerant container, 12 ... Suction chamber, 13 ... Discharge chamber, 14 ... Refrigerant passage, 15 ... Protrusion.
Claims (1)
回路と、前記基板を保持する基板枠と、この基板枠に密
着して前記複数の集積回路素子の上面と微小間隔を保っ
て対向する外面を有し、前記集積回路素子と対向する内
面の底部に複数個の柱状突起を設けた複数のざぐり穴と
これらのざぐり穴を連結する冷媒流路とを有する冷却板
と、この冷却板に密着して設けられ、冷媒の取込口と取
出口とこの取入口に接続され冷媒のタンク室となる吸入
室と前記取入口と前記冷媒流路とに接続された排出室と
前記吸入室から前記ざぐり穴の底部に向う複数個のノズ
ルとを有する冷媒容器とを有することを特徴とする集積
回路の冷却構造。1. An integrated circuit having a plurality of integrated circuit elements mounted on a substrate, a substrate frame for holding the substrate, and a surface of the substrate frame which is in close contact with the upper surface of the plurality of integrated circuit elements with a minute gap therebetween. And a cooling plate having a plurality of counterbored holes provided with a plurality of columnar protrusions at the bottom of the inner surface facing the integrated circuit element and a coolant channel connecting the counterbored holes, and this cooling plate And a suction chamber which is provided in close contact with the suction port, is connected to the inlet and outlet of the refrigerant, and serves as a tank chamber for the refrigerant, and the discharge chamber and the suction chamber connected to the inlet and the refrigerant passage. To a bottom of the counterbore, and a cooling medium container having a plurality of nozzles.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25353788A JPH0732221B2 (en) | 1988-10-06 | 1988-10-06 | Integrated circuit cooling structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25353788A JPH0732221B2 (en) | 1988-10-06 | 1988-10-06 | Integrated circuit cooling structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02100348A JPH02100348A (en) | 1990-04-12 |
| JPH0732221B2 true JPH0732221B2 (en) | 1995-04-10 |
Family
ID=17252748
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25353788A Expired - Lifetime JPH0732221B2 (en) | 1988-10-06 | 1988-10-06 | Integrated circuit cooling structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0732221B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2995590B2 (en) * | 1991-06-26 | 1999-12-27 | 株式会社日立製作所 | Semiconductor cooling device |
| JP3367465B2 (en) | 1999-05-13 | 2003-01-14 | 日本電気株式会社 | Oscillation frequency adjustment device |
| US7054403B2 (en) | 2000-03-21 | 2006-05-30 | Nippon Telegraph And Telephone Corporation | Phase-Locked Loop |
| JP2001324289A (en) * | 2000-05-16 | 2001-11-22 | Toshiba Ceramics Co Ltd | High temperature heat exchanger |
| JP4551261B2 (en) * | 2005-04-01 | 2010-09-22 | 株式会社日立製作所 | Cooling jacket |
| JP4857190B2 (en) * | 2007-05-17 | 2012-01-18 | 新日本無線株式会社 | Frequency sweep oscillation circuit |
| JP5287922B2 (en) * | 2011-04-19 | 2013-09-11 | 株式会社豊田自動織機 | Cooling system |
-
1988
- 1988-10-06 JP JP25353788A patent/JPH0732221B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02100348A (en) | 1990-04-12 |
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