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JPH0732297B2 - Circuit component mounting structure - Google Patents
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JPH0732297B2 - Circuit component mounting structure - Google Patents

Circuit component mounting structure

Info

Publication number
JPH0732297B2
JPH0732297B2 JP60149198A JP14919885A JPH0732297B2 JP H0732297 B2 JPH0732297 B2 JP H0732297B2 JP 60149198 A JP60149198 A JP 60149198A JP 14919885 A JP14919885 A JP 14919885A JP H0732297 B2 JPH0732297 B2 JP H0732297B2
Authority
JP
Japan
Prior art keywords
electrodes
terminals
flexible circuit
insulating film
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60149198A
Other languages
Japanese (ja)
Other versions
JPS6211290A (en
Inventor
外与志 河田
真太郎 木栖
哲雄 青木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP60149198A priority Critical patent/JPH0732297B2/en
Publication of JPS6211290A publication Critical patent/JPS6211290A/en
Publication of JPH0732297B2 publication Critical patent/JPH0732297B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Description

【発明の詳細な説明】 〔概要〕 本発明はそれぞれ対応する複数の電極端子を備えた2つ
の基板を、該各基板の端子間接続用の複数本の電極を絶
縁性フィルムに形成してなる可撓性回路基板により接続
する際に、各基板の対応する端子間にずれ等があっても
容易に接続を行えるようにしたもので、可撓性回路基板
を、絶縁性フィルムの平面方向、特に電極配列方向に可
撓性を有する構造として目的の達成を図っている。
DETAILED DESCRIPTION OF THE INVENTION [Outline] The present invention comprises two substrates each having a plurality of corresponding electrode terminals, and a plurality of electrodes for connecting terminals of each substrate formed on an insulating film. When connecting with a flexible circuit board, it is possible to easily connect even if there is a gap between the corresponding terminals of each board, the flexible circuit board, the plane direction of the insulating film, In particular, the object is achieved as a structure having flexibility in the electrode arrangement direction.

〔産業上の利用分野〕[Industrial application field]

本発明はそれぞれ対応する複数の電極端子を備えた2つ
の基板を可撓性回路基板により電気的に接続する回路部
品実装構造に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a circuit component mounting structure for electrically connecting two substrates each having a plurality of corresponding electrode terminals by a flexible circuit substrate.

この種の基板間接続には、フレキシブルケーブル等の可
撓性回路基板が広く用いられているが、この場合、各基
板の対応する端子間にずれ等があっても容易に接続を行
える構造が要望される。
Flexible circuit boards such as flexible cables are widely used for this type of board-to-board connection. In this case, however, there is a structure that allows easy connection even if there is a gap between the corresponding terminals of each board. Requested.

〔従来の技術〕[Conventional technology]

第6図は対向配置された基板1,2を示す斜視図、第7図
は基板1,2の対向状態を示す側面図である。また、第8
図はこれらの基板1,2を接続する従来のフレキシブルケ
ーブル(可撓性回路基板)3の平面図である。各基板1,
2はそれぞれ表面に複数の電極端子4,5を備えており、こ
れらの端子4,5は各基板1,2に形成された回路に接続して
いる。フレキシブルケーブル3はベースフィルム(絶縁
性フィルム)6に複数本の電極7を形成してなり、電極
7の配列ピッチは、各基板の端子4,5と同様である。フ
レキシブルケーブル3の形成は、例えばポリイミドやポ
リエステル等を基材とし、これに数十μmの厚さの金属
板を張り付けた後、該金属板の電極以外の不要部分をエ
ッチングにより取り除くことにより行われる。このフレ
キシブルケーブル3による基板1,2の接続は、各電極7
の一端を基板1の各端子4に、各電極7の他端を基板2
の各端子5にそれぞれ接続することにより行われる。
FIG. 6 is a perspective view showing the substrates 1 and 2 arranged to face each other, and FIG. 7 is a side view showing the state where the substrates 1 and 2 face each other. Also, the eighth
The figure is a plan view of a conventional flexible cable (flexible circuit board) 3 for connecting these boards 1 and 2. Each board 1,
Each of the terminals 2 has a plurality of electrode terminals 4 and 5 on its surface, and these terminals 4 and 5 are connected to the circuits formed on the substrates 1 and 2. The flexible cable 3 is formed by forming a plurality of electrodes 7 on a base film (insulating film) 6, and the arrangement pitch of the electrodes 7 is the same as that of the terminals 4 and 5 of each substrate. The flexible cable 3 is formed, for example, by using polyimide, polyester, or the like as a base material, attaching a metal plate having a thickness of several tens of μm thereto, and then removing unnecessary portions other than the electrodes of the metal plate by etching. . This flexible cable 3 connects the substrates 1 and 2 with each electrode 7
To one terminal 4 of the substrate 1 and the other end of each electrode 7 to the substrate 2
It is performed by connecting to each terminal 5 of.

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

このようなフレキシブルケーブル3を用いた従来の実装
構造では、特に電極7の幅が狭く電極間のピッチが小さ
いと、基板間の位置ずれ(対向する端子4,5間のずれ)
が問題となる。そして、甚だしい場合、第7図に例示し
たように、端子間のずれの量aが大きくなると、接続は
できなくなる。
In the conventional mounting structure using such a flexible cable 3, especially when the width of the electrodes 7 is narrow and the pitch between the electrodes is small, the positional displacement between the substrates (the displacement between the opposing terminals 4 and 5).
Is a problem. Then, in extreme cases, as shown in FIG. 7, when the amount of displacement a between the terminals becomes large, the connection becomes impossible.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は上述の問題点を解決することのできる回路部品
実装構造を提供することを目的としたもので、そのため
の手段として、第1図に例示したように、可撓性回路基
板の所定領域内の絶縁性フィルムを各電極間において複
数本の電極に跨がるように削除し、この可撓性基板を用
いて各基板間の接続を行う構成を採用している。
The present invention is intended to provide a circuit component mounting structure capable of solving the above-mentioned problems, and as a means therefor, as illustrated in FIG. 1, a predetermined area of a flexible circuit board is provided. The insulating film inside is removed so as to straddle a plurality of electrodes between the electrodes, and the flexible substrate is used to connect the substrates.

〔作用〕[Action]

可撓性回路基板の所定領域内の絶縁性フィルムが各電極
間において複数本の電極に跨がるように削除されている
ため、絶縁性フィルムの平面方向、特に電極配列方向の
可撓性が大きく増大する。従って、この可撓性回路基板
を用いて接続しようとする各基板の対向する端子間にず
れがあっても、増大した上記可撓性を利用して、ずれて
いる端子間の接続を容易かつ確実に行うことが可能にな
る。
Since the insulating film in the predetermined area of the flexible circuit board is removed so as to straddle a plurality of electrodes between the electrodes, the flexibility of the insulating film in the plane direction, particularly in the electrode arrangement direction is improved. Greatly increased. Therefore, even if there is a deviation between the opposing terminals of each board to be connected using this flexible circuit board, the increased flexibility can be utilized to facilitate connection between the misaligned terminals. It becomes possible to carry out surely.

〔実施例〕〔Example〕

以下、第1図乃至第5図に関連して本発明の実施例を説
明する。
Embodiments of the present invention will be described below with reference to FIGS. 1 to 5.

第1図及び第2図に第1の実施例を示す。A first embodiment is shown in FIGS. 1 and 2.

第1図は可撓性回路基板11の平面図、第2図は同側面図
で、可撓性基板11は、第1図の左右方向に伸びる複数対
(本側の場合は4対)の帯状のポリイミドフィルム1
21,122,123,124よりなる絶縁性フィルム12により複
数本の電極13を挟持してなる。各対のポリイミドフィル
ム121,122,123,124の間には間隙(削除部分)14,15,
16が形成されており、第1図の左右方向に所定のピッチ
で配設された各電極13はこの間隙14,15,16の部分で露出
している。すなわち、絶縁性フィルム12は、第1図の上
下方向の複数箇所において各電極13の一部が露出するよ
うに削除されている。各電極13の配列ピッチは、この可
撓性回路基板11により接続しようとする各基板に形成さ
れている電極端子の配列ピッチと等しくなっている。
FIG. 1 is a plan view of the flexible circuit board 11, and FIG. 2 is a side view of the same. The flexible board 11 includes a plurality of pairs (four pairs in the case of the main side) extending in the left-right direction of FIG. Band-shaped polyimide film 1
A plurality of electrodes 13 are sandwiched between insulating films 12 composed of 2 1 , 12 2 , 12 3 , and 12 4 . Between each pair of polyimide films 12 1 , 12 2 , 12 3 and 12 4 there is a gap (removed part) 14,15,
16 are formed, and the respective electrodes 13 arranged at a predetermined pitch in the left-right direction in FIG. 1 are exposed at the gaps 14, 15, 16. That is, the insulating film 12 is removed so that a part of each electrode 13 is exposed at a plurality of positions in the vertical direction in FIG. The arrangement pitch of the electrodes 13 is equal to the arrangement pitch of the electrode terminals formed on each board to be connected by the flexible circuit board 11.

このように、可撓性回路基板11を構成する絶縁性フィル
ム12は第1図の上下方向の複数箇所で削除されており、
各電極13がこの削除部分(間隙14,15,16の部分)で露出
しているため、該絶縁性フィルム12の平面方向特に電極
配列方向の可撓性が大きく増大する。従って、この可撓
性回路基板を用いて接続しようとする各基板の対向する
端子間にずれがあっても、増大した上記可撓性を利用し
て、ずれている各端子間の接続を容易かつ確実に行うこ
とが可能になる。
In this way, the insulating film 12 constituting the flexible circuit board 11 is deleted at a plurality of positions in the vertical direction of FIG.
Since each electrode 13 is exposed at the removed portions (the portions of the gaps 14, 15, 16), the flexibility of the insulating film 12 in the plane direction, particularly in the electrode arrangement direction is greatly increased. Therefore, even if there is a deviation between the opposing terminals of each board to be connected using this flexible circuit board, it is easy to connect the misaligned terminals by utilizing the increased flexibility. And it becomes possible to perform reliably.

この場合、各間隙14,15,16の部分で電極13がむき出して
露出しているが、このむき出しの電極上にポリアミドフ
ィルムを残しておいても良い。このようにすると、可撓
性回路基板の所定領域内の絶縁性フィルムが各電極間に
おいて削除されたことになり、各電極はむき出しで露出
せずに保護,補強されて絶縁性も良くなる。また、電極
13のむき出しで露出している部分に樹脂等の絶縁膜を塗
布するかあるいは別のフィルムを張り付けるようにして
も良い。
In this case, the electrode 13 is exposed and exposed at the gaps 14, 15 and 16, but the polyamide film may be left on the exposed electrode. By doing so, the insulating film in the predetermined area of the flexible circuit board is removed between the electrodes, and the electrodes are protected and reinforced without being exposed by being exposed, and the insulating property is also improved. Also electrodes
An insulating film such as a resin may be applied to the exposed portion of 13 or another film may be attached.

第3図に第2の実施例を示す。A second embodiment is shown in FIG.

本例の場合は、可撓性回路基板21は、ポリアミド等の絶
縁性フィルム22と電極23とよりなり、絶縁性フィルム22
には削除部分24,24が形成されている。このように、本
例の可撓性回路基板21は、絶縁性フィルム22を第3図の
左右方向に完全に削除するのではなく、その一部を電極
以外の部分で残すようにしている。この残す場所は、第
3図では、左,右端と真中の例を示したが、その他の箇
所としても良い。各電極23は、一部が削除部分24,24内
で露出しており、この場合の作用、効果は前例と同様で
ある。また電極露出部分の保護,補強等も前例と同様に
行うことができる。
In the case of this example, the flexible circuit board 21 is composed of an insulating film 22 such as polyamide and an electrode 23, and the insulating film 22
Deleted portions 24, 24 are formed in the. As described above, in the flexible circuit board 21 of this example, the insulating film 22 is not completely removed in the left-right direction in FIG. 3, but a part of the insulating film 22 is left in a portion other than the electrodes. In FIG. 3, the places to be left are shown at the left and right ends and in the middle, but they may be left at other places. Part of each electrode 23 is exposed in the deleted portions 24, 24, and the action and effect in this case are similar to those of the previous example. Further, protection and reinforcement of the exposed electrode portion can be performed in the same manner as in the previous example.

上述の各実施例で説明した可撓性回路基板を用いた回路
部品接続要領を第4,5図に示す。第4図は側面図、第5
図は第4図の断面図である。この場合に使用する可撓性
回路基板31は第1の実施例の形式のもの(絶縁性フィル
ム削除部分である間隙が1箇所)で、対向する基板32,3
3の接続は、各基板上に形成された電極34,35の端子36,3
7に可撓性基板31の各電極38の各端部を接続することに
より行われる。この場合、前述のように各基板の対向す
る端子36,37に第4図に示すように左右方向のずれがあ
っても、基板間接続を容易かつ確実に行うことができ
る。
The procedure for connecting circuit components using the flexible circuit board described in each of the above embodiments is shown in FIGS. FIG. 4 is a side view, FIG.
The figure is a cross-sectional view of FIG. The flexible circuit board 31 used in this case is of the type of the first embodiment (there is one gap where the insulating film is removed), and the opposing boards 32 and 3 are used.
3 is connected to the terminals 36, 3 of the electrodes 34, 35 formed on each substrate.
This is done by connecting each end of each electrode 38 of the flexible substrate 31 to 7. In this case, even if the opposing terminals 36 and 37 of each substrate are displaced in the horizontal direction as shown in FIG. 4 as described above, the connection between the substrates can be easily and reliably performed.

なお、端子間の接続を完了した後、該端子接続部と絶縁
性フィルム削除部分の間隙に対し、さらに保護,補強を
行うため、絶縁性樹脂などで固める等の処理を施すこと
もできる。
After the connection between the terminals is completed, the gap between the terminal connection portion and the portion where the insulating film is removed may be subjected to a treatment such as hardening with an insulating resin for further protection and reinforcement.

上述の説明では一層の電極を有する可撓性回路基板につ
いて述べたが、可撓性回路基板を多層電極を有するもの
としても良いことは勿論である。
In the above description, the flexible circuit board having one layer of electrodes has been described, but it goes without saying that the flexible circuit board may have multiple layers of electrodes.

また、この可撓性回路基板上に、回路部品を実装できる
ような基板構成,あるいは電極構成をとり、所定の回路
部品を実装することも勿論可能である。
Further, it is of course possible to mount a predetermined circuit component on the flexible circuit substrate by adopting a substrate structure or an electrode structure capable of mounting a circuit component.

〔発明の効果〕〔The invention's effect〕

以上述べたように、本発明によれば、接続しようとする
各基板の対向する電極端子にずれがあっても、基板間接
続を容易かつ確実に行うことが可能である。
As described above, according to the present invention, even if the opposing electrode terminals of each substrate to be connected are misaligned, the inter-substrate connection can be easily and reliably performed.

【図面の簡単な説明】[Brief description of drawings]

第1図は本発明の第1の実施例を示す可撓性回路基板の
平面図、 第2図は同側面図、 第3図は本発明の第2の実施例を示す可撓性回路基板の
平面図、 第4図は本発明の回路部品実装要領を示す側面図、 第5図は第3図の断面図、 第6図は基板配置を示す斜視図、 第7図は基板対向状態を示す側面図、 第8図は従来の基板接続用フレキシブルケーブルの平面
図で、 図中、 11,21,31は可撓性回路基板、 12,22は絶縁性フィルム、 13,23,38は電極、 14,15,16,24は絶縁性フィルム削除部分、 32,33は基板、 36,37は端子(電極端子)である。
FIG. 1 is a plan view of a flexible circuit board showing a first embodiment of the present invention, FIG. 2 is a side view of the same, and FIG. 3 is a flexible circuit board showing a second embodiment of the present invention. 4 is a plan view, FIG. 4 is a side view showing a circuit component mounting procedure of the present invention, FIG. 5 is a sectional view of FIG. 3, FIG. 6 is a perspective view showing a board arrangement, and FIG. 7 is a board facing state. Fig. 8 is a side view, and Fig. 8 is a plan view of a conventional flexible cable for board connection. In the figure, 11,21,31 are flexible circuit boards, 12,22 are insulating films, 13,23,38 are electrodes. , 14, 15, 16 and 24 are insulating film removed portions, 32 and 33 are substrates, and 36 and 37 are terminals (electrode terminals).

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】複数の電極端子を備えた第1の基板と、 前記第1の基板の各端子に対応する複数の電極端子を備
えた第2の基板とを、 前記各基板の端子間接続用の複数本の電極を絶縁性フィ
ルムに形成した可撓性回路基板により接続してなり、 前記可撓性回路基板の所定領域内の前記絶縁性フィルム
が、前記各電極間において前記複数本の電極に跨がるよ
うに削除されたことを特徴とする回路部品実装構造。
1. A connection between terminals of each substrate, comprising: a first substrate having a plurality of electrode terminals; and a second substrate having a plurality of electrode terminals corresponding to the respective terminals of the first substrate. Connecting a plurality of electrodes for flexible circuit board formed in an insulating film, the insulating film in a predetermined region of the flexible circuit board, the plurality of electrodes between the electrodes A circuit component mounting structure characterized by being deleted so as to straddle electrodes.
JP60149198A 1985-07-09 1985-07-09 Circuit component mounting structure Expired - Lifetime JPH0732297B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60149198A JPH0732297B2 (en) 1985-07-09 1985-07-09 Circuit component mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60149198A JPH0732297B2 (en) 1985-07-09 1985-07-09 Circuit component mounting structure

Publications (2)

Publication Number Publication Date
JPS6211290A JPS6211290A (en) 1987-01-20
JPH0732297B2 true JPH0732297B2 (en) 1995-04-10

Family

ID=15469965

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60149198A Expired - Lifetime JPH0732297B2 (en) 1985-07-09 1985-07-09 Circuit component mounting structure

Country Status (1)

Country Link
JP (1) JPH0732297B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4496280B2 (en) 2007-04-28 2010-07-07 新東工業株式会社 Tilt-type automatic pouring method and storage medium
JP4266235B2 (en) 2007-04-28 2009-05-20 新東工業株式会社 Tilt-type automatic pouring method and storage medium storing ladle tilt control program

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5364248U (en) * 1976-11-04 1978-05-30
JPS5752954U (en) * 1980-09-13 1982-03-27
JPS58188684U (en) * 1982-06-10 1983-12-15 セイコーエプソン株式会社 electronic display device

Also Published As

Publication number Publication date
JPS6211290A (en) 1987-01-20

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