JPH0732303B2 - Printed board terminal processing method - Google Patents
Printed board terminal processing methodInfo
- Publication number
- JPH0732303B2 JPH0732303B2 JP2966386A JP2966386A JPH0732303B2 JP H0732303 B2 JPH0732303 B2 JP H0732303B2 JP 2966386 A JP2966386 A JP 2966386A JP 2966386 A JP2966386 A JP 2966386A JP H0732303 B2 JPH0732303 B2 JP H0732303B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal portion
- plating
- solder
- terminal
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Description
【発明の詳細な説明】 〔概要〕 プリント板端子部のめっき加工方法であって、プリント
板の配線回路を半田めっきした後、同時にめっきされた
プリント板端子部の半田めっきを剥離し、その端子部の
銅部にニッケル，金めっきを施すに際し、半田めっきの
剥離後の端子部に、ホウフッ化水素酸液を噴射して洗浄
する第１スプレー洗浄処理と、引続きホウフッ化水素酸
液を噴射しながらバフ研磨するバフ研磨洗浄処理と、さ
らに引続きホウフッ化水素酸液を噴射して洗浄する第２
スプレー洗浄処理とからなるホウフッ化水素酸スクラバ
工程を行うことによって、該端子部の半田残滓や汚れを
完全に除去して活性化するとともに端子部の銅面を滑ら
かに仕上げ、銅部上にめっきされるニッケル，金めっき
の密着性および光沢をよくすることを可能とする。DETAILED DESCRIPTION OF THE INVENTION [Outline] A method of plating a printed circuit board terminal portion, wherein a wiring circuit of the printed circuit board is solder-plated, and then the solder plating of the printed circuit board terminal portion which is plated at the same time is peeled off. When nickel or gold plating is applied to the copper part of the part, the first spray cleaning process of spraying a borofluoric acid solution to the terminal part after peeling the solder plating to clean it, and subsequently spraying a borofluoric acid solution While buffing and cleaning treatment for buffing while cleaning, and then cleaning by spraying borofluoric acid solution
By performing a borohydrofluoric acid scrubber process consisting of a spray cleaning process, the solder residue and dirt on the terminal part are completely removed and activated, and the copper surface of the terminal part is finished smoothly and plated on the copper part. It is possible to improve the adhesion and gloss of the nickel and gold plating used.
本発明はプリント板端子部のめっき加工方法に関し、特
にプリント板端子部にめっきされるニッケル，金めっき
の密着性および光沢をよくするように改良されたプリン
ト板端子部のめっき加工方法に関するものである。The present invention relates to a method of plating a printed circuit board terminal portion, and more particularly to a method of plating a printed circuit board terminal portion improved to improve the adhesion and gloss of nickel and gold plating plated on the printed circuit board terminal portion. is there.
プリント板の配線回路を外部に取出す端子部は、外部接
栓との経年変化による接触抵抗の劣化等が発生しないよ
うにニッケル，金めっきが施こされる。The terminal portion for taking out the wiring circuit of the printed board to the outside is plated with nickel and gold so that deterioration of the contact resistance due to aging with the external plug does not occur.
この端子部にニッケル，金めっきを施すに際し、端子部
の銅表面に半田残滓や汚れがあるとニッケル，金めっき
がなじまず密着性がわるくなり、経年使用による接触抵
抗の劣化等を招くとともに、その表面が粗いとめっき仕
上がりに光沢がなくなり、外観品質を低下せしめる。When nickel or gold plating is applied to this terminal part, if there is solder residue or dirt on the copper surface of the terminal part, the nickel and gold plating will not adhere well and the adhesion will deteriorate, causing the deterioration of contact resistance due to aging and the like. If the surface is rough, the finish of the plating will be dull and the appearance quality will be degraded.
そこで、半田剥離後の端子部の銅表面に半田残滓や汚れ
をなくして滑らかにし、ニッケル，金めっきの密着性と
光沢を得ることができるプリント板端子部のめっき加工
方法が要望されていた。Therefore, there has been a demand for a method of plating a terminal portion of a printed board, which can remove the solder residue and stains on the copper surface of the terminal portion after the solder is peeled off and smooth the surface and obtain the adhesion and gloss of nickel and gold plating.
第３図は従来のプリント板端子部のめっき加工方式のブ
ロック図を示す。FIG. 3 shows a block diagram of a conventional plating method for a printed circuit board terminal portion.
第３図において、従来のめっき加工方式は、プリント板
端子部にめっきされた半田を剥離する半田剥離工程１
と、半田が剥離された端子部の銅面を研磨する研磨工程
２と、研磨面を水洗いする水洗工程３と、水洗いされた
研磨面を塩酸液（10％液）で洗浄する塩酸洗浄工程４
と、塩酸洗浄された端子面を水洗いする水洗工程５と、
水洗い後、端子面にニッケルめっきと、金めっきを順次
行なうニッケル，金めっき工程６とより構成されてい
る。In FIG. 3, the conventional plating method is the solder stripping step 1 for stripping the solder plated on the printed circuit board terminal portion.
A polishing step 2 for polishing the copper surface of the terminal portion from which the solder has been peeled off, a water washing step 3 for washing the polished surface with water, and a hydrochloric acid washing step 4 for washing the washed polished surface with a hydrochloric acid solution (10% solution).
And a washing step 5 of washing the terminal surface washed with hydrochloric acid with water,
After washing with water, the terminal surface is composed of nickel plating and gold plating step 6 in which gold plating is sequentially performed.
半田剥離工程１において、プリント板回路の半田めっき
と同時にめっきされたプリント板端子部の半田を剥離剤
を用いて剥離する。In the solder stripping step 1, the solder on the printed board terminal portion plated at the same time as the solder plating on the printed board circuit is stripped using a stripping agent.
次に、研磨工程２において、界面活性剤を用いた手ブラ
シで端子面を研磨し、半田剥離工程１で残った残滓を除
去する。Next, in the polishing step 2, the terminal surface is polished with a hand brush using a surfactant to remove the residue left in the solder stripping step 1.
研磨工程後、水洗工程３と塩酸洗浄工程４において、水
洗いと、10％塩酸液で約５分間洗浄して表面を洗浄し、
さらに細かい残滓や汚れを除去して水洗工程５で塩酸液
を洗い流した後、ニッケル，金めっき工程６において端
子部面にニッケルめっきと、金めっきを順次行なう。After the polishing step, in the water washing step 3 and the hydrochloric acid washing step 4, washing with water and washing with a 10% hydrochloric acid solution for about 5 minutes to wash the surface,
After further removing fine residues and dirt and washing away the hydrochloric acid solution in the water washing step 5, nickel and gold plating steps 6 sequentially perform nickel plating and gold plating on the terminal surface.
上記のめっき加工方式において、端子部面の半田を除去
する方法は、界面活性剤を有する洗浄剤を用いて手ブラ
シにより端子面の研磨を行なう研磨工程２が主流とな
る。In the above-mentioned plating method, the method of removing the solder on the terminal surface is mainly the polishing step 2 in which the terminal surface is polished with a hand brush using a cleaning agent having a surfactant.
手ブラシによる端子面の研磨は、端子部の銅表面を粗く
するとともに、半田残滓や汚れを完全に除去できない。
それがために、粗くなった端子部の銅面にニッケル，金
めっきを施した場合、ニッケル，金めっきに光沢がでに
くくなって端子部の外観品質を低下せしめるとともに、
端子部の半田残滓や汚れによってニッケル，金めっきの
密着性がわるくなり、経年使用による接触抵抗の劣化等
を招いて信頼性を損なうといった問題がある。Polishing the terminal surface with a hand brush not only roughens the copper surface of the terminal portion, but also cannot completely remove solder residue and dirt.
Therefore, when nickel or gold plating is applied to the roughened copper surface of the terminal part, the nickel and gold plating is less glossy and the appearance quality of the terminal part is deteriorated.
There is a problem that the adhesion of nickel and gold plating is deteriorated due to solder residue and dirt on the terminal portion, which leads to deterioration of contact resistance due to long-term use and impairs reliability.
本発明はこのような点に鑑みて創作されたもので、プリ
ント板端子部のニッケル，金めっきの密着性と、光沢を
よくすることができるプリント板端子部のめっき加工方
法を提供することを目的としている。The present invention has been made in view of the above circumstances, and provides a method for plating a printed circuit board terminal portion which can improve the adhesion of nickel and gold plating on the printed circuit board terminal portion and gloss. Has an aim.
第１図は本発明のプリント板端子部のめっき加工方式の
ブロック図であり、従来の研磨工程２に代わって、ホウ
フッ化水素酸液を噴射して化学的、また物理的に洗浄す
るホウフッ化水素酸スクラバ工程７を設けた構成として
いる。FIG. 1 is a block diagram of a method of plating a printed circuit board terminal portion according to the present invention. Instead of the conventional polishing step 2, borofluoride which is chemically and physically cleaned by spraying a hydroborofluoric acid solution. The configuration is provided with the hydro-acid scrubber process 7.
ホウフッ化水素酸スクラバ工程７としては、 ホウフッ化水素酸液を端子部面にかなりの圧力で噴射
させて洗浄する第１スプレー洗浄処理と、 ホウフッ化水素酸液を端子部面にかなりの圧力で噴射
させると共に、バフによりその端子面を研磨するバフ研
磨洗浄処理と、 更にホウフッ化水素酸液を端子部面にかなりの圧力で
噴射させて洗浄する第２スプレー洗浄処理とを、 一連化したラインで行って、端子部面を付着する剥離半
田の残滓を完全に除去するとともに、剥離工程１の半田
剥離で粗くなった端子部の銅表面の凹凸をなくして滑ら
かにする。The borofluoric acid scrubber process 7 includes: a first spray cleaning process in which a borofluoric acid solution is sprayed onto the terminal surface with a considerable pressure for cleaning, and a borofluoric acid solution is sprayed onto the terminal surface with a considerable pressure. A line in which a buff polishing cleaning process of spraying and buffing the terminal surface with a buff, and a second spray cleaning process of spraying a borofluoric acid solution onto the terminal surface with a considerable pressure for cleaning are performed. Then, the residue of the peeling solder that adheres to the terminal portion surface is completely removed, and the unevenness of the copper surface of the terminal portion roughened by the solder peeling in the peeling step 1 is eliminated and smoothed.
本発明では、ホウフッ化水素酸スクラバにより、半田剥
離後の残滓半田や汚れが完全に除去されるとともに、端
子部の銅面が滑らかとなり、密着性がよく、かつ光沢の
あるニッケル，金めっきを可能としている。In the present invention, the borohydrofluoric acid scrubber completely removes the residual solder and the stain after the solder is peeled off, and the copper surface of the terminal portion becomes smooth, and the adhesion is good, and the nickel and gold plating with gloss are applied. It is possible.
第１図は本発明のプリント板端子部のめっき方式のブロ
ック図、第２図（ａ）〜（ｃ）は一実施例のホウフッ化
水素酸工程の模式図を示す。FIG. 1 is a block diagram of a plating method for a printed circuit board terminal portion of the present invention, and FIGS. 2 (a) to 2 (c) are schematic diagrams of a borofluoric acid process of one embodiment.
第１図に示すように、一実施例のプリント板端子部のめ
っき方式は、半田剥離工程１で端子部の半田を剥離した
後、第２図（ａ）に示すように、ホウフッ化水素酸液を
端子部面に相当な圧力で当てて洗浄するスプレー洗浄工
程と、ホウフッ化水素酸液を端子部面に相当な圧力で当
てるとともに、バフにより端子部面を研磨するバフ研磨
洗浄工程と、さらにホウフッ化水素酸液を端子部面に相
当な圧力で当て洗浄するスプレー洗浄工程とを一連化し
たランイで構成している。As shown in FIG. 1, the plating method for the printed circuit board terminal portion of one embodiment is such that after the solder in the terminal portion is peeled off in the solder peeling step 1, as shown in FIG. A spray cleaning step in which the liquid is applied to the terminal surface with a considerable pressure to wash it, and a buff polishing cleaning step in which the terminal surface is polished with a buff while the borofluoric acid solution is applied to the terminal surface with a corresponding pressure, Furthermore, the spray cleaning process in which a borofluoric acid solution is applied to the surface of the terminal portion at a considerable pressure to perform cleaning is constituted by a series of runners.
第２図（ａ）のスプレー洗浄工程において、５〜10VOl
％の濃度のホウフッ化水素酸を端子部８の上，下方向に
より噴射機９より4KG/cm2の圧力を持ってスプレーして
端子部面を洗浄し、端子部８面の半田残滓や汚れを除去
する。In the spray cleaning process of Fig. 2 (a), 5-10 VOl
% Of borofluoric acid is sprayed from above and below the terminal portion 8 from the injector 9 with a pressure of 4 KG / cm 2 to clean the terminal portion surface, and solder residue and dirt on the terminal portion 8 surface To remove.
次に、第２図（ｂ）のバフ研磨工程において、前記濃度
のホウフッ化水素酸を端子部８の上，下方向より噴射機
９より3KG/cm2の圧力を持ってスプレーするとともにバ
フ10を回転させて端子部面を軟らかく研磨しつつ洗浄を
行ない、細かい半田残滓や端子部銅面の凹凸を平滑化す
る。Next, in the buffing step of FIG. 2 (b), borofluoric acid having the above-mentioned concentration is sprayed from above and below the terminal portion 8 from the injector 9 with a pressure of 3 KG / cm 2 , and the buff 10 Rotate to clean the terminal surface while softening it, and smooth fine solder residue and irregularities on the copper surface of the terminal.
さらに第２図（ｃ）に示すように、前記濃度のホウフッ
化水素酸を端子部８の上，下方向より噴射機９より4KG/
cm2の圧力を持ってスプレーして端子部面の洗浄を行な
い、半田残滓や汚れを完全に除去する。Further, as shown in FIG. 2 (c), borofluoric acid having the above-mentioned concentration is applied from above and below the terminal portion 8 from the injector 9 at 4 kg /
Clean the terminal surface by spraying with a pressure of cm 2 to completely remove solder residue and dirt.
このように、半田剥離後の粗い端子部銅面をスプレー，
バフ研磨スプレー，スプレーのホウフッ化水素酸の洗浄
プロセスを各工程において２〜３分間実施することによ
り、端子部の銅表面を滑らかにするとともに、活性化を
行なう。In this way, spray the rough copper surface of the terminal after solder peeling,
By performing a buffing spray and a borofluoric acid cleaning process of the spray for 2 to 3 minutes in each step, the copper surface of the terminal portion is smoothed and activated.
ホウフッ化水素酸スクラバ工程７において滑らかで活性
化された端子部は、水洗工程3,塩酸洗浄工程4,水洗工程
５を経てニッケル，金めっき工程６においてニッケル，
金めっきされる。The smooth and activated terminal portion in the borohydrofluoric acid scrubber process 7 undergoes a water washing process 3, a hydrochloric acid washing process 4, a water washing process 5, nickel, nickel in a gold plating process 6,
Gold plated.
以上説明したように本発明によれば、プリント板端子部
のめっき加工工程にホウフッ化水素酸スクラバ工程を設
けたことにより、半田剥離後の端子部銅面の半田残滓や
汚れを完全に除去して活性化を行なうとともに、その表
面を滑らかにし、粘着性をよく、且つ光沢のあるニッケ
ル，金めっきを得ることができる。As described above, according to the present invention, by providing the borofluoric acid scrubber process in the plating process of the printed circuit board terminal portion, the solder residue and dirt on the terminal portion copper surface after the solder peeling is completely removed. It is possible to obtain nickel and gold plating which has a smooth surface, good adhesion, and gloss while being activated.
第１図は本発明のプリント板端子部のめっき加工方式の
ブロック図、 第２図（ａ）〜（ｃ）は一実施例のホウフッ化水素酸液
スクラバ工程の模式図、 第３図は従来のプリント板端子部のめっき加工方式のブ
ロック図である。 図において、１は半田剥離工程、２は研磨工程、3,5は
水洗工程、４は塩酸洗浄工程、６はニッケル，金めっき
工程、７はホウフッ化水素酸スクラバ工程、８は端子
部、９は噴射機、10はバフを示す。FIG. 1 is a block diagram of a plating method of a printed circuit board terminal portion of the present invention, FIGS. 2 (a) to 2 (c) are schematic diagrams of a hydrofluoric acid solution scrubber process of one embodiment, and FIG. FIG. 3 is a block diagram of a plating method of a printed board terminal portion of FIG. In the figure, 1 is a solder stripping step, 2 is a polishing step, 3 and 5 are water washing steps, 4 is a hydrochloric acid washing step, 6 is a nickel and gold plating step, 7 is a borohydrofluoric acid scrubber step, 8 is a terminal portion, 9 Is an injector and 10 is a buff.
Claims (1)
際し、 前記端子部に、ホウフッ化水素酸液を噴射して洗浄する
第１スプレー洗浄処理と、引続きホウフッ化水素酸液を
噴射しながらバフ研磨するバフ研磨洗浄処理と、さらに
引続きホウフッ化水素酸液を噴射して洗浄する第２スプ
レー洗浄処理とからなるホウフッ化水素酸スクラバ工程
を行った後、その端子部に金属めっきを施すようにした
ことを特徴とするプリント板端子部のめっき加工方法。1. When applying a metal plating to a terminal portion of a printed board, a first spray cleaning process of spraying and cleaning the terminal portion with a borofluoric acid solution, and subsequently spraying the borofluoric acid solution. After performing a borofluoric acid scrubber process consisting of a buffing cleaning process of buffing and a second spray cleaning process of subsequently injecting and cleaning a borohydrofluoric acid solution, metal plating should be applied to the terminals. A method of plating a printed circuit board terminal portion, characterized in that
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2966386A JPH0732303B2 (en) | 1986-02-12 | 1986-02-12 | Printed board terminal processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2966386A JPH0732303B2 (en) | 1986-02-12 | 1986-02-12 | Printed board terminal processing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62186590A JPS62186590A (en) | 1987-08-14 |
| JPH0732303B2 true JPH0732303B2 (en) | 1995-04-10 |
Family
ID=12282354
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2966386A Expired - Lifetime JPH0732303B2 (en) | 1986-02-12 | 1986-02-12 | Printed board terminal processing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0732303B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2569872B2 (en) * | 1990-03-02 | 1997-01-08 | ヤマハ株式会社 | Sound field control device |
| JP2009200236A (en) * | 2008-02-21 | 2009-09-03 | Daisho Denshi Co Ltd | Board with contact terminal, ic memory card, and manufacturing method of board with contact terminal |
-
1986
- 1986-02-12 JP JP2966386A patent/JPH0732303B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62186590A (en) | 1987-08-14 |
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