JPH0735940B2 - Cooling system - Google Patents
Cooling systemInfo
- Publication number
- JPH0735940B2 JPH0735940B2 JP63086783A JP8678388A JPH0735940B2 JP H0735940 B2 JPH0735940 B2 JP H0735940B2 JP 63086783 A JP63086783 A JP 63086783A JP 8678388 A JP8678388 A JP 8678388A JP H0735940 B2 JPH0735940 B2 JP H0735940B2
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- water
- ambient temperature
- cooling
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title claims description 34
- 239000003507 refrigerant Substances 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 14
- 239000002826 coolant Substances 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 41
- 238000010586 diagram Methods 0.000 description 6
- 238000009833 condensation Methods 0.000 description 4
- 230000005494 condensation Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000498 cooling water Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- JEGUKCSWCFPDGT-UHFFFAOYSA-N h2o hydrate Chemical compound O.O JEGUKCSWCFPDGT-UHFFFAOYSA-N 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Description
【発明の詳細な説明】 [産業上の利用分野] 本発明は電子計算機等の電子装置を構成する発熱素子を
冷却するための液体冷媒を循環供給する冷却装置に関す
る。The present invention relates to a cooling device that circulates and supplies a liquid refrigerant for cooling a heating element that constitutes an electronic device such as an electronic computer.
[従来の技術] 一般に、電子計算機等の電子装置は多数の集積回路を搭
載したプリント基板を多数枚筐体に実装し、架に取付け
た送風機により強制空冷を行っている。[Prior Art] Generally, in an electronic device such as an electronic computer, a large number of printed boards on which a large number of integrated circuits are mounted are mounted in a housing, and forced air cooling is performed by a blower mounted on a rack.
近年、高速装置の実現のための大規模集積回路の採用お
よび高密度実装により装置内の発蒸密度が高くなってき
ており、これらの装置では液冷方式を採用する場合が多
い。第4図に従来のこの種の冷却方式の構成を示す。In recent years, due to the adoption of a large-scale integrated circuit and the high-density mounting for realizing a high-speed device, the vaporization density in the device has become high, and these devices often employ a liquid cooling system. FIG. 4 shows the configuration of a conventional cooling system of this type.
同図において、40は冷却装置、41は被冷却体である電子
装置を示し、両者は給水ホース10と戻りホース11にて接
続される。電子装置41内には発熱素子であるLSI1と、こ
れに密着して冷却する内部に冷媒を流す冷却板2と、冷
却板2間を接続する架内配管部3とから構成される。In the figure, reference numeral 40 denotes a cooling device and 41 denotes an electronic device which is a cooled object, both of which are connected by a water supply hose 10 and a return hose 11. The electronic device 41 is composed of an LSI 1 which is a heating element, a cooling plate 2 which closely adheres to the LSI 1 and flows a cooling medium inside, and an on-board piping section 3 which connects the cooling plates 2 to each other.
冷却装置40より供給された水が冷却板2内を通り熱を奪
い、温度が高くなった後冷却装置40に戻され、ここで冷
却されて再び電子装置41に供給される閉循環式である。The water supplied from the cooling device 40 passes through the inside of the cooling plate 2 to remove heat, and after the temperature rises, the water is returned to the cooling device 40 where it is cooled and supplied to the electronic device 41 again. .
冷却装置40は、水を電子装置41に送り出すためのポンプ
5とタンク4と水−水の熱交換器6とから構成される。
熱交換器6には外部より温度の低い冷却水6aが供給され
て電子装置41より戻った水を冷却する。The cooling device 40 includes a pump 5 for sending water to the electronic device 41, a tank 4, and a water-water heat exchanger 6.
Cooling water 6a having a lower temperature is supplied to the heat exchanger 6 from the outside to cool the water returned from the electronic device 41.
ここで、電子装置41に供給する水12の温度は三方弁7に
て熱交換器6に流れる水量をバルブモータ8の回転によ
り開度を変えて制御される。バルブモータ8の回転角は
温度制御器9の出力にて決定される。この温度制御器9
は、電子装置41内の架内配管部3で水が流入する管に設
けた水温センサ13と電子装置41内の空間に設けた気温セ
ンサ14の差に応じて出力が変化し、前述の差を一定に保
つための出力をバルブモータ8に送る。ここで、気温セ
ンサ14は電子装置41の雰囲気温度を検出し、水12の温度
は水温センサ13にて検出され、雰囲気温度より若干高め
に保たれる様に制御され、いかなる環境下でも水温低下
によって発生する結露を防止している。温度制御器9の
出力は、内部に設定された比例・積分・微分(PID)の
値に依存し、PIDの値は雰囲気の微少変化では変化しな
い様反応を遅くしてある。雰囲気の微少変化にて水温が
変動すると、LSI1の信頼度に悪影響を与える可能性があ
るためである。Here, the temperature of the water 12 supplied to the electronic device 41 is controlled by changing the opening of the water amount flowing to the heat exchanger 6 by the three-way valve 7 by rotating the valve motor 8. The rotation angle of the valve motor 8 is determined by the output of the temperature controller 9. This temperature controller 9
The output changes according to the difference between the water temperature sensor 13 provided in the pipe into which water flows in the in-carriage piping part 3 in the electronic device 41 and the temperature sensor 14 provided in the space in the electronic device 41. Is sent to the valve motor 8. Here, the air temperature sensor 14 detects the ambient temperature of the electronic device 41, the temperature of the water 12 is detected by the water temperature sensor 13, and is controlled so as to be kept slightly higher than the ambient temperature. Condensation caused by this is prevented. The output of the temperature controller 9 depends on the proportional / integral / derivative (PID) values set inside, and the reaction is delayed so that the PID value does not change with a slight change in the atmosphere. This is because if the water temperature changes due to a slight change in the atmosphere, the reliability of the LSI 1 may be adversely affected.
[発明が解決しようとする課題] しかしながら、上述した従来の冷却装置では、PIDの設
定値を追従が遅くなる様に設定すると、微少変動に対し
効果がある反面、雰囲気温度が急激に変動した場合、水
温が追従できずに水温と雰囲気温に大きな差が生じると
いう欠点がある。[Problems to be Solved by the Invention] However, in the above-described conventional cooling device, when the set value of PID is set so that the tracking is slow, it is effective against a minute change, but when the atmospheric temperature fluctuates rapidly. However, there is a drawback that the water temperature cannot follow and a large difference occurs between the water temperature and the ambient temperature.
第3図に、雰囲気温度が変化した場合の水温の変化を示
す。同図において、気温45が急激に高くなった場合、水
温46(図中破線)は急激に上昇せず、規定値に達するま
で時間を要する。この時、湿度によっては結露する可能
性がある。また急激に低くなった場合、水温は長時間高
くなっているので、LSIの信頼度にとって好ましくな
い。FIG. 3 shows the change in water temperature when the ambient temperature changes. In the figure, when the air temperature 45 suddenly rises, the water temperature 46 (broken line in the figure) does not rise rapidly, and it takes time to reach the specified value. At this time, depending on the humidity, dew condensation may occur. If the temperature drops sharply, the water temperature rises for a long time, which is not desirable for the reliability of the LSI.
さらに、電子装置内の1部のLSIの電源が切断され発熱
量が変動した場合でも負荷量の変化に冷却能力の調整が
追従せず、水温と気温に大きな差が生じ同様の現象が発
生するという欠点がある。Furthermore, even when the power supply to a part of the LSI in the electronic device is cut off and the amount of heat generated fluctuates, the adjustment of the cooling capacity does not follow the change in the amount of load, causing a large difference between the water temperature and the air temperature, and the same phenomenon occurs. There is a drawback that.
[課題を解決するための手段] 本発明は上記課題を解決し、気温の変動に追従して適切
に電子装置の冷却を行うことのできる冷却装置を提供す
ることを目的とする。[Means for Solving the Problems] It is an object of the present invention to solve the above problems and provide a cooling device that can appropriately cool an electronic device by following changes in temperature.
上記目的を達成するため本発明に係る冷却装置は、 被冷却体に液体冷媒を循環供給して被冷却体の冷却を行
う冷却装置において、 前記被冷却体の雰囲気温度を検出する雰囲気温度検出手
段と、 前記被冷却体から戻される前記液体冷媒の温度を検出す
る冷媒温度検出手段と、 前記雰囲気温度検出手段が検出する前記雰囲気温度が時
間変化するときに、前記液体冷媒の温度を前記雰囲気温
度によって定まる所定温度に制御する際の温度変化速度
を前記雰囲気温度検出手段および前記冷媒温度検出手段
が検出する温度の差分によって調節する温度制御手段を
有することを特徴とするものである。In order to achieve the above object, the cooling device according to the present invention is a cooling device that circulates and supplies a liquid coolant to a cooled object to cool the cooled object, wherein an ambient temperature detecting means for detecting an ambient temperature of the cooled object. A refrigerant temperature detecting means for detecting the temperature of the liquid refrigerant returned from the object to be cooled; and when the ambient temperature detected by the ambient temperature detecting means changes with time, the temperature of the liquid refrigerant is set to the ambient temperature. It is characterized by further comprising temperature control means for adjusting the temperature change rate when controlling to a predetermined temperature determined by the temperature difference detecting means according to the difference between the temperatures detected by the ambient temperature detecting means and the refrigerant temperature detecting means.
すなわち、上記温度制御手段である温度制御器は液体冷
媒の温度を雰囲気温度との差の大きさにより出力信号の
変化速度を変えるパラメータを変更する手段を有し、こ
のパラメータにより制御信号の変化速度を変えるもので
あり、また、制御信号の変化速度に緩急をつけることに
より冷却能力制御信号にて放熱能力の制御速度に緩急を
実現し、液体冷媒温度の雰囲気温度の変化への追従性を
変えるものである。That is, the temperature controller, which is the above-mentioned temperature control means, has means for changing a parameter for changing the changing speed of the output signal according to the size of the difference between the temperature of the liquid refrigerant and the ambient temperature, and the changing speed of the control signal is changed by this parameter. In addition, by changing the speed of change of the control signal, the cooling speed control signal realizes the speed of control of the heat dissipation capacity and changes the followability to changes in the ambient temperature of the liquid refrigerant. It is a thing.
[実施例] 次に、本発明の一実施例について図面を参照して説明す
る。[Embodiment] Next, an embodiment of the present invention will be described with reference to the drawings.
第1図は本発明の一実施例による冷却装置の温度制御方
式の構成を示す図である。尚、図中、第4図と同一構成
要素のものについては同一参照番号を付して説明する。FIG. 1 is a diagram showing a configuration of a temperature control system of a cooling device according to an embodiment of the present invention. In the figure, the same components as those in FIG. 4 are described with the same reference numerals.
同図において、40aが冷却装置、411が電子装置である。
両装置は給水ホース10と戻りホース11とによって接続さ
れ液体冷媒(例えば水)を循環させている。電子装置41
内は、発熱体であるLSI1が多数搭載され、LSI1に密着し
て内部に冷却装置40aからの水を流してLSI1を冷却する
冷却板2と、冷却板2を結ぶ架内配管3とから構成され
る。In the figure, 40a is a cooling device, and 411 is an electronic device.
Both devices are connected by a water supply hose 10 and a return hose 11 and circulate a liquid refrigerant (for example, water). Electronic device 41
A large number of LSIs 1 that are heating elements are mounted inside, and are composed of a cooling plate 2 that is in close contact with the LSI 1 and cools the LSI 1 by flowing water from the cooling device 40a into the inside, and an on-board pipe 3 that connects the cooling plates 2. To be done.
一方冷却装置40aは、ポンプ5、タンク4、水−水の熱
交換器6、三方弁7及びバルブモータ8から構成され、
外部より供給される冷却水6aにより、電子装置41から戻
った水を熱交換により冷却する。電子装置41に供給する
水12の温度は、温度制御器9aが温温センサ14と、水温セ
ンサ13の値を入力し、水122の温度が気温より若干高く
なるようにバルブモータ8により三方弁7の開度を変え
て制御される。On the other hand, the cooling device 40a includes a pump 5, a tank 4, a water-water heat exchanger 6, a three-way valve 7 and a valve motor 8,
The cooling water 6a supplied from the outside cools the water returned from the electronic device 41 by heat exchange. As for the temperature of the water 12 supplied to the electronic device 41, the temperature controller 9a inputs the values of the temperature sensor 14 and the water temperature sensor 13, and the valve motor 8 causes the three-way valve so that the temperature of the water 122 becomes slightly higher than the ambient temperature. It is controlled by changing the opening of 7.
なお、上記した気温センサ14と水温センサ13は、従来技
術で述べた位置と同一である。The temperature sensor 14 and the water temperature sensor 13 described above are the same as the positions described in the related art.
ここで、本実施例の温度制御器9aは、水温センサ13と気
温センサ14の差△Tを認識して、PIDの値を変える機能
を有する。△Tの大きさごとにPID値を定め、△Tが小
さい場合には、PID値を追従が遅くなる値に設定し、気
温の微少変動に対し水12の温度が変化しないようにす
る。Here, the temperature controller 9a of the present embodiment has a function of recognizing the difference ΔT between the water temperature sensor 13 and the temperature sensor 14 and changing the value of PID. A PID value is determined for each size of ΔT, and when ΔT is small, the PID value is set to a value that delays tracking so that the temperature of the water 12 does not change with a slight change in temperature.
一方、△Tが大きい場合には、PIDの値を応答速度が早
くなる値に設定し、気温や電子装置41の発熱量の急激な
変動に対してすぐ追従するようにする。On the other hand, when ΔT is large, the value of PID is set to a value at which the response speed becomes fast so that the PID value is immediately followed by the rapid change in the air temperature and the heat generation amount of the electronic device 41.
第2図(a),(b)に温度制御器9aの構成を示す。2A and 2B show the structure of the temperature controller 9a.
同図において、水温センンサ13と気温センサ14の値をマ
ルチプレクサ21にて交互に計測し、A/Dコンバータ22に
てデジタル信号に変換し、入力ポート23を介してCPU24
に入力する。マルチプレクサ21は、CPU24により出力ポ
ート26を介して制御される。CPU24は水温と気温の差△
Tを演算し、ROM25内に設けたPID設定値テーブル25aを
参照してPID設定値を決定する(第2図(b))。PID設
定値は、出力ポート26を介してD/Aコンバータ27により
アナログ信号に変換され、バルブモータ8に出力され
る。In the figure, the values of the water temperature sensor 13 and the temperature sensor 14 are alternately measured by the multiplexer 21, converted into a digital signal by the A / D converter 22, and the CPU 24 through the input port 23.
To enter. The multiplexer 21 is controlled by the CPU 24 via the output port 26. CPU24 is the difference between water temperature and temperature △
T is calculated, and the PID set value is determined by referring to the PID set value table 25a provided in the ROM 25 (FIG. 2 (b)). The PID set value is converted into an analog signal by the D / A converter 27 via the output port 26 and output to the valve motor 8.
なお、CPU24の一連の動作は、ROM25にて制御される。こ
の様な温度制御により、第3図で曲線47に示すように気
温が急激に上昇した場合、△Tが一瞬大きくなり温度制
御器9aが△Tを認識してPIDの設定値を変える。そし
て、すぐに追従させる出力をバルブモータ8に送り、三
方弁7にてバイパス量を多くして曲線47に示すように水
温を上昇させる。したがって気温と水温の差が大きくな
る時間は短くてすみ、ほぼ水温は気温の変化に追従する
ことができる。The series of operations of the CPU 24 are controlled by the ROM 25. With such temperature control, when the air temperature suddenly rises as shown by the curve 47 in FIG. 3, ΔT increases momentarily and the temperature controller 9a recognizes ΔT and changes the set value of PID. Then, an output to be immediately followed is sent to the valve motor 8, and the three-way valve 7 increases the bypass amount to raise the water temperature as shown by a curve 47. Therefore, the time during which the difference between the air temperature and the water temperature becomes large can be short, and the water temperature can almost follow the changes in the air temperature.
また、気温が逆に低下した場合でも、PID設定値を変え
て、バイパス量を少なくして気温に追従し、曲線47に示
すように水温が高い状態になる時間は短い。Further, even when the air temperature decreases, the PID set value is changed to reduce the bypass amount to follow the air temperature, and as shown by the curve 47, the time in which the water temperature becomes high is short.
尚、本実施例ではPIDの設定値を第2図(b)に示すよ
うに4種類にしたが、これに限らず何種類でも良く、種
類が多い程制御性は良くなる。In this embodiment, the set value of the PID is set to four kinds as shown in FIG. 2 (b), but it is not limited to this and any kind may be used, and the more kinds, the better the controllability.
[発明の効果] 以上説明したように、本発明による冷却装置は、被冷却
体の雰囲気温度と被冷却体から戻される液体冷媒の温度
差に応じて熱交換器を制御することにより気温の変動に
追従して液体冷媒が冷却可能となるので雰囲気温度と液
体冷媒の温度差が大きくなることが無い。したがって水
温が気温より低くなる時間が非常に短くでき結露を防止
できる効果がある。また、気温より高くなる時間も短く
できるため例えば電子装置のような被冷却体のLSIの信
頼性に影響を与えることがない。[Effects of the Invention] As described above, the cooling device according to the present invention controls the heat exchanger according to the difference between the ambient temperature of the object to be cooled and the temperature of the liquid refrigerant returned from the object to be cooled, thereby varying the temperature. Since the liquid refrigerant can be cooled by following the above, the difference between the ambient temperature and the liquid refrigerant does not increase. Therefore, the time when the water temperature becomes lower than the air temperature can be extremely shortened, which is effective in preventing dew condensation. In addition, since the time when the temperature is higher than the temperature can be shortened, the reliability of the LSI of the cooled object such as the electronic device is not affected.
さらに、電子装置の発熱量が変動した場合でも、冷却能
力がすぐ追従して変化するので水温はすぐに追従すると
いう効果があり、前述の結露の問題や、水温が高いまま
になるということがない。このように、追従性を早くし
たのにもかかわらず、従来の気温の微変動に対しては水
温が変動しないので、信頼性の高い冷却システムが提供
できる。Furthermore, even if the amount of heat generated by the electronic device fluctuates, the cooling capacity immediately follows and changes, so the water temperature has the effect of immediately following it, and the problem of condensation described above and the fact that the water temperature remains high Absent. In this way, the water temperature does not fluctuate with respect to the conventional minute fluctuations of the air temperature despite the quick follow-up performance, so that a highly reliable cooling system can be provided.
第1図は本発明の一実施例による冷却装置の構成を示す
図、第2図(a)は第1図に示す温度制御器の構成を示
すブロック図、第2図(b)はPID値設定テーブルを示
す図、第3図は水温の変化状態を示す図、第4図は従来
の冷却装置の構成を示す図である。 1:LSI、2:冷却板 3:架内配管、4:タンク 5:ポンプ、6:熱交換器 7:三方弁、8:バルブモータ 9,9a:温度制御器、10:給水ホース 11:戻りホース、 13:水温センサ、14:気温センサ 40,40a:冷却装置、41:電子装置FIG. 1 is a diagram showing the configuration of a cooling device according to an embodiment of the present invention, FIG. 2 (a) is a block diagram showing the configuration of the temperature controller shown in FIG. 1, and FIG. 2 (b) is a PID value. FIG. 3 is a diagram showing a setting table, FIG. 3 is a diagram showing a change state of water temperature, and FIG. 4 is a diagram showing a configuration of a conventional cooling device. 1: LSI, 2: Cooling plate 3: In-line piping, 4: Tank 5: Pump, 6: Heat exchanger 7: Three-way valve, 8: Valve motor 9,9a: Temperature controller, 10: Water supply hose 11: Return Hose, 13: Water temperature sensor, 14: Temperature sensor 40, 40a: Cooling device, 41: Electronic device
Claims (1)
体の冷却を行う冷却装置において、 前記被冷却体の雰囲気温度を検出する雰囲気温度検出手
段と、 前記被冷却体から戻される前記液体冷媒の温度を検出す
る冷媒温度検出手段と、 前記雰囲気温度検出手段が検出する前記雰囲気温度が時
間変化するときに、前記液体冷媒の温度を前記雰囲気温
度によって定まる所定温度に制御する際の温度変化速度
を前記雰囲気温度検出手段および前記冷媒温度検出手段
が検出する温度の差分によって調節する温度制御手段を
有することを特徴とする冷却装置。1. A cooling device that circulates and supplies a liquid coolant to an object to be cooled to cool the object to be cooled, and an ambient temperature detecting means for detecting an ambient temperature of the object to be cooled; Refrigerant temperature detecting means for detecting the temperature of the liquid refrigerant, when the ambient temperature detected by the ambient temperature detecting means changes with time, when controlling the temperature of the liquid refrigerant to a predetermined temperature determined by the ambient temperature A cooling device comprising temperature control means for adjusting a temperature change rate according to a difference between temperatures detected by the ambient temperature detection means and the refrigerant temperature detection means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63086783A JPH0735940B2 (en) | 1988-04-08 | 1988-04-08 | Cooling system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63086783A JPH0735940B2 (en) | 1988-04-08 | 1988-04-08 | Cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01260274A JPH01260274A (en) | 1989-10-17 |
| JPH0735940B2 true JPH0735940B2 (en) | 1995-04-19 |
Family
ID=13896352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63086783A Expired - Lifetime JPH0735940B2 (en) | 1988-04-08 | 1988-04-08 | Cooling system |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0735940B2 (en) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2694515B2 (en) * | 1995-03-01 | 1997-12-24 | エス・ティエス株式会社 | Cooling system |
| JP4272503B2 (en) * | 2003-12-17 | 2009-06-03 | 株式会社日立製作所 | Liquid cooling system |
| DE102004046791A1 (en) * | 2004-09-27 | 2006-04-06 | Kermi Gmbh | Interface unit for consumer unit, has primary flow connection supplying coolant of cooling system that is directly or indirectly connected with flow distribution unit having secondary flow connection for connecting with consumer unit |
| JP2006200756A (en) * | 2005-01-18 | 2006-08-03 | Fuji Electric Systems Co Ltd | Water cooling system |
| DE102005055277B3 (en) * | 2005-11-17 | 2007-08-16 | Kermi Gmbh | A method for supplying and discharging a cooling medium to and from a loss heat generating consumer unit |
| CN105652990A (en) * | 2015-12-23 | 2016-06-08 | 曙光信息产业(北京)有限公司 | Liquid storage tank |
| UA126174U (en) * | 2017-12-26 | 2018-06-11 | Оу Юбісі Холдінг Груп | BEVERAGE LINE COOLING SYSTEM |
| JP7359708B2 (en) * | 2019-03-28 | 2023-10-11 | 住友重機械工業株式会社 | Actuator for injection molding machine, actuator cooling device, injection molding machine, and how to use actuator cooling device |
-
1988
- 1988-04-08 JP JP63086783A patent/JPH0735940B2/en not_active Expired - Lifetime
Non-Patent Citations (1)
| Title |
|---|
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01260274A (en) | 1989-10-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20030193777A1 (en) | Data center energy management system | |
| US6041851A (en) | Switchgear cabinet air-conditioning arrangement | |
| US7499278B2 (en) | Method and apparatus for dissipating heat from an electronic device | |
| US11337340B2 (en) | Open and closed flow air/coolant hybrid system | |
| JP5474030B2 (en) | COOLING DEVICE AND OPERATION METHOD FOR FAN CONTROL | |
| US6512209B1 (en) | Temperature control apparatus, temperature control method and device | |
| MY118393A (en) | An electronic package having active means to maintain its operating temperature constant | |
| US20230413493A1 (en) | Smart flow rate control system for cooling server racks | |
| JPH06164178A (en) | Cooling system | |
| JPH0735940B2 (en) | Cooling system | |
| JP2022084812A (en) | Cooling system, electronic rack, and method | |
| JPH07218075A (en) | Computer cooling system | |
| JPH07121242A (en) | Device and method for cooling electronic equipment | |
| JP2002257450A (en) | Cooling apparatus of semiconductor device | |
| EP0421743A2 (en) | Coolant supply apparatus for liquid-cooled electronic device | |
| EP1825346B1 (en) | Cooling system for electric cabinets | |
| JPH0575284A (en) | Cooling device | |
| JPH04146694A (en) | Electronic equipment cooling device | |
| JPH0452624B2 (en) | ||
| JPH0831997A (en) | Semiconductor cooling device | |
| JP2508640B2 (en) | Cooling system | |
| JPH02120690A (en) | Cooling apparatus of electronic apparatus | |
| JPH0452625B2 (en) | ||
| TWI900958B (en) | Liquid cooling system and liquid cooling device | |
| US20260129810A1 (en) | Cooling distribution unit with constant supply return temperature |