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JPH0736050B2 - Method of coupling semiconductor light emitting device and optical waveguide - Google Patents
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JPH0736050B2 - Method of coupling semiconductor light emitting device and optical waveguide - Google Patents

Method of coupling semiconductor light emitting device and optical waveguide

Info

Publication number
JPH0736050B2
JPH0736050B2 JP60066485A JP6648585A JPH0736050B2 JP H0736050 B2 JPH0736050 B2 JP H0736050B2 JP 60066485 A JP60066485 A JP 60066485A JP 6648585 A JP6648585 A JP 6648585A JP H0736050 B2 JPH0736050 B2 JP H0736050B2
Authority
JP
Japan
Prior art keywords
optical waveguide
light emitting
emitting device
semiconductor light
optical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60066485A
Other languages
Japanese (ja)
Other versions
JPS61226717A (en
Inventor
克之 井本
英明 対馬
稔 前田
捷樹 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP60066485A priority Critical patent/JPH0736050B2/en
Publication of JPS61226717A publication Critical patent/JPS61226717A/en
Publication of JPH0736050B2 publication Critical patent/JPH0736050B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4207Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms with optical elements reducing the sensitivity to optical feedback
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4202Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G02B6/4203Optical features
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236Fixing or mounting methods of the aligned elements
    • G02B6/424Mounting of the optical light guide
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4246Bidirectionally operating package structures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は、半導体発光素子と光導波路の結合方式に係
り、特に反射光が半導体発光素子に戻るのを抑圧するの
に好適な結合方式に関する。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coupling method for a semiconductor light emitting device and an optical waveguide, and more particularly to a coupling method suitable for suppressing reflected light from returning to the semiconductor light emitting device.

〔発明の背景〕[Background of the Invention]

従来、半導体レーザを用いた光通信装置において、光フ
アイバ端面,コネクタ端面,光合分波器端面などからの
反射光が半導体レーザに戻ると、C/Nやひずみが大幅に
変動することが知られている。そのため、この対策法と
して、上記端面を斜め研磨して反射光が半導体レーザに
戻らないようにする方法(第1図(a))、半導体レー
ザと結合光学系レンズとをオフセットする方法、反射面
を光軸に対して傾斜させる方法、が用いられ、良好な特
性が得られている。ところが将来の光デバイスとして注
目を集めている光集積回路の場合には、半導体基板上
に、半導体レーザ、受光素子、光導波路、光合分波部、
光変調部、光スイツチ部などの光デバイスが集積化され
た光モジユールで構成され、この光モジユールに光フア
イバを接続することにより、光フアイバ内に光信号が伝
送される(たとえば特開昭57-49288号公報がある。)。
この場合に光モジユール内で発生した半導体レーザの反
射光が半導体レーザに戻り、C/Nやひずみ劣化の原因に
なつていることがわかつた。この場合、光フアイバ端面
は斜め研磨(角度8°)したものを用いたにもかかわら
ず上記のような問題点が発生した。すなわち、半導体レ
ーザの出射光を光導波路(単なる光導波路以外に、上記
光合分波部などの光デバイスも含む。)を介して光フア
イバに結合する系においては、反射光対策が重要である
ことがわかつた。
Conventionally, in an optical communication device using a semiconductor laser, it is known that C / N and distortion greatly change when the reflected light from the optical fiber end face, connector end face, optical multiplexer / demultiplexer end face, etc. returns to the semiconductor laser. ing. Therefore, as measures against this, a method of obliquely polishing the end face so that reflected light does not return to the semiconductor laser (FIG. 1A), a method of offsetting the semiconductor laser and the coupling optical system lens, and a reflecting surface Is used with respect to the optical axis, and good characteristics have been obtained. However, in the case of an optical integrated circuit, which is attracting attention as a future optical device, a semiconductor laser, a light receiving element, an optical waveguide, an optical multiplexing / demultiplexing unit,
It is composed of an optical module in which optical devices such as an optical modulator and an optical switch are integrated, and an optical signal is transmitted in the optical fiber by connecting the optical fiber to the optical module (for example, Japanese Patent Laid-Open No. -There is a 49288 bulletin.).
In this case, it was found that the reflected light of the semiconductor laser generated in the optical module returns to the semiconductor laser and causes C / N and distortion deterioration. In this case, the above-mentioned problems occurred even though the end faces of the optical fibers were obliquely polished (angle 8 °). That is, in a system in which the emitted light of a semiconductor laser is coupled to an optical fiber via an optical waveguide (including optical devices such as the above optical multiplexer / demultiplexer in addition to simple optical waveguides), it is important to take measures against reflected light. I got caught.

〔発明の目的〕[Object of the Invention]

本発明の目的は、半導体レーザの出射光を光導波路を通
して光フアイバへ結合する光集積回路において、反射光
が半導体レーザに戻らないようにした半導体発光素子と
光導波路の結合方式を提供することにある。
An object of the present invention is to provide a coupling method of a semiconductor light emitting device and an optical waveguide, which prevents reflected light from returning to the semiconductor laser in an optical integrated circuit that couples the emitted light of the semiconductor laser to the optical fiber through the optical waveguide. is there.

〔発明の概要〕[Outline of Invention]

本発明は、基板上に半導体レーザ、該レーザの出射光を
伝搬させる光導波路を設け、レーザ光入射側の光導波路
の幅,厚み,屈折率のいずれか一つ、あるいは2つ以上
を部分的にテーパ状に形成させた構成にしたものであ
る。すなわち、半導体レーザの出射光は光導波路の入射
側の幅あるいは厚み、または屈折率が入射光の伝搬方向
に向って部分的にテーパ状に大きくなつているので、結
合して伝搬し、光導波路の形状一定部で定常状態に保た
れて伝搬していくが、光フアイバ端面などからの反射光
に対しては上記幅あるいは厚み、または屈折率がテーパ
状に減少している部分で光は集中的に漏洩させられ、半
導体レーザへ戻りにくくなる。光導波路は、埋込形,拡
散形,装荷形,リツジ形,盛上形などが適用できる。
According to the present invention, a semiconductor laser and an optical waveguide for propagating emitted light of the laser are provided on a substrate, and any one of the width, thickness, and refractive index of the optical waveguide on the laser light incident side, or two or more of them are partially formed. It is configured to have a tapered shape. That is, since the emitted light of the semiconductor laser has a width or thickness on the incident side of the optical waveguide, or a refractive index that is partially increased in the taper direction in the propagation direction of the incident light, it is coupled and propagates. Propagation is maintained in a steady state in the part where the shape is constant, but with respect to the reflected light from the end face of the optical fiber, the light is concentrated in the part where the width or thickness or the refractive index is tapered. Leakage, and it becomes difficult to return to the semiconductor laser. As the optical waveguide, a buried type, a diffusion type, a loading type, a ridge type, a raised type and the like can be applied.

本発明において、反射光を抑圧できることを説明する。
上記光導波路において、たとえばレーザ光入射側に向っ
て光導波路の幅をテーパ状に部分的に、かつ連続的に減
少させていくと、上記光導波路をテーパ状に減少してい
く方向に伝搬している波長λ0の光信号は、光導波路へ
の光の閉じ込めが徐々に悪くなり、テーパ部から所望角
度で放射状に出ていき、ついには光導波路の幅、光導波
路とクラツド部の屈折率差からきまる規格化周波数が伝
搬条件を満たさないような小さな値になると、上記λ0
の光信号はカツトオフになり、伝搬しなくなる。本発明
はこの原理を応用したもので、カツトオフ特性を有する
ごく近傍まで上記光導波路の幅,厚み,屈折率のいずれ
か一つ、あるいは2つ以上をレーザ光入射側に向って部
分的にテーパ状に減少させ、反射光を放射状に漏洩させ
る。なお、上記放射状に漏洩した反射光は、光導波路の
場合にはクラツドが空気、または無限に近い位に十分に
厚いので、ふたたび光導波路内にもどることなく、した
がつて、半導体レーザにも戻つてこない。なお、従来、
半導体レーザの出射光を単一モード光フアイバへ効率よ
く結合させる方法として、第1図(b)に示すように、
光フアイバ先端部をテーパ状に細くし、その先端部を球
状にする方法がるが、この場合には、半導体レーザの反
射光は、テーパ状部分で少しずつ漏洩する。しかし、漏
洩した光はクラツド部に入り、クラツド部と空気の界面
で反射しながらクラツデイングモードとなつてクラツド
部内を伝搬し、半導体レーザに戻つてくるため、本発明
のような効果はない。また、光フアイバの場合にはカツ
トオフ特性がなく、しかもクラツド部へのしめだし界も
少ない。
In the present invention, it will be described that reflected light can be suppressed.
In the above optical waveguide, for example, when the width of the optical waveguide is tapered partially and continuously toward the laser light incident side, the optical waveguide propagates in a tapering decreasing direction. The optical signal with the wavelength λ 0 gradually loses the confinement of light in the optical waveguide and radiates out at a desired angle from the tapered portion, and finally the width of the optical waveguide and the refractive index of the optical waveguide and the cladding portion. When the normalized frequency determined by the difference becomes a small value that does not satisfy the propagation condition, the above λ 0
The optical signal is cut off and does not propagate. The present invention is an application of this principle, and one or more of the width, thickness, and refractive index of the above-mentioned optical waveguide is partially tapered toward the laser light incident side up to the very vicinity having the cut-off characteristic. The reflected light is leaked radially. In the case of the optical waveguide, the reflected light leaked in the radial direction does not return to the inside of the optical waveguide again because the cladding is thick enough to the air or near infinity. I can't come. In addition, conventionally,
As a method for efficiently coupling the emitted light of a semiconductor laser to a single mode optical fiber, as shown in FIG. 1 (b),
There is a method of tapering the tip of the optical fiber and making the tip spherical, but in this case, the reflected light of the semiconductor laser leaks little by little in the tapered portion. However, the leaked light enters the cladding portion, propagates in the cladding portion as a cladding mode while being reflected at the interface between the cladding portion and air, and returns to the semiconductor laser, so that there is no effect as in the present invention. . Further, in the case of an optical fiber, there is no cut-off characteristic, and there is also little field of exudation to the cladding.

また光導波路の入出力端部を第2図,第3図の9のごと
くテーパ状光導波路とし、入出力部での結合損失の低減
をはかることが知られている(特開昭58-118610)。こ
れは光導波路と光フアイバとのコア形状の相異による結
合損失をできる限り低減するために連続的に長い距離に
わたつてテーパ形状にしたものであり、本発明のよう
に、同一基板上に半導体レーザと光導波路を設け、部分
的にテーパ形状をもたせて反射光を漏洩させる構成と異
なり、また効果も違う。
Further, it is known that the input / output ends of the optical waveguide are tapered optical waveguides as shown by 9 in FIGS. 2 and 3 to reduce the coupling loss at the input / output portion (Japanese Patent Laid-Open No. 58-118610). ). This is a taper shape continuously over a long distance in order to reduce the coupling loss due to the difference in the core shapes of the optical waveguide and the optical fiber as much as possible. This is different from the configuration in which a semiconductor laser and an optical waveguide are provided and a partially tapered shape is provided to leak reflected light, and the effect is also different.

〔発明の実施例〕Example of Invention

第4図に本発明の半導体レーザと光導波路の結合方式の
実施例を示す。同図(a)は上面図、(b)および
(c)は正面図である。半導体基板1(たとえば、n形
GaAs基板)の上に半導体レーザ2、光導波路3がモノリ
シツクに形成されている。同図(a)の5は光導波路3
の幅をテーパ状にした部分である。(c)は厚さもテー
パ状にした部分である。すなわち、光導波路3の幅、あ
るいは厚さを半導体レーザの出射光端側からその出射光
の伝搬方向に向かつて部分的に、かつ連続的形状に増大
させてある。
FIG. 4 shows an embodiment of the coupling system of the semiconductor laser and the optical waveguide of the present invention. The figure (a) is a top view, (b) and (c) are front views. Semiconductor substrate 1 (eg, n-type
A semiconductor laser 2 and an optical waveguide 3 are monolithically formed on a GaAs substrate. In the figure (a), 5 is the optical waveguide 3.
Is a portion in which the width of the is tapered. (C) is a portion where the thickness is also tapered. That is, the width or the thickness of the optical waveguide 3 is increased partially and continuously in the propagation direction of the emitted light from the emitted light end side of the semiconductor laser.

第5図に第4図のテーパ部5の拡大図を示す。同図にお
いて、2は波長λ1(たとえば1.55μm)で単一モード
発振している半導体レーザである。光導波路3の幅w2
上記波長λ1の光信号が単一モード伝送できるように設
定された幅(約8μm)である。w1は波長λ1(1.55μ
m)の光のモードしや断が起こる幅(5.25μm)よりも
若干大きい値に設定する。このような寸法構造に設定し
ておくと、半導体レーザ2の出射光は光導波路3内を伝
搬していくが、半導体レーザ2側に戻つてきた反射光は
このテーパ部5で光が光導波路3からしみだして外に漏
洩し、半導体レーザ2にほとんど戻つてこなくなる。こ
の戻り光量はw1に依存する。すなわち、w1が小さいほ
ど、光導波路3への光の閉じこめ量が少なくなり、光導
波路3外への光のしみ出し量が多くなる。テーパ部5の
長さLは反射光の拡がり角度に依存する。Lが短い程、
反射光の拡がり角度が大きくなる。光導波路3の幅を変
える代わりに、光導波路3の厚み、屈折率を変えても同
様の効果が得られる。
FIG. 5 shows an enlarged view of the tapered portion 5 in FIG. In the figure, 2 is a semiconductor laser that oscillates in a single mode at a wavelength λ 1 (for example, 1.55 μm). The width w 2 of the optical waveguide 3 is a width (about 8 μm) set so that the optical signal of the wavelength λ 1 can be transmitted in a single mode. w 1 is the wavelength λ 1 (1.55μ
Set a value that is slightly larger than the width (5.25 μm) at which the light mode and disconnection in (m) occur. When such a size structure is set, the emitted light of the semiconductor laser 2 propagates in the optical waveguide 3, but the reflected light returning to the semiconductor laser 2 side is converted into light by the tapered portion 5. It exudes from 3 and leaks to the outside, and almost never returns to the semiconductor laser 2. This amount of returning light depends on w 1 . That is, the smaller w 1 is, the smaller the amount of light confined in the optical waveguide 3 is, and the larger the amount of light seeping out of the optical waveguide 3 is. The length L of the tapered portion 5 depends on the spread angle of the reflected light. The shorter L is,
The spread angle of the reflected light becomes large. The same effect can be obtained by changing the thickness and the refractive index of the optical waveguide 3 instead of changing the width of the optical waveguide 3.

第6図はアレイ状の半導体レーザ2a,2bの出射光を合波
して伝送させる場合の実施例である。2a,2bは同一波
長、あるいは異波形の半導体レーザでもよい。
FIG. 6 shows an embodiment in which the emitted lights of the arrayed semiconductor lasers 2a and 2b are combined and transmitted. 2a and 2b may be semiconductor lasers having the same wavelength or different waveforms.

本発明の光導波路は第7図,第8図に示すようなものを
適用できる。第7図は埋込形、第8図はリツジ形であ
る。これらの図で、(a)は上面図、(b)は側面図、
(c)は正面図である。
As the optical waveguide of the present invention, those shown in FIGS. 7 and 8 can be applied. FIG. 7 shows the embedded type, and FIG. 8 shows the ridge type. In these figures, (a) is a top view, (b) is a side view,
(C) is a front view.

第4〜8図において、光導波路の半導体レーザ側先端部
は第9図(a)のごとく斜め傾斜(角度θは数度程
度。)をもたせると、光導波路側からの半導体レーザ側
への反射光を半導体レーザに戻るのを抑制できる。ま
た、半導体レーザ出射光の光導波路への結合効率を高め
るために、第9図(b)のように、光導波路の先端部を
曲面状(好ましくは放物面状)に形成させてもよい。さ
らに、第9図(c)のように、先端部に、半導体レーザ
の屈折率と等しいかそれよりも低く、光導波路の屈折率
よりも高い材質のドーピング材をイオン打込み法などに
よりドープすれば、より高結合効率特性を得ることがで
きる。また本発明の実施例では、半導体基板上に半導体
レーザと光導波路しか形成されていないが、これに限定
されるものではない。すなわち、受光素子、光合分波
部、光スイツチ部、光変調部、レンズなどの光デバイス
を形成していてもよい。さらに、光導波路の先端部には
反射防止用の膜を形成することにより、この先端部から
の反射光を低減させることができる。また、光導波路3
と光フアイバ4の接続部での反射光を半導体レーザに戻
さないようにするために、上記接続部の光導波路の端面
に傾斜を設けるとより有効である。また上記実施例では
半導体発光素子として、半導体レーザを用いたが、発光
ダイオードでもよい。
In FIGS. 4 to 8, when the tip portion of the optical waveguide on the semiconductor laser side is obliquely inclined (angle θ is about several degrees) as shown in FIG. 9A, reflection from the optical waveguide side to the semiconductor laser side is performed. It is possible to prevent light from returning to the semiconductor laser. Further, in order to increase the coupling efficiency of the light emitted from the semiconductor laser to the optical waveguide, the tip of the optical waveguide may be formed into a curved surface shape (preferably a parabolic surface shape) as shown in FIG. 9 (b). . Further, as shown in FIG. 9 (c), if the tip end is doped with a doping material that is equal to or lower than the refractive index of the semiconductor laser but higher than the refractive index of the optical waveguide by ion implantation or the like. Therefore, higher coupling efficiency characteristics can be obtained. Further, in the embodiment of the present invention, only the semiconductor laser and the optical waveguide are formed on the semiconductor substrate, but the present invention is not limited to this. That is, an optical device such as a light receiving element, an optical multiplexer / demultiplexer, an optical switch, an optical modulator, and a lens may be formed. Further, by forming an antireflection film on the tip of the optical waveguide, it is possible to reduce the reflected light from the tip. Also, the optical waveguide 3
In order to prevent the reflected light at the connection portion of the optical fiber 4 and the optical fiber 4 from returning to the semiconductor laser, it is more effective to provide the end face of the optical waveguide of the connection portion with an inclination. Further, although the semiconductor laser is used as the semiconductor light emitting element in the above-mentioned embodiment, a light emitting diode may be used.

〔発明の効果〕〔The invention's effect〕

本発明によれば、半導体レーザに反射光がほとんど戻ら
ないので、高C/N,低ひずみの安定した光伝送システムを
実現することが可能である。
According to the present invention, since reflected light hardly returns to the semiconductor laser, it is possible to realize a stable optical transmission system with high C / N and low distortion.

【図面の簡単な説明】[Brief description of drawings]

第1図から第3図は従来技術を説明するための図、第4
図は本発明の実施例を示す図、第5図から第9図は本発
明の他の実施例を示す図である。 1……半導体基板、2,2a,2b……半導体レーザ、3,3a,3b
……光導波路のコア部、5,5a,5b……光導波路のテーパ
部、7……高屈折率材。
1 to 3 are views for explaining the prior art, and FIG.
FIG. 5 is a diagram showing an embodiment of the present invention, and FIGS. 5 to 9 are diagrams showing another embodiment of the present invention. 1 ... Semiconductor substrate, 2,2a, 2b ... Semiconductor laser, 3,3a, 3b
…… Optical waveguide core, 5, 5a, 5b …… Optical waveguide taper, 7 …… High refractive index material.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】基板上に半導体発光素子、該発光素子の出
射光を伝搬させる光導波路を設け、該出射光の入射側の
光導波路の幅,厚み,屈折率の少なくとも一つを入射光
の伝搬方向に向って部分的にテーパ状に増大させて形成
することを特徴とする半導体発光素子と光導波路の結合
方式。
1. A semiconductor light emitting element, an optical waveguide for propagating the emitted light of the light emitting element are provided on a substrate, and at least one of the width, thickness and refractive index of the optical waveguide on the incident side of the emitted light is set to A method of coupling a semiconductor light emitting device and an optical waveguide, which is characterized in that it is formed by partially tapering in the propagation direction.
【請求項2】特許請求の範囲第1項において、上記半導
体発光素子の出射光端側の光導波路の先端部を曲面状に
構成したことを特徴とする半導体発光素子と光導波路の
結合方式。
2. The coupling method for a semiconductor light emitting device and an optical waveguide according to claim 1, wherein the tip of the optical waveguide on the outgoing light end side of the semiconductor light emitting device is formed in a curved shape.
【請求項3】特許請求の範囲第2項において、上記半導
体発光素子の出射光端側の光導波路の曲面状先端部に、
上記半導体発光素子の屈折率と等しいかそれよりも低
く、光導波路の屈折率よりも高い材質のドーピング材を
ドープしたことを特徴とする半導体発光素子と光導波路
の結合方式。
3. The curved end portion of the optical waveguide on the outgoing light end side of the semiconductor light emitting device according to claim 2,
A method of coupling a semiconductor light emitting device and an optical waveguide, wherein a doping material of a material having a refractive index equal to or lower than that of the semiconductor light emitting device and higher than that of the optical waveguide is doped.
【請求項4】特許請求の範囲第1項において、上記半導
体発光素子の出射光端側の光導波路の先端部を傾斜構造
にしたことを特徴とする半導体発光素子と光導波路の結
合方式。
4. The method for coupling a semiconductor light emitting device and an optical waveguide according to claim 1, wherein the tip end of the optical waveguide on the side of the emitted light of the semiconductor light emitting device has an inclined structure.
【請求項5】特許請求の範囲第1項において、上記光導
波路は埋込形、拡散形、リッジ形若しくは盛上形のいず
れかの構造を採用したことを特徴とする半導体発光素子
と光導波路の結合方式。
5. A semiconductor light emitting device and an optical waveguide according to claim 1, wherein the optical waveguide has any one of a buried type, a diffused type, a ridge type and a raised type structure. Method of combining.
JP60066485A 1985-04-01 1985-04-01 Method of coupling semiconductor light emitting device and optical waveguide Expired - Lifetime JPH0736050B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60066485A JPH0736050B2 (en) 1985-04-01 1985-04-01 Method of coupling semiconductor light emitting device and optical waveguide

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60066485A JPH0736050B2 (en) 1985-04-01 1985-04-01 Method of coupling semiconductor light emitting device and optical waveguide

Publications (2)

Publication Number Publication Date
JPS61226717A JPS61226717A (en) 1986-10-08
JPH0736050B2 true JPH0736050B2 (en) 1995-04-19

Family

ID=13317136

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60066485A Expired - Lifetime JPH0736050B2 (en) 1985-04-01 1985-04-01 Method of coupling semiconductor light emitting device and optical waveguide

Country Status (1)

Country Link
JP (1) JPH0736050B2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4828358A (en) * 1988-03-03 1989-05-09 American Telephone And Telegraph Company, At&T Bell Laboratories Testing in the manufacture, operation, and maintenance of optical device assemblies
JP2595070Y2 (en) * 1990-12-27 1999-05-24 京セラ株式会社 Optical waveguide connection structure
JP2002169043A (en) 2000-12-01 2002-06-14 Nec Corp Optical module
JP6330486B2 (en) * 2014-05-29 2018-05-30 富士通株式会社 Semiconductor nanowire optical device and manufacturing method thereof

Also Published As

Publication number Publication date
JPS61226717A (en) 1986-10-08

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