JPH0736208B2 - Method of manufacturing magnetic head - Google Patents

Description

TECHNICAL FIELD The present invention relates to a method of manufacturing a magnetic head.

[Outline of Invention]

According to the present invention, in the method of manufacturing a magnetic head, by forming the first upper magnetic layer composed of the magnetic pole tip and the junction after forming the first insulating layer or the second insulating layer, it is possible to make uniform without being affected by the step. It is possible to manufacture a magnetic head with high accuracy by the film thickness.

[Conventional technology]

As shown in FIG. 4, the conventional magnetic head manufacturing method is
A lower magnetic layer 12 is formed by depositing a magnetic film on a ceramics or ferrite substrate 11. Then SiO ₂ and Al ₂
A non-magnetic film 13 such as —O _{3 is} deposited and formed with a thickness equal to the gap length to form a gap portion. Next, in order to insulate the magnetic pole and the coil, a first insulating layer 14 made of a resin system, a lower coil 15 of a conductor layer to be a coil, and a second insulating layer 16 upper coil 1
7 and the third insulating layer 18 are sequentially deposited and laminated. Finally, the upper magnetic layer was deposited to form a magnetic head.

[Problems and Objectives to be Solved by the Invention]

However, in the above-mentioned conventional technique, the pattern accuracy becomes poor due to the influence of the step generated in the insulating layer and the coil when the upper magnetic layer is formed, and the resist cannot be removed or remains because the resist is thickly accumulated in the lower part. . In addition, the thickness of the non-magnetic layer forming the gap is reduced and the thickness of the non-magnetic layer forming the gap is reduced due to the influence of reverse sputtering in order to improve the adhesion of each film such as the insulating layer, coil, and upper magnetic layer. There is a problem that the gap length is not large.

Therefore, the present invention solves such a problem, and an object of the present invention is to provide a method of manufacturing a magnetic head having a high accuracy, a high dimensional change and a high yield.

[Means for solving problems]

A method of manufacturing a magnetic head according to the present invention comprises a step of forming a lower magnetic layer on a substrate, a step of depositing and forming a nonmagnetic layer forming a gap at a magnetic pole tip on the lower magnetic layer, Forming a first insulating layer on the layer except for the magnetic pole tip; forming a lower coil on the first insulating layer; and having an outer peripheral edge on the lower coil an outer peripheral edge of the first insulating layer. Forming a second insulating layer so as to be more inward, and a magnetic pole tip portion extending from one side of the sloped portion excluding the upper surface of the second insulating layer to the nonmagnetic layer on the magnetic pole tip side and the magnetic pole tip portion. Forming a first upper magnetic layer at a junction between the other side of the slope of the second insulating layer and the lower magnetic layer forming a junction opposite to the magnetic pole tip; Forming an upper coil on the layer, and forming an outer coil on the upper coil. Forming a third insulating layer so that the edge is inside the outer peripheral edge of the second insulating layer, the magnetic pole tip portion provided on the sloped portion of the second insulating layer on the third insulating layer, and the junction And a step of forming a second upper magnetic layer so as to overlap the first upper magnetic layer in a part.

[Action]

According to the above configuration of the present invention, by forming the first upper magnetic layer after forming the second insulating layer or after forming the first insulating layer, the step is relaxed when the second upper magnetic layer is formed. Since the film thickness is uniform and the light scattering due to exposure is reduced, highly accurate patterning can be performed. Also, in the case where the magnetic layer is deposited with an incident angle (for example, sputtering), the slope angle is relaxed, so that the film can be deposited uniformly.

If the first upper magnetic layer is formed after the formation of the first insulation, the change in the film thickness of the gap due to the influence of reverse sputtering for improving the adhesion in the subsequent steps does not occur due to the cover of the first upper magnetic layer.

〔Example〕

FIG. 1 is a manufacturing diagram of a magnetic head of the present invention. A Co-based amorphous and Fe-based magnetic layer is deposited on a substrate 1 made of Al-based ceramics and ferrite-based material by sputtering or plating to form a lower magnetic layer 2. And a non-magnetic layer 3 such as Al ₂ O ₃ or SiO _{2 is} deposited thereon by a thickness corresponding to the gap length. Next, a resin-based first insulating layer 4 that insulates the magnet from the coil is formed by deposition, and a Cu-based, Al-based
The lower coil 5 composed of a system conductor layer is deposited by plating or sputtering, and a second insulating layer having the same quality as the first insulating layer is formed thereon.
The insulating layer 6 is deposited. The outer peripheral edge of the second insulating layer is formed inside the outer peripheral edge of the first insulating layer. Next, the first upper magnetic layer 7a at the tip of the magnetic pole and the first upper magnetic layer 7b at the junction for joining the upper magnetic layer and the lower magnetic layer are simultaneously formed by the same method as the lower magnetic layer 2. . The same material as the lower magnetic layer 1 is used for the first upper magnetic layer. It is preferable to form the first upper magnetic layers 7a and 7b from the slope portion formed of the first insulating layer 4 and the second insulating layer 6 because the thickness of the slope portion can be increased and the magnetic resistance of the magnetic head can be reduced. (2) To extend to the upper flat part of the insulating layer makes it difficult to form the coil because the gap between the upper insulating layer and the upper coil 8 formed on the second insulating layer becomes narrower, but to extend as close to the upper coil 8 as possible. Is good. Further, it is possible to perform fine patterning more accurately when patterning on a flat surface or a place where the angle is gentler than where the angle of the slope is tight.

After forming the first upper magnetic layers 7a and 7b, the upper coil 8 is formed by the same method as the lower coil 5, and the third insulating layer 9 is formed by the same method as the first and second insulating layers. The outer peripheral edge of the third insulating layer is formed inside the outer peripheral edge of the second insulating layer. At this time, the third insulating layer needs to be patterned into a shape having no step with the ends of the first upper magnetic layers 7a and 7b. Considering the positional deviation, the third insulating layer 9 is formed so as to overlap the first upper magnetic layers 7a and 7b by several microns.

Finally, the upper magnetic layer 7c is replaced by the lower magnetic layer 2 and the first upper magnetic layer 7c.
The magnetic head is formed by forming the adherend in the same manner as a and 7b.

FIG. 3 is a cross-sectional view of the magnetic head constructed by the above-mentioned method. The difference from the above-mentioned method is that
While the first upper magnetic layer 7a at the tip of the magnetic pole was formed to have a desired thickness, the method shown in FIG.
This is that the upper magnetic layer 7a and the second upper magnetic layer 7c are superposed to have a desired thickness. The advantage of this method is that the thickness of the slope can be increased and that the decrease in the thickness of the first upper magnetic layer 7a due to the reverse sputtering for improving the adhesion can be controlled by the second upper magnetic layer 7c. That is. A third upper magnetic layer 7d is deposited on the second upper magnetic layer 7c to form a magnetic head with the upper flat portion having a desired film thickness.

FIG. 2 is a sectional view of a magnetic head similarly constructed by the above method. The difference from the above method is that the first upper magnetic layer 7a
That is, the first upper magnetic layers 7a and 7b are formed after the first insulating layer is formed, not after the step of forming the second insulating layer. The advantage of this method is that the pattern can be processed with high accuracy by forming it at a small step, and that the gap nonmagnetic layer 3 is not reverse-sputtered, so that an accurate gap length can be formed.

〔The invention's effect〕

As described above, according to the present invention, by forming the first upper magnetic layer composed of the magnetic pole tip and the junction after the second insulating layer or the first insulating layer is formed, the step is reduced and the resist film thickness is reduced. The uniformity of the pattern and the reduction of light scattering due to the exposure allow the pattern shapes of the second and third upper magnetic layers to be processed with high accuracy. In addition, since the steps on the sloped portion of the upper magnetic layer were alleviated, the incident angle was large when the film of the magnetic layer was deposited, resulting in a uniform film thickness. By increasing the thickness, the magnetic resistance is lowered, the efficiency of the magnetic head is improved, and a high reproduction output can be obtained. At the tip of the magnetic pole, the first upper magnetic layer covers the gap even when reverse sputtering for improving adhesion is performed, so that the dimension of the gap length does not change. At the junction between the lower magnetic layer and the upper magnetic layer, since the step is relaxed, there is no problem that the resist in the lower portion cannot be removed or remains when the second or third upper magnetic layer is formed. Have.

That is, in the manufacturing method of the present invention, the step of forming a lower magnetic layer on the substrate, the step of depositing and forming a nonmagnetic layer forming a gap at the magnetic pole tip on the lower magnetic layer, the nonmagnetic layer Forming a first insulating layer on top of the magnetic pole tip portion, forming a lower coil on the first insulating layer, and forming an outer peripheral edge on the lower coil from an outer peripheral edge of the first insulating layer. A step of forming a second insulating layer so as to be inside, and a magnetic pole tip portion from one side of the sloped portion excluding the upper surface of the second insulating layer to the non-magnetic layer on the magnetic pole tip side and the first magnetic pole portion. A step of forming a first upper magnetic layer at a junction between the other side of the inclined surface of the insulating layer and the lower magnetic layer forming a junction opposite to the magnetic pole tip; and the second insulating layer Forming an upper coil on the upper coil, and forming an outer peripheral edge on the upper coil. A step of forming a third insulating layer so as to be inside the outer peripheral edge of the second insulating layer; a step of forming the magnetic pole tip portion and the junction portion provided on the sloped surface portion of the second insulating layer on the third insulating layer; The following effects are brought about by forming the second upper magnetic layer so as to overlap the first upper magnetic layer.

That is, the magnetic thin film deposited on the thick interlayer insulating layer is
Since the upper magnetic layer and the second magnetic layer are arranged in two steps, etching is possible, and the first insulating layer, the second insulating layer, and the third insulating layer are each formed gradually smaller, and Since the magnetic layer and the second magnetic layer are formed so as to overlap each other on the slope portion,
It is possible to provide a thin-film magnetic head with good performance that can prevent the thinned state of the magnetic film on the slope portion that has conventionally been present.

[Brief description of drawings]

1A to 1I are manufacturing drawings of the magnetic head of the present invention. 2 and 3 are cross-sectional views showing the structure of the magnetic head of the present invention. 4A to 4H are manufacturing drawings of a conventional magnetic head. 1 ... Substrate 2 ... Lower magnetic layer 3 ... Gap non-magnetic layer 4 ... First insulating layer 5 ... Lower coil 6 ... Second insulating layer 7a, 7b, 7c, 7d ... Upper magnetic layer 8 ... … Upper coil 9 …… Third insulating layer 11 …… Substrate 12 …… Lower magnetic layer 13 …… Gap non-magnetic layer 14 …… First insulating layer 15 …… Lower coil 16 …… Second insulating layer 17 …… Upper part Coil 18 ... Third insulating layer 19 ... Upper magnetic layer

Claims (1)

[Claims] 1. A step of forming a lower magnetic layer on a substrate, a step of depositing and forming a nonmagnetic layer forming a gap at a magnetic pole tip on the lower magnetic layer, and a magnetic pole tip on the nonmagnetic layer. Forming a first insulating layer except for a portion, forming a lower coil on the first insulating layer, and forming an outer peripheral edge on the lower coil so as to be inside an outer peripheral edge of the first insulating layer. Forming a second insulating layer on the non-magnetic layer on one side of the sloped surface excluding the upper surface of the second insulating layer and on the non-magnetic layer on the magnetic pole tip side and the second insulating layer. Forming a first upper magnetic layer at a junction between the other side of the sloped portion and the lower magnetic layer forming a junction opposite to the magnetic pole tip; and an upper coil on the second insulating layer. And a step of forming an outer peripheral edge of the second insulating layer on the upper coil. Forming a third insulating layer so as to be inside the outer peripheral edge, the magnetic pole tip portion provided on the sloped portion of the second insulating layer on the third insulating layer, and the first upper magnetic layer at the junction portion. And a step of forming the second upper magnetic layer so as to overlap each other.