JPH0736480B2 - Electronic component mounting system that can change the attitude of electronic components - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic component mounting system for mounting an electronic component on a component supporting member such as a printed circuit board, and in particular, it is equipped with a plurality of component holding heads and The present invention relates to an electronic component mounting system having a function of changing a rotation posture of a held electronic component about an axis of a component holding head.

2. Description of the Related Art A plurality of component holding heads are attached to a head holder that rotates intermittently around a single axis by a constant angle at angular intervals equal to the constant angle, and each component holding head is one of the stop positions. An electronic component mounting system that receives an electronic component at a component receiving position and mounts the electronic component on a printed circuit board at another component mounting position which is a stop position is already widely known. According to such a system, electronic components can be sequentially mounted on the printed circuit board by a plurality of component holding heads that move in one direction along one circumference with the intermittent rotation of the head holder, and the cycle time can be reduced. It can be shortened and the efficiency of component mounting work can be improved.

Further, changing the rotational posture of the electronic component held by the component holding head about the component holding head axis in the electronic component mounting system is already known from Japanese Patent Laid-Open No. 58-213496. In the electronic component mounting system described in this publication, a suction head, which is a component holding head, is attached to a head holder in a state in which it can rotate around the axis of a suction tube that sucks and holds electronic components. The rotation posture of the electronic component sucked on the pipe around the suction pipe axis is detected by the imaging device, and based on the detection result, the head rotation device rotates the suction head by a predetermined angle to change the rotation posture of the electronic component. It has become so. According to such a system, the electronic component can be mounted on the printed circuit board or the like after correcting the error of the holding posture of the electronic product by the suction head, so that the mounting accuracy of the electronic component can be improved.

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, in the electronic component mounting system described in the above publication, reception of an electronic component by a component holding head, posture detection and posture change of the received electronic component,
In addition, since the mounting on the printed circuit board is performed at the same position, the cycle time for mounting one electronic component becomes long, and there is a problem that the efficiency of component mounting work can be suppressed to a low level.

Further, since the head rotating device is provided on the head holding body that holds the component holding head so as to be rotatable, and moves together with the head holding body, the mass that moves together with the component holding head is large, and the component holding head can move at high speed. It is difficult to move the parts to improve the efficiency of component mounting work.

Further, as described above, if a plurality of component holding heads are attached to the head holder that intermittently rotates by a constant angle to improve the efficiency of the mounting work, the head rotating devices should be provided in the same number as the component holding heads. It is necessary, and there is a problem that the structure of the device becomes complicated and the cost becomes high.

Means for Solving the Problems In order to solve the above problems, the present invention provides a head holder that rotates intermittently around a single axis by a constant angle at the same angular interval as the intermittent rotation angle and the single axis. A plurality of component holding heads are attached rotatably around an axis parallel to the component holding heads, and each component holding head receives an electronic component from a component supply device at a component receiving position which is one of the stop positions of the plurality of component holding heads. In an electronic component mounting system for mounting an electronic component on a component supporting member such as a printed circuit board positioned by a component supporting member positioning device at a component device position which is another stop position, from the component receiving position to the component mounting position. The electronic component held by the component holding head is placed at one of a plurality of stop positions existing in the movement path of the component holding head. An attitude detection device that detects the rotational attitude around the axis of the component holding head by imaging is provided, and its stop position is set as the attitude detection position, and at another stop position existing between the attitude detection position and the component mounting position. A head rotation device that rotates each component holding head by an angle determined based on the posture information of the electronic component obtained by the posture detection device is provided, and its stop position is set as the posture change position. It is always in the disengaged state, and is brought into the engaged state in which each component holding head can be rotated each time the component holding head reaches the posture changing position.

Action In the electronic component mounting system configured as described above, a plurality of component holding heads are sequentially moved to the component receiving position, the posture detection position, the posture changing position, and the component mounting position with the intermittent rotation of the head holder. To do. Then, at the component receiving position, the component holding head receives the component from the component supply device, and at the posture detection position, the posture detecting device detects the posture of the electronic component held by the component holding head by imaging, and based on the detection result. The head rotation device rotates the component holding head at the posture changing position to change the posture of the electronic component, and the component holding head mounts the posture-changed electronic component on the printed circuit board at the component mounting position.

As described above, in the electronic component mounting system according to the present invention, the component holding head receives the electronic component, the posture detecting device detects the posture of the electronic component, the head rotating device changes the posture of the electronic component, and the component holding head. Since the electronic components are mounted on the printed circuit board in parallel,
The cycle time for mounting one electronic component is shortened and the efficiency of component mounting work is improved.

Further, since only one head rotation device for changing the posture of the electronic component needs to be provided for a plurality of component holding heads, the structure of the device can be simplified and the cost can be reduced.

Further, since the head rotating device is provided at a fixed position separately from the head holding member, the moment of inertia of the portion that rotates together with the head holding member is small, and the intermittent driving device for driving the head holding member is small, and The vibration and noise associated with the intermittent rotation of the head holder can be reduced, and the head holder can be rotated at high speed. From this point as well, the efficiency of the electronic component mounting work can be improved.

Desirable Aspect of the Invention In a desirable aspect of the present invention, each of the component holding heads is provided with a driven rotating body, and the head rotating device drives each of the component holding heads stopped at the posture changing position. It is provided with a drive rotating body that is coaxially engaged with the rotating body by relative movement in the axial direction.

By making the rotating device independent of the head holder to reduce the moment of inertia during intermittent rotation of the head holder, it is possible to rotate the head holder at a high speed while suppressing the generation of vibration and noise. When the holding head stops at the posture changing position, the structure for engaging the rotating device with the component holding head becomes complicated, and it becomes difficult to rotate the component holding head at an accurate angle. However, as in the present aspect, if the driven rotary body of the component holding head and the drive rotary body of the rotating device are coaxially engaged by relative movement in the axial direction, a configuration for engaging them is provided. Is simple, and it is easy to rotate the component holding head at an accurate angle.

In another desirable aspect of the present invention, in a component release position between the posture detection position and the component mounting position,
A component releasing means is provided for causing each component holding head to release the electronic component determined to be inappropriate based on the information obtained by the image pickup by the posture detection device.

Since the attitude detection device is for picking up an image of an electronic component and detecting the attitude of the electronic component, the electronic device held by the component holding head is compared by comparing the obtained image with the image showing the original shape. It is possible to determine whether or not the part is proper. If the electronic component is improper, the component releasing means causes the component holding head to release the electronic component, so that the improper electronic component is mounted on the component support member and a defective electronic circuit is formed. Can be avoided.

In still another desirable mode of the present invention, the posture detection device illuminates an electronic component held by the component holding head stopped at the posture detection position from one side, and a component holding stopped at the posture detection position. The head is arranged non-coaxially, is provided with an image pickup device for picking up a projected image of an electronic component, and at least one reflecting surface, and changes the direction of light emitted from the illumination device and passing around the electronic component. And a light guide device that leads to the imaging device.

In this way, when the projection image of the electronic component is obtained by the image pickup device and the posture of the electronic component is detected based on the projection image, the posture can be accurately detected without being affected by gloss, color, unevenness, etc. of the surface of the electronic component. be able to. Moreover, if the light guide device is used, it is possible to dispose the image pickup device not coaxially with the component holding head at the posture detection position, and avoid the interference of the image pickup device with the head holder or the component support part positioning device. However, it is easy to dispose them, and the degree of freedom in designing the system is improved.

Embodiment Hereinafter, one embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 shows the appearance of an electronic component mounting system which is an embodiment of the present invention. This electronic component mounting system is the main frame
10, a component supply device 12, a substrate loading device 14, a substrate unloading device 16, a substrate positioning device 18, a mounting device 20, and the like. The component supply device 12 is one in which a large number of component supply units 32 are arranged adjacent to each other in the moving direction of the moving base 30 on a moving base 30 movably supported along a straight line by the main body frame 10. Each component supply unit 32 holds one type of taping electronic component, and is moved to a position facing the mounting device 20 by the movement of the moving table 30 to supply one electronic component at a time. In Although,
Since it is well known, detailed description will be omitted.

The printed board to which electronic parts are attached is a board loading device.
It is carried in by 14 and attached to the substrate positioning device 18 by a loading device (not shown). In this embodiment, the printed circuit board is the component support member, and the board positioning device 18 is the component support member positioning device. The substrate positioning device 18 includes a substrate support base 36, which is installed on an XY table that is movable in the X-axis direction parallel to the moving direction of the moving base 30 and in the Y-axis direction perpendicular thereto. The printed circuit board is supported at an accurate position and positioned at any position on the XY plane. Then, the mounting device 20 sequentially mounts the electronic components received from the component supply device 12 on the positioned printed circuit board, and the printed circuit board on which all the components have been mounted is removed by an unloading device (not shown), and the substrate unloading device 16 Be carried out by.
These operations are controlled by the controller 22. The control device 22 is mainly composed of a computer, and controls each device based on a program stored in a memory of the computer and information provided from the outside by a magnetic disk, a magnetic tape, or the like. Control device
An operation panel 40 attached to the display 22, a display 42 for displaying operation instructions of the operation panel 40, input data, operation status of each device, etc., and an electronic component held by a suction head (described later) as a component holding head. A monitor television 44 is provided for the operator to monitor the posture of the parts. These substrate loading device 14, substrate unloading device 16, substrate positioning device 18, control device 22,
Since the operation panel 40, the display 42, the monitor TV 44, etc. are well known, a detailed description thereof will be omitted, and the mounting device 20 will be described below.

As is apparent from FIG. 2, the mounting device 20 is the main body frame.
It comprises a rotating shaft 50 which is held rotatably about a vertical axis by 10. A rotary plate 52 is fixed to the upper end of the rotary shaft 50, and twelve cam followers 54 are attached to the outer peripheral portion of the rotary plate 52 at equal angular intervals, and these cam followers 54 rotate around a horizontal axis. It is adapted to engage the cam 56. As a result, the rotary plate 52 and the rotary shaft 50 are intermittently rotated by 30 degrees each time the cam 56 makes one rotation.

A head holder 58 is fixed to the lower end of the rotary shaft 50, and 12 sets of suction head units 60 are fixed to the head holder 58.
Are attached at equal angular intervals. These suction head units 60 all have the structure shown in FIGS. As is apparent from FIG. 3, two rods 62, which are paired with each other, are attached to the outer peripheral portion of the head holding body 58 in a vertical posture and movably in the axial direction.
Both ends thereof are connected to each other by connecting members 63 and 64. A cam follower 65 is attached to the upper connecting member 63, and the cam follower 65 is engaged with the cam 66 shown in FIG. The cam 66 is fixed to the main body frame 10 and has an annular cam groove 67 formed on the outer peripheral surface so as to be inclined with respect to the horizontal plane.
As the 58 rotates, the rod 62 is moved up and down.

Further, an arm 69 is attached to the lower connecting member 64 by a shaft member 68.
Is rotatably attached about a vertical axis, and as is apparent from FIG. 4, two suction heads 70 as component holding heads are attached to this arm 69. Two positioning bushes 72 are attached to the end of the arm 69 opposite to the side where the suction head 70 is attached. The two suction heads 70 and the positioning bushes 72 are provided on one arc centered around the rotation center line of the arm 69, and each center line and the rotation center line of the arm 69. It is arranged so that the angles formed by the straight lines connecting the and are equal to each other. further,
As is clear from FIG. 5, a positioning pin 74 is slidably fitted in the connecting member 64 in the vertical direction, and
Biased downward by 76. Positioning bush 72
A tapered hole is formed on the upper end of the spring, and a tapered portion is formed on the lower end of the positioning pin 74.
The arms 69 are prevented from rotating by being engaged with each other by the urging force of 76, and one of the two suction heads 70 suitable for the target electronic component is selectively fixed in the operating position. It is like this. The engagement between the positioning pin 74 and the positioning bush 72 is released when the operating member 78 fixed to the positioning pin 74 is lifted against the urging force of the spring 76 by an operating device (not shown), and the state is maintained. Arm by an arm rotation device not shown
69 is rotated and another suction head 70 is fixed in the working position.

As shown most clearly in FIG. 5, each suction head 70 has a head main body portion 86 in which transparent plates 82, 84 made of glass or synthetic resin are fixed to both ends of a tubular member 80 made of metal. I have it. A substantially airtight space is formed inside the head main body 86, a vertical through hole communicating with this space is formed in the lower transparent plate 84, and an adsorption pipe 88 is press-fit into this through hole. Has been done. The head main body portion 86 is fitted into the outer cylinder 90 so as not to be rotatable relative to each other and slidable in the axial direction, and is always held by the spring 92 at a descending end position in which it abuts on the stopper 94. The outer cylinder 90 is rotatably and axially slidably fitted in a through hole formed in the arm 69 in the vertical direction, and is always in a rising end position where a flange 98 contacts the arm 69 by a spring 96. Be kept, again
At the upper end of the outer cylinder 90, a cylindrical inner surface friction surface 100 centering on the center line of the suction head 70, that is, the center line of the suction pipe 88.
A driven rotary body 102 including the above is fixed by screwing, and the driven rotary body 102 and the spring 96 are covered with a cover 104.

The arm 69 is provided with a suction head 70, more specifically, a brake device 110 for preventing rotation of the outer cylinder 90 and the head main body 86. The braking device 110 includes a friction member 112 and a lever 1.
14, equipped with springs 116 etc. Lever 114 is arm 6
An intermediate portion is rotatably attached to the pin 9 by a pin 117, a friction member 112 is fixed to one end portion, and a spring 116 is mounted between the other end portion and the arm 69.
The friction member 112 fits into a through hole formed in the arm 69,
The tip of the suction head 70 is pressed against the outer peripheral surface of the outer cylinder 90 by the urging force of the spring 116 to prevent the suction head 70 from rotating.

The suction pipe 88 is a space formed in the head main body 86.
Passageways 118 and 120 formed in the arm 69 and the shaft member 68.
Through the passages 122 and 124 formed in the head holder 58 and the rotary shaft 50, and further through a joint 126.
Via port 128 to a vacuum device (not shown). A switching valve 13 is provided at the connection between the passages 120 and 122.
0 is provided and is switched by a valve operating device (not shown) so that the adsorption pipe 88 can be selectively communicated with the vacuum device and the atmosphere.

Each suction head 70 is stopped at positions 12 of A to L shown in FIG. 6 with intermittent rotation of the head holder 58. Then, at position A, the electronic component is received from the component supply device 12, and at position G it is mounted on the printed circuit board. The position A is the component receiving position and the position G is the component mounting position. Further, a posture detection device 140 and a head rotation device 142 are provided at the positions C and E, respectively, and the position C is the posture detection position and the position E is the posture change position. Further, at the position D, when the electronic component detected at the position C is different from the expected one, the switching valve
130 is switched so that the wrong electronic component is released from the suction head 70. In this embodiment,
The switching valve 130 and the means for switching the switching valve 130 when the electronic component is different from the planned one constitute the component releasing means.

As is apparent from FIG. 7, the posture detection device 140 includes a projector 146 as an illumination device, a prism device 148 as a light guide device, and an image pickup device 150 assembled to an auxiliary frame 144 fixed to the main body frame 10. There is. Floodlight 146
Is fixed to the auxiliary frame 144 by the bracket 152,
It is positioned right above the suction head 70 stopped at the posture detection position C. The light projected from the projector 146 is transmitted through the suction head 70 in parallel with its center line, and then is turned by 90 degrees by the two prisms 154 of the prism device 148, and enters the imaging device 150. The image pickup device 150 is provided with a lens 156, and converts the projection image of the electronic component W connected on a solid-state image pickup device (not shown) by the lens 156 into a binarized signal. The imaging device 150 is attached to the auxiliary frame 144 by the bracket 160, but the height of the bracket 160 is adjusted by the adjusting screw 162, so that the focal length can be adjusted. Note that 164 is a power unit of the imaging device 150.

As shown in FIG. 8, the head rotating device 142 includes a driving rotating body 174 held by a guide bush 172 fixed to the auxiliary frame 170 so as to be rotatable and axially slidable. The drive rotating body 174 is provided with a gear 176.
Reference numeral 6 is connected to a servo motor 182 shown in FIG. 9 via a gear 178 and a timing belt 180. Therefore, the driving rotator 174 is rotated by the servo motor 182 at an arbitrary angle.

The drive rotor 174 is a hollow shaft-shaped member as shown in FIG. 10, but a wide annular groove 184 is formed on the outer peripheral surface of the lower end portion thereof, and a rubber friction ring 186 is fitted therein. Has been. In addition, a plurality of through holes are formed in the bottom wall of the annular groove 184 so as to penetrate therethrough in the radial direction, and one ball 188 is movably accommodated in each through hole. And
A rod-shaped expansion member 192 having a taper portion 190 at its lower end is slidably inserted into the drive rotor 174, and the expansion member 192
Fixed pin 194 and slot 196 formed in drive rotor 174
The engagement between the extension member 192 and the driving rotator 174 prevents relative rotation of the extension member 192 and limits the relative movement of the two in the axial direction.

A stopper ring 200 is fixed to the upper end of the drive rotor 174, and the stopper ring 200 abuts on the upper end surface of the guide bush 172 to define the lower end position of the drive rotor 174. Further, the nut 202 is provided near the upper end of the expansion member 192.
Is fixed, and the spring 203 is mounted between the nut 202 and the upper end surface of the drive rotor 174, and the expansion member 192
Is urged upward with respect to the driving rotator 174. A taper portion 204 is formed at the upper end of the expansion member 192, and an elevating member 206 is engaged with this via a bearing 208.
An engaging member 210 is also attached to the elevating member 206, which engages with the nut 202 to move the expansion member 192 to the elevating member 206.
It is designed to be raised and lowered with it.

As can be seen from FIG. 8, the elevating member 206 includes an auxiliary frame through two rods 212 and a guide block 214.
It is held so as to be able to move up and down by 170, and is connected by a connecting rod 216 to a cam device (not shown) for lifting drive. The lifting member 206, the rod 212, the guide block 214, and the connecting rod 216 are shown in FIG. 8 in a state of being rotated by a certain angle around the axis of the driving rotator 174 for easy understanding. There is.

The head rotating device 142 is provided at a position where the driving rotator 174 is concentric with the suction head 70 in a state where the suction head 70 is stopped at the position E, and when the elevating member 206 is lowered, the head rotating device 142 is first driven with the elevating member 206. The rotary body 174 is integrally lowered, and the lower end portion of the drive rotary body 174, that is, the portion where the friction ring 186 is mounted is fitted into the driven rotary body 102 of the suction head 70 shown in FIG. . Then, after the stopper ring 200 comes into contact with the upper end surface of the guide bush 172 and the descent of the drive rotor 174 is stopped, the expansion member 192 is opposed to the drive rotor 174 against the biasing force of the spring 203. The ball 188 by the wedge action of the tapered portion 190.
Are pushed outward in the radial direction to partially bulge the friction ring 186 to frictionally engage the inner circumferential friction surface 100 of the driven rotary body 102. That is, the expansion member 192 having the tapered portion 190 and the ball 188 form an expansion mechanism for the friction ring 186.

As is apparent from FIG. 8, a release lever 220 of a brake release device 218 that releases the brake device 110 is attached to the auxiliary frame 170. One arm of the release lever 220 is connected to the cam device by a connecting rod 222, and the acting member 224 is attached to the other arm. The connecting rod 222 is connected to the connecting rod 216 by a cam device.
The driving member 174 is lowered by this, and the friction ring 186 is pressed against the inner circumferential friction surface 100 of the driven rotating member 102, and then the acting member.
224 acts on the lever 114 to release the brake device 110,
Further, after the suction head 70 is rotated by a predetermined angle, the brake device 110 is returned to the operating state before the driving rotary body 174 is separated from the driven rotary body 102.

Next, the operation of the entire electronic component mounting system will be described. While the suction head 70 stopped at the position A (component receiving position) in FIG. 6 is receiving the component from the component supply device 12, the suction head 70 stopped at the position C (posture detection position) detects the electronic component W The rotation posture of the suction head 70 around the axis is detected, and at the position E (posture change position), the suction head 70 is rotated by the head rotating device 142, and the rotation posture of the electronic component W around the suction head axis is changed. Further, at position G (mounting position), the electronic component W is mounted on the printed circuit board. The operation at each of these positions is performed in parallel for different suction heads 70.
The operation at each position will be described in detail by focusing on.

When the suction head 70 is stopped at the position A, a selected one of the many component supply units 32 of the component supply device 12 is positioned directly below the suction head 70, and
The cover tape is peeled off from the electronic component holding tape held by the component supply unit 32 so that the electronic component W can be taken out. Therefore, if a head pressing device (not shown in FIG. 5) abuts against the driven rotating body 102 and pushes it down against the urging force of the spring 96,
The head body 86 and the suction pipe 88 also descend accordingly.
The lower end surface of the suction tube 88 contacts the upper surface of the electronic component W. The driven rotator 102 and the outer cylinder 90 are pushed down thereafter, but the head main body 86 and the suction tube 88 are allowed to remain stopped by the compression of the spring 92.
In this state, since the suction pipe 88 is communicated with the vacuum device, the electronic component W is sucked by the suction pipe 88 and the operation of the head pressing device is released to raise the suction head 70, so that the electronic component W is accompanied by it. As a result, the mounting device 20 finishes receiving the electronic component W from the component supply device 12.

When the suction head 70 that has received the electronic component W is stopped at the position C in this manner, the suction head 70 is positioned between the light projector 146 and the prism device 148 as shown in FIG. Therefore, the projected image of the electronic component W is formed on the surface of the solid-state image pickup element of the image pickup device 150 by the light projected from the projector 146. The imaging device 150 converts this projection image into a binarized signal and outputs it to the control device 22. The control device 22 compares the binarized signal with the binarized signal indicating the position of the regular electronic component W stored in advance in the memory of the control device 22 itself,
The attitude error Δθ with respect to the regular position of the electronic component W is calculated.

If the suction head 70 is stopped at the position E after the posture detection is performed as described above, the suction head 70 should be located directly below the drive rotating body 174 of the head rotating device 142 as shown in FIG. Becomes Therefore, the elevating member 20 is moved by the cam device.
When 6 is lowered, the lower end portion of the driving rotator 174 fits inside the driven rotator 102 shown in FIG. When the elevating member 206 is further lowered from this state, the expansion member 192 is lowered relative to the driven rotating body 102 in FIG. 10, and the friction ring 186 is expanded via the ball 188,
This is pressed against the inner peripheral friction surface 100 of the driven rotating body 102. Subsequently, the brake releasing device 218 operates to release the brake device 110, so that the suction head 70 becomes rotatable.
In this state, the servo motor 182 is operated and the suction head 70 is rotated. The servo motor 182 is rotated by an angle corresponding to the posture error Δθ obtained by the control device 22 as described above, and accordingly, the suction head 70 and the electronic component W held by the suction head 70 are required to cancel the posture error Δθ. It can be rotated by a certain angle. Then, the brake device 110 is activated again, the elevating member 206 is raised, the drive rotor 174 is disengaged from the driven rotor 102, and the attitude change of the electronic component W is completed.

After the posture error is removed as described above, the suction head 70
When is stopped at the position G, the printed circuit board positioning device 18 positions the printed circuit board at a predetermined position. Therefore, when the suction head 70 is pushed down by a head pushing device (not shown), the electronic component W held by the suction pipe 88 is pushed to a predetermined position on the printed circuit board and fixed by mounting or the like. Switching valve 130 in that state
The electronic component W is released from the suction head 70 by switching the switch and the suction device 88 to communicate with the atmosphere. After that, when the suction head 70 moves up, the mounting of the electronic component W on the printed circuit board is completed.

As is clear from the above description, in the electronic component mounting system, the suction head 70 receives the electronic component W,
Since posture detection, posture change, and mounting on the printed circuit board are performed in parallel at a plurality of positions, the cycle time is shortened and the efficiency of electronic component mounting work is improved.

Further, since the posture detection device 140 and the head rotation device 142 need only be provided for each of the 24 suction heads 70, the structure of the device is simplified and the effect of reducing the manufacturing cost can be obtained.

Further, since the head rotating device 142 is separated from the head holding body 58 and provided at a fixed position, the moment of inertia of the head holding body 58 becomes small, and vibrations caused by intermittent rotation of the head holding body 58,
Noise is reduced, and the head holder 58 can be rotated at high speed.

Further, two suction heads 70 are attached to each arm 69 provided at 12 positions of the head holder 58, and the suction head 70 suitable for the shape and size of the target electronic component W can be selected. It is a highly versatile device.

Further, since the image formed on the surface of the solid-state image pickup device of the image pickup device 150 is a projected image of the electronic component W, it may be affected by the surface roughness and color of the electronic component W like the image of the electronic component W by reflected light. Therefore, the posture of the electronic component W can be accurately detected.

In the embodiment described in detail above, the component holding head is the suction head 70 that sucks the electronic component by vacuum, and the periphery of the suction tube 88 of the head main body 86 is formed of a transparent body. However, the component holding head is not limited to this, and the holding head capable of holding the electronic component W in a state in which the attitude of the electronic component W can be detected. If so, it can be adopted.

Further, in the above embodiment, only the attitude error of the electronic component is corrected at the attitude changing position for easy understanding, but the electronic component is printed in a different attitude from the attitude received from the component supply device. If it is necessary to mount it on the board, it is also possible to rotate the electronic component at this position by the required angle, and in this way, the board positioning device 18 should have the function of rotating the printed board. Instead, electronic components can be mounted in any posture.

Further, in the above-described embodiment, only the error of the rotational posture of the electronic component is detected at the posture detection position, but the center line of the electronic component W and the reference line of the component holding head (for example, the center of the suction head 70). Line) is also detected,
If the board positioning device 18 is operated based on this, not only the mounting attitude of the electronic component but also the absolute mounting position accuracy can be improved.

In addition, although not exemplarily illustrated, it goes without saying that the present invention can be implemented in various modified and improved modes based on the knowledge of those skilled in the art.

[Brief description of drawings]

FIG. 1 is a perspective view schematically showing an entire electronic component mounting system according to an embodiment of the present invention. FIG. 2 is a front sectional view showing a main part of a mounting device of the electronic component mounting system shown in FIG. FIG. 3 is a sectional view taken along line III-III in FIG. FIG. 4 is a sectional view taken along line IV-IV in FIG. FIG. 5 is a sectional view taken along line VV in FIG. Sixth
FIG. 7 is an explanatory view showing the relative positional relationship between the main part of the mounting device shown in FIG. 2 and the posture detecting device and head rotating device attached to it, and is a VI-VI sectional view in FIGS. 7 and 8. FIG. 7 is a front view of the posture detection device shown in FIG. FIG. 8 is a front view of the brake releasing device and the head rotating device shown in FIG. FIG. 9 is a bottom view of the brake releasing device and the head rotating device shown in FIG. FIG. 10 is a sectional view taken along line XX in FIG. 10: Main frame, 12: Component supply device 14: Substrate loading device, 16: Substrate unloading device 18: Substrate positioning device, 20: Mounting device 22: Control device, 52: Rotating plate 58: Head holder, 70: Suction head 82, 84: transparent plate, 86: head main body 88: suction tube, 90: outer cylinder 100: inner peripheral friction surface, 102: driven rotating body 110: brake device, 140: posture detection device 142: head rotating device, 146: Projector 148: Prism device, 150: Imaging device 174: Driving rotator, 176, 178: Gear 180: Timing belt 182: Servo motor, 186: Friction ring 188: Ball, 192: Expansion member 218: Brake release device

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasuo Muto 19 Chausan, Yamamachi, Chiryu-shi, Aichi Fuji Machinery Manufacturing Co., Ltd. (56) Reference JP-A-57-164310 (JP, A) JP-A-SHO 59-46179 (JP, A)

Claims (1)

[Claims] 1. A plurality of component holding heads for a head holder which is intermittently rotated by a constant angle around one axis and is rotatable about an axis parallel to the one axis with the same angular interval as the intermittent rotation angle. Are mounted, each component holding head receives an electronic component from the component supply device at a component receiving position which is one of the stop positions of the plurality of component holding heads, and the component support member positioning is performed at a component mounting position which is another stop position. In an electronic component mounting system for mounting an electronic component on a component supporting member such as a printed circuit board that is positioned by a device, a plurality of stop positions existing in a movement path of the component holding head from the component receiving position to the component mounting position. One of them is the rotation posture of the electronic component held by the component holding head about the axis of the component holding head. An attitude detecting device for detecting by image pickup is provided, and its stop position is used as an attitude detecting position, and each component holding head is obtained by the attitude detecting device at another stop position existing between the attitude detecting position and the component mounting position. A head rotating device that rotates an angle determined based on the attitude information of the electronic component is provided, and its stop position is set as the attitude changing position, and the head rotating device is always in the disengaged state. An electronic component mounting system capable of changing the posture of an electronic component, characterized in that each time the component holding head reaches a posture changing position, the component holding head is brought into an engaged state capable of rotating each component holding head.