JPH0737051B2 - Method and apparatus for resin encapsulation molding of electronic parts - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to, for example, ICs and LSs.
The present invention relates to an improvement in a method for sealing and molding electronic components such as I, diodes, and capacitors with a resin, and in particular, formation of voids (air bubbles) inside and outside a resin-sealed molded body (mold package) of electronic components. Regarding things to prevent.

[0002]

2. Description of the Related Art Conventionally, resin encapsulation molding of electronic parts has been carried out by a transfer molding method. In this method, for example, a resin molding die (see FIGS. 2 to 5) is used. Usually, it is performed as follows. That is,
In advance, the upper mold (fixed mold) and the lower mold (movable mold) are heated to the resin molding temperature by the heating means. Next, the lead frame on which the electronic component is mounted is fitted and set at a predetermined position of the setting recess provided on the mold surface of the lower mold, and the resin tablet is supplied into the pot (see FIG. 2). Next, the lower mold is moved upward to clamp both upper and lower molds. At this time, the electronic component and the lead frame around the electronic component are fitted in both cavities opposite to the mold surfaces of the both molds. In addition, since the resin tablets in the pot are heated and sequentially melted, when the resin tablets are pressed by the plunger, the molten resin material will pass through the resin passages provided between the pot and the cavity. It is transferred to both cavities side through and is injected / filled in the cavities (see FIG. 4). The inside of the cavity and the cavity
The outside is usually defined as a narrow and shallow groove-like small gap.
Since communicate with each other through a vent that is made, when to inject and filling a molten resin material into the both cavities, the using resin injection and filling action, the air and moisture inside the cavity air vent It is provided so that it can be pushed out to the outside naturally. Therefore, the electronic component and the lead frame around it are sealed in the resin-molded molded body that is molded according to the shape of both cavities, and the lower mold is moved downward after the resin is cured. Both molds may be opened, and at the same time, the resin-sealed molded bodies in both cavities and the cured resin in the lead frame and the resin passage may be released from each other by a release mechanism (see FIG. 5). ).

[0003]

By the way, as described above, it exists in the pot, the resin passage, and both cavities.
Residual air, etc. is considered to be naturally discharged to the outside from the air vent. However, when this residual air etc. is naturally discharged, the discharge function is uncertain (incomplete). As a result, there is a problem in that the formation of voids in the resin-molded article cannot be effectively prevented.

In order to solve the problem of void formation of the resin-sealed molded body, for example, residual air existing in the pot, the resin passage, and both cavities is forcibly discharged by the exhaust action of the vacuum source. Can be considered (for example,
JP 64-53555 A / JP 63-186435 A / Special
(Kaisho 64-39033, etc.) . However, this forced evacuation means is excellent in that the residual air or the like is not mixed in the molten resin material, but it is not practically used because of the following technical problems. . That is,
Although vertical in the resin mold dies is the resin molded mold opening and closing for each (mold clamping and mold opening), in order to adopt the forced ventilation means, Oite when both said mold clamping, at least The pot, resin passage, and cavity must be shut off from the outside air, and residual air and moisture within that range must be discharged.

As the outside air shut-off means described above, for example, O-rings are arranged on the mold surfaces of both molds, and when the molds are clamped, the O-rings are pressed to shut off the outside air from the range set by the O-rings. Or the fitting concavo-convex portions are arranged opposite to each other on the mold surfaces, and the concavo-convex portions are fitted at the time of mold clamping,
It is conceivable that the O-ring provided on the fitting surface of the uneven portion is pressed to block the range set by the O-ring from the outside air. However, the above-mentioned conventional publicly-known technology etc.
As described above, when the outside air blocking means such as the O-ring and the fitting concave and convex portion is provided on the mold surfaces of both types, the mold clamping of both types and the outside air blocking action by the outside air blocking means are performed substantially at the same time. Because
For example, even when the lead frame supplied to both mold surfaces is not set to a predetermined position and state for some reason, the mold clamping action and the external air blocking action are performed substantially simultaneously, There is a problem that the mold surfaces of the two molds, the lead frame, and the outside air blocking means themselves are damaged.

Further, when the outside air shut-off means is fixedly mounted on the mold surfaces of both molds, there is a problem that the chase block mounting and replacement work for both molds is troublesome, and moreover, there are many kinds of products. In the case of the type in which chase blocks are frequently exchanged in response to the demand for small-volume production, there is a problem that the chase block exchange work requires time and labor, and overall productivity is reduced.

[0007] The heating by the heating means and pressurizing means the resin tablet supplying resin tablets into pots
In the case of melting, for the purpose of assisting the heating and melting action , the resin tablet is preheated before being supplied into the pot. However, since a molten resin layer is formed on the surface of the pre-heated resin tablet, if this is supplied into the pot and the original heating action of the heating means of the die is applied to the molten resin layer, the molten resin layer is contained inside the resin tablet. The large amount of air and moisture contained in the molten resin material cannot be flown out because it is hindered by the molten resin layer. Therefore, a large amount of the air and moisture is mixed into the molten resin material and flows into the cavity. There is a problem that it is formed as a void on the surface portion and inside of the molded body.

When the upper and lower molds are completely clamped,
Say the occurrence of resin burrs in both mold surfaces to prevent resin formed
Based on the shape requirements, the mold surfaces of both molds are tightly and strongly
Remains in the cavity because it is bonded (pressed)
The air and moisture that are generated are in a specific place between the mold surfaces of both molds.
It is discharged to the outside of the cavity through the air vent provided.
Will be done. However, the air vent
The function of exhausting residual air in the vitiality to the outside
In addition, the molten resin material injected and filled in the cavity is
Prevents flow out of the cavity through the air vent.
Since it is necessary to have the function to stop,
As described above, the shape is a narrow and shallow groove-like minute gap.
Is typically formed from Therefore, the upper and lower models
When all molds are clamped, residual air in the cavity is
It is extremely difficult to discharge only from the
Difficult, or a vacuum occurs when both molds are completely clamped.
Existence between the mold surfaces of both molds even if exhausted by the source
Due to poor discharge efficiency of residual air, etc.
Setting a vacuum in the range is virtually expected.
There is a technical problem of not saying.

Among the above-mentioned problems, the present invention is particularly
Simplify the overall procedure and configuration of the means for forcibly exhausting residual air and moisture in the outside air cutoff range to its workability and
The purpose is to improve operability.

Further, the present invention provides an electronic component capable of efficiently and reliably discharging the above-mentioned residual air and moisture to the outside and preventing the residual air and moisture from being mixed into the molten resin material. An object of the present invention is to provide a resin sealing molding method and device.

Further, according to the present invention, the air and water in the resin tablet supplied into the pot are efficiently and surely discharged to the outside to prevent the air and water from being mixed into the molten resin material. It is an object of the present invention to provide a resin encapsulation molding method and apparatus for an electronic component, which can be manufactured.

[0012]

In order to solve the above-mentioned problems, a method for resin-sealing and molding an electronic component according to the present invention is a pot in which an upper die and a lower die are provided in a pair, and the lower die is arranged. A resin tablet is supplied inside, and it is configured between the upper and lower molds.
At least outside the pot, resin passage, and cavity
Isolates the surrounding area from the outside air, and within this outside air isolation range
While forcibly discharging residual air and moisture to the outside,
With heated and melted by the heating means and pressurizing means resin tablet in the pot, the tree the molten resin material
Injected into the cavity between the upper and lower dies through butter passage
By the electronic component is set into the cavity to a method of molding a resin sealing, in the outside air cutoff state between the upper and lower mold sections, the mold while maintaining the required gap between the upper and lower mold sections of the mold surface an intermediate mold clamping step of the upper and lower dies performing tightening, the outside air cutoff state between the upper and lower dies, and full clamping step of the upper and lower dies for bonding mold surfaces of the upper and lower dies, the lower die pot When heating and melting the resin tablets supplied inside,
The resin tablet by heating and expanding the resin tablet.
The air and moisture contained in the resin tablet are allowed to flow out between the mold surfaces of the upper and lower molds by making the inside and the outside of the chamber air-permeable, and the outflowing air and water are prevented from reaching the outside air blocking range.
And a forced evacuation process of forcibly discharged to囲外, above
In the middle mold clamping process and the complete mold clamping process for both upper and lower molds,
By performing the forced evacuation process, air and moisture remaining between the mold surfaces of the upper and lower molds and the inside of the resin tablet
The air and water flowing between the mold surfaces of the upper and lower molds
It is characterized in that it is forcibly discharged out of the air cutoff range .

Further, another method of resin-sealing and molding an electronic component according to the present invention is to provide an upper mold and a lower mold in pairs, and to supply the resin tablets into a plurality of pots arranged in the lower mold. , At least a pot / tree constructed between the upper and lower molds
Isolate the outside of the oil passage and cavity from the outside air, and
The air and moisture remaining in this outside air cutoff range
When the resin tablet in the pot is heated and melted by the heating means and the pressurizing means while being forcibly discharged to
In addition , by injecting the molten resin material into the cavity between the upper and lower molds through the resin passage , the electronic component set in the cavity is resin-sealed and molded by the multi-plunger method. a molding method, in the external air shutoff state between the upper and lower dies, said upper and lower
And full clamping step of the upper and lower mold sections to bond the mold surface of the mold, heating and melting of the resin tablet is supplied to the lower die pot
When the resin tablet is heated and expanded,
The inside and outside of the bullet are made to have air permeability so that the air and water contained in the resin tablet flow out between the mold surfaces of the upper and lower molds , and the outflowing air and water are removed from the outside air.
It has a forced evacuation process to forcibly discharge it outside the cutoff range ,
Forced exhaust in the complete mold clamping process for both upper and lower molds
By performing the process, the air and moisture remaining between the mold surfaces of the upper and lower molds and the upper and lower molds from inside the resin tablet
The air and water flowing between the mold surfaces of the
Through air vents and / or air passages between mold surfaces
It is characterized by forcibly discharging it to the outside .

Further, in the method of resin-molding and molding an electronic component according to the present invention, the resin table mold supplied in the lower mold pot described above is used.
During heating and melting of the container, the bottom surface of the resin tablet and the peripheral surface of the resin tablet are heated to expand the resin tablet from the top surface side thereof upward in the pot. It is a thing.

Further, a resin encapsulation molding apparatus for an electronic component according to the present invention for solving the above-mentioned problems is provided with a resin molding die in which an upper die and a lower die having a plurality of pots are provided opposite to each other. a resin sealing and molding apparatus for electronic parts, the people each of said upper and lower mold, - at least the pot in the upper and lower mold sections
A pair of outside air covering the outer periphery of the resin passage / cavity
The shut-off member is slidably fitted to each of the upper and lower molds.
The mold is clamped while maintaining the required gap between the mold surfaces.
At the time of intermediate mold clamping of both molds, and by joining the mold surfaces of the upper and lower molds
That during upper and lower dies fully clamping of, along with both the both outside air blocking member is disposed so as to be freely fitted, the on
Each fitting surface between the lower mold and the outside air blocking member, and
A seal member is interposed between the fitting surfaces of both the outside air blocking members, and the outside air blocking space and the vacuum source side are set between the upper and lower molds when the both outside air blocking members are fitted together. Are connected to each other via a vacuum path, and a required air passage communicating with the outside air blocking space is provided between the mold surfaces when the upper and lower molds are completely clamped. is there.

[0016]

According to the present invention, when the upper and lower molds are clamped between the intermediate mold and the complete mold, both outside air blocking members are slid so that both the outside air blocking members are fitted to each other. The outside air blocking space portion can be easily configured by covering at least the outer periphery of the pot, the resin passage, and the cavity portion in both molds. Therefore, when the two molds are clamped between the two molds, by operating the vacuum source connected to the outside air blocking space, the residual air and moisture in the outside air blocking space can be efficiently and reliably passed through the vacuum path. It is possible to perform a forced exhaust step of exhausting to the outside.

Further, since the bottom surface portion and the peripheral surface portion of the resin tablet supplied to the lower mold pot are heated, the upper portion of the pot is open, and the resin tablet inside the pot is opened from the upper surface side. It will expand upwards. Therefore,
The air and water contained in the resin tablet will sequentially flow out from the upper surface side of the expanded resin tablet between the mold surfaces of both molds. Therefore, the outflowing air and the water can be forcibly discharged to the outside in the above-described forced exhaust step.

In addition, since the residual air and moisture in the outside air blocking space and the air and moisture contained in the resin tablet can be discharged to the outside by the forced exhaust step, these air and moisture are mixed in the molten resin material. Can be prevented efficiently and reliably.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 schematically shows the construction of a resin encapsulation molding apparatus for electronic parts, and FIGS. 2-5 schematically show the main parts of a mold in the apparatus. 6 to 9 show an enlarged main part of the mold.

This apparatus is provided with an upper mold 1 (fixed mold) mounted on the upper fixed plate and a lower mold 2 (movable mold) mounted on the lower movable plate. Further, the fixed side (upper mold side) mold base 3 and the movable side (lower mold side) mold base 4 are respectively provided with heating means 5 and 6 such as heaters.
A fixed chase block 7 is removably mounted on the fixed mold base 3 by a fitting means such as a dovetail groove 3a and a dovetail portion 7a. Further, the movable side chase block 8 is detachably mounted on the movable side mold base 4 by a fitting means such as a dovetail groove 4a and a dovetail portion 8a. Also, the chase blocks (7, 8) fitted to the mold bases (3, 4) are fitted at predetermined positions via appropriate blocks 7b, 8b fixed to both front and rear ends thereof. Is provided. In addition, both chase blocks (7, 8) are shown in FIG.
The case where both the front and rear ends of the block are fixed with blocks (7b, 8b) was shown, but one side of the block (7b, 8b), for example, omitting the block on the rear side of the device, The part corresponding to the side block and both mold bases (3, 4) may be integrally formed. Further, a suitable seal member (not shown) may be interposed between the chase blocks (7, 8) and the fixed blocks (7b, 8b).

A plurality of required resin material supply pots 9 are arranged in the movable side chase block 8, and a required plurality of resin molding cavities 10 are provided at predetermined positions around each pot 9. Are arranged respectively. The movable chase block 8 is also provided with a dedicated heating means 11 such as a heater. In addition, below the movable side chase block 8, a lower ejector plate 12 having an ejector pin 12a for releasing a resin-sealed molded product molded in the cavity 10 and the inside of each pot 9 are supplied. Plunger holders 13 each having a plunger 13a (pressurizing means) for pressurizing the resin tablets R separately provided are respectively provided. The upper end of each ejector pin 12a is fitted into a pin hole 14 communicating with each cavity 10. The upper end of each plunger 13a is fitted into each pot 9 through insertion holes 15 and 16 provided in the movable mold base 4 and the ejector plate 12, respectively. Also, the above plunger holder
The rail 13 is detachably mounted on a rail member 13b provided on the lower portion of the movable mold base 4. An appropriate seal member is provided between the fitting space of the lower ejector plate 12 provided on the movable mold base 4 and the outside, and between the fitting space of the plunger holder 13 and the outside. You may interpose (not shown).

The fixed chase block 7 is provided with cavities 20 corresponding to the positions and the number of the cavities 10 of the movable chase block. The fixed chase block 7 is equipped with a dedicated heating means 21 such as a heater. Further, above the chase block 7, there are provided an upper ejector plate 22 provided with an ejector pin 22a for releasing a resin-sealed molded product molded in the cavity 20, and a support pin 22b of the upper ejector plate. An elastic member 23 such as a spring for pushing down the upper ejector plate 22 is provided via the support pins 22b. The lower end of each ejector pin 22a has a pin hole 24 communicating with each cavity 20, and a cull portion provided at the position of each pot 9.
The pin holes 24a communicating with 25 are fitted respectively. The ejector plate 22 is a double type (1.
2) When the mold is opened, it is pushed down by the elasticity of the elastic member 23, so that the resin passage portion of the required length provided inside the cavity 20 and between the pot 9 and the cavity 20 (in the example shown in FIG. The resin-sealed molded body P cured in the portion 25 and the gate portion 26) is provided so that it can be released downward (see FIG. 5).

When the molds of both molds (1 and 2) are opened, the lower ejector plate 12 is the ejector bar.
12b pushed up by its respective ejector pin 12a
Causes the resin-sealed molded body P in each cavity 10 to be released from the mold upward (see FIG. 5), but at the time of the complete mold clamping, it is arranged so as to face both the upper and lower ejector plates (22, 12). Upper and lower return pins (not shown) are provided to retract both ejector plates upward and downward, respectively (see FIG. 4).

Further, the movable side mold base 4 described above,
An outer air blocking member 30 having a round tubular shape or a rectangular tubular shape that covers at least the outer periphery of each pot 9 and each cavity 10 on the die surface of the lower die 2 is fitted, and the outer air blocking member 30 is required. It is fitted so as to be slidable in the mold opening / closing direction via the drive mechanism 31 of FIG. Further, a suitable seal member 32 is disposed on the fitting surface between the movable side mold base 4 and the outside air blocking member 30.

The fixed-side mold base 3 described above has
At least each resin passage on the die surface of the upper die 3 (cull portion 25
And a gate portion 26), and a round-cylindrical / square-cylindrical outside air blocking member 33 that covers the outer periphery of each cavity 20 is fitted.
The outside air shut-off member 33 is fitted slidably in the mold opening / closing direction via a required drive mechanism 34. Further, a suitable seal member 35 is disposed on the fitting surface between the fixed side mold base 3 and the outside air blocking member 33.

Further, at the time of the intermediate mold clamping and the complete mold clamping of both the molds (1, 2), the pair of outside air blocking members (30, 33) through the above-mentioned both drive mechanisms (31, 34). 2) is moved forward in the mold clamping direction, the both outside air blocking members (30, 33) are provided so that the tips of both members fit (see FIGS. 3 and 4). In FIG. 4, the upper end of the outside air blocking member 30 fitted to the movable mold base 4 is moved up to near the mold surface of the lower mold 2 and fitted to the fixed mold base 3. The case where the outside air blocking member 33 is fitted to the outer peripheral surface of the outside air blocking member 30 of the movable mold base 4 is illustrated.

Further, an appropriate seal member 36 is disposed between the fitting surfaces of both the outside air blocking members (30, 33). Furthermore, both mold bases (3, 4) and both chase blocks (7
・ 8), chase blocks (7 ・ 8) and ejector pins (22a ・ 12a), movable chase block 8, pot 9 and plunger 13a. Are intervening. Therefore, at the time of intermediate mold clamping and complete mold clamping of both molds (1 and 2) shown in FIGS. 3 to 4, by fitting the tips of both outside air blocking members (30 and 33), Between the mold surfaces of the molds (1 ・ 2), the outside air blocking member (30 ・
33) and the sealing members (32, 35, 36, 37) form a space 38 in which the outside air is shut off. In addition,
Since the space between the surfaces of the molds (1, 2) is substantially shielded from the outside air by the seal members (35, 36), the interposition of the seal members 37 is not always necessary. Further, instead of interposing the seal members 37, or when omitting the seal member 37, as described above, between the chase blocks (7, 8) and the fixed blocks (7b, 8b). It is preferable to interpose a suitable seal member. Further, the lower mold 2 provided for fitting the plunger holder 13
A suitable seal member 37a and a seal cover 37b may be interposed between the space 2a and the outside so as to shut off the outside air in the space 2a (see FIG. 1).

Further, one end side of a vacuum path 39 such as a vacuum pipe is communicated and connected to the above-mentioned outside air shut-off space portion 38 which is constructed when the both outside air shut-off members (30, 33) are fitted together. The other end of the vacuum path 39 is connected to a vacuum pump or another suitable vacuum source 40 side. Further, the fitting surfaces of both the outside air blocking members (33, 30) may be vertical cross-section vertical surfaces 41 as shown in FIGS. 2 to 6, and the taper as shown in FIG. The surface 42 may be used, and in short, any structure can be used as long as it can block the flow of air and water between the both by the seal member 36 disposed on the fitting surface of the both. Therefore, both types (1
・ When the vacuum source 40 is operated during the intermediate mold clamping of 2), the residual air and water in the outside air blocking space 38 including the pot 9, resin passage (25, 26) and cavity (10, 20) are removed. It can be forcibly sucked and discharged to the outside to bring the entire inside of the outside air blocking space 38 into a vacuum state. Further, when the vacuum source 40 is operated during the complete mold clamping of both molds (1 and 2) shown in FIG. 4, the pot 9, resin passages (25, 26), cavity (10,
20) Since air and moisture in the part are discharged to the outside through a required air vent 43 provided on at least one mold surface (the upper mold surface in the illustrated example) of both molds, the outside air blocking space is also the same. The entire inside of the portion 38 can be in a vacuum state. The above-mentioned setting of the vacuum state in the outside air shut-off space portion 38 is further performed by continuously performing the forced exhaust action during intermediate mold clamping of both molds (1 and 2) and the forced exhaust action during complete mold clamping. It will be certain.

FIG. 9 shows a mold in a resin-sealing molding apparatus for electronic parts by a multi-plunger method in which a plurality of pots are arranged in a lower mold, and the upper and lower molds (1 and 2) are both complete molds. The state at the time of tightening is shown, and it is necessary to connect the pot 9 / resin passage (25/26) to the outside (outer air blocking space 38) between the mold surfaces of the molds (1 and 2). The air passage 44
The figure shows a case where the above is arranged. Incidentally, if necessary, by disposing a valve pin for opening and closing the passage at a required position of the air passage 44, for example, a structure for preventing molten resin material from entering the passage during resin molding. May be adopted.

As described above, a required air passage for communicating the pot / resin passage with the outside is provided between the die surfaces of the two dies.
When 44 is arranged, the both molds can be completely clamped to perform forced exhaust in the outside air blocking space 38. Then, at this time, the entire inside of the outside air blocking space 38 including the pot, the resin passage, and the cavity can be brought to a vacuum state. Therefore, for example, the pot
Since the outside of the resin passage / cavity part is shut off from the outside air, both molds can be completely clamped immediately in this state, and air and moisture between the mold surfaces can be forcibly discharged. In this case, there is an advantage that intermediate mold clamping of both molds can be omitted and the overall molding time can be shortened.

The above-mentioned both outside air blocking members (30, 33) are
Through both drive mechanisms (31 ・ 34), both mold bases (3
・ It is provided so that it can be moved backward to a position (see Fig. 2) that does not interfere with the attachment / detachment / replacement work of both chase blocks (7 ・ 8) for (4). Therefore, both the outside air blocking members
Since the mold opening and closing operations of both molds (1 and 2) can be performed with the (30/33) moved forward to the forward positions shown in FIGS. 3 to 4, it is not always necessary to perform the molding during normal resin molding. It is not necessary to retreat the outside air blocking members (30, 33) for each cycle.

Further, in the configuration of the resin sealing molding apparatus for electronic parts shown in the embodiment example, the outside air blocking space portion 38 has the both molds.
Although the case where it is configured between the joint surfaces of (1 and 2) and around the outside thereof is shown, the outside air blocking space 38 and the fitting space of both ejector plates (12 and 22) in both molds are shown. A configuration may be adopted in which a vent hole is provided in between so that residual air and moisture in the fitting space portion are also discharged to the outside at the same time. In addition, a configuration is adopted in which a forced exhaust means is additionally provided for forcibly discharging the residual air and moisture in the fitting space of both ejector plates (12, 22) to the outside through the required vacuum path 39a. (See FIG. 5).

The configuration of the above-described embodiment shows a type in which both chase blocks (7, 8) are frequently attached and detached, but a resin encapsulation molding apparatus for electronic parts having a normal type configuration. The same can be applied to.

Further, the above-mentioned both outside air blocking members (33, 30)
The drive mechanism (31 ・ 34) of the
Either a mechanical drive mechanism such as a pinion mechanism, an electric drive mechanism such as an electric motor, or a fluid drive mechanism such as hydraulic pressure or pneumatic pressure may be adopted. From the viewpoint, it is preferable to employ the above-mentioned electric drive mechanism or pneumatic drive mechanism.

A method of resin-molding the electronic component 27a mounted on the lead frame 27 using the above-mentioned resin-molding apparatus will be described below.

First, the lead frame 27 is set through a proper supply / extraction mechanism 28, and a recess 29 for setting is provided on the mold surface of the lower mold.
The resin tablet R
Is supplied into each pot 9 (see FIG. 2). Next, the lower mold 2 is raised by the lower movable plate, and both upper and lower molds (1.
Intermediate mold clamping is performed with the required gap S maintained between the mold surfaces of 2) (see FIGS. 3 and 8). Next, in this intermediate mold clamped state, by sliding both the outside air blocking members (30, 33) to fit both of the outside air blocking members,
At least pot 9 and resin passage (25, 26) in both types
-The outside air blocking space 38 is formed by covering the outer periphery of the cavity (10, 20) (see Fig. 3) . Next, in this intermediate mold clamped state, the vacuum source 40 connected to the outside air blocking space portion 38 is operated to force the residual air and moisture in the outside air blocking space portion to the outside through the vacuum path 39. To discharge. Therefore, at this time, the pot 9 and the resin passage (2
5 ・ 26) ・ Outside air blocking space 38 including cavity (10 ・ 20)
The whole inside will be set to a vacuum state. Next, the lower mold 2 is further raised to perform complete mold clamping in a state where the mold surfaces of both molds (1, 2) are joined (see FIG. 4). Even during this complete mold clamping, the outside air blocking space 38 by the vacuum source 40 is
Continue the forced evacuation function. Also, the resin tablets R in the pot 9 are sequentially melted by the heating means (5, 6, 11, 21), so that the resin tablets R are
The molten resin material is injected into both cavities (10, 20) through the resin passages (25, 26) by pressurizing with a,
The electronic component 27a set in the cavity can be sealed in the resin-sealed molded body P. In addition, the above-mentioned resin-sealed molded body P is the upper and lower ejector plates (22, 12).
The mold can be released between the two molds (1, 2) (see Fig. 5).

By the way, the resin tablet R supplied into the pot 9 has the upper portion in the open state.
Inside, the heating means (5, 6, 11, 21) will be subjected to the heat expansion effect. That is, since the bottom surface portion and the peripheral surface portion of the resin tablet R are heated, the resin tablet R expands upward from the upper surface portion side in the pot 9. Therefore, the air and the water contained in the resin tablet R will sequentially flow out from the expanded upper surface side of the resin tablet between the mold surfaces of the molds (1, 2).
Further, even at the time of complete mold clamping, the vacuum source 40 continues the forced exhaust operation in the outside air blocking space 38,
The outflowing air and moisture from the inside of the resin tablet described above can be forcibly discharged to the outside through the air vent 43 and the outside air blocking space 38 described above. Therefore, the residual air and moisture in the outside air blocking space 38 and the air and moisture contained in the resin tablet R can be forcibly discharged to the outside, and these air and moisture are mixed in the molten resin material. Can be efficiently and surely prevented.

The present invention is not limited to the above-mentioned embodiments, but can be arbitrarily and appropriately modified / selected as necessary within the scope of the gist of the present invention. Is.

[0039]

According to the present invention, when the upper and lower molds are clamped between the intermediate molds and the complete molds, the residual air and moisture in the outside air blocking space of the molds, the air contained in the resin tablets, and Since moisture can be efficiently and reliably discharged to the outside, it is possible to prevent the air and moisture from being mixed into the molten resin material. Therefore, a resin sealing molding method and device for an electronic component capable of preventing the formation of voids or defective portions due to the above-mentioned residual air and moisture inside or inside the resin sealing molded body are provided. There is an effect that can be done. Further, this brings about an excellent effect that a product of this kind having high quality and high reliability can be molded.

Further, according to the present invention, the overall procedure and structure of the means for forcibly exhausting the residual air and moisture within the outside air cutoff range to the outside can be simplified to improve the workability and operability thereof. It has an excellent practical effect that can be achieved.

[Brief description of drawings]

FIG. 1 is a partially exploded perspective view schematically showing a configuration of a resin encapsulation molding apparatus for electronic components.

FIG. 2 is a partially cutaway vertical sectional view showing an enlarged main part of a mold in a resin sealing molding apparatus for electronic parts, showing a mold open state before resin sealing molding.

FIG. 3 is a partially cutaway vertical sectional view of a main part of a mold corresponding to FIG. 2, showing an intermediate mold clamped state of the mold.

FIG. 4 is a partially cutaway vertical sectional view of a main part of a mold corresponding to FIG. 2, showing a complete mold clamping state at the time of resin sealing molding.

5 is a partially cutaway vertical sectional view of a main part of a mold corresponding to FIG. 2, showing a mold open state after resin sealing molding.

FIG. 6 is an enlarged vertical cross-sectional view of a fitting surface of both the outside air blocking member.

FIG. 7 is a vertical cross-sectional view of a mating surface of both of the outside air blocking members, showing another example of the shape.

FIG. 8 is an enlarged vertical cross-sectional view of a main part of a mold corresponding to FIG. 3, showing an intermediate mold clamped state of the mold.

FIG. 9 is a partially cutaway vertical cross-sectional view showing another example of the configuration of the mold part in the resin encapsulation molding apparatus for electronic parts, showing a completely clamped state during resin encapsulation molding.

[Explanation of symbols]

 1 Upper mold 2 Lower mold 2a Space part 3 Fixed side mold base 4 Movable side mold base 5 Heating means 6 Heating means 7 Fixed side chase block 8 Movable side chase block 9 Pot 10 Cavity 12 Lower ejector plate 13a Plunger 20 Cavity 22 Ejector plate 25 Cull part 26 Gate part 27 Lead frame 27a Electronic component 30 Outside air blocking member 31 Drive mechanism 32 Sealing member 33 Outside air blocking member 34 Driving mechanism 35 Sealing member 36 Sealing member 37 Sealing member 37a Sealing member 37b Sealing cover 38 Outside air blocking space 39 Vacuum path 39a Vacuum path 40 Vacuum source 43 Air vent 44 Air path P Resin-sealed molded product R Resin tablet S Gap

Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location B29L 31:34

Claims (4)

[Claims] 1. A the upper and lower molds were contraposed supplies the resin tablet into the pot which is arranged in the lower die, the
At least a pot, resin passage,
Insulates the outside of the cavity from the outside air, and
Force the air and moisture remaining in the outside air cutoff range to the outside
While discharging, the resin tablet in the pot is heated and melted by the heating means and the pressurizing means , and the molten resin material is injected into the cavity between the upper and lower molds through the resin passage to thereby form the cavity. the electronic component is set within a method of forming a resin sealing, on the
In the outside air cutoff state between the lower dies, and an intermediate mold clamping step of the upper and lower dies performing mold clamping in a state keeping a prescribed gap between the mold surfaces of the upper and lower dies, the outside air cutoff state between the upper and lower mold sections in, the vertical and dies complete mold clamping step, the resin tablet is supplied to the lower mold pot of bonding the mold surface of the upper and lower mold sections
When the resin is melted by heating, the resin tablet is expanded by heating.
And make the inside and outside of the resin tablet breathable.
Te, upper air and moisture contained inside the resin tablets
Forced exhaust work to let outflow between the mold surfaces of both lower molds and to forcefully discharge the outflowing air and moisture out of the outside air cutoff range.
And the above-mentioned intermediate mold clamping process for both upper and lower molds and complete
By performing the forced evacuation process in the mold clamping process,
And air and water remaining between the mold surfaces of the upper and lower dies, the tree
Empty space that has flowed from the inside of the oil tablet between the upper and lower mold surfaces.
This <br/> a method of resin-seal-molding an electronic component, characterized in that forcibly discharge the air and moisture to the outside air cutoff range. 2. An upper mold and a lower mold are provided in a pair, a resin tablet is supplied into a plurality of pots arranged in the lower mold, and at least a pot and a tree formed between the upper and lower molds.
Isolate the outside of the oil passage and cavity from the outside air, and
The air and moisture remaining in this outside air cutoff range
When the resin tablet in the pot is heated and melted by the heating means and the pressurizing means while being forcibly discharged to
In addition , by injecting the molten resin material into the cavity between the upper and lower molds through the resin passage , the electronic component set in the cavity is resin-sealed and molded by the multi-plunger method. a molding method, in the external air shutoff state between the upper and lower dies, said upper and lower
And full clamping step of the upper and lower mold sections to bond the mold surface of the mold, heating and melting of the resin tablet is supplied to the lower die pot
When the resin tablet is heated and expanded,
The inside and outside of the bullet are made to have air permeability so that the air and water contained in the resin tablet flow out between the mold surfaces of the upper and lower molds , and the outflowing air and water are removed from the outside air.
It has a forced evacuation process to forcibly discharge it outside the cutoff range ,
Forced exhaust in the complete mold clamping process for both upper and lower molds
By performing the process, the air and moisture remaining between the mold surfaces of the upper and lower molds and the upper and lower molds from inside the resin tablet
The air and water flowing between the mold surfaces of the
Through air vents and / or air passages between mold surfaces
And forcibly discharging the resin to the outside . 3. A resin tablet supplied into a lower mold pot.
2. When the resin tablet is heated and melted, the bottom surface portion and the peripheral surface portion of the resin tablet are heated so that the resin tablet is expanded upward from the upper surface portion side in the pot. 2. The resin encapsulation molding method for an electronic component according to 2. 4. A resin encapsulation molding apparatus for an electronic component, comprising a resin molding die in which an upper die and a lower die having a plurality of pots are provided in opposition to each other, wherein each of the upper die and the lower die comprises: freely each slide pair outside air blocking member which covers the outer side at least around the pot resin passage cavity portion in said upper and lower mold sections <br/>
While fitting, keep the required gap between the mold surfaces of the upper and lower molds.
During the middle mold clamping of the upper and lower molds, where the molds are clamped together
When the mold surfaces of the upper and lower molds are joined together, the molds are completely clamped
At this time, both of the outside air blocking members can be fitted freely.
As well as arranged so that each mating face of said upper and lower mold sections and the both outside air blocking member, as well, a sealing member is interposed in the fitting surface of both said outside air blocking member therebetween, further, the cars The outside air shut-off space, which is set between the upper and lower molds when the outside air shut-off members are fitted together, and the vacuum source side are connected for communication through a vacuum path, and between the mold surfaces when the upper and lower molds are completely closed. A resin encapsulation molding apparatus for an electronic component, characterized in that a required air passage communicating with the outside air blocking space is provided in the structure.