JPH073797B2 - Contact opening / closing device for IC socket - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact opening / closing device for mounting an IC package by lowering a contact opening / closing member provided in a socket body to slide the contact into a contact released state.

[0002]

2. Description of the Related Art In Japanese Utility Model Laid-Open No. 62-111673, a contact piece is formed on the upper end of a curved spring piece of a contact, and the contact piece is pressed by a contact opening / closing member to be slid rearward so that an IC package is manufactured. The contact with the terminal member is released, and the IC package is mounted on the socket mounting portion when the contact is released.

On the other hand, the IC package has a structure in which it is adsorbed by an adsorbing section provided on a manipulator of a robot, brought to a higher level of the IC mounting section, and released by adsorbing to drop the IC mounting section.

[0004]

Problems to be Solved by the Invention As described above, the IC
As for the package, the IC suction part equipped on the robot sucks the IC package and mounts it on the socket.
Although it is intended to automate the mounting of the IC package in the socket, in this prior example, even if the control of the IC suction portion is accurately performed on the robot side, the IC socket mounted on the wiring board or the like is not used. Since the relative positioning is not guaranteed and the IC package is not mounted accurately due to the fine pitch of the IC package terminal member and contacts, the relative position of the terminal member of the package and the socket contact is properly secured. It has caused difficult problems.

[0005]

The present invention has been provided in order to effectively deal with the above situation. As a means thereof, the upper surface of the IC package body is an IC adsorption portion provided in a robot manipulator. The socket body is attached to the IC mounting portion by suction, and positioning pins are provided on both sides of the IC suction portion of the manipulator, while the positioning pins are aligned with the contact opening / closing member. Positioning holes are provided, and the IC package is mounted by the IC suction portion between the positioning pins.
A contact opening / closing device for an IC socket is provided with a pressing force applying section for pressing down the pressing operation section of the contact opening / closing member before mounting the package.

Further, according to the present invention, the pressing force applying portion is provided with the IC.
It is arranged so as to be positioned on both sides of the mounting portion, and the IC suction portion is arranged in the middle of the both pressing force applying portions.

[0007]

The function of the present invention is to attach the IC package to the IC of the socket by adsorbing the IC package at the IC adsorption portion of the manipulator.
When mounting on the mounting part, by aligning the positioning pins located on both sides of the IC adsorption part and arranged on the manipulator with the positioning holes provided on the contact opening / closing member,
The contact opening / closing member and the mounting position of the socket body in which the contact opening / closing member is vertically movable are appropriately determined with respect to the IC mounting portion, and then the contact opening / closing is performed by the pressing force applying portions arranged on both sides of the positioning pin. The work of pushing down the member to open the contact and the mounting of the IC package by the IC suction portion are performed.

With this, it is possible to easily achieve automation of a series of operations for determining the mounting position of the IC package with respect to the IC socket, lowering the contact opening / closing member to the open state, and mounting the IC package. In addition, the IC package is mounted while surely forming the opened state of the contact and properly securing the relative position with the contact.

[0009]

Embodiments of the present invention will be described in detail below with reference to FIGS.

The socket body 1 has a large number of contacts 4 arranged to come into contact with the upper surfaces of the large number of terminal members 3 of the IC package 2.

The terminal member 3 of the IC package 2 is shown in FIG.
As shown in (1), the two side surfaces facing each other are protruded to the side in parallel with each other, and are bent in two steps to have a substantially horizontal tip.

As shown in FIGS. 3 and 7, the contact 4 has a male terminal 5 which extends below the fixed end 7 implanted in the socket body 1 and projects downward from the socket body. It has a curved spring piece 6 which is continuously provided above 7. The curved spring piece 6 is projected forward (to the side of the IC package 2), and a contact piece portion 8 is provided continuously to the upper end of the curved spring piece 6. The contact piece portion 8 is projected to the projecting side (front side) of the curved spring piece 6 and has a downward contact projection 9 formed at the tip thereof.

A cantilever arm 10 extends rearward from the upper end of the contact, that is, the contact piece portion 8. The cantilever arm 10
Has a pressing receiving portion 11 which is connected to the contact piece portion 8 at one end and has a free end at the other end, and which is opened and closed by a contact opening / closing member described later. The pressure receiving portion 11 is formed by a protrusion protruding upward.

The upper end of the upward projecting piece serving as the pressure receiving portion 11 is the pressing point P ₂ by the contact opening / closing member, and the lower end of the contacting projection 9 of the contact piece portion 8 is the upper surface of the terminal member 3 of the IC package 2. The contact point P ₁ with the contact point P ₁ is set so that the pressing point P ₂ is located above the horizontal line passing through the contact point P ₁ .

A curved spring piece 6 for connecting the contact piece portion 8 in series.
Upper P ₃ a disposed to the upper than the contact point P _1, to distribution of the pressing point P ₂ to the upper than the upper end P ₃ of the curved spring piece 6. The relationship between the contact point P ₁ , the upper end P ₃ of the curved spring piece and the pressing point P ₂ is clearly shown in FIG.

The relative relationship in which the contact point P ₁ is lower and the pressing point P ₂ is higher is determined by the extending direction of the cantilever arm 10 and the projecting dimension of the contact receiving portion 11.

The cantilever arm 10 shown in the drawing is once extended from the contact piece portion 8 to the contact point P ₁ or less and is further bent into a hook shape to form the upward projecting piece (press receiving portion 11).

Preferably, the pressing point P _{2 of the} pressing receiving portion 11 is
The extension dimension of the cantilever arm 10 is selected so as to be arranged rearward of the curved spring piece 6.

3 to 5 show the case where the contact 4 is of a single-sided contact type, and the contacting projection 9 of the contacting piece 8 is shown.
Is in pressure contact with the upper surface of the tip of the terminal member supported by the terminal support seat 16 from diagonally above as shown by an arrow W ₃ in FIG.

FIG. 6 shows a case where the contact 4 is of a double-sided contact type (sandwich type). As shown in the drawing, a contact piece 22 is erected on the fixed end 7, and the IC package is provided at the tip thereof. 2 supports the lower surface of the tip portion of the terminal member 3, and the contact piece portion 8 pressurizes and contacts the upper surface of the tip portion portion, thereby supporting the lower surface of the tip portion of the terminal member 3, and the contact piece portion 8 on the upper surface of the tip portion. The upper and lower surfaces of the tip end portion of the terminal member 3 are sandwiched by pressurizing and contacting each other. Reference numeral 12 denotes a contact opening / closing member that applies a pressing force to the pressure receiving portion 11 of the contact 4, and is mounted on the socket body 1 so as to be vertically movable.

The contact opening / closing member 12 is shown in FIGS.
As shown in FIG.
The IC mounting portion 14 of the socket body 1 is formed immediately below the accommodation window 13. The IC mounting portion 14 has a ridge 15 for supporting the base of the terminal member 3 of the IC package 2.
While supporting the terminal member 3, the side surface of the main body of the IC package 2 or the bent step portion of the terminal member 3 is regulated for positioning.
At this time, in the embodiment shown in FIGS. 3 to 5, the tip end portion of the terminal member 3 is supported by the terminal support seat 16 outside the ridge 15 and installed in a fixed position, and in the embodiment shown in FIG. The tip of the terminal member 3 is supported by the contact piece 22. The positioning ridge 15 does not support the terminal member 3, and the IC package is
It may be provided as a means for restricting only the side surface of the main body of J2.

The contacts 4 are juxtaposed along opposite sides of the IC mounting portion 14, and the contact piece portion 8 of the contact 4 is an opening 17 formed outside the terminal support seat 16.
3 to 5, the contact protrusion 9 is brought into contact with the surface of the terminal support seat 16 in the embodiment shown in FIGS.
Further, in the embodiment shown in FIG. 6, the contact pieces 22 are put in contact with each other to store elasticity, that is, in a so-called pre-loaded state.

Further, the contact opening / closing member 12 is the IC
A pair of push-down operation portions 18 are provided on the left and right outer sides of the accommodation window 13. The engaging fingers 19 are erected from the opposing side walls of the push-down operation portion 18, the engaging fingers 19 are slid into the guide grooves 20 formed in the opposing side walls of the socket body 1, and can be moved up and down in accordance with the guide grooves 20. The engaging claw provided at the tip of the engaging finger 19 is engaged with the stepped portion provided at the upper end of the guide groove when the contact opening / closing member 12 is lifted by a certain amount, and the ascending dead center of the opening / closing member 12 is determined.

The contact opening / closing member 12 is connected to the socket body 1 by the coupling means as described above, that is, the engaging fingers 19.
Is mounted so that it can move up and down, and in the mounted state, a corresponding state between the IC housing window 13 and the IC mounting portion 14 of the socket body 1 is formed, and the pressing receiving portion 11 and the pressing portion 21 of the contact 4 described below are formed. A corresponding state is formed, and the pressing operation portion 18 is placed above the pressing receiving portion 11 of the contact 4 so as to face it.

A partition wall 27 intervening between the pressing operation portion 18 and the pressure receiving portion 11 of each of the contacts 4 is provided so as to project downward, and the pressure receiving portion of the contact 4 is formed at a valley portion between the partition walls 27. A pressing portion 21 that applies a pressing force to 11 is formed.

The pressing portion 21 is a downward slope having an upward slope toward the rear of the contact, and when the pressing force is applied to the pressing operation portion 18 of the contact opening / closing member 12, the pressing portion 21 is vertically lowered. Pressing point P _{2 of the} receiving portion 11
Moves from the lower end side (FIG. 3) to the upper end side (FIG. 4) while sliding on the inclined surface forming the pressing portion 21.

More specifically, when a pressing force is applied to the pressure receiving portion 11 as shown in FIGS. 7 and 8, the pressing point P ₂ displaces the bending spring piece 6 against the elasticity, and also the cantilever movement. - backward from displacing the arm upper position past the top dead center of a circle centered on the said contact point P ₁ (pressing start point), a trajectory toward the same side dead center rear I than in the direction of arrow W ₁擺動At the same time, the contact contact piece portion 8 is reliably separated from the terminal member 3. Preferably, the cantilever arm 10 and the contact piece portion 8 are rigid against pressing.

At this time, the pushing point P ₂ is given a pushing force in the vertical direction indicated by the arrow W ₂ , but this pushing force does not act as a force to push down the contact point P ₁ in the vertical direction, but rather the above contact point. the upper end P ₃ of curved upper P ₁ spring piece 6, and the pressing point P ₂ is the rear擺動the arrow W ₁ direction from a configuration in which the pressing point P ₂ respectively disposed on top of the curved spring piece upper P ₃ contacts It effectively contributes as a component force that causes the point P ₁ to oscillate backward while separating the point P ₁ obliquely upward.

In the above embodiment, the pressing portion 21 is formed as an inclined surface to facilitate the backward tilting operation. However, the pressing portion 21 is formed into a substantially horizontal surface so that the pressing force is applied to the pressing receiving portion 11. It is also possible to obtain the above-mentioned backward tilting operation.

Thus, as shown in FIG.
A state in which the IC package 2 is sufficiently separated to a position where it does not interfere with the package 2 is formed, and in the same state, the IC package 2 is mounted in the IC accommodating portion 14 through the IC accommodating window 13 and to the pressing operation portion 18 of the contact opening / closing member 12. When the pressing force of is released,
The opening / closing member 12 rises a certain amount upward by the restoring force of the bending spring piece 6 and the cantilever arm 10 of the contact 4 to form a pressing standby state again, and the contact 4 is restored by the restoring piece. The terminal member 3 (FIG. 5) in which the portion 8 is slid forward and the contact projection 9 is supported by the terminal support seat 16 (FIG. 5),
Alternatively, the upper surface of the tip end portion of the terminal member 3 (FIG. 6) whose lower surface is supported by the contact piece 22 comes into contact with each other with a constant contact pressure from obliquely above the arrow W ₃ . This contact pressure is the sum of the previously stored elastic force and the elastic force generated corresponding to the thickness of the terminal member 3.

As described above, the IC package 2 is sandwiched between the terminal support seat 16 or the contact piece 22 and the contact projection 9 of the contact piece portion 8 and held by the socket body 1.

When the push-down operation portion 18 of the contact opening / closing member 12 is pushed down again from the above contact state, the contact 4 is slid backward as described above, releasing the contact with the IC package 2 and becoming a non-interference state. Attach and detach the IC package 2.

The pressing operation of the contact opening / closing member 12 can be performed by the simplest vertical movement of the robot manipulator.

As shown in FIG. 1, the manipulator comprises a pressing force applying section 23 for the pressing operation section 18 and the pressing force applying section 2.
Each of the IC suction parts 24 is provided in the middle of 3, and while the pressing force applying part 23 pushes down the upper surface of the pressing operation part 18,
The suction part 24 sucks the upper surface of the IC package 2 main body,
The IC mounting portion 14 is mounted or taken out. In other words, as described above, the push-down operation sections 18 are arranged on the left and right sides of the IC mounting section 14 and the IC suction section 24.

Further, the manipulator is provided with positioning pins 25 located on both sides of the front and back of the IC suction portion 24, and a wall defining the IC housing window 13 of the contact opening / closing member 12, for example, the above-mentioned. A positioning hole 26 corresponding to the positioning pin 25 is provided on the wall connecting the push-down operation section 18. I
When the C-package 2 is attached and detached, the positioning pin 25 is aligned in the positioning hole 26 by lowering the manipulator, and the mounting position of the IC package 2 with respect to the socket is set. After that, the contact opening / closing member 23 is lowered by the pressing force applying portion 23 to open the contact opening member 23, and the suction of the IC suction portion 24 is released, whereby the IC package 2 is moved to the IC mounting portion 1.
The contact 4 and the terminal member 3 can be mounted by mounting the contact 4 at a predetermined position.

In the above embodiment, the contacts 4 are arranged side by side on the left and right sides of the IC mounting portion 14 of the socket body 1, but in the present invention, the contacts 4 are arranged side by side and on the four sides in front and back. It is also possible to carry out. In this case, the pressing operation portion 18 of the contact opening / closing member 12 is provided on the left, right, front and back of the IC housing window 13 correspondingly, and the positioning hole 26 is an arbitrary partition wall including the diagonal line of the IC housing window 13. It should be provided at the position.

[0037]

[Effects of the Invention] An IC provided in a robot manipulator
Even if the IC part is automatically sucked by the suction part and mounted on the mounting part of the socket, or even if the robot side accurately controls the position of the IC suction part to the IC mounting position, the terminal member of the IC package If the positioning of the IC package with respect to the IC mounting portion of the socket is not guaranteed due to the fine pitch, the relative displacement between the terminal member and the contact occurs, which makes it difficult to secure a highly reliable contact. However, according to the present invention, when the IC package is sucked by the IC suction portion of the manipulator and mounted on the IC mounting portion of the socket, the positioning pin provided on the manipulator is inserted into the positioning hole provided on the contact opening / closing member. By aligning, the mounting position with respect to the contact opening / closing member and the contact opening / closing member can be assembled vertically movable. The mounting position of the socket main body with respect to the IC mounting portion is properly determined, and then the contact opening / closing member is pushed down by the pressing force applying portion to open the contact, and the IC package is mounted by the IC suction portion. The work of determining the mounting position of the IC package with respect to the IC socket, the work of lowering the contact opening / closing member to the open state, and the work of mounting the IC package,
Automation of a series of operations can be easily achieved with a simple structure.
In addition, the open state of the contact is surely formed, and the relative position between the terminal member and the contact is properly secured to ensure that the IC is
The package can be mounted, highly reliable contact can be secured, and it is possible to effectively deal with the narrowing of the pitch of the terminal members of the IC package.

Further, the pressing pin of the contact opening / closing member is configured by arranging the positioning pin and the pressing force applying portion on the left and right sides or front and rear sides of the IC suction portion in the middle and operating the IC suction portion in the middle thereof. It is possible to provide a contact opening / closing device that can perform each of the above-mentioned works properly and rationally in cooperation with each of the above-mentioned arrangements of the positioning holes, can easily set the relative position between the respective elements, and is advantageous in automation.

[Brief description of drawings]

FIG. 1 is a perspective view of an IC socket showing an embodiment of the present invention.

FIG. 2 is a plan view of the same.

FIG. 3 is a partial sectional view of the same before a pressing operation.

FIG. 4 is a sectional view of the same after a pressing operation.

FIG. 5 is a cross-sectional view showing a contact state with the IC package after the pressing operation is released.

FIG. 6 is a cross-sectional view showing another example of a contact state with an IC package.

FIG. 7 is a side view of the contact.

FIG. 8 is a side view showing a rearward swinging state of the contact.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 IC socket main body 2 IC package 3 Terminal member 4 Contact 5 Male terminal 6 Curved spring piece 7 Fixed end 8 Contact piece part 9 Contact protrusion 10 Cantilever arm 11 Press receiving part 12 Contact opening / closing member 13 Storage window 14 IC mounting part 15 Protrusion 16 Terminal support seat 18 Depressing operation part 19 Engaging finger 20 Guide groove 21 Pressing part 22 Contact piece P ₁ Contact point P ₂ Pressing point 23 Depressing force applying part 24 IC suction part 25 Positioning pin 26 Positioning hole

Claims (2)

[Claims] 1. A socket body having a large number of contacts arranged to come into contact with a terminal member of an IC package, and a contact provided between the terminal member of the IC package and the contact when the socket body is vertically movable and is lowered. In the IC socket, the contact opening / closing member is provided, and the upper surface of the IC package main body is attached to the IC mounting portion of the socket main body by adsorbing the upper surface of the IC package main body to the IC mounting portion of the robot manipulator. Positioning pins are provided on both sides of the IC suction part, and positioning holes for aligning the positioning pins are provided in the contact opening / closing member, and the IC by the IC suction part is provided between the positioning pins. The package is configured to be mounted as described above, and further, the IC package is mounted on the manipulator. Contact switchgear in the IC socket, characterized in that is provided with a depressed depresses force imparting unit of a depression actuation of the contact shutter member Te. 2. The pressing force applying section is arranged on both sides of the IC mounting section, and the IC is provided in the middle of the both pressing force applying sections.
The contact opening / closing device for an IC socket according to claim 1, further comprising a suction portion.