JPH0738363B2 - LC composite parts - Google Patents

Description

TECHNICAL FIELD The present invention relates to an LC composite component such as a filter having conductive patterns formed on both main surfaces of a dielectric layer.

2. Description of the Related Art Conventionally, the filter having the configuration shown in FIG. 7 is known as the filter. That is, a dielectric layer made of a ceramic substrate
Four U-shaped conductive patterns 21, 22, 23, 24 are formed on the right and left sides of the front and back main surfaces 20a, 20b of 20, respectively. The conductive pattern 21 is formed on the left upper surface and the right lower surface. The ground terminals 25 and 26 are connected to the conductive pattern 24 that is formed, and the input terminals are connected to the conductive pattern 23 that is formed on the lower left surface.
An output terminal 28 is connected to the conductive pattern 22 formed on the upper surface on the right side.

The portions 21a and 23a, 21b and 23b of the two conductive patterns 21 and 23 on the left side, which face each other with the dielectric layer 20 in between, are capacitors C11 and C12.
And one of the non-opposing parts 21c and 23c respectively forms the coil L
As shown in the left side of FIG. 8, the two capacitors C11, C12 and the coils L11, L12 form the resonator Q11.
Make up.

Also in the two pattern electrodes 22 and 24 on the right side, the portions 22a and 24a, 22b and 24b facing each other with the dielectric layer 20 in between form capacitors C13 and C14, and the one non-facing portion 22c and 24c respectively. Since the coils L13 and L14 are formed, the two capacitors C13 and C14 and the coils L13 and L14 are formed as shown on the left side of FIG.
And constitute the resonator Q12. Since the portions 21c and 24c forming the coils L11 and L13 are close to each other, inductive coupling occurs between the two, and the two resonators Q11 and Q12 are mainly magnetically coupled as shown by M ( Some capacity coupling). Note that L25 and L26 are the inductances of the ground terminals 25 and 26.

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention However, when two adjacent resonators are coupled in this way, the coils L11 and L13 contributing to magnetic coupling are provided.
There was a limit to the degree of coupling because there was a limit to the approach distance between the corresponding portions 21c and 24c of. Further, since the resonator has a planar structure in which the resonators are arranged in parallel, the size of the filter depends on the number of the resonators arranged in parallel, which makes it difficult to reduce the size.

The present invention has been made to solve such problems,
The degree of freedom can be given to the coupling between the resonators to reduce the size, and
It is an object of the present invention to provide an LC composite part capable of obtaining a high degree of bonding.

Means for Solving the Problems In an LC composite component according to the present invention, two or more resonators each having an LC circuit formed by a conductive pattern formed on both main surfaces of a dielectric layer are stacked, and they are vertically adjacent to each other. Between the resonators, a coupling adjustment electrode layer having an electrode gap portion at the center for allowing the passage of magnetic force lines is interposed in order to adjust the degree of magnetic coupling of the coil elements of both resonators.

Action In the present invention, since the resonators are laminated in the vertical direction,
The distance between the coils facing each other in each resonator is shortened, and the coupling can be strengthened accordingly, and the electrode gap of the coupling adjustment electrode layer interposed between the resonators allows desired coupling depending on the usage and the like. You can get a degree.

Example FIG. 2 is an external perspective view showing a bandpass filter to which the present invention is applied, FIG. 1 is a sectional view taken along the line AA ′ in FIG. 2, and FIG. 3 is an exploded perspective view of the product of the present invention. Is. For example, as shown in FIG. 3, the product of the present invention includes a protective layer 1 having a shield electrode film 2 formed on an upper surface thereof, a sheet layer 3, and a conductive pattern 4 on upper and lower main surfaces 5b and 5a of a dielectric layer 5. , 6 are formed, a sheet layer 8 on which a coupling adjustment electrode layer 9 is formed, a sheet layer 10, and upper and lower main surfaces 12 of a dielectric layer 12.
Resonator 14 in which conductive patterns 11 and 13 are formed on b and 12a
And the sorting layer 15 having the shield electrode film 16 formed on the upper surface.
Then, the protective layer 17 is sequentially laminated on the upper side and integrally fired, so that the structure shown in FIG. 1 is obtained. The second
As shown in the figure, ground terminals 18a, 18b and input / output terminals 19a, 19b are formed at the four corners of the product of the present invention, which is a laminated and rectangular plate.

The two protective layers 1,17 and the four sheet layers 3,8,10,15 are made of a dielectric or an insulator, and the two shield electrode films 2,
16 is made of metal such as copper or aluminum.

In the resonator 7, U-shaped conductive patterns 4 and 6 are formed in opposite directions on the upper and lower main surfaces 5b and 5a of the dielectric layer 5. Each conductive pattern 4,6 is two capacitor electrode patterns 4a, 4
It is composed of b, 6a, 6b and one coil pattern 4c, 6c. Of these, capacitor electrode patterns 4a and 6a, 4b and 6b
Face each other with the dielectric layer 5 in between, and form capacitors C1 and C2 having a capacitance determined by the dielectric constant and thickness of the dielectric layer 5 and the facing area of the capacitor electrodes. On the other hand, the coil patterns 4c and 6c form the coils L1 and L2 in high frequency. 4d is a tongue formed on the conductive pattern 4 for connecting to the output terminal 19b, and 6d is a tongue formed on the conductive pattern 6 for connecting to the ground terminal 18a.

In the above structure, the conductive patterns 4 and 6 facing each other on the front and back surfaces of the dielectric layer 5 have the first capacitor C as shown in FIG.
A resonator Q1 represented by an equivalent circuit in which a capacitor C2 is connected in parallel to an LC series circuit in which coils L1 and L2 are connected to both sides of 1 is configured.

The resonator 14 has a structure in which the resonator 7 is rotated 180 ° in the horizontal direction, and the U-shaped conductive patterns 11 and 13 are arranged in opposite directions on the upper and lower main surfaces 12b and 12a of the dielectric layer 12. Has been formed. Each conductive pattern 11, 13 has two capacitor electrode patterns 11a, 11b, 13a, 13b and one coil pattern 11c, 13
It consists of c and. Of these, the capacitor electrode patterns 11a and 13a, 11b and 13b face each other with the dielectric layer 12 in between, and capacitors C3 and C4 having a capacitance determined by the dielectric constant and thickness of the dielectric layer 12 and the facing area of the capacitor electrodes. Is formed. On the other hand, the coil patterns 11c and 13c form the coils L3 and L4 in high frequency. Note that 11d is a tongue piece formed on the conductive pattern 11 to connect to the input terminal 19a, and 13d is a tongue piece formed on the conductive pattern 13 to connect to the ground terminal 18b.

In the above-mentioned structure, the conductive patterns 11 and 13 facing each other on the front and back surfaces of the dielectric layer 12 have the capacitor C4 in the LC series circuit in which the coils L3 and L4 are connected to both sides of the first capacitor C3 as shown in FIG. Resonator represented by an equivalent circuit connected in parallel
Configure Q2.

Since the resonator 14 has a configuration in which the resonator 7 is horizontally rotated by 180 °, the coil patterns 13c and 11c are also located on the coil patterns 4c and 6c of the resonator 7.

The coupling adjustment electrode layer 9 is for adjusting the degree of coupling between the two resonators 7 and 14 which are disposed above and below the coupling adjustment electrode layer 9.
The coupling adjustment electrode layer 9 is made of a metal having a low magnetic permeability, such as Cu.
Consists of. Therefore, each coil pattern 4c, 13c, 6c, 11
The magnetic force lines generated by c are blocked by the coupling adjustment electrode layer 9. However, in the central portion of the coupling adjustment electrode layer 9, there is formed an electrode void 9a through which the magnetic force lines generated by the coil patterns 4c, 13c, 6c, 11c should pass, and the area or shape of this electrode void 9a By changing the two coil patterns 4c and 13 located above and below, as shown in FIG.
The coupling degree of c, 6c and 11c can be adjusted respectively.
That is, the coupling degree of the two resonators 7 and 14 arranged above and below is adjusted by the coupling adjusting electrode layer 9 according to the intended use. It should be noted that the resonators 7 and 14 are arranged vertically, and the distance between the coils facing each other is shorter than in the case of the conventional parallel arrangement, and the degree of coupling is significantly increased. Therefore,
There is no problem even if the coupling adjustment electrode layer 9 is interposed between the two.

FIG. 4 is an equivalent circuit of a bandpass filter composed of the resonators 7 and 14 coupled in this way. Note that magnetic coupling exists between the coil portions of the resonators 7 and 14 in the diagonally upper and lower directions. By the way, the strength of the magnetic coupling can be changed also by the size of the electrode void 9a. FIG. 6 is a graph showing the frequency characteristics of the filter when the size of the electrode void 9a is changed in two levels.
Shows the case where the electrode void 9a is made large, and shows the case where the electrode is made small.

As understood from this figure, when the electrode void 9a is increased, the center frequency can be lowered, that is, the degree of coupling can be increased. On the contrary, when the electrode void 9a is made small, the center frequency becomes high and the degree of coupling can be made small.

The coupling adjustment electrode layer 9 not only serves to couple the resonators 7 and 14, but also has a shielding effect as with the shield electrode films 2 and 16.

Further, in the above embodiment, the case where two resonators are vertically laminated is shown, but the present invention is also applied to a bandpass filter including three or more resonators laminated vertically. Of course it is possible. Also in this case, the size of the filter is almost the same as that of one resonator.

Furthermore, the present invention is not limited to bandpass filters and can be similarly applied to other LC composite components.

As described above, in the present invention, since the resonators are stacked in the vertical direction, the distance between the opposing coils in both resonators is short, and the degree of magnetic coupling between both resonators can be increased correspondingly,
Between each of the resonators, since a coupling adjustment electrode layer having an electrode void portion that allows the passage of magnetic force lines formed in the center is interposed,
Depending on the size of the electrode voids, the degree of bonding can be easily adjusted according to the application, and there is an effect that an LC composite component having a great utility value can be obtained.

In addition, since the resonators are stacked, there is an effect that the size can be reduced.

[Brief description of drawings]

1 is a sectional view taken along the line AA ′ in FIG. 2, FIG. 2 is an external perspective view showing a bandpass filter to which the present invention is applied,
FIG. 3 is an exploded perspective view thereof, FIG. 4 is an equivalent circuit diagram thereof, FIG. 5 is a schematic view showing a coupled state of the bandpass filter, and FIG. 6 is a size of an electrode void portion provided in a coupling adjustment electrode layer. FIG. 7 is a plan view showing the configuration of a conventional bandpass filter, and FIG. 8 is an equivalent circuit diagram of the bandpass filter. 5,12 …… Dielectric layer, 5a, 5b, 12a, 12b …… Main surface, 4,6,11,
13 ... Conductive pattern, 7, 14 ... Resonator, 9 ... Coupling adjustment electrode layer, 9a ... Electrode void.

Claims (1)

[Claims] 1. A stack of two or more resonators each having an LC circuit formed of a conductive pattern formed on both main surfaces of a dielectric layer, and a coil element of each resonator between upper and lower adjacent resonators. An LC composite component, characterized in that a coupling adjustment electrode layer is formed in the center of which an electrode void is formed to allow passage of magnetic force lines in order to adjust the degree of magnetic coupling.