JPH0738369B2 - Holding plate for chip parts - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a holding plate for chip parts, and is particularly used for handling external parts of chip parts such as microminiature multilayer capacitors and resistors. A holding plate for a chip component.

[Prior art]

An example of a conventional holding plate for a chip component is disclosed, for example, in Japanese Patent Application Laid-Open No. 61-264787, which was published on Nov. 22, 1986. As shown in FIG. 7, the chip component holding plate 1 includes a sheet member 2 made of an elastic material, and the sheet member 2 has a large number of through holes 3 formed therein. A magnetic force attraction plate 4 made of a material capable of attracting magnetic force is integrally formed on one surface of the sheet member 2, and the sheet member 2 is attached to the magnetic force attraction plate 4.
A through hole 5 larger than the through hole 3 is formed at a position corresponding to each through hole 3. The magnetic attraction plate 4 is integrally molded with the sheet member 2 so that the main surface thereof and the main surface of the sheet member 2 are flush with each other.

[Problems to be Solved by the Invention]

In order to apply an external electrode to a chip component using such a holding plate 1, first, as shown in FIG. 8, the chip component 6 is press-fitted into the through hole 3 of the holding plate 1, and then, By the magnetic force of the magnet plate 7,
The magnetic attraction plate 4 is attracted to support the holding plate 1. Since the magnetic attraction plate 4 is attracted by the magnetic force of the magnet plate 7 as described above, it is most desirable that both are in close contact with each other.

However, since the respective principal surfaces are formed flush with each other, when the chip component 6 is press-fitted into the through hole 3 of the sheet member 2, the sheet member 2 is elastically deformed as shown in FIG. The main surface may project slightly. In particular, this phenomenon is remarkable in the high temperature state because the thermal expansion coefficients of the two are different. When the sheet member 2 is thus deformed, the adhesion between the magnet plate 7 and the magnetic attraction plate 4 deteriorates, and the attraction of the magnetic attraction plate 4 becomes unstable. As a result, the external electrode applied There was a problem that the accuracy of was not good.

Therefore, a main object of the present invention is to provide a holding plate for a chip component, which is capable of accurately applying an external electrode.

[Means for Solving the Problems]

The present invention comprises a sheet member made of an elastic material, a large number of through holes formed in the sheet member and capable of elastically holding chip parts, and a material formed on at least one surface of the sheet member and capable of attracting magnetic force. Further, in the holding plate of the chip component, which is provided with a magnetic attraction plate having a through hole larger than the through hole at a position corresponding to each through hole of the sheet member, a part of the magnetic attraction plate in the thickness direction is a sheet. A holding plate for a chip component, characterized in that the magnetic attraction plate and the sheet member are integrally molded so as to be embedded in the member and the main surface of the sheet member is recessed from the main surface of the magnetic attraction plate. .

[Action]

Even if the sheet member is deformed by press-fitting the chip component into the through hole of the sheet member or by thermal expansion of the sheet member, the main surface of the sheet member is already recessed from the main surface of the magnetic attraction plate. The sheet member does not protrude from the main surface of the magnetic attraction plate.

〔The invention's effect〕

According to the present invention, since the sheet member does not protrude from the main surface of the magnetic attraction plate, the magnetic attraction plate and the attraction magnet plate are in complete contact. Therefore, since the magnetic attraction plate can be supported stably and reliably, the handling work such as attaching external electrodes to the chip component, marking, or measuring the characteristics of the chip component is facilitated. Therefore, the accuracy can be expected to improve.

The above-mentioned objects, other objects, features and advantages of the present invention will become more apparent from the following detailed description of the embodiments with reference to the drawings.

〔Example〕

Referring to FIGS. 1, 2, and 3, a holding plate 10 for a chip component includes a sheet member 12 made of an elastic material such as silicon rubber, and a stainless steel (SU).
S430) and a magnetic force attraction plate 14 made of a flexible iron-based alloy capable of attracting magnetic force are included in the laminated integral structure. At this time, the main surface of the sheet member 12 is recessed from the main surface of the magnetic attraction plate 14 by, for example, about 0.1 mm, that is, the main surface of the sheet member 12 and the main surface of the magnetic attraction plate 14 have a step. Is formed in.

A plurality of through holes 16 are formed in each of the vertical direction and the horizontal direction of the sheet member 12. The inner diameter of the through hole 16 is formed to have a square cross section that is substantially the same as or slightly smaller than the outer shape of the chip component (not shown). As described above, the slightly small through holes 16 are formed by pressing (press-fitting) the chip component into the through holes 16.
This is because the chip component is held by the elastic force of.

In the magnetic attraction plate 14, a circular through hole 17 having a larger diameter than the inner diameter of the through hole 16 is provided corresponding to each position of the through holes 16 of the sheet member 12, and the circular through hole 17 is formed. Surrounds the periphery of the rectangular through hole 16. The magnetic attraction plate 14 is used to attract the magnetic attraction plate 14 by a magnetic force of a magnet plate 38 described later to support the holding plate 10.

Positioning holes 18a and 18b may be formed in the vicinity of both ends in the center of the holding plate 10 in the vertical direction (or the horizontal direction).

Next, a method of manufacturing the holding plate 10 will be briefly described with reference to FIG. In the first mold (lower mold) 20,
A recess having a shape corresponding to the planar shape of the holding plate 10 is formed, and the depth of the recess is selected to be substantially equal to the thickness of the holding plate 10. A quadrangular prismatic molding pin 22 for forming each through hole 16 of the sheet member 12 is formed on the bottom surface of the recess.
Are formed upright. Then, a release agent 24 is applied to the bottom surface of the recess of the first mold 20.

On the other hand, circular through holes are provided at positions corresponding to the plurality of through holes 16.
A magnetic attraction plate 14 in which 17 is formed by, for example, plate molding or etching is prepared. This magnetic attraction plate 14 is coated with a primer 26 on its upper surface,
The circular through holes 17 are positioned so as to be inserted into the molding pins 22 and are formed on the bottom surface of the recess (the release agent 24
Contacting) into the first mold 20. Then, liquid silicone rubber which is a material of the sheet member 12 is injected into the first mold 20.

A second mold 28 having a lower surface coated with a release agent 24 is superposed on the upper part of the first mold 20, and the whole is heated to cure the silicone rubber. by this,
As shown in FIGS. 1 to 3, the sheet member 12 made of silicon rubber having the through holes 16 and the magnetic attraction plate 14 are integrally molded.

Next, with reference to FIGS. 5A to 5E, an example of a step of applying external electrodes to a chip component using the holding plate 10 of this embodiment will be described.

First, as shown in FIG. 5A, the holding plate 10 is appropriately positioned with the magnetic attraction plate 14 facing downward, and the transfer plate 30 is placed on the upper surface of the sheet member 12. The transfer plate 30 is a holding plate 10 or a sheet member 12.
Has a funnel-shaped guide hole 32 formed at a position corresponding to the plurality of through holes 16. Then, a large number of chip components 34 such as a multilayer capacitor are supplied to the upper surface of the transfer plate 30, and the holding plate 10 and the transfer plate 30 are shaken left and right and back and forth. At this time, the chip component 34 is fitted into each guide hole 32 and brought to the upper position of each through hole 16.

Subsequently, as shown in FIG. 5B, the press pins 36 are inserted from above the guide holes 32 through the guide holes 32. By inserting the press pin 36, one end portion (the lower end portion in FIG. 5B) of the chip component 34 is press-fitted into the through hole 16 of the sheet member 12, and the chip component 34 has the other end portion from the surface of the sheet member 12. The projecting state is elastically held by the through hole 16, that is, the sheet member 12. At this time, if the insertion process of the press pin 36 is made constant, the length of the other end (the upper end in FIG. 5B) of the chip part 34 protruding from the surface of the sheet member 12 becomes constant.

Subsequently, as shown in FIG. 5C, the holding plate 10 elastically holding the chip components 34 in the plurality of through holes 16 is turned upside down, and the magnetic attraction plate 14 is turned upward. In this state, the attraction plate 14 is attracted by the magnetic force of the magnet plate 38. At this time, since the magnetic attraction plate 14 has flexibility, if the attraction surface of the magnet plate 38 is a flat surface, the holding plate 10 for the chip component does not warp, and thus the sheet The other ends (lower ends in FIG. 5C) of the plurality of chip components 34 projecting downward from the member 12 are flush with each other.

Further, as shown in FIG. 5D, the main surface of the sheet member 12 is recessed from the main surface of the magnetic attraction plate 14, that is, the sheet member 12 and the magnetic attraction plate 14 are formed with a step. Therefore, even if the sheet member 12 is deformed by elastic deformation or thermal expansion, it does not protrude from the main surface of the magnetic attraction plate 14. Therefore, the magnet plate
38 and the magnetic attraction plate 14 are completely pressure-bonded to each other, and the magnetic attraction of the magnetic plate 38 causes the magnetic attraction plate 14 to be stably and reliably attracted to support the holding plate 10.

The magnet plate 38 is supported by the support member 40 in a suspended state. Below the magnet plate 38, a flat plate 42 in which a paste-like conductive paint such as silver that is a material of the external electrode is thinly drawn is placed. Then, the support member 40 is lowered downward, and the tip ends of the plurality of chip components 34 held by the holding plate 10 are pressed against the flat plate 42. Therefore, each chip component
Conductive paint adheres to the other end of 34. Then, the support member 40, that is, the magnet plate 38 is pulled up and heated and dried. As a result, external electrodes are provided to the other end of the held plurality of chip components 34 exposed from the sheet member 12.

Subsequently, as shown in FIG. 5E, another holding plate 10 'having the same structure is prepared with the magnetic attraction plate 14 facing downward. Above the other holding plate 10 ', the holding plate 10 holding the chip component 34 having the external electrode formed at the other end in the previous step is provided via the spacer 44, and the through hole 16 is formed. And 16 'are positioned so as to correspond to each other. After that, the press pins 36 are press-fitted from the upper part thereof, so that the plurality of chip parts 34 are separated from each other by another holding plate 10 '.
Moved to. Therefore, the other end to which the external electrode is provided is inserted into each through hole 16 ′ of the separate holding plate 10 ′, and the one end to which the external electrode is not yet provided is from the surface of the sheet member 12 ′. In the projecting state, the chip component 34 is elastically held by the holding plate 10 '.
This holding plate 10 'is again brought to the step shown in FIG. 5C, and the external electrode is applied to one end of the chip part 34 where the external electrode is not applied. After heating and drying the external electrode at this one end, the chip component 34 is pushed out from the holding plate 10 'by a press pin, and the external electrode of the chip component 34 is subjected to a baking treatment.

The integration of the sheet member 12 and the magnetic attraction plate 14 is not limited to the method of using the mold as in the above-described embodiment, but may be performed by bonding with an adhesive or the like. Further, in the above-described embodiment, the through hole 16 for holding the chip component 34 is described as having a square cross section, but other shapes such as a round shape may be used. Further, the holding of the chip component 34 is not limited to the upright state as in the above-described embodiment, but may be a horizontally laid state.

Further, referring to FIG. 6, a holding plate 50 according to another embodiment of the present invention includes a plate-like magnetic attraction plate 52 which is made of the same material as the previous embodiment but is thick. A plurality of through holes 54 are formed in the magnetic attraction plate 52. In each of the through holes 54, a rubber 58 having a through hole 56 having a size corresponding to the size of the chip component is formed. At this time, a step is formed between the main surface of the rubber 58 and the main surface of the magnetic attraction plate 52 such that the main surface of the rubber 58 is recessed. Even if the rubber 58 having the through holes 56 is individually addressed as in this embodiment, the main surface of the rubber 58 is recessed from the main surface of the magnetic attraction plate 52. Also in the example, the same effect as that of the previous embodiment can be obtained.

In any of the above embodiments, the magnetic attraction plates 14 and 52 may each have a magnetic force, and in this case, the magnet plate 38 is a simple support plate having no magnetic force. It may be.

[Brief description of drawings]

FIG. 1, FIG. 2 and FIG. 3 are illustrative views showing one embodiment of the present invention, and particularly FIG. 1 shows an enlarged sectional view of an essential part,
FIG. 2 shows an enlarged plan view of an essential part, and FIG. 3 shows an overall plan view. FIG. 4 is a sectional view showing a method of manufacturing the holding plate of the embodiment shown in FIGS. FIGS. 5A to 5E are views showing a step of forming external electrodes on a chip component by using the holding plate of this embodiment, and particularly FIG. 5A shows positioning of the chip component on each through hole of the holding plate. Fig. 5B shows a step of press-fitting the positioned chip component into the through hole, Fig. 5C shows a step of magnetically attracting the holding plate to the magnet plate to give external electrodes, and Fig. 5D shows FIG. 5C is an enlarged cross-sectional view of an essential part of FIG. 5C, and FIG. 5E shows a step of transferring the chip component to another holding plate. FIG. 6 is a partially cutaway schematic view showing another embodiment of the present invention. FIG. 7 is an enlarged cross-sectional view of a main part showing a conventional technique. FIG. 8 is an enlarged sectional view of an essential part showing a state in which a holding plate is magnetically attracted to a magnet plate in the prior art. FIG. 9 is an enlarged sectional view of an essential part showing a state of a conventional sheet member. In the figure, 10 is a holding plate, 12 is a sheet member, and 14, 5
2 is a magnetic attraction plate, 16, 17, 54 and 55 are through holes, 34 is a chip component, and 58 is rubber.

Claims (1)

[Claims] 1. A sheet member made of an elastic material, a plurality of through-holes formed in the sheet member and capable of elastically holding a chip component, and a magnetic force formed on at least one surface of the sheet member. A holding plate for a chip component, comprising a magnetic attraction plate in which a through hole larger than the through hole is formed at a position corresponding to each through hole of the sheet member, in the thickness direction of the magnetic attraction plate. A part of is embedded in the sheet member, and the magnetic attraction plate and the sheet member are integrally molded so that the main surface of the sheet member is recessed from the main surface of the magnetic attraction plate. A holding plate for chip parts.