JPH0739146B2 - Resin molding material - Google Patents
Resin molding materialInfo
- Publication number
- JPH0739146B2 JPH0739146B2 JP63044947A JP4494788A JPH0739146B2 JP H0739146 B2 JPH0739146 B2 JP H0739146B2 JP 63044947 A JP63044947 A JP 63044947A JP 4494788 A JP4494788 A JP 4494788A JP H0739146 B2 JPH0739146 B2 JP H0739146B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- molding material
- thermal expansion
- inorganic filler
- carbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、エポキシ樹脂、ポリエステル樹脂、フエノー
ル樹脂、ジアリルフタレート樹脂で代表される熱硬化性
樹脂や、ポリフエニレンサルフアイド（PPS）、液晶（L
iquid Crystal）ポリエステル（LCP）、ポリエーテルイ
ミド（PEI）、ポリエーテルサルフオン（PES）で代表さ
れる熱可塑性樹脂のもつ優れた機械的性質、電気的性
質、寸法安定性、耐熱性、耐薬品性などの諸性質を活か
してなる複合成形材料とガラスや金属などでつくられた
光学部品、電子・電気部品、センサー部品等とを接合ま
たは組み立てた部品がどのような温・湿度環境下でも略
同一寸法で追従させることができるような精密成形用樹
脂成形材料に関する。DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention is a thermosetting resin represented by epoxy resin, polyester resin, phenol resin, diallyl phthalate resin, polyphenylene sulfide (PPS), liquid crystal. (L
iquid Crystal) Excellent mechanical properties, electrical properties, dimensional stability, heat resistance, and chemical resistance of thermoplastic resins represented by polyester (LCP), polyetherimide (PEI), and polyether sulfone (PES) The composite molding material that takes advantage of various properties such as properties and optical parts made of glass, metal, etc., electronic / electrical parts, sensor parts, etc. are joined or assembled under almost any temperature and humidity environment. The present invention relates to a resin molding material for precision molding that can be made to follow the same dimension.
〈従来の技術〉 従来この種の低熱膨張性樹脂成形材料としては、実用に
供されているものに （１）熱膨張係数が比較的小さいエポキシ樹脂に熔融シ
リカを高充填することにより、熱膨張係数を小さくして
いる半導体封止用成形材料 （２）熱膨張係数が小さい液晶（Liquid Crystal）ポリ
エステル（LCP）やポリフエニレンサルフアイド（PPS）
などにガラス繊維を高充填させることにより熱膨張係数
を小さくしている成形材料 があったが上記以外のプラスチツクでは殆ど見あたら
ず、 （３）他の物質ではセラミツクぐらいのものであった。<Prior Art> Conventionally, this type of low thermal expansion resin molding material has been practically used. (1) Thermal expansion of epoxy resin having a relatively small thermal expansion coefficient by high loading of fused silica Molding material for semiconductor encapsulation with small coefficient (2) Liquid crystal (Liquid Crystal) polyester (LCP) and polyphenylene sulfide (PPS) with small coefficient of thermal expansion
There was a molding material in which the thermal expansion coefficient was made small by filling glass fiber with a high degree, but it was hardly found in plastics other than the above, and (3) other materials were about ceramic.
〈発明が解決しようとする課題〉 然しながら、上記従来の各成形材料による場合は、それ
らによる成形品において、各々次のような問題点を有し
ていた。<Problems to be Solved by the Invention> However, in the case of using the conventional molding materials described above, the molded products made from them each have the following problems.
即ち、（１）の成形材料による場合は、限られた用途で
しか使用できず、熱膨張係数は1.5×10-5／℃程度まで
であった。また、複雑な形状の成形品などの成形には不
向きである。That is, in the case of using the molding material of (1), it can be used only in limited applications, and the thermal expansion coefficient was up to about 1.5 × 10 −5 / ° C. Further, it is not suitable for molding a molded product having a complicated shape.
（２）のガラス繊維高充填のものでは、流動方向と直角
方向とに方向差があり、高温環境下ではネジレや歪の原
因になるという問題がある。The highly filled glass fiber of (2) has a difference in direction between the flow direction and the perpendicular direction, which causes a problem of twisting and distortion in a high temperature environment.
（３）のセラミツクでは製造工程が複雑で量産性に欠け
製造原価も高い上に完成品の寸法変化が大きく精密加工
には不向きである。In the ceramic of (3), the manufacturing process is complicated, mass productivity is low, the manufacturing cost is high, the dimensional change of the finished product is large, and it is not suitable for precision machining.
近年、電子産業やオートメーシヨン機器分野、光関係技
術分野等で金属の代替えやガラスとの接合を行う各種デ
バイス、精密部品などに、温度差からくる歪や内部応力
の発生をなくすために低熱膨張性を有することや、寸法
精度、寸法安定性、曲げ強度、曲げ弾性率、熱安定性な
どの高い要求度の成形品が必要とされ、現在のところ樹
脂成形品ではそれだけの用途範囲を満足させることがで
きるものが見当たらない。In recent years, in the electronics industry, automation equipment field, optical technology field, etc., low thermal expansion to eliminate the generation of strain and internal stress caused by temperature difference in various devices and precision parts that substitute for metals and join with glass Is required, and molded products with high demands for dimensional accuracy, dimensional stability, bending strength, bending elastic modulus, thermal stability, etc. are currently required, and resin molded products currently satisfy the application range. I can't find anything I can do.
そこで本発明は、これらの用途範囲を満足させることが
できる成形材料を得ることを目的とし、その基本的な技
術思想は、合成樹脂との混合材料として熱膨張係数が負
若しくは著しく小さい熱膨張係数を有する無機充填剤や
無機系の炭素材料の混合物を成形品に高充填させること
によって性能の向上を図ろうとするものであって、これ
らの無機充填剤の熱膨張係数の作用で、熱膨張係数の可
及的に小さい樹脂成形材料を得ようとするものである。Therefore, the present invention aims to obtain a molding material capable of satisfying these application ranges, and its basic technical idea is to obtain a material having a negative or extremely small thermal expansion coefficient as a mixed material with a synthetic resin. It is intended to improve the performance by highly filling a molded product with a mixture of an inorganic filler and an inorganic carbon material having a coefficient of thermal expansion of the inorganic filler. The present invention aims to obtain a resin molding material that is as small as possible.
この目的を達成するための本発明に係る樹脂成形材料
は、合成樹脂に混合する無機充填剤を熱膨張係数が４×
10-6／℃以下のものとし、好ましくは負の熱膨張係数を
持ったものが用いられる。The resin molding material according to the present invention for achieving this object has an inorganic filler mixed with a synthetic resin with a thermal expansion coefficient of 4 ×.
It is preferably 10 −6 / ° C. or less, and preferably has a negative coefficient of thermal expansion.
また、この無機充填剤の熱膨張係数の温度範囲としては
常温から400℃程度の範囲での熱膨張係数で選定し、特
に常温から200℃の範囲での熱膨張係数が著しく小さい
もの若しくは負のものが好ましい。As the temperature range of the coefficient of thermal expansion of this inorganic filler, the coefficient of thermal expansion in the range of room temperature to about 400 ° C is selected. Particularly, the coefficient of thermal expansion in the range of room temperature to 200 ° C is extremely small or negative. Those are preferable.
〈課題を解決するための手段〉 上記の如くした本発明に係る樹脂成形材料の基本的な技
術思想は、熱可塑性、熱硬化性、両樹脂を対象とし、そ
の混合材としての無機充填剤の熱膨張係数を４×10-6／
℃以下という著しく小さいものまたは熱膨張係数が負の
ものを用い、かつ樹脂に対する充填量を高密度にするこ
とにより、樹脂複合材料の熱膨張係数を1.4×10-5／℃
以下好ましくは1.0×10-5／℃以下という可及的に小さ
い値のものとすることができるようにしたものである。<Means for Solving the Problem> The basic technical idea of the resin molding material according to the present invention as described above is thermoplastic, thermosetting, both resins, and the inorganic filler as a mixture thereof The coefficient of thermal expansion is 4 × 10 -6 /
The thermal expansion coefficient of the resin composite material is 1.4 × 10 -5 / ° C.
It is preferable that the value be as small as possible, preferably 1.0 × 10 −5 / ° C. or less.
また、配合する無機充填剤として炭素繊維を併用するこ
とにより、曲げ強度、曲げ弾性率などの機械的特性の優
れたものが得られる他に、球状の炭素または球状の黒鉛
又は球状のアモルフアスカーボンと併用することにより
摺動的に優れた熱膨張係数の小さい樹脂成形用材料が得
られる。In addition, by using carbon fiber as an inorganic filler to be blended, in addition to those having excellent mechanical properties such as flexural strength and flexural modulus, spherical carbon or spherical graphite or spherical amorphous carbon can be obtained. When used together with, a resin molding material having a small coefficient of thermal expansion, which is slidingly excellent, can be obtained.
〈作用〉 以下これらの各点に関して本発明者らが研究し開発した
事項について詳細に説明する。<Operation> The matters studied and developed by the present inventors with respect to each of these points will be described in detail below.
即ち、熱膨張係数が負若しくは著しく小さい熱膨張係数
を有する無機充填剤を考えた場合、固体の結晶構造と熱
膨張の関係は、共有結合の結晶が最も小さくなり、次に
イオン結合、金属結合、分子結合の順に大きくなる。ま
た、共有結合を持つ化合物の中でも、その共有結合性が
強くなるに従い熱膨張係数が小さくなる。That is, when considering an inorganic filler having a negative or remarkably small thermal expansion coefficient, the relationship between the solid crystal structure and the thermal expansion is that the covalent bond crystal is the smallest, followed by the ionic bond and the metal bond. , Molecular bond becomes larger in order. Further, among compounds having a covalent bond, the coefficient of thermal expansion becomes smaller as the covalent bond becomes stronger.
例 CaO＞MgO＞Y2O3＞Al2O3＞BeO＞ZrO2＞SiO2 この性質に注目し、高温型石英のようにSiO2四面体が三
次元フレームワークを作るものを採用した。これらは請
求の範囲に示す物質のように、線膨張率の異方性は大き
いが、ボリュームとしては、負又は熱膨張係数の特に小
さいものである。これらの物質としては、コーデイエラ
イト、キータイト、高温型スポジュメント、高温型ユー
クリプタイト、リユーサイト、ムライトである。これら
が温度上昇下においても負の熱膨張係数を有すると考え
られる。Example CaO>MgO> Y 2 O 3 > Al 2 O 3>BeO> ZrO 2> SiO 2 focuses on this property, SiO 2 tetrahedra as high quartz has adopted what make a three-dimensional framework. These substances have large anisotropy of linear expansion coefficient like the substances shown in the claims, but have a negative volume or a particularly small coefficient of thermal expansion as a volume. Examples of these substances are cordierite, keatite, high temperature type spodium, high temperature type eucryptite, rheusite and mullite. It is considered that these have a negative coefficient of thermal expansion even when the temperature rises.
このような結晶格子をもち、その温度範囲が常温から40
0℃のものであれば充填剤としは使用できるが、好まし
くはモース硬度が２〜７のものがよい。It has such a crystal lattice and its temperature range is from room temperature to 40
If it is 0 ° C., it can be used as a filler, but it is preferably one having a Mohs hardness of 2 to 7.
これらの炭素系以外の無機充填剤としては平均粒径が30
μｍ以下のものが最も効果的である。つまり、平均粒径
が30μｍ以上のものを用いると流動性の低下をもたら
し、なおかつ、細密充填ができにくくなるためめ低熱膨
張係数のものが得にくくなる。These inorganic fillers other than carbon have an average particle size of 30.
Those having a thickness of μm or less are most effective. That is, when the average particle diameter is 30 μm or more, the fluidity is lowered, and since it is difficult to perform the close packing, it is difficult to obtain a material having a low thermal expansion coefficient.
炭素系を含む無機充填剤と樹脂との比率は重量百分率で
成形材料全体に占める全充填剤の合計が50パーセント乃
至85パーセントの範囲内の割合で配合される。配合比が
50パーセント未満では成形後の熱膨張係数が小さくなら
ず、また85パーセント以上では材料に適度な流動性と結
合性を与えることができないからである。The ratio of the inorganic filler containing a carbonaceous material to the resin is such that the total amount of all the fillers in the entire molding material is 50% to 85% by weight. Compounding ratio
This is because if it is less than 50%, the thermal expansion coefficient after molding does not become small, and if it is 85% or more, the material cannot be provided with appropriate fluidity and bondability.
即ち、成形材料の流動性と結合性とが保たれる範囲でで
きるだけ充填剤の配合量を多くすることが好ましい。That is, it is preferable to increase the compounding amount of the filler as much as possible within the range where the fluidity and the binding property of the molding material are maintained.
〈発明の効果〉 以上詳述したように本発明は熱硬化性樹脂、熱可塑性樹
脂全般についていえ、これらの樹脂材料への混合材料と
しては、負若しくは著しく小さい熱膨張係数を持つ無機
充填剤を選定し、かつ、その平均粒径を特定し、また必
要によってはこれらの無機充填剤への混合材として無機
系の炭素材料、無機系の粘土類、石英や熔融シリカなど
の１種乃至数種を併用することにより、成形品の熱膨張
係数が1.4×10-5／℃以下殊に1.0×10-5／℃以下となる
ように調整してあるものである。<Effects of the Invention> As described in detail above, the present invention can be applied to thermosetting resins and thermoplastic resins in general. As a mixed material for these resin materials, an inorganic filler having a negative or remarkably small thermal expansion coefficient is used. One or several kinds of inorganic carbon materials, inorganic clays, quartz, fused silica, etc., which have been selected and whose average particle size has been specified and, if necessary, as a mixture with these inorganic fillers When used together, the thermal expansion coefficient of the molded product is adjusted to 1.4 × 10 −5 / ° C. or less, particularly 1.0 × 10 −5 / ° C. or less.
従来より、精密部品に使用されるアルミニウムの熱膨張
係数は2.1〜2.4×10-5／℃、またステンレスや鉄で1.1
〜1.3×10-5／℃であるので、本発明によって得られる
成形材料で成形した成形品でステンレスや鉄と同値の熱
膨張係数をもつものや、更に成形品の方が熱膨張係数を
小さいものとすることができる。Conventionally, the thermal expansion coefficient of aluminum used for precision parts is 2.1 to 2.4 × 10 -5 / ° C, and 1.1 for stainless steel and iron.
Since it is up to 1.3 x 10 -5 / ° C, the molded product molded with the molding material of the present invention has the same coefficient of thermal expansion as stainless steel or iron, or the molded product has a smaller thermal expansion coefficient. Can be one.
また、光学系によく用いられるガラスのBK7では、熱膨
張係数が0.7〜0.8×10-5／℃であるので、これらガラス
と同等の熱膨張係数の成形品も本発明にいう成形材料と
して調整可能である。In addition, since BK7, which is a glass often used for optical systems, has a coefficient of thermal expansion of 0.7 to 0.8 × 10 −5 / ° C., molded products having a coefficient of thermal expansion equivalent to those of glass are also prepared as the molding material in the present invention. It is possible.
従って、光学系のレンズとの接合部において、レンズ及
び接合部に全く歪を与えないホルダーが得られると共
に、高温環境下または長期使用による寸法的変化や歪も
殆ど起こさない成形品が得られる。Therefore, in the joint portion of the optical system with the lens, a holder that does not give distortion to the lens and the joint portion at all can be obtained, and a molded product that hardly causes dimensional change or distortion due to high temperature environment or long-term use can be obtained.
また、摺動特性の良い球状の炭素または球状の黒鉛また
は球状アモルフアスカーボンを併用した成形品ではロー
ラー、ベアリングなどの高摺動部品を熱膨張係数を利用
してステンレスなどと一体成形による製作が可能で、成
形品の設計変更による一体化により摺動部品点数の削減
とそれによるコストの大幅な低減が期待できる。In addition, in the case of molded products that use spherical carbon, spherical graphite, or spherical amorphous carbon with good sliding characteristics, high sliding parts such as rollers and bearings can be integrally molded with stainless steel using the thermal expansion coefficient. It is possible, and it can be expected that the number of sliding parts will be reduced and the cost will be greatly reduced by the integration by changing the design of the molded product.
上記の如く多くの性能を有した成形品は機械部品として
も有望であり広い分野での適応が期待できる。Molded products having many properties as described above are promising as machine parts and can be expected to be applied in a wide range of fields.
〈実施例〉 以下本発明の実施例を詳述する。<Examples> Examples of the present invention will be described in detail below.
これらの実施例中には、次の材料、即ち、キータイト
（SiO2）、カオリン（Al4（OH）8Si4O10）、β−スポジ
ュメント（LiAl（SiO3）2）、クレー（粘土鉱物の英語
名）、リューサイト（RbAl（SiO2）2）、ペターライト
（LiSi4AlO10）等の何れかまたは複数種を使用してい
る。In these examples, the following materials were used: keatite (SiO 2 ), kaolin (Al 4 (OH) 8 Si 4 O 10 ), β-sporement (LiAl (SiO 3 ) 2 ), clay (clay minerals). , English name), leucite (RbAl (SiO 2 ) 2 ), peterlite (LiSi 4 AlO 10 ), etc., or a plurality of them are used.
実施例１ 上記の各材料を略均一に混練、粉砕したものを射出成形
機によって射出圧力1500kg/cm2、金型温度180℃で成形
して成形品サンプルを得た。Example 1 Each of the above materials was kneaded and pulverized substantially uniformly, and the product was molded by an injection molding machine at an injection pressure of 1500 kg / cm 2 and a mold temperature of 180 ° C. to obtain a molded product sample.
実施例２ 上記の各材料を略均一に混練、粉砕したものを射出成形
機によって射出圧力1500kg/cm2、金型温度180℃で成形
して成形品サンプルを得た。Example 2 Each of the above materials was kneaded and pulverized substantially uniformly, and the product was molded by an injection molding machine at an injection pressure of 1500 kg / cm 2 and a mold temperature of 180 ° C. to obtain a molded product sample.
実施例３ 上記の各材料を300℃に加熱混練してペレツト化した成
形材料を射出成形機によって射出圧力1500kg/cm2、シリ
ンダー温度320℃、金型温度160℃で成形して成形品サン
プルを得た。Example 3 Each of the above materials was kneaded by heating at 300 ° C. and pelletized, and the molding material was molded by an injection molding machine at an injection pressure of 1500 kg / cm 2 , a cylinder temperature of 320 ° C., and a mold temperature of 160 ° C. to obtain a molded product sample.
実施例４ 上記の各材料を300℃に加熱混練してペレツト化した成
形材料を射出成形機によって射出圧力1500kg/cm2、シリ
ンダー温度320℃、金型温度160℃で成形して成形品サン
プルを得た。Example 4 Each of the above materials was kneaded by heating at 300 ° C. and pelletized, and the molding material was molded by an injection molding machine at an injection pressure of 1500 kg / cm 2 , a cylinder temperature of 320 ° C., and a mold temperature of 160 ° C. to obtain a molded product sample.
次に本発明の上記各実施例と比較すべき従来例を詳述す
る。Next, a conventional example to be compared with each of the embodiments of the present invention will be described in detail.
従来例１ 上記の各材料を300℃に加熱混練してペレツト化した成
形材料を射出成形機によって射出圧力1500kg/cm2、シリ
ンダー温度320℃、金型温度160℃で成形して成形品サン
プルを得た。Conventional example 1 Each of the above materials was kneaded by heating at 300 ° C. and pelletized, and the molding material was molded by an injection molding machine at an injection pressure of 1500 kg / cm 2 , a cylinder temperature of 320 ° C., and a mold temperature of 160 ° C. to obtain a molded product sample.
従来例２ 以上に掲げた本発明の実施例１乃至４及び従来例１及び
２は熱膨張係数測定用の成形品サンプルでJISK6911の熱
膨張係数測定寸法に基づいて測定した。Conventional example 2 The above-described Examples 1 to 4 of the present invention and Conventional Examples 1 and 2 are samples of molded articles for measuring the coefficient of thermal expansion, which were measured based on the dimensions for measuring the coefficient of thermal expansion of JIS K6911.
上記の成形品サンプルの比較評価から明白なように本発
明の実施例品は熱膨張係数が従来のものに比べ優れてい
ることと、流動方向、直角方向の差も著しく小さい。 As is apparent from the comparative evaluation of the above-mentioned molded product samples, the products of the examples of the present invention have a thermal expansion coefficient superior to that of the conventional products, and the difference between the flow direction and the right-angled direction is significantly small.
また、熱変形温度、曲げ弾性率、曲げ強度及び摺動特性
なども優れた樹脂成形材料であり、いろいろな方面での
応用が期待できる。Further, it is a resin molding material having excellent heat deformation temperature, flexural modulus, flexural strength and sliding characteristics, and can be expected to be applied in various fields.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 安達 稔 大阪府大阪市西区立売掘１丁目14番20号 アニツクスビル10階 安達新産業株式会社 内 (72)発明者 木澤 隆 大阪府大阪市西区立売掘１丁目14番20号 アニツクスビル10階 安達新産業株式会社 内 (72)発明者 稲田 盛一 大阪府大阪市西区立売掘１丁目14番20号 アニツクスビル10階 安達新産業株式会社 内 (56)参考文献 特開 昭61−228026（ＪＰ，Ａ) 特開 平１−217072（ＪＰ，Ａ) 特開 平１−163221（ＪＰ，Ａ) 特開 昭63−142033（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Minoru Adachi, Minoru Adachi 1-14-20, Sales dig, Nishi-ku, Osaka-shi, Osaka Prefecture Anitsukusu Building 10th floor Adachi Shin Sangyo Co., Ltd. (72) Takashi Kizawa, Nishi-ku, Osaka-shi, Osaka 1-14-20 Anitsukusu Building 10th floor, Adachi Shinsangyo Co., Ltd. (72) Inventor Soriichi Inada 1-14-20 Anitsukusui 10th floor, Adachi Shinsangyo Co., Ltd. (56) References JP-A-61-228026 (JP, A) JP-A 1-217072 (JP, A) JP-A 1-163221 (JP, A) JP-A 63-142033 (JP, A)
Claims (4)
なる樹脂成形用材料であって、無機充填剤がケイ酸塩化
合物で、β−ユークリプタイト、リユーサイト、キータ
イト、コーデイエライト、ムライト、β−スポジユーメ
ントから選ばれた単一または複数種の30μｍ以下の微粉
粒であって、かつ、該無機充填剤中に熱膨張係数が４×
10-6／℃以下または負の熱膨張係数を有する単一または
複数種のカーボンフアイバー、カーボンビーズ、グラフ
アイトの何れかからなる炭素系無機充填剤が前記の無機
充填剤と合わせた総量に対し重量比で20パーセント以上
配合されていて、この無機充填剤の成形材料全体に占め
る割合が重量比50パーセント以上85パーセント以下の割
合で配合され、配合された後の成形用材料の熱膨張係数
が1.4×10-5／℃以下の成形品を成形することができる
組成とされている樹脂成形用材料。1. A resin molding material comprising an inorganic filler and a synthetic resin as main materials, wherein the inorganic filler is a silicate compound, and β-eucryptite, rheusite, keatite, cordierite, Single or plural kinds of fine powder particles having a particle size of 30 μm or less selected from mullite and β-spodium and having a thermal expansion coefficient of 4 × in the inorganic filler.
Based on the total amount of the carbon-based inorganic filler consisting of one or more kinds of carbon fibers, carbon beads, or graphite having a thermal expansion coefficient of 10 -6 / ° C or less or a negative thermal expansion coefficient combined with the above-mentioned inorganic filler. 20% or more by weight, and the proportion of the inorganic filler in the entire molding material is 50% or more and 85% or less by weight, and the coefficient of thermal expansion of the molding material after being mixed is A resin molding material whose composition is such that a molded product of 1.4 × 10 -5 / ° C or less can be molded.
脂、フエノール樹脂、ジアリルフタレート樹脂、シリコ
ン樹脂の何れかまたはこれらの混合物である請求項記
載の樹脂成形用材料。2. The resin molding material according to claim 1, wherein the resin is any one of an epoxy resin, a polyester resin, a phenol resin, a diallyl phthalate resin, a silicone resin, or a mixture thereof.
（PPS）、液晶（Liquid Crystal）ポリエステル（LC
P）、ポリエーテルイミド（PEI）、ポリエーテルサルフ
オン（PES）の何れかまたはこれらの混合物である請求
項記載の樹脂成形用材料。3. The resin is polyphenylene sulfide (PPS), liquid crystal (Liquid Crystal) polyester (LC
The resin molding material according to claim 1, which is any one of P), polyetherimide (PEI), and polyether sulfone (PES), or a mixture thereof.
状の黒鉛、球状のアモルフアスカーボンの何れかである
請求項記載の樹脂成形用材料。4. The resin molding material according to claim 4, wherein the carbon-based inorganic filler is any of spherical carbon, spherical graphite, and spherical amorphous carbon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63044947A JPH0739146B2 (en) | 1988-02-26 | 1988-02-26 | Resin molding material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63044947A JPH0739146B2 (en) | 1988-02-26 | 1988-02-26 | Resin molding material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01216823A JPH01216823A (en) | 1989-08-30 |
| JPH0739146B2 true JPH0739146B2 (en) | 1995-05-01 |
Family
ID=12705678
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63044947A Expired - Lifetime JPH0739146B2 (en) | 1988-02-26 | 1988-02-26 | Resin molding material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0739146B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002127018A (en) * | 2000-10-25 | 2002-05-08 | Mitsubishi Materials Corp | Resin bond whetstone |
| JP2006043884A (en) * | 1999-08-17 | 2006-02-16 | Mitsubishi Materials Corp | Resin bond grinding wheel |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105273379B (en) * | 2015-11-30 | 2017-02-01 | 扬州大学 | Preparation method of polylactic acid nano composite material |
| JP6703117B2 (en) * | 2016-01-05 | 2020-06-03 | トヨタ モーター ヨーロッパ | Carbon fiber reinforced plastic material with high smoothness |
| JPWO2018180185A1 (en) * | 2017-03-28 | 2020-02-06 | 日本電産株式会社 | Resin gear and gear mechanism |
| CN110418911A (en) * | 2017-03-28 | 2019-11-05 | 日本电产株式会社 | Plastic gear and gear mechanism |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH064703B2 (en) * | 1985-04-01 | 1994-01-19 | 大阪瓦斯株式会社 | Carbon fiber reinforced colored resin composition |
| JPS63142033A (en) * | 1986-12-05 | 1988-06-14 | Mitsubishi Mining & Cement Co Ltd | Magnesia whisker reinforced thermoplastic resin |
| JPH01163221A (en) * | 1987-12-18 | 1989-06-27 | Yahashi Kogyo Kk | Molded body of thermoplastic synthetic resin composition |
| JPH0751646B2 (en) * | 1988-02-25 | 1995-06-05 | 松下電器産業株式会社 | Whisker reinforced plastics |
-
1988
- 1988-02-26 JP JP63044947A patent/JPH0739146B2/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006043884A (en) * | 1999-08-17 | 2006-02-16 | Mitsubishi Materials Corp | Resin bond grinding wheel |
| JP2002127018A (en) * | 2000-10-25 | 2002-05-08 | Mitsubishi Materials Corp | Resin bond whetstone |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01216823A (en) | 1989-08-30 |
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