JPH0746719B2 - Contact image sensor - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a structure of a contact image sensor.

SUMMARY OF THE INVENTION According to the present invention, in a contact image sensor in which a plurality of image sensor chips are mounted on a substrate, the input / output terminals are concentrated in one place, and at least one of the input / output terminals is input / output terminal. Is used as a common input / output terminal for at least two image sensor chips, thereby reducing the number of input / output terminals and facilitating connection with peripheral circuits.

[Conventional technology]

A conventional contact image sensor is disclosed in, for example, Japanese Patent Laid-Open No. 59-86.
The 362 is shown in FIGS. The sensor chips are mounted in a staggered pattern, and the number of input terminals is considerably large. Further, the mounting board is also complicated to require a multilayer wiring board.

[Problems and Objectives to be Solved by the Invention]

The conventional technology has a problem that a multilayer wiring board is used to connect a large number of sensor chips, and the number of input terminals is increased, resulting in a significant increase in mounting cost. Therefore, the present invention solves such a problem, and an object thereof is to concentrate the input / output terminals at one place and reduce the number of the input / output terminals to facilitate the connection with the peripheral circuit. , Providing a mounting method that reduces the mounting cost.

[Means for solving problems]

The contact image sensor of the present invention is a contact image sensor configured by mounting a plurality of image sensor chips on a substrate, and is connected to at least two image sensor chips of the plurality of image sensor chips. I / O terminals are arranged in one place and
It is characterized in that at least one of the input / output terminals arranged centrally in one place is a common input / output terminal for the at least two image sensor chips.

Preferably, as a first method, terminals provided in the vicinity of both ends in the long axis direction of an image sensor chip group composed of at least two image sensor chips are arranged in one place via a wiring pattern of a substrate. In addition to the input / output terminals, in the clock wiring, the dummy wiring for the positive phase clock is connected from one end in the long axis direction of the image sensor chip group, and the dummy wiring for the negative phase clock is connected from the other end. The image sensor chip group is provided so as to extend to the vicinity of the center on the substrate.

Further, preferably, as a second method, terminals provided around the connection ends of adjacent image sensor chips of at least two image sensor chips are connected to each other via a wiring pattern of the substrate.

As the third method, the first method and the second method are used together.

[Operation] In the present invention, since the input / output terminals connected to at least two image sensor chips are arranged at one location in a concentrated manner, connection with peripheral circuits is facilitated. Further, since at least one input / output terminal among the input / output terminals centrally arranged in this way is used as a common input / output terminal for at least two image sensor chips,
The number of input / output terminals is reduced. As a result, the size of the board can be reduced, and connection with peripheral circuits is further facilitated.

According to the first method of the above configuration of the present invention, wiring is performed from both ends in the major axis direction of the image sensor chip group, so that the width of the image sensor chip in the minor axis direction can be shortened. The provision of the clock dummy wiring does not reduce the dynamic range of the contact image sensor.

According to the second method, since the adjacent image sensor chips are wired together, the wiring area on the substrate can be reduced and the substrate can be made smaller.

According to the third method, wiring is performed from both ends of the image sensor chip group in the long axis direction and from adjacent image sensor chips, so that wiring resistance is reduced, and a larger number of image sensor chips can be mounted.

〔Example〕

1, 2, and 5 are mounting plan views of the contact image sensor of the present invention. 3 and 4 are plan views of the image sensor chip used in the contact image sensor of the present invention. In this embodiment, first, the image sensor chip will be described, and then mounting of the contact image sensor will be described.

In FIGS. 3 and 4, 102 and 104 are image sensor chips, and 10
6 is a pad, 107 is a photosensor array, 108 is a scanning circuit, and 109 is an auxiliary cutting line. In this embodiment, a MOS type image sensor chip will be described as an example. 106D is a video output terminal, which is used for connecting a video signal when the image sensor chip is cut along the auxiliary cutting line 109 and the image sensor chips are connected to each other. 106F is a video output terminal and is used when the auxiliary cutting line 109 is not cut.

106E is a start pulse or end pulse terminal.
106G is an auxiliary pad used when the image sensor chip is cut along the auxiliary cutting line. Image sensor chip 10
The difference between 2 and 104 is whether or not the auxiliary pad 106G is provided. More specifically, the image sensor chip 104 having the auxiliary pad 106G has a larger chip width. The photo sensor array 107 is arranged near the auxiliary cutting line 109, and is cut along the auxiliary cutting line 109 so that the image sensor chips can be connected to each other. The scanning circuit 108 is shorter than the photosensor array 107 because the pad 106E and the like are arranged.

In FIG. 1, 1 to 9 are input terminals, 101 is a substrate, and 102A and 10A.
2B is an image sensor chip, and 103A and 103B are clock wirings. The substrate 101 is a transparent substrate such as glass on which a wiring pattern 103 is formed by thick film printing. Image sensor chips 102A and 102B are image sensor chips 1
The auxiliary cutting lines 109 on the left and right of 02 are used to cut only one side. The image sensor chips 102A and 102B are the substrate 101.
, And electrically connected by a bonding wire 105. Input terminals 1 and 9 are shielded, 103C is shielded wiring,
Input terminal 2 is start pulse, 103E is start pulse wiring, input terminal 3 is positive phase clock wiring, 103A is positive phase clock wiring, input terminal 4 is negative phase clock wiring, 103B is negative phase clock wiring, input terminals 5, 6, 7 Is an electrode, and the input terminal 8 is a video output. A problem with the mounting method as shown in FIG. 1 is a clock jump into the video output wiring on the image sensor chip.

Therefore, in this embodiment, as shown in FIG. 1, on the image sensor chip 102A side, from the side closer to the image sensor chip, the reverse phase, the normal phase, and the reverse phase, and the image sensor chip 102B.
On the side, the positive wiring, the negative wiring, and the positive wiring and the clock wirings 103A and 103B are wired to balance the jump of the positive and negative phases of the clock to the video output wiring. Since the wiring pattern can be configured in a plane, a single layer wiring is sufficient. Input terminals are concentrated in one place. Since the auxiliary pad 106G is unnecessary, the width of the image sensor chip is small.

In FIG. 2, 104A and 104B are image sensor chips. The image sensor chips 104A and 104B are obtained by cutting one side of each of the left and right auxiliary cutting lines 109 of the image sensor chip 104. The image sensor chip 104B is electrically connected via the image sensor chip 104A.
Compared with the embodiment of FIG. 1, since the auxiliary pad 106G is required, the width of the image sensor chip is large, and since the wiring pattern 103 between the auxiliary pads 106G is short, the width of the substrate 101 is small.

In FIG. 5, the image sensor chips 104C and 104D are
The image sensor chip 104 is cut on both sides by auxiliary cutting lines 109 on the left and right. As is apparent from FIG. 5, the system of FIGS. 1 and 2 is applied. This is effective in reducing the resistance of wiring when connecting a large number of image sensor chips.

〔The invention's effect〕

As described above, the present invention has the following effects.

(1) Since the input / output terminals connected to at least two image sensor chips are arranged at one place in a concentrated manner, connection with peripheral circuits becomes easy. Furthermore, since at least one of the input / output terminals thus centrally arranged is a common input / output terminal for at least two image sensor chips, the number of input / output terminals is reduced. Decrease. As a result, the size of the board can be reduced, and connection with peripheral circuits is further facilitated.

(2) Since the image sensor chip group is connected from both ends in the long axis direction, the width of the image sensor chip can be reduced, and the cost of the image sensor chip is reduced. In addition, the provision of the dummy wiring pattern for the clock does not reduce the dynamic range of the contact image sensor.

(3) Since the connection is made from the vicinity of the adjacent ends of the adjacent image sensor chips via the wiring pattern of the substrate, the wiring area on the substrate can be reduced, the substrate can be made smaller, and the size, weight and cost can be reduced. Have.

[Brief description of drawings]

1, 2, 5 are mounting plan views showing an embodiment of the contact image sensor of the present invention. 3 and 4 are plan views of an image sensor chip used in an embodiment of the contact image sensor of the present invention. 1 to 9 are input terminals, 101 is a substrate, 102A and B are image sensor chips, 103 is a wiring pattern, 103A and B are clock wirings, and 104A and B are image sensor chips.

Claims (3)

[Claims] 1. A contact-type image sensor configured by mounting a plurality of image sensor chips on a substrate, and an input / output terminal connected to at least two image sensor chips of the plurality of image sensor chips. Is 1
At least one of the input / output terminals centrally arranged at the one location is a common input / output terminal for the at least two image sensor chips. Characteristic of contact image sensor. 2. Terminals provided in the vicinity of both ends in the long axis direction of the image sensor chip group consisting of the at least two image sensor chips are concentrated at the one place via the wiring pattern of the substrate. Connect to the output terminal,
In addition, in the clock wiring, a dummy wiring for a positive phase clock is provided near one end in the major axis direction of the image sensor chip group, and a dummy wiring for a negative phase clock is provided near the other end of the image sensor chip group. The contact type image sensor according to claim 1, wherein the contact type image sensor is provided so as to extend to the vicinity of the center on the substrate. 3. The terminals of the at least two image sensor chips, which are respectively provided around the connection ends of the adjacent image sensor chips, are connected to each other via a wiring pattern of the substrate. The contact image sensor according to item 1 above.