JPH0746753B2 - Blackening method for copper clad laminates - Google Patents
Blackening method for copper clad laminatesInfo
- Publication number
- JPH0746753B2 JPH0746753B2 JP61081294A JP8129486A JPH0746753B2 JP H0746753 B2 JPH0746753 B2 JP H0746753B2 JP 61081294 A JP61081294 A JP 61081294A JP 8129486 A JP8129486 A JP 8129486A JP H0746753 B2 JPH0746753 B2 JP H0746753B2
- Authority
- JP
- Japan
- Prior art keywords
- blackening
- treatment
- blackening treatment
- treatment liquid
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims description 10
- 229910052802 copper Inorganic materials 0.000 title claims description 3
- 239000010949 copper Substances 0.000 title claims description 3
- 238000011282 treatment Methods 0.000 claims description 44
- 239000007788 liquid Substances 0.000 claims description 19
- 238000004381 surface treatment Methods 0.000 claims description 7
- 239000007800 oxidant agent Substances 0.000 claims description 4
- 238000007654 immersion Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 239000011889 copper foil Substances 0.000 description 7
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- UKLNMMHNWFDKNT-UHFFFAOYSA-M sodium chlorite Chemical compound [Na+].[O-]Cl=O UKLNMMHNWFDKNT-UHFFFAOYSA-M 0.000 description 1
- 229960002218 sodium chlorite Drugs 0.000 description 1
- SUKJFIGYRHOWBL-UHFFFAOYSA-N sodium hypochlorite Chemical compound [Na+].Cl[O-] SUKJFIGYRHOWBL-UHFFFAOYSA-N 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 229910000162 sodium phosphate Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical compound [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Description
【発明の詳細な説明】 ［発明の目的］ （産業上の利用分野） 本発明は、黒化処理むらを発生させない多層板用銅張積
層板の黒化処理方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application] The present invention relates to a blackening treatment method for a copper-clad laminate for a multilayer board that does not cause uneven blackening treatment.
（従来の技術） 近年電子機器の発達およびそれに伴う印刷配線板の高密
度化に対処して多層基板が用いられるようになってきて
いる。この多層基板は、薄い内層用両面板に回路を形成
し、その上にプリプレグと銅箔を積層して加熱、加圧す
ることにより製造されている。(Prior Art) In recent years, multilayer boards have come to be used in response to the development of electronic devices and the accompanying increase in density of printed wiring boards. This multilayer board is manufactured by forming a circuit on a thin inner layer double-sided board, laminating a prepreg and a copper foil thereon, and heating and pressing.
しかしながら、内層板上の回路銅箔の表面はそのままの
状態であると、加熱や吸湿により層間剥離が生じ易いた
め、通常様々な表面処理を施して剥離を防止する方法が
とられている。However, if the surface of the circuit copper foil on the inner layer plate is left as it is, delamination easily occurs due to heating or moisture absorption. Therefore, various surface treatments are usually performed to prevent delamination.
このような方法として、銅箔表面の黒化処理や黄銅化処
理等の方法が行われている。これらの方法の内、引剥し
強度、耐熱性等の諸特性が優れていることから、酸化剤
を用いて表面に酸化被膜を形成させる黒化処理が最も一
般的に用いられている。As such a method, a method such as blackening treatment or brassing treatment of the copper foil surface has been performed. Among these methods, the blackening treatment in which an oxide film is formed on the surface by using an oxidizing agent is most commonly used because it has excellent properties such as peeling strength and heat resistance.
（発明が解決しようとする問題点） しかしながらこの黒化処理方法においては、製造工程中
に形成された種々の処理膜、銅箔表面が酸化されるのを
防ぐために行われる塩酸洗浄および水洗い時に付着した
水滴、内層板に形成された信号回路等に起因して処理む
らが生じ易いという問題があった。なお水滴の残留を防
ぐために、黒化処理の前に乾燥工程を設けることも考え
られるが、乾燥条件によってはパターニングに寸法変化
が発生することがあり回路設計上好ましくない。(Problems to be solved by the invention) However, in this blackening treatment method, various treatment films formed during the manufacturing process, and adhesion during hydrochloric acid washing and water washing performed to prevent the copper foil surface from being oxidized There is a problem that uneven processing is likely to occur due to the water droplets, the signal circuit formed on the inner layer plate, and the like. Note that a drying step may be provided before the blackening treatment in order to prevent water droplets from remaining, but dimensional changes may occur in patterning depending on the drying conditions, which is not preferable in terms of circuit design.
そして従来このような処理むらが発生した場合には、黒
化処理をやりなおしたり、前工程の研磨からやりなおし
たりすることが行われていた。In the past, when such processing unevenness occurred, the blackening processing was performed again and the polishing from the previous step was performed again.
しかしながら黒化処理をくり返して行なう場合には、効
率が悪いうえに、最初に正常に黒化された部分は過剰に
黒化処理が行われることになってしまい、処理膜が切れ
やすくなって引剥し強度、耐熱性が正常品よりも弱くな
ってしまうという問題があった。However, if the blackening process is repeated, the efficiency is poor, and the first normally blackened part is excessively blackened, which easily cuts the processed film and causes a blackout. There was a problem that peel strength and heat resistance were weaker than those of normal products.
また前工程の研磨からやりなおす場合には、銅箔の処理
層を除去してしまうため、処理層の均一化は図れるが、
前述の場合より一層効率が悪く、さらに再研磨により内
層銅箔が薄くなるためスルーホール信頼性が低下し好ま
しくない。When the polishing process is repeated from the previous step, the treated layer of the copper foil is removed, so that the treated layer can be made uniform,
The efficiency is further worse than in the case described above, and the inner layer copper foil is thinned by re-polishing, so that the through hole reliability is deteriorated, which is not preferable.
本発明は、このような従来の問題を解消すべくなされた
もので、黒化処理むらがなく膜の特性および処理効率と
もに良好な黒化処理方法を提供することを目的とする。The present invention has been made to solve such a conventional problem, and an object of the present invention is to provide a blackening treatment method which is free from unevenness of blackening treatment and has good film characteristics and treatment efficiency.
［発明の構成］ （問題点を解決するための手段） すなわち本発明の黒化処理方法は、多層板用銅張積層板
を酸化剤および塩基性物質を溶解させた黒化処理液に浸
漬して黒化処理を行う方法において、前記黒化処理に先
立って、前記黒化処理液と同一成分を含有し、前記黒化
処理液の濃度より低濃度の処理液を使用して、前記黒化
処理液へ浸漬する時間の1/4〜1/2の時間で、かつ80℃未
満、30℃以上の温度で表面処理を行うことを特徴として
いる。[Structure of the Invention] (Means for Solving Problems) That is, the blackening treatment method of the present invention involves immersing a copper-clad laminate for a multilayer plate in a blackening treatment liquid in which an oxidizing agent and a basic substance are dissolved. In the method of performing the blackening treatment, the blackening treatment is performed using a treatment liquid containing the same components as the blackening treatment liquid and having a concentration lower than that of the blackening treatment liquid prior to the blackening treatment. It is characterized in that the surface treatment is performed at a temperature of less than 80 ° C and 30 ° C or more for 1/4 to 1/2 of the time of immersion in the treatment liquid.
本発明において使用される黒化液は、例えば亜塩素酸ナ
トリウム（NaClO2）のような酸化剤と水酸化ナトリウム
（NaOH）のようなアルカリにリン酸ナトリウム（Na3P
O4）を添加したものがあげられる。The blackening solution used in the present invention is an oxidizer such as sodium chlorite (NaClO 2 ) and an alkali such as sodium hydroxide (NaOH) and sodium phosphate (Na 3 P
O 4 ) is added.
また本発明における軽度の表面処理には、上記の黒化処
理液を単に水で1/4〜3/4程度に希釈しただけの溶液や、
黒化処理液が例えば80〜90℃であるとき液温を単に80℃
未満、30℃以上程度まで低くしただけの溶液を使用した
り、同一の黒化処理液を使用し単に処理液への浸漬時間
を1/4〜1/2程度に短縮しだけでもよいが、黒化処理液と
その成分比率を代えた溶液や、黒化処理液にさらに界面
活性剤のような他の成分を添加した溶液を使用するよう
にしてもよい。Further, for the mild surface treatment in the present invention, a solution obtained by simply diluting the above-mentioned blackening treatment solution with water to about 1/4 to 3/4,
When the blackening treatment liquid is, for example, 80 to 90 ° C, the liquid temperature is simply 80 ° C.
However, it is possible to use a solution that has been lowered to about 30 ° C or more, or to use the same blackening treatment solution and simply shorten the immersion time in the treatment solution to about 1/4 to 1/2. You may make it use the solution which changed the blackening process liquid and its component ratio, or the solution which further added other components, such as a surfactant, to the blackening process liquid.
（作用） 本発明においては、多層板用銅張積層板の黒化処理に先
立って、前述した方法により軽度の表面処理を行うこと
により、均一に黒化処理を行うことができる。(Operation) In the present invention, prior to the blackening treatment of the copper clad laminate for a multilayer board, a slight surface treatment is performed by the above-mentioned method, whereby the blackening treatment can be uniformly performed.
（実施例） 以下本発明の実施例について説明する。(Examples) Examples of the present invention will be described below.
この実施例および比較例で用いた黒化処理液と表面処理
液の液組成および処理条件を第１表に示す。Table 1 shows liquid compositions and treatment conditions of the blackening treatment liquid and the surface treatment liquid used in the examples and comparative examples.
この処理液を用いて異なる条件下で銅箔に黒化処理を施
し比較検討を行った。第２表にその実施例および比較例
の処理条件を示し、各条件下で得られた処理膜の特性を
第３表に示す。なお使用したパターンは信号回路であ
る。 Using this treatment liquid, the copper foil was subjected to blackening treatment under different conditions and a comparative study was conducted. Table 2 shows the treatment conditions of the examples and comparative examples, and Table 3 shows the characteristics of the treated films obtained under the respective conditions. The pattern used is a signal circuit.
［発明の効果］ 以上の実施例からも明らかなように、本発明の黒化処理
の方法によれば、外観処理むらがなく、加熱後の引剥し
強度およびはんだ耐熱性の低下も少なく優れた特性を維
持する黒化処理膜が得られ、また処理効率の低下も防ぐ
ことができる。さらに表面処理液による処理条件が緩か
であるため、高信頼性のポリイミド多層板への適用も可
能である。 [Effects of the Invention] As is clear from the above examples, according to the method for blackening treatment of the present invention, there is no unevenness in appearance treatment, peeling strength after heating and deterioration of solder heat resistance are excellent and excellent. It is possible to obtain a blackening treatment film that maintains the characteristics, and it is possible to prevent a reduction in treatment efficiency. Furthermore, since the treatment condition with the surface treatment liquid is mild, it can be applied to a highly reliable polyimide multilayer board.
Claims (1)
物質を溶解させた黒化処理液に浸漬して黒化処理を行う
方法において、前記黒化処理に先立って、前記黒化処理
液と同一成分を含有し、前記黒化処理液の濃度より低濃
度の処理液を使用して、前記黒化処理液へ浸漬する時間
の1/4〜1/2の時間で、かつ80℃未満、30℃以上の温度で
表面処理を行うことを特徴とする銅張積層板の黒化処理
方法。1. A method of performing blackening treatment by immersing a copper clad laminate for a multilayer board in a blackening treatment liquid in which an oxidizing agent and a basic substance are dissolved, wherein the blackening treatment is performed prior to the blackening treatment. Containing the same components as the treatment liquid, using a treatment liquid having a concentration lower than the concentration of the blackening treatment liquid, 1/4 to 1/2 of the time of immersion in the blackening treatment liquid, and 80 A method for blackening a copper-clad laminate, which comprises performing a surface treatment at a temperature of less than 30 ° C and 30 ° C or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61081294A JPH0746753B2 (en) | 1986-04-09 | 1986-04-09 | Blackening method for copper clad laminates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61081294A JPH0746753B2 (en) | 1986-04-09 | 1986-04-09 | Blackening method for copper clad laminates |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62238690A JPS62238690A (en) | 1987-10-19 |
| JPH0746753B2 true JPH0746753B2 (en) | 1995-05-17 |
Family
ID=13742362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61081294A Expired - Fee Related JPH0746753B2 (en) | 1986-04-09 | 1986-04-09 | Blackening method for copper clad laminates |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0746753B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56167399A (en) * | 1980-05-27 | 1981-12-23 | Tokyo Shibaura Electric Co | Method of surface treating multilayer printed board inner layer plate |
-
1986
- 1986-04-09 JP JP61081294A patent/JPH0746753B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62238690A (en) | 1987-10-19 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |