JPH0746759B2 - How to automatically attach irregular lead parts to printed boards - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for automatically mounting an unfixed lead component used for automatically assembling an electronic circuit on a printed board onto the printed board. .

2. Description of the Related Art Various electronic circuits such as audio circuits and video circuits are assembled on a printed board, and how to increase the automation rate of assembly is an important issue to reduce manufacturing cost.

The electronic circuit is assembled by inserting a lead wire of an electronic component into an opening formed on a printed board and temporarily fixing it, or by soldering it to a predetermined portion of a wiring pattern.

At present, assembling automation has been almost achieved for electronic components such as semiconductor integrated circuits in which the shape and dimensions of lead wires are extremely high. On the other hand, in the case of an electronic component having a long and low-rigidity lead wire such as a single transistor or a wire-wound resistor, it is difficult to automate it because the shape of the lead wire greatly varies due to the deformation of the lead wire. For this reason, conventionally, such an irregular lead component has been manually mounted on a printed board.

Problems to be Solved by the Invention In the above-mentioned conventional technology, since the irregular lead parts such as a single transistor are manually mounted on the printed board, the manufacturing cost and the assembly time are increased, and the artificial There is a problem that errors and variations easily occur.

Structure of the Invention Means for Solving Problems According to the automatic mounting method of the present invention for solving the above problems of the prior art, first, each lead wire length is different and each cut surface is with respect to the bottom surface of the main body. The tip portions of the two indeterminate lead wires are cut so as to be inclined at about 45 degrees.

After this, the optical fiber is positioned near the openings of the printed board and the tips correspond to the openings, and the light source is positioned so as to project a light beam substantially parallel to the printed board. The relative position and angle between the electronic components and the printed board are roughly adjusted based on open loop control so that the cutting surface of the tip end of the board faces the light source that projects light rays parallel to the printed board and is located near the opening of the insertion target. Next, the reflected light from the 45-degree cut surface of the long lead wire is incident on the optical fiber near the corresponding opening, and the reflected light is positioned almost at the center of the corresponding opening. While finely adjusting the relative position of the optical fiber based on the optical closed loop control, the tip end portion is inserted into the corresponding opening, and the optical fiber is separated and retracted from the printed board in connection with the insertion.

Finally, the reflected light from the 45-degree cut surface of the short lead wire is incident on the optical fiber near the corresponding opening, and the relative position of the electronic component and the printed board is adjusted so that the reflected light is located almost in the center of the corresponding opening. Is finely readjusted based on the optical closed loop control, and the tip portion is inserted into the corresponding opening.

By automatically performing each of the above steps, it is possible to achieve automatic mounting of indeterminate lead parts with large variations in shape,
Cost and assembly time are reduced, and human error and variability due to manual labor are avoided.

Hereinafter, the operation of the present invention will be described in detail with reference to Examples.

1 to 6 are views showing the procedure of the automatic mounting method according to the embodiment of the present invention.

First, as shown in FIG. 1, an electronic component 1 such as a single transistor or capacitor having two irregular lead wires 1b and 1c extending downward from the bottom of the main body 1a with variations in shape is formed. It is held by the holding unit 2 and carried from a storage space such as a component storage box to the vicinity of the lead wire cutting units 3a and 3b. The holding portion 2 has a function of holding the top of the electronic component 1 and is moved in the illustrated three orthogonal axes (X, Y, Z) directions in accordance with the rotation of a servo motor (not shown).

Next, as shown in FIG. 2, the tip ends of the lead wires 1b and 1c are applied to the cutting portions 3b and 3c, respectively, and the cutting is performed by the operation of the cutting portions 3b and 3c. As the cutting portions 3b and 3c, a cutting tool similar to a nipper, in which the shapes and movements of the cutting edges on both sides are symmetrical in order to maintain the flatness of the cutting surface, is used.

As shown in FIG. 3, the lead wires 1b and 1c after cutting are different from each other in length by δ, and each cut surface is inclined by about 45 degrees with respect to the bottom surface of the main body 1a.

After this, as shown in FIG. 4, a light source (projection of a light beam 6 in which the bottom portion of the main body 1a is substantially parallel to the printed board 4 and the cut surfaces of the leading ends of the lead wires 1b and 1c are parallel to the printed board ( The relative position and angle of the electronic component 1 and the printed wiring board 4 are roughly adjusted based on the open loop control by the rotation of the servomotor so that the electronic component 1 and the printed wiring board 4 are located near the openings 4b and 4c to be inserted while facing each other (not shown). .

After this, the light beam reflected by the cut surface of the longer lead wire 1b is incident on the center of the optical fiber 5b arranged at the center of the opening 4b, so that a well-known optical system using a servo motor and an optical system is used. By the closed loop control, the relative positions of the electronic component 1 and the printed wiring board 4 are finely adjusted. The convex tip of the optical fiber 5b has a function of converging the incident light beam.
The image of the cut surface formed inside is digitized by a quantizer circuit (not shown) in the subsequent stage and is calculated to calculate the deviation from the center of the optical fiber 5b. Is driven to finely adjust the position of the holding unit 2.

When this fine adjustment is completed, as shown in FIG. 5, the printed wiring board 4 is moved upward, so that the tip portion of the longer lead wire 1b is inserted into the corresponding opening 4b. At the same time, the optical fibers 5b and 5c are retracted below the printed board.

Subsequently, by the optical closed loop control using the servo motor and the optical system, the light beam reflected by the cut surface of the shorter lead wire 1c is incident on the center of the optical fiber 5c arranged at the center of the opening 4c. The relative position between the electronic component 1 and the printed board 4 is readjusted.

When this fine adjustment is completed, as shown in FIG. 6, the printed board 4 is moved further upward so that the tip portion of the shorter lead wire 1c is inserted into the corresponding opening 4c.

Finally, although not shown, the tip portions of the lead wires 1b and 1c inserted into the openings 4b and 4c are bent to complete the entire process of the automatic device.

As described above, the structure in which the printed board 4 is moved upward in the insertion process shown in FIGS. 5 and 6 has been illustrated. However, the holding portion 2 is interlocked with the optical fibers 5b and 5c while the printed board 4 is kept stationary. It may be configured to move downward.

Effects of the Invention As described in detail above, the automatic mounting method of the present invention is
45 degree cutting of the tip of the irregular lead wire, relative adjustment of relative position and angle by open loop control, and position by optical closed loop control using reflected light from the 45 degree cut surface of each lead wire. Since it is a configuration that automatically inserts it into the opening with fine adjustment of, it is possible to automatically mount the irregular lead parts, which was difficult due to the large variation in shape, which reduces the cost and assembly time. Variations in human error caused by humans are avoided.

[Brief description of drawings]

1 to 6 are process diagrams showing the procedure of the automatic mounting method according to the embodiment of the present invention. 1 ... Atypical lead part, 1a ... Main body, 1b, 1c ...
Lead wire, 3b, 3c …… cutting part, 4 …… printed board, 4b, 4
c ... Aperture, 5b, 5c ... Optical fiber, 6 ... Rays projected parallel to the printed board 4.

Claims (1)

[Claims] 1. An electronic component is automatically provided with two openings formed on a printed board at the respective tip portions of two irregular lead wires extending downward from the bottom of the main body of the electronic component with variations in shape. A method for automatically mounting this electronic component on a printed circuit board by inserting the tip end portions of the two indeterminate lead wires so that the lead wire lengths are different and the cut surfaces are on the bottom surface of the main body. Almost 45
Cut it so that it has an angle of inclination, position the optical fiber in the vicinity of the openings of the printed board so that the tip corresponds to each opening, and position the light source so that the light beam is projected almost parallel to the printed board. The relative position and angle of the electronic component and the printed board should be such that the cut surface of the tip of each irregular lead wire is positioned near the opening of the insertion target while facing the light source that projects a light beam parallel to this printed board. Is roughly adjusted based on open-loop control, and the reflected light from the 45-degree cut surface of the long lead wire is incident on the optical fiber near the corresponding aperture, and the reflected light is positioned at the center of the corresponding aperture. The relative position between the component and the printed board is finely adjusted based on the optical closed loop control, and the tip part is inserted into the corresponding opening. The reflected light from the 45-degree cut surface of the wire is incident on the optical fiber near the corresponding opening, and the relative position of the electronic component and the printed board is optically adjusted so that the reflected light is located almost at the center of the corresponding opening. A method for automatically mounting an indeterminate lead component on a printed board, which comprises automatically performing a step of inserting the tip portion into a corresponding opening while performing fine adjustment based on closed-loop control.