JPH0750729B2 - Film carrier manufacturing method - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a TAB (Tape Automate).
The present invention relates to a method of manufacturing a film carrier used for a semiconductor device or the like manufactured by the d Bonding) method and a cutting machine used for manufacturing the film carrier.

[0002]

2. Description of the Related Art In recent years, electronic devices have become more functional, lighter, thinner, smaller, and smaller, and the semiconductor devices mounted on them have also been required to have higher integration and higher functionality. Is needed. The TAB method using a film carrier has attracted attention as a method of mounting a semiconductor device suitable for such requirements.

A film carrier using a polyimide resin as an insulating layer has a three-layer structure film carrier in which a metal conductor layer and a polyimide resin layer are adhered via an adhesive, and a two-layer structure consisting of a metal conductor layer and a polyimide resin layer. There are structural film carriers. Currently, the film carrier mainly used is a three-layer structure film carrier, but since an epoxy-based material is used for the intervening adhesive layer, the problem that the heat resistance inherent in the polyimide resin cannot be exhibited, Due to the impurity chlorine ions contained in the adhesive layer, there is a problem in that the mounted semiconductor device lacks reliability.

A film carrier which overcomes the above problems is a two-layer structure film carrier consisting of a metal conductor layer and a polyimide resin layer. In the two-layer structure film carrier, in addition to patterning the metal conductor layer by etching or the like, it is necessary to provide the polyimide resin layer with a predetermined opening such as a device hole. As a method therefor, a wet etching method, a dry etching method, A laser etching method is known.

The wet etching method requires a lithographic technique, requires a long process and is inferior in economic efficiency, and has a very low polyimide resin etching rate. Therefore, workability in a subsequent manufacturing process becomes extremely difficult. There is a problem that the application is limited only to a low film carrier having a thin polyimide resin layer.

As a dry etching method, a sputtering method and an ion milling method are known, but all of them require expensive and large-scale equipment, and since continuous production is not possible, there is a problem in economical efficiency, productivity, workability and the like. There is.

In recent years, the laser etching method, which has been attracting attention, has problems such as melting and damage of the metal conductor layer due to heat, generation and adhesion of carbon which is difficult to remove. As a method for producing an excellent two-layer structure film carrier which does not have the above problems, a method using a cutting machine can be mentioned. This method forms a predetermined opening part such as a device hole using a cutting machine such as a numerical control processing machine at a predetermined part of a polyimide resin layer of a two-layer structure film carrier body including a metal conductor layer and a polyimide resin layer. It is a method of manufacturing a film carrier.

In this method using a cutting machine, a cutting edge is applied to the main body of the film carrier having a two-layer structure during cutting.
During the cutting process with the cutting edge, the two-layer structure film carrier body is fixed to the processing stage so that the two-layer structure film carrier body is not displaced by the force of over 000 kg / mm ^2. Need to be kept. As a method for fixing the film carrier to the stage, there are a method using a positioning pin, a method using a weight, and a method of temporarily adhering with a removable adhesive. In the above two methods, the force applied by the cutting blade is resisted. It is not enough to fix the film carrier, and the adhesive method will use an adhesive that is not originally necessary, and not only the quality problem such as contamination by the adhesive but also the economical efficiency, workability, and productivity. There are also problems in terms.

As a fourth method of fixing the film carrier to the stage, there is a method of using a suction fixing jig known in an exposure machine used in lithography for patterning in the film carrier manufacturing process.
As shown in FIG. 4, since the film carrier fixing jig for the exposure machine fixes the film carrier uniformly, the film carrier is fixed by vacuum through suction holes having a diameter of about 0.1 to 1 mmφ evenly provided on the upper surface of the jig. Is fixed by adsorption.

Using this suction fixing jig for an exposure machine as a fixing jig for a main body of a film carrier having a two-layer structure, it is necessary to remove a predetermined portion of a polyimide resin layer by a cutting machine and form a device hole or the like. At the time of cutting and opening the portion corresponding to the adsorption hole portion provided in the corresponding portion in the opening portion, not only undesired unevenness is generated in the residual metal conductor layer at least in the hole portion, but also the metal conductor layer is penetrated. It has a problem that it will be damaged.

[0011]

DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention As a result of intensive studies to solve the above-mentioned problems, a two-layer structure film carrier main body is required to have a suction fixing jig even if the suction holes are not evenly provided on the upper surface of the jig. It was found that the film carrier, which is almost evenly adsorbed on a smooth jig and uses a cutting machine to form a device hole in the two-layer structure film carrier body, has no hindrance in the manufacture of the film carrier, and based on the knowledge The present invention has been completed by conceiving that the two-layer structure film carrier main body is adsorbed and fixed by using a fixing jig provided with an adsorption groove and / or an adsorption hole only in a portion corresponding to a portion other than the opening portion. It was

As is apparent from the above description, the present invention is
Method for producing a film carrier by forming a predetermined opening portion such as a device hole by removing a predetermined portion of a polyimide resin layer of a two-layer structure film carrier body composed of a metal conductor layer and a polyimide resin layer using a cutting machine In the above, there is no need to use an adhesive agent or the like which is not originally necessary, and further, the film carrier body having a two-layer structure is not damaged.
It is an object of the present invention to provide a simple method for fixing a main body of a two-layer structure film carrier, which is excellent in economy, workability and productivity.

[0013]

[Means for Solving the Problems] The present invention includes the following (1) to
It has the configuration of (6). (1) A method for producing a film carrier, wherein a device hole is formed by removing a predetermined portion of the polyimide resin layer of a two-layer structure film carrier body composed of a metal conductor layer and a polyimide resin layer using a cutting machine. A film carrier characterized in that the two-layer structure film carrier main body is suction-fixed and cut by a suction-fixing jig having suction grooves and / or suction holes provided only in a portion corresponding to a portion other than a predetermined opening portion. Manufacturing method. (2) The two-layer structure film carrier main body adsorption / fixing jig in which the suction groove and / or the suction hole of the two-layer structure film carrier main body adsorption / fixing jig is provided in a portion corresponding to at least a portion surrounding a predetermined opening. The method for producing a film carrier according to the above item 1, characterized in that: (3) At least the predetermined opening portion is surrounded by a suction groove of the two-layer film carrier main body suction fixing jig so as to form a closed circuit at a portion corresponding to the portion surrounding the predetermined opening portion of the film carrier main body. 3. The method for producing a film carrier according to any one of the above items 1 and 2, wherein the provided two-layer structure film carrier main body adsorption jig is used. (4) A cutting machine for producing a film carrier by forming a device hole by removing a polyimide resin layer at a predetermined portion of a two-layer structure film carrier body composed of a metal conductor layer and a polyimide resin layer using a cutting machine. In a suction fixing jig for the two-layer structure film carrier main body, wherein a suction groove and / or a suction hole is provided only in a portion other than the device hole for fixing the two-layer structure film carrier main body by suction. A cutting machine characterized by being equipped. (5) An adsorption fixing jig for adsorbing and fixing an adsorbing groove and / or an adsorbing hole for adsorbing and fixing the two-layer structure film carrier main body is provided in a portion corresponding to a portion surrounding a predetermined opening. The cutting machine according to the fourth aspect, characterized in that (6) Adsorption grooves for adsorbing and fixing the two-layer structure film carrier body are provided in a portion corresponding to a portion surrounding the predetermined opening portion of the film carrier body so as to form a closed circuit at least surrounding the predetermined opening portion. The cutting machine according to any one of the above items 4 and 5, characterized in that it is provided with the two-layer structure film carrier main body adsorption jig.

The structure, operation and effect of the present invention will be described in detail below. The constituent material of the metal conductor layer used in the two-layer structure film carrier body is copper, aluminum,
Examples thereof include gold, silver, iron, tin, lead, or alloys thereof or those plated with these. The two-layer structure film carrier body is formed by casting a polyimide resin solution or a polyimide precursor solution on a metal conductor layer made of the above material, or by vapor deposition or electrodeposition of the metal conductor layer constituent material on the polyimide resin layer. And a thermoplastic polyimide resin laminated on the metal conductor layer, and a thermoplastic polyimide resin used as an adhesive to bond the metal conductor layer and the polyimide resin layer to each other. .

The adsorption fixing jig for adsorbing and fixing the two-layer structure film carrier body as described above is one in which an adsorption groove and / or an adsorption hole is provided at a portion corresponding to a portion other than the predetermined opening portion. A typical example is shown in. When removing the polyimide resin layer of the predetermined opening part by the cutting machine with the cutting edge of the cutting machine, the suction groove and the suction hole are not provided on the stage surface below the predetermined opening part that hits the cutting edge. Therefore, the main body of the two-layer structure film carrier is not damaged.

There is no particular problem if the suction groove and / or the suction hole is provided at a portion corresponding to a portion other than the predetermined opening portion, but if the cutting speed is increased to improve productivity, a positional deviation occurs. In some cases, as shown in FIG.
It is desirable to provide at least a portion corresponding to a portion surrounding the predetermined opening portion. Further, for the sake of completeness, as shown in FIG. 3, it is more desirable to provide a suction groove that surrounds at least the predetermined opening and forms a closed circuit at a portion corresponding to the portion surrounding the predetermined opening.

[0017]

According to the present invention, the suction groove and / or the suction hole is provided at a portion corresponding to a portion other than the predetermined portion of the two-layer structure film carrier body, instead of the ordinary suction jig having the suction holes provided uniformly. In addition, a predetermined part of the polyimide resin layer is removed by using a cutting machine by using a special suction jig. Device holes and the like can be formed without damaging them. According to the present invention, a two-layer structure film carrier body composed of a metal conductor layer and a polyimide resin layer is fixed using a special suction jig as described above, and a predetermined portion of the polyimide resin layer is removed using a cutting machine, A device hole or the like is formed.

[0018]

As described above, according to the present invention, the main body of the two-layer structure film carrier is firmly fixed on the smooth suction jig without any gaps without using an adhesive or the like, so that the positional deviation does not occur during cutting. The target thickness can be opened without unevenness. INDUSTRIAL APPLICABILITY The present invention is a method having excellent quality, economical efficiency, workability, and productivity, and moreover, since a suction groove and / or a suction hole is provided in a portion corresponding to a portion other than the predetermined opening portion, a two-layer structure film Does not damage the carrier body. This makes it possible to easily manufacture a film carrier having excellent heat resistance and reliability.

[0019]

[Brief description of drawings]

FIG. 1 is a sectional view when a two-layer structure film carrier body is suction-fixed by a typical suction-fixing jig according to the present invention. In the figure, a is a polyimide resin predetermined opening,
b is a polyimide resin layer, c is a metal conductor layer, and b and c are 2
It constitutes a layered film carrier. Further, d is a suction groove or a suction hole, e is a vacuum pump connecting pipe, and f is d, e, g.
This is a suction-fixing jig that includes the (suction-fixing jig cavity). FIG. 2 is a plan view of a two-layer structure film carrier body which is suction-fixed by a typical suction-fixing jig having suction grooves and / or suction holes formed so as to surround a predetermined opening according to the present invention. is there. In the figure, a is a polyimide resin predetermined opening portion, and b is a two-layer structure film carrier. d is a suction groove, e is a vacuum pump connecting pipe, f is a suction fixing jig including d, e, and g (suction holding jig cavity), and h is a suction hole.

FIG. 3 is a plan view of a two-layer structure film carrier body which is suction-fixed by a typical suction-fixing jig having a suction groove forming a closed circuit surrounding a predetermined opening according to the present invention. . In the figure, a is a polyimide resin predetermined opening portion, and b is a two-layer structure film carrier. d is a suction groove forming a closed circuit, e is a vacuum pump connecting pipe, f is d,
It is a suction fixing jig including e and g (cavity of suction fixing jig). FIG. 4 is a cross-sectional view when a two-layer structure film carrier body is suction-fixed by a suction-fixing jig used in a conventional exposure machine or the like, and the meaning of each symbol is the same as in FIG.

Claims (6)

[Claims] 1. A method of manufacturing a film carrier, wherein a device hole is formed by removing a predetermined portion of the polyimide resin layer of a two-layer structure film carrier body composed of a metal conductor layer and a polyimide resin layer using a cutting machine. The suction fixing jig having suction grooves and / or suction holes provided only in a portion corresponding to a portion other than the predetermined opening portion.
A method of manufacturing a film carrier, which comprises adsorbing and fixing a layer structure film carrier body and performing cutting. 2. A two-layer structure film carrier main body adsorption / fixing jig in which the suction groove and / or suction hole of the two-layer structure film carrier main body adsorption / fixing jig is provided in a portion corresponding to at least a portion surrounding a predetermined opening portion. The method for producing a film carrier according to claim 1, wherein: 3. A closed circuit is formed by surrounding at least the predetermined opening portion at a portion of the two-layer structure film carrier main body suction fixing jig corresponding to a portion surrounding the predetermined opening portion of the film carrier main body. The method for producing a film carrier according to any one of claims 1 and 2, wherein the jig for adsorbing the main body of the film carrier having the two-layer structure thus provided is used. 4. A cutting for manufacturing a film carrier by forming a device hole by removing a polyimide resin layer at a predetermined portion of a two-layer structure film carrier body composed of a metal conductor layer and a polyimide resin layer by using a cutting machine. In a processing machine, a suction fixing jig of the two-layer structure film carrier main body in which suction grooves and / or suction holes are provided only in a portion other than the device hole for fixing the two-layer structure film carrier main body by suction. A cutting machine equipped with tools. 5. A two-layer structure film carrier body suction-fixing jig, wherein a suction groove and / or a suction hole for suction-fixing a two-layer structure film carrier body is provided at a portion corresponding to a portion surrounding a predetermined opening portion. The cutting machine according to claim 4, further comprising: 6. A closed circuit is formed by surrounding at least a predetermined opening portion of a two-layer structure film carrier main body in a portion corresponding to a portion surrounding the predetermined opening portion of the film carrier main body. The cutting machine according to any one of claims 4 and 5, further comprising: a jig for adsorbing the main body of the film carrier having the two-layer structure provided on the cutting machine.