JPH0750803B2 - Method for manufacturing composite piezoelectric body - Google Patents
Method for manufacturing composite piezoelectric bodyInfo
- Publication number
- JPH0750803B2 JPH0750803B2 JP31337386A JP31337386A JPH0750803B2 JP H0750803 B2 JPH0750803 B2 JP H0750803B2 JP 31337386 A JP31337386 A JP 31337386A JP 31337386 A JP31337386 A JP 31337386A JP H0750803 B2 JPH0750803 B2 JP H0750803B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- piezoelectric
- piezoelectric particles
- plate
- particles
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、複合圧電体の製造方法に関する。The present invention relates to a method for manufacturing a composite piezoelectric body.
〈従来技術〉 チタン酸ジルコン酸鉛(PZT)、チタン酸鉛(PT)等の
強誘電セラミック粒子(粉末)を、合成樹脂、合成ゴム
等の高分子材料中に分散、混合して所定の形状に成形
し、さらに上下面に電極を形成して、分極してなる複合
圧電体は公知である。<Prior Art> Ferroelectric ceramic particles (powder) such as lead zirconate titanate (PZT) and lead titanate (PT) are dispersed and mixed in a polymer material such as synthetic resin or synthetic rubber to have a predetermined shape. It is known that a composite piezoelectric body is formed by molding, and further, electrodes are formed on the upper and lower surfaces and polarized to form a composite piezoelectric body.
ところでこのような複合圧電体は、第6図に示すよう
に、各セラミック粒子bが高分子のマトリックスa中に
互いに独立して分布し、かつ上下電極c,c間で高分子を
介して不連続状となっている。このため、分極処理に際
して、分極電圧がセラミック粒子bに対して充分印加さ
れないこととなり所望の性能が得られない。また、所望
性能を得るために過度に分極電圧を高めれば絶縁破壊を
生じることとなる。By the way, in such a composite piezoelectric body, as shown in FIG. 6, each ceramic particle b is distributed independently of each other in a polymer matrix a, and there is no polymer between the upper and lower electrodes c, c. It is continuous. Therefore, during the polarization treatment, the polarization voltage is not sufficiently applied to the ceramic particles b, and the desired performance cannot be obtained. Further, if the polarization voltage is excessively increased to obtain the desired performance, dielectric breakdown will occur.
そこで、第7図に示すように、合成ゴム、合成樹脂材料
によりあらかじめ多数の透孔eを形成した保持シートd
を作成し、該透孔e内に、強誘電体セラミックからなる
円筒状、方体状等の柱状に成形した多数の圧電粒子fを
埋入して、該保持シートの表裏面に圧電粒子fを露出す
るとともに、その保持シートの表裏面を電極g,gで被覆
した複合圧電体が提案された。Therefore, as shown in FIG. 7, a holding sheet d having a large number of through holes e formed in advance from a synthetic rubber or synthetic resin material.
A large number of piezoelectric particles f formed of a ferroelectric ceramic and formed in a columnar shape such as a cylindrical shape or a rectangular shape are embedded in the through holes e, and the piezoelectric particles f are formed on the front and back surfaces of the holding sheet. A composite piezoelectric body was proposed in which the front surface and the back surface of the holding sheet were covered with electrodes g, g while exposing the.
この構成にあっては、電極g,g間に圧電粒子fが連続し
ているため、分極電圧を直接印加することができ、前記
欠点を除去し得ることとなる。In this structure, since the piezoelectric particles f are continuous between the electrodes g, the polarization voltage can be directly applied, and the above-mentioned defects can be eliminated.
ところが一方、かかる構成では、圧電粒子fの形状のバ
ラ付や、埋入状態の不整一等により、各圧電粒子fが保
持シートdの透孔e内に緊密に埋入されず、透孔e内で
隙間を生じて、脱落することがあった。On the other hand, in such a configuration, the piezoelectric particles f are not tightly embedded in the through holes e of the holding sheet d due to variations in the shape of the piezoelectric particles f, irregular embedding state, etc. There was a gap inside and it sometimes fell off.
本発明は、かかる構成の圧電複合材料の欠点を除去し得
る製造方法の提供を目的とするものである。It is an object of the present invention to provide a manufacturing method capable of removing the defects of the piezoelectric composite material having such a structure.
〈問題点を解決するための手段〉 本発明は、次の工程からなる複合圧電体の製造方法であ
る。<Means for Solving Problems> The present invention is a method for manufacturing a composite piezoelectric body including the following steps.
イ)多数の透孔が列設されてなる整列板を、上面に接着
層が形成された基板上に配置する。A) An alignment plate having a large number of through holes arranged in line is arranged on a substrate having an adhesive layer formed on the upper surface thereof.
ロ)前記整列板の透孔内に柱状圧電粒子を埋入してから
該整列板を除去し、前記基板上に圧電粒子のみを保持す
る。B) After the columnar piezoelectric particles are embedded in the through holes of the alignment plate, the alignment plate is removed and only the piezoelectric particles are held on the substrate.
ハ)成型枠内に、前記圧電粒子を内側にして基板をかぶ
せ、該基板と成型枠とで整列板の厚み相当分の深さの成
型室を形成する。C) A substrate is covered in the molding frame with the piezoelectric particles inside, and a molding chamber having a depth corresponding to the thickness of the alignment plate is formed by the substrate and the molding frame.
ニ)成型室内に、ペースト状のポリマーを注入する。D) Inject the pasty polymer into the molding chamber.
ホ)ポリマーの固結によって形成される板状成形体を、
基板と成型枠から分離する。E) A plate-shaped molded body formed by consolidating a polymer,
Separate from the substrate and molding frame.
ヘ)前記板状成形体の上下面に電極を形成し、該電極間
に電圧を印加して、板状成形体の圧電粒子を厚み方向に
分極する。F) Electrodes are formed on the upper and lower surfaces of the plate-shaped compact, and a voltage is applied between the electrodes to polarize the piezoelectric particles of the plate-shaped compact in the thickness direction.
〈作用〉 圧電粒子を整列状態に保持してから、その周囲に生ずる
格子状の空隙にポリマーを注入するものであるから、各
圧電粒子の形状のバラ付と無関係に、保持シート内に圧
電粒子が一体的かつ緊密に埋設されることとなる。<Function> Since the piezoelectric particles are held in an aligned state and then the polymer is injected into the lattice-shaped voids formed around the piezoelectric particles, the piezoelectric particles are retained in the holding sheet irrespective of variations in the shape of each piezoelectric particle. Will be buried integrally and closely.
〈実施例〉 本発明方法は以下のステップに基いて好適に実施され
る。<Example> The method of the present invention is preferably carried out based on the following steps.
・第1ステップ 第1図にあって、1は片面に粘着テープ2が配設された
基板であって、その上面に整列板3を乗載し、該粘着テ
ープ2により接合する。前記粘着テープ2は接着層の一
例をなすものであって、基板1上に直接、接着層を塗布
形成してもよい。First Step In FIG. 1, reference numeral 1 denotes a substrate having an adhesive tape 2 arranged on one side thereof, on which an alignment plate 3 is mounted and joined by the adhesive tape 2. The adhesive tape 2 is an example of an adhesive layer, and the adhesive layer may be directly formed on the substrate 1 by coating.
前記整列板3には矩形状の透孔4が縦横に整列して配設
されている。Rectangular through holes 4 are arranged in the alignment plate 3 vertically and horizontally.
そして、各透孔4には、1mm角程度の矩形柱状の圧電粒
子5を埋設する。前記透孔4の形状は埋設する圧電粒子
5の形状に対応して円柱状等種々の形状が供され得る。Then, each through hole 4 is filled with a rectangular columnar piezoelectric particle 5 of about 1 mm square. The shape of the through hole 4 may be various shapes such as a cylindrical shape corresponding to the shape of the embedded piezoelectric particles 5.
該圧電粒子5は、粉末粒子をプレス成形して形成したも
ののほか、本出願人と同一出願人に係る特願昭61−2041
99号に開示されている手段によって、形成された単結晶
の大粒子をそのまま用いることができる。The piezoelectric particles 5 are formed by press-molding powder particles, and Japanese Patent Application No. 61-2041 of the same applicant as the present applicant.
By the means disclosed in No. 99, the large single crystal particles formed can be used as they are.
すなわち、組成式Pb1+xTiO3+x(ただし0<x)のもと
に、TiO2とPbOを所定の割合で混合し、これを1150℃〜1
300℃の範囲で加熱焼成して得られるチタン酸鉛粒子は
粒径が大きく、かつc軸が発達した方体状をしているこ
とが確かめられた。この粒径は30μm〜1.5mm程度にも
なる。ここでxは酸化鉛PbOの過剰率を示すこととな
る。That is, based on the composition formula Pb 1 + x TiO 3 + x (where 0 <x), TiO 2 and PbO are mixed at a predetermined ratio, and this is mixed at 1150 ° C to 1
It was confirmed that the lead titanate particles obtained by heating and calcining in the range of 300 ° C. had a large particle size and had a cubic shape with developed c-axis. This particle size is about 30 μm to 1.5 mm. Here, x represents the excess rate of lead oxide PbO.
従って、かかる手段で形成されたチタン酸鉛粒子は、圧
電粒子5としてそのまま用いることが可能となる。Therefore, the lead titanate particles formed by such means can be used as the piezoelectric particles 5 as they are.
・第2ステップ 次に前記整列板3を、第2図に示すように基板1上から
除去する。この除去後の基板1上面には、圧電粒子5が
取残され、粘着テープ2の接合力により、前記整列板3
の透孔4の配置に基いて、整列状に保持されている。す
なわち、圧電粒子5の周囲には、格子状の空隙が生じて
いることとなる。Second Step Next, the alignment plate 3 is removed from the substrate 1 as shown in FIG. After the removal, the piezoelectric particles 5 are left on the upper surface of the substrate 1, and the bonding force of the adhesive tape 2 causes the alignment plate 3 to move.
Based on the arrangement of the through-holes 4 in FIG. That is, the lattice-shaped voids are formed around the piezoelectric particles 5.
・第3ステップ 6は、前記整列板3の厚み相当分の深さを持ちかつ同一
平面形状の内部スペース7が形成された矩形皿状成型枠
であって、その一辺縁には、前記内部スペース7内に連
通する樹脂供給口8が形成されている。そして、前記基
板1を裏返して、成型枠6上面に被着し、各圧電粒子5
を内部スペース7内に収納する。かかる状態において、
前記成型枠6と基板1間には、遮閉状の成型室9が形成
される。The third step 6 is a rectangular dish-shaped molding frame having a depth equivalent to the thickness of the alignment plate 3 and having an internal space 7 of the same plane shape, and one side edge thereof has the internal space. A resin supply port 8 communicating with the inside of 7 is formed. Then, the substrate 1 is turned over and adhered to the upper surface of the molding frame 6, and the piezoelectric particles 5
Is stored in the internal space 7. In such a state,
A closed molding chamber 9 is formed between the molding frame 6 and the substrate 1.
前記構成にあって、成型室9の周縁は、成型枠6の周縁
鍔により構成されているが、前記基板1の形状を皿型と
してもよい。In the above configuration, the peripheral edge of the molding chamber 9 is constituted by the peripheral brim of the molding frame 6, but the shape of the substrate 1 may be dish-shaped.
・第4ステップ 前記樹脂供給口8から成型室9内に、合成ゴム、合成樹
脂材料等のペースト状のポリマー10をホッパー11から注
入し、圧電粒子5周囲の格子状空隙内に充填する。Fourth Step A paste-like polymer 10 such as synthetic rubber or synthetic resin material is injected from the hopper 11 into the molding chamber 9 through the resin supply port 8 to fill the lattice-shaped voids around the piezoelectric particles 5.
・第5ステップ 基板1と、成型枠6を分離し、ポリマー10の固結によっ
て形成される板状成形体11を取出す。そしてこの成形体
11は、合成ゴム、合成樹脂材料よりなる保持シート12
に、圧電粒子5が整列状に埋設された構成となる。-Fifth step The substrate 1 and the molding frame 6 are separated, and the plate-shaped molded body 11 formed by consolidating the polymer 10 is taken out. And this molded body
11 is a holding sheet 12 made of synthetic rubber or synthetic resin material
In addition, the piezoelectric particles 5 are embedded in an array.
・第6ステップ 前記板状成形体11の上下面に電極13,13を形成し、該電
極13,13間に電圧を印加して、板状成形体11の圧電粒子
5を厚み方向に分極する。-Sixth step: Electrodes 13 and 13 are formed on the upper and lower surfaces of the plate-shaped compact 11, and a voltage is applied between the electrodes 13 and 13 to polarize the piezoelectric particles 5 of the plate-shaped compact 11 in the thickness direction. .
この電極13,13は、入出力電極として、そのまま用いる
ことができる。The electrodes 13 and 13 can be used as they are as input / output electrodes.
〈発明の効果〉 本発明は上述のように、合成ゴム、合成樹脂よりなる保
持シート12に圧電粒子5が整列状に埋設された構成の複
合圧電体にあって、圧電粒子5を整列させて後に、その
周部にポリマーを注入して形成するものであるから、前
記圧電粒子5を保持シート12内に緊密かつ一体的に埋設
することができ、その保持が強固である等の優れた効果
がある。<Effects of the Invention> As described above, the present invention provides a composite piezoelectric body in which piezoelectric particles 5 are embedded in an array in a holding sheet 12 made of synthetic rubber or synthetic resin. Since it is formed by injecting a polymer into the peripheral part later, the piezoelectric particles 5 can be embedded tightly and integrally in the holding sheet 12, and the holding is strong, which is an excellent effect. There is.
【図面の簡単な説明】 第1〜5図は、本発明方法の好適な一実施例の各製造工
程を示すものであって、第1図は基板1上に整列板3を
保持した状態の斜視図、第2図は整列板3を除去して、
基板1上に圧電粒子5を保持した状態の斜視図、第3図
は成型手段を示す縦断側面図、第4図は成形体11の斜視
図、第5図は成形体11の分極処理を示す縦断側面図であ
る。また第6,7図は夫々従来構成の複合圧電体の構造を
示す縦断側面図である。 1;基板、2;粘着テープ、3;整列板、4;透孔、5;圧電粒
子、6;成型枠、7;内部スペース、8;樹脂供給口、9;成型
室、10;ポリマー、11;成形体、12;保持シート、13,13;
電極BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1 to 5 show respective manufacturing steps of a preferred embodiment of the method of the present invention, and FIG. 1 shows a state in which an alignment plate 3 is held on a substrate 1. In perspective view and FIG. 2, the alignment plate 3 is removed,
Fig. 3 is a perspective view showing a state where the piezoelectric particles 5 are held on the substrate 1, Fig. 3 is a vertical sectional side view showing the molding means, Fig. 4 is a perspective view of the molded body 11, and Fig. 5 shows polarization treatment of the molded body 11. It is a vertical side view. Further, FIGS. 6 and 7 are longitudinal side views showing the structure of a composite piezoelectric body having a conventional structure, respectively. 1; Substrate, 2; Adhesive tape, 3; Alignment plate, 4; Through hole, 5; Piezoelectric particles, 6; Molding frame, 7; Internal space, 8; Resin supply port, 9; Molding chamber, 10; Polymer, 11 Molded body, 12; holding sheet, 13,13;
electrode
Claims (1)
法。 イ)多数の透孔が列設されてなる整列板を、上面に接着
層が形成された基板上に配置する。 ロ)前記整列板の透孔内に柱状圧電粒子を埋入してから
該整列板を除去し、前記基板上に圧電粒子のみを保持す
る。 ハ)成型枠内に、前記圧電粒子を内側にして基板をかぶ
せ、該基板と成型枠とで整列板の厚み相当分の深さの成
型室を形成する。 ニ)成型室内に、ペースト状のポリマーを注入する。 ホ)ポリマーの固結によって形成される板状成形体を、
基板と成型枠から分離する。 ヘ)前記板状成形体の上下面に電極を形成し、該電極間
に電圧を印加して、板状成形体の圧電粒子を厚み方向に
分極する。1. A method of manufacturing a composite piezoelectric body comprising the following steps. A) An alignment plate having a large number of through holes arranged in line is arranged on a substrate having an adhesive layer formed on the upper surface thereof. B) After the columnar piezoelectric particles are embedded in the through holes of the alignment plate, the alignment plate is removed and only the piezoelectric particles are held on the substrate. C) A substrate is covered in the molding frame with the piezoelectric particles inside, and a molding chamber having a depth corresponding to the thickness of the alignment plate is formed by the substrate and the molding frame. D) Inject the pasty polymer into the molding chamber. E) A plate-shaped molded body formed by consolidating a polymer,
Separate from the substrate and molding frame. F) Electrodes are formed on the upper and lower surfaces of the plate-shaped compact, and a voltage is applied between the electrodes to polarize the piezoelectric particles of the plate-shaped compact in the thickness direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31337386A JPH0750803B2 (en) | 1986-12-26 | 1986-12-26 | Method for manufacturing composite piezoelectric body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31337386A JPH0750803B2 (en) | 1986-12-26 | 1986-12-26 | Method for manufacturing composite piezoelectric body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63164483A JPS63164483A (en) | 1988-07-07 |
| JPH0750803B2 true JPH0750803B2 (en) | 1995-05-31 |
Family
ID=18040481
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31337386A Expired - Lifetime JPH0750803B2 (en) | 1986-12-26 | 1986-12-26 | Method for manufacturing composite piezoelectric body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0750803B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5046367B2 (en) * | 2006-10-23 | 2012-10-10 | 公益財団法人鉄道総合技術研究所 | Piezoelectric material, method for manufacturing the same, vibration damping device, and driving device |
| JP5469344B2 (en) * | 2009-01-14 | 2014-04-16 | 株式会社竹中工務店 | Membrane actuator, multi-layer membrane actuator, and air spring structure |
-
1986
- 1986-12-26 JP JP31337386A patent/JPH0750803B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63164483A (en) | 1988-07-07 |
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