JPH0752130B2 - Tactile sensor - Google Patents
Tactile sensorInfo
- Publication number
- JPH0752130B2 JPH0752130B2 JP60261579A JP26157985A JPH0752130B2 JP H0752130 B2 JPH0752130 B2 JP H0752130B2 JP 60261579 A JP60261579 A JP 60261579A JP 26157985 A JP26157985 A JP 26157985A JP H0752130 B2 JPH0752130 B2 JP H0752130B2
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- semiconductor
- tactile sensor
- sensitive element
- transmitting portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Description
【発明の詳細な説明】 ［産業上の利用分野］ この発明は面領域における圧力分布状況等を検出する触
覚センサに関する。TECHNICAL FIELD The present invention relates to a tactile sensor that detects a pressure distribution condition or the like in a surface area.
［技術的背景及び問題点］ 近年人間の手の代行を果たすメカニカルハンドの開発が
盛んである。ところで、このようなメカニカルハンドに
人間の手と同等の触覚機能を具備させるためには、その
指先等にかかる圧力の大小のみならず圧力分布パターン
やすべり等の検出をも適確に行なえる触覚センサの開発
が重要な課題の一つと言える。[Technical background and problems] In recent years, development of mechanical hands that act as a substitute for human hands has been active. By the way, in order to equip such a mechanical hand with a tactile function equivalent to that of a human hand, a tactile sensation that can accurately detect not only the magnitude of the pressure applied to the fingertips but also the pressure distribution pattern and slippage, etc. It can be said that the development of sensors is one of the important issues.
このような触覚センサは、多数の圧力検出部を例えばマ
トリックス状に配列して構成されるもので、従来から多
数の開発例がみられ、特に加圧力に応じて抵抗値の変化
する感圧導電性ゴムを使用するものが一般的である。と
ころが、感圧導電性ゴムは、出力特性に直線性がなく、
またヒステリシス、クリープ等の現象が顕著であるた
め、物体のパターン認識は可能であるが、接触圧検出の
精度を高めることが困難であった。Such a tactile sensor is configured by arranging a large number of pressure detection parts in a matrix, for example, and many development examples have been seen in the past. In particular, a pressure-sensitive conductive material whose resistance value changes according to the applied pressure. It is common to use natural rubber. However, pressure-sensitive conductive rubber has no linearity in output characteristics,
Further, since phenomena such as hysteresis and creep are remarkable, pattern recognition of an object is possible, but it is difficult to improve the accuracy of contact pressure detection.
これに対して、近年半導体素子を利用した触覚センサの
開発が注目されている。On the other hand, in recent years, development of a tactile sensor using a semiconductor element has been attracting attention.
このような触覚センサとして、例えば特開昭60−90696
号公報に記載されたようなものがある。これは、第６図
及び第７図に示すものと略同様のものである。第６図に
示すものは、複数のダイヤフラム部101を有する半導体
感圧素子103上にチップキャリヤ105を介してシリコンゴ
ムシート107が接合されたものである。前記チップキャ
リヤ105にはダイヤフラム部101と対向する位置に貫通孔
109が形成され、この貫通孔109には圧力伝達媒体として
のシリコンオイル111が封入されている。また、前記シ
リコンゴムシート107には、ダイヤフラム部101と対応す
る位置に受圧部113が一体成形されている。従って、シ
リコンゴムシート107の受圧部113に作用する圧力はシリ
コンオイル111を介して半導体感圧素子103のダイヤフラ
ム部101を撓ませ、圧力の検出ができる。As such a tactile sensor, for example, JP-A-60-90696
There is one such as that described in the publication. This is substantially the same as that shown in FIGS. 6 and 7. In FIG. 6, a silicon rubber sheet 107 is bonded onto a semiconductor pressure sensitive element 103 having a plurality of diaphragm portions 101 via a chip carrier 105. A through hole is formed in the chip carrier 105 at a position facing the diaphragm portion 101.
109 is formed, and the through hole 109 is filled with silicon oil 111 as a pressure transmission medium. A pressure receiving portion 113 is integrally formed on the silicon rubber sheet 107 at a position corresponding to the diaphragm portion 101. Therefore, the pressure acting on the pressure receiving portion 113 of the silicon rubber sheet 107 bends the diaphragm portion 101 of the semiconductor pressure sensitive element 103 through the silicon oil 111, and the pressure can be detected.
また、第７図に示すものは、複数のダイヤフラム部101
を有する半導体感圧素子103に重合したチップキャリヤ1
05の貫通孔109にシリコンゴム製の弾性体115を挿入して
ダイヤフラム部101上に位置させると共に、弾性体115の
受圧部113をチップキャリヤ105上へ突出させたものであ
る。従って、弾性体115の受圧部113に作用する圧力は直
接弾性体115から半導体感圧素子103のダイヤフラム部10
1に伝達され、圧力の検出ができる。Further, FIG. 7 shows a plurality of diaphragm parts 101.
Chip carrier 1 superposed on semiconductor pressure-sensitive element 103 having
An elastic body 115 made of silicon rubber is inserted into the through hole 109 of 05 to be positioned on the diaphragm portion 101, and the pressure receiving portion 113 of the elastic body 115 is projected onto the chip carrier 105. Therefore, the pressure acting on the pressure receiving portion 113 of the elastic body 115 is directly applied from the elastic body 115 to the diaphragm portion 10 of the semiconductor pressure sensitive element 103.
It is transmitted to 1 and the pressure can be detected.
しかしながら、第６図に示すような触覚センサには、つ
ぎのような問題がある。第１に、シリコンオイル111は
微小な隙間からでも洩れるため、シリコンオイル111の
密封構造を精密加工する必要があり、この加工が極めて
困難である。第２に、シリコンオイル111がシリコンゴ
ムシート107に浸透していくため、シリコンゴムシート1
07が柔軟化され耐久性が乏しい。第３にシリコンオイル
111は熱膨張が大きいため、ダイヤフラム部101の出力特
性に悪影響を及ぼすことになり信頼性が乏しい。However, the tactile sensor as shown in FIG. 6 has the following problems. First, since the silicon oil 111 leaks even from a minute gap, it is necessary to precisely process the sealing structure of the silicon oil 111, which is extremely difficult. Secondly, since the silicone oil 111 permeates the silicone rubber sheet 107, the silicone rubber sheet 1
07 is soft and has poor durability. Third, silicone oil
Since 111 has a large thermal expansion, it adversely affects the output characteristics of the diaphragm portion 101 and is poor in reliability.
また、第７図に示すような触覚センサには、つぎのよう
な問題がある。第１に弾性体115とチップキャリヤ105と
の間に摩擦が生じるため、あるいは、物体を持ち上げた
際に受圧部113にかかる横方向の力で受圧部113が強い曲
げやねじりを受けるため半導体感圧素子103の出力特性
に悪影響を及ぼすこととなり信頼性が乏しい。第２に、
弾性体115とチップキャリヤ105との間に生じる摩擦によ
って、弾性体115が破損しやすく、信頼性、耐久性が低
い。Further, the tactile sensor as shown in FIG. 7 has the following problems. First, because the friction is generated between the elastic body 115 and the chip carrier 105, or the pressure-receiving portion 113 is strongly bent or twisted by the lateral force applied to the pressure-receiving portion 113 when an object is lifted, a semiconductor sense is obtained. The output characteristics of the piezoelectric element 103 are adversely affected and the reliability is poor. Second,
Due to the friction generated between the elastic body 115 and the chip carrier 105, the elastic body 115 is easily damaged, and the reliability and durability are low.
［発明の目的］ この発明は、このような従来の問題点に鑑み創案された
もので、加圧状況を高精度に検出することができ、しか
も、耐久性に優れた触覚センサの提供を目的とする。[Object of the Invention] The present invention has been devised in view of the above-mentioned conventional problems, and an object of the present invention is to provide a tactile sensor capable of detecting a pressurizing condition with high accuracy and having excellent durability. And
［発明の概要］ 上記目的を達成するために、この発明は、受けた圧力を
検出する半導体素子で形成された半導体感圧素子と、 この半導体感圧素子に対して面接触で密着して固定され
受圧部で受けた圧力を該半導体感圧素子へ伝達する弾性
体製の圧力伝達部と、 この圧力伝達部と一体的に形成され該圧力伝達部を支持
する弾性体製の支持部と、 を有することを特徴とする。[Summary of the Invention] In order to achieve the above object, the present invention provides a semiconductor pressure-sensitive element formed of a semiconductor element that detects a received pressure and a surface pressure contact of the semiconductor pressure-sensitive element to fix the semiconductor pressure-sensitive element. A pressure transmitting portion made of an elastic body for transmitting the pressure received by the pressure receiving portion to the semiconductor pressure sensitive element, and an elastic body supporting portion formed integrally with the pressure transmitting portion and supporting the pressure transmitting portion, It is characterized by having.
［発明の効果］ この発明では、圧力伝達部を半導体感圧素子に対して面
接触で密着して固定されているものとしているため、圧
力伝達部に加わった圧力の押圧方向成分が半導体感圧素
子にて正確に検出される。EFFECTS OF THE INVENTION In the present invention, since the pressure transmitting portion is fixed in close contact with the semiconductor pressure-sensitive element by surface contact, the pressure direction component of the pressure applied to the pressure transmitting portion is the semiconductor pressure-sensitive element. Accurately detected by the element.
そして、圧力伝達部と支持部とを一体的構造としている
ため、圧力伝達部の機械的な摺動部をなくすことがで
き、摩擦や摩耗の発生がないため、圧力伝達部の圧力伝
達性能を安定させることができる。Further, since the pressure transmitting portion and the supporting portion are integrally structured, the mechanical sliding portion of the pressure transmitting portion can be eliminated, and no friction or wear occurs, so that the pressure transmitting performance of the pressure transmitting portion can be improved. Can be stabilized.
また、物体を持ち上げた際に圧力伝達部にかかる横方向
の力を、圧力伝達部を支持する支持部によって吸収でき
るため、耐久性を向上することができる。Further, since the lateral force applied to the pressure transmitting portion when the object is lifted can be absorbed by the supporting portion that supports the pressure transmitting portion, durability can be improved.
さらに、圧力伝達部と支持部との硬度を調整することに
より、センサ出力の感度、直線性の最適化、あるいは支
持剛性の最適化を図ることができる。Furthermore, by adjusting the hardness of the pressure transmission portion and the support portion, it is possible to optimize the sensitivity and linearity of the sensor output or the support rigidity.
［実施例］ 以下、この発明の実施例を図面に基づいて説明する。[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.
第１図は、この発明の第１実施例に係る触覚センサの断
面図である。FIG. 1 is a sectional view of a tactile sensor according to the first embodiment of the present invention.
同図において、触覚センサは、例えばメカニカルハンド
の把持面にマトリクス状に配列されているもので、半導
体感圧素子１と、この半導体感圧素子１上に接合された
受圧体３とから構成されている。In FIG. 1, the tactile sensor is arranged in a matrix on the gripping surface of a mechanical hand, for example, and is composed of a semiconductor pressure sensitive element 1 and a pressure receiving body 3 bonded on the semiconductor pressure sensitive element 1. ing.
前記半導体感圧素子１は、シリコンゴムで弾性部を形成
し、半導体技術を用いて歪抵抗を弾性部に拡散形成した
もので、圧力検出部としてのダイヤフラム部５を有して
おり、チップキャリヤ７に取付けられている。前記チッ
プキャリヤ７には、前記ダイヤフラム部５と対向する位
置に貫通孔９が形成されている。The semiconductor pressure-sensitive element 1 is an element in which an elastic portion is formed of silicon rubber, and a strain resistance is diffused and formed in the elastic portion using a semiconductor technique. The semiconductor pressure-sensitive element 1 has a diaphragm portion 5 as a pressure detecting portion. It is attached to 7. A through hole 9 is formed in the chip carrier 7 at a position facing the diaphragm portion 5.
前記受圧体３は、シリコンゴム等の弾性体によって形成
された円柱状の圧力伝達部11を有し、この圧力伝達部11
の一側は受圧部13となっており、他側は半導体感圧素子
１のダイヤフラム部５に接着されている。The pressure receiving body 3 has a cylindrical pressure transmitting portion 11 formed of an elastic body such as silicon rubber.
One side is a pressure receiving portion 13, and the other side is bonded to the diaphragm portion 5 of the semiconductor pressure sensitive element 1.
この圧力伝達部11の周囲には圧力伝達部11と一体的に形
成され圧力伝達部11を支持する弾性体製の支持部15が形
成されている。この支持部15は接着硬化性弾性材料、例
えばシリコンゴム接着シール材で構成され、圧力伝達部
11周囲の空間を埋めるように充填されている。従って、
支持部15は、圧力伝達部11周囲において貫通孔９内に入
り、また、チップキャリヤ７上に接着された状態とな
る。前記圧力伝達部11の受圧部13には、硬質プラスチッ
クで形成された剛性プレート17が接合され、この上に物
体との接触面として適度な弾性と摩擦係数増大を意図し
てシリコンゴムシート19が接着されている。21はボンデ
ィングワイヤ、23は出力リード、25はキャップである。Around the pressure transmission portion 11, a support portion 15 made of an elastic body is formed integrally with the pressure transmission portion 11 and supports the pressure transmission portion 11. The support portion 15 is made of an adhesive curable elastic material, for example, a silicone rubber adhesive seal material, and the pressure transmitting portion
11 Filled to fill the surrounding space. Therefore,
The supporting portion 15 enters the through hole 9 around the pressure transmitting portion 11 and is in a state of being bonded onto the chip carrier 7. A rigid plate 17 made of hard plastic is joined to the pressure receiving portion 13 of the pressure transmitting portion 11, and a silicone rubber sheet 19 is provided on the pressure receiving portion 13 for the purpose of increasing elasticity and friction coefficient appropriately as a contact surface with an object. It is glued. Reference numeral 21 is a bonding wire, 23 is an output lead, and 25 is a cap.
前記剛性プレート17は、該剛性プレート17に作用する圧
縮力を面圧に変換し、この面圧を圧力伝達部11を介して
ダイヤフラム部５に伝達するものである。従って、前記
剛性プレート17を介して受圧部13に加えられた圧力は、
圧力伝達部11によって前記ダイヤフラム部５に伝達さ
れ、該ダイヤフラム部５に作用してこれを歪ませること
になる。この歪みは歪抵抗に及び、ピエゾ抵抗効果によ
り圧力検出信号として出力リード23から出力される。The rigid plate 17 converts a compressive force acting on the rigid plate 17 into a surface pressure and transmits the surface pressure to the diaphragm portion 5 via the pressure transmission portion 11. Therefore, the pressure applied to the pressure receiving portion 13 via the rigid plate 17 is
It is transmitted to the diaphragm portion 5 by the pressure transmitting portion 11 and acts on the diaphragm portion 5 to distort it. This strain extends to the strain resistance and is output from the output lead 23 as a pressure detection signal due to the piezoresistive effect.
前記圧力伝達部11には機械的な摺動部がないため、摩擦
や摩耗を生じることがなく、耐久性に優れ安定した圧力
伝達性能を得ることができる。従って、圧力検出部５を
半導体感圧素子１によって形成したことと相俟って、高
精度の圧力検出を行なうことができ、信頼性を向上する
ことができる。Since the pressure transmitting portion 11 has no mechanical sliding portion, friction and wear do not occur, and it is possible to obtain stable pressure transmitting performance with excellent durability. Therefore, in combination with the fact that the pressure detecting portion 5 is formed by the semiconductor pressure sensitive element 1, it is possible to perform highly accurate pressure detection and improve reliability.
また、物体を把握した状態で何らかの衝撃力が物体又は
ハンド側に加わるとき、触覚センサの受圧体３に急激な
外力が作用する可能性がある。このとき、受圧体３を構
成する圧力伝達部11と支持体15の弾性により外力が吸収
され、これにより円部応力の極部集中を防げ、ダイヤフ
ラム５の破損や接着面の剥離等を防止でき、耐久性が向
上する。Further, when an impact force is applied to the object or the hand side while grasping the object, a sudden external force may act on the pressure receiving body 3 of the tactile sensor. At this time, the external force is absorbed by the elasticity of the pressure transmitting portion 11 and the support body 15 which constitute the pressure receiving body 3, whereby the concentration of the circular stress at the extreme portion can be prevented, and the damage of the diaphragm 5 and the peeling of the adhesive surface can be prevented. , Durability is improved.
さらに、支持部15の硬度を高めれば圧力伝達部11に対す
る横方向の支持剛性が増し、重量のある物をつかんだと
きでも、圧力伝達部11の曲がりや、ねじれは極めて少な
く、確実な圧力検知ができる。逆に支持部15の硬度を低
めれば、僅かな圧力でも圧力伝達部11は変位可能とな
り、出力感度、直線性を向上させることができ、対象物
が軽量で精度が要求される場合に適する。圧力伝達部11
と支持部15との相対的な硬度差をも調整することによっ
て、さらに種々の条件に対応することができ、設計自由
度が著しく向上する。Further, if the hardness of the support portion 15 is increased, the lateral support rigidity for the pressure transmission portion 11 is increased, and even when a heavy object is grasped, the pressure transmission portion 11 is hardly bent or twisted, and reliable pressure detection is possible. You can Conversely, if the hardness of the support portion 15 is lowered, the pressure transmission portion 11 can be displaced even with a slight pressure, and the output sensitivity and linearity can be improved, which is suitable when the object is lightweight and accuracy is required. . Pressure transmitter 11
By adjusting the relative hardness difference between the support portion 15 and the support portion 15 as well, various conditions can be met, and the degree of freedom in design is significantly improved.
第２図はこの発明の第２実施例を示すもので、この実施
例は上記第１実施例の変形例である。この実施例では、
チップキャリヤ27を半導体感圧素子１のダイヤフラム部
５の裏面側に取り付けたものである。FIG. 2 shows a second embodiment of the present invention, which is a modification of the first embodiment. In this example,
The chip carrier 27 is attached to the back surface side of the diaphragm portion 5 of the semiconductor pressure sensitive element 1.
なお、上記第１実施例と略同一の構成部分には同符号を
付して説明を省略する。The same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.
この実施例によれば、上記第１実施例と略同様な効果が
期待できる他、キャップを省略できるため触覚センサの
薄形化を図ることができる。According to this embodiment, substantially the same effect as that of the first embodiment can be expected, and since the cap can be omitted, the tactile sensor can be made thinner.
第３図はこの発明の第３実施例を示すもので、この実施
例は、上記第２実施例の変形例である。この実施例で
は、上記第２実施例におけるシリコンゴムシートを支持
部29と一体にモールド形成している。なお、上記第１実
施例、第２実施例と略同一の構成部分には、同符号を付
して説明を省略する。FIG. 3 shows a third embodiment of the present invention, which is a modification of the second embodiment. In this embodiment, the silicone rubber sheet of the second embodiment is integrally molded with the support portion 29. The same components as those in the first and second embodiments are designated by the same reference numerals and the description thereof will be omitted.
この実施例によれば、上記第２実施例と略同様な効果が
期待できる他、さらに、耐久性を向上することができ
る。According to this embodiment, substantially the same effect as that of the second embodiment can be expected, and the durability can be further improved.
第４図は、この発明の第４実施例を示すものである。こ
の実施例では、圧力伝達部31、支持部33の全体が接着硬
化性弾性体材料で一体成形されると共に、圧力伝達部31
に芯材35が設けられた構成となっている。なお、上記第
１実施例と略同一の構成部分には同符号を付して説明を
省略する。FIG. 4 shows a fourth embodiment of the present invention. In this embodiment, the entire pressure transmitting portion 31 and the supporting portion 33 are integrally formed of an adhesive curable elastic material, and the pressure transmitting portion 31
The core material 35 is provided in the structure. The same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.
この実施例によれば、上記第１実施例と略同様な効果が
期待できる。According to this embodiment, substantially the same effect as that of the first embodiment can be expected.
第５図は、この発明の第５実施例を示すものである。こ
の実施例では、圧力伝達部37、支持部39の全体がシリコ
ンゴムで一体成形され、圧力伝達部37と支持部39との硬
度を変えたものである。なお上記第１実施例と略同一の
構成部分には同符号を付して説明を省略する。FIG. 5 shows a fifth embodiment of the present invention. In this embodiment, the entire pressure transmitting portion 37 and the supporting portion 39 are integrally molded of silicone rubber, and the hardness of the pressure transmitting portion 37 and the supporting portion 39 are changed. The same components as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.
この実施例によれば、上記第１実施例と略同様な効果が
期待できる他、圧力伝達部37と支持部39との剥離がなく
耐久性が向上する。According to this embodiment, substantially the same effect as that of the first embodiment can be expected, and in addition, the pressure transmitting portion 37 and the supporting portion 39 are not separated from each other and the durability is improved.
なお、この発明はメカニカルハンド以外の圧力検知にも
使用でき、必ずしもマトリックス状に配置して使用する
ものに限らず、単体として使用することも可能である。The present invention can be used for pressure detection other than the mechanical hand, and is not limited to one arranged in a matrix and used, but can be used as a single unit.
第１図はこの発明の第１実施例に係る触覚センサの断面
図、第２図はこの発明の第２実施例に係る触覚センサの
断面図、第３図はこの発明の第３実施例に係る触覚セン
サの断面図、第４図はこの発明の第４実施例に係る触覚
センサの断面図、第５図はこの発明の第５実施例に係る
触覚センサの断面図、第６図及び第７図は従来例による
触覚センサの断面図である。 （図面の主要部を表わす符号の説明） １……半導体感圧素子 13……受圧部 11、31、37……圧力伝達部 15、29、33、39……支持部1 is a sectional view of a tactile sensor according to a first embodiment of the present invention, FIG. 2 is a sectional view of a tactile sensor according to a second embodiment of the present invention, and FIG. 3 is a third embodiment of the present invention. FIG. 4 is a sectional view of a tactile sensor according to a fourth embodiment of the present invention, and FIG. 5 is a sectional view of a tactile sensor according to a fifth embodiment of the present invention. FIG. 7 is a sectional view of a conventional tactile sensor. (Explanation of the symbols indicating the main parts of the drawing) 1 ... Semiconductor pressure sensitive element 13 ... Pressure receiving section 11, 31, 37 ... Pressure transmitting section 15, 29,33,39.
Claims (1)
れた半導体感圧素子と、 この半導体感圧素子に対して面接触で密着して固定され
受圧部で受けた圧力を該半導体感圧素子へ伝達する弾性
体製の圧力伝達部と、 この圧力伝達部と一体的に形成され該圧力伝達部を支持
する弾性体製の支持部と、 を有することを特徴とする触覚センサ。1. A semiconductor pressure-sensitive element formed of a semiconductor element for detecting a pressure received, and a pressure received by a pressure-receiving portion which is fixed in close contact with the semiconductor pressure-sensitive element by surface contact. A tactile sensor comprising: a pressure transmitting portion made of an elastic body that transmits to the element; and a support portion made of an elastic body that is integrally formed with the pressure transmitting portion and supports the pressure transmitting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60261579A JPH0752130B2 (en) | 1985-11-22 | 1985-11-22 | Tactile sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60261579A JPH0752130B2 (en) | 1985-11-22 | 1985-11-22 | Tactile sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62123326A JPS62123326A (en) | 1987-06-04 |
| JPH0752130B2 true JPH0752130B2 (en) | 1995-06-05 |
Family
ID=17363876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60261579A Expired - Lifetime JPH0752130B2 (en) | 1985-11-22 | 1985-11-22 | Tactile sensor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0752130B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7669480B2 (en) | 2005-03-30 | 2010-03-02 | National Institute Of Information And Communications Technology, Incorporated | Sensor element, sensor device, object movement control device, object judgment device |
| JP2014074668A (en) * | 2012-10-05 | 2014-04-24 | Alps Electric Co Ltd | Load detector and electronic apparatus using the same |
| US9616591B2 (en) | 2010-12-30 | 2017-04-11 | United States Gypsum Company | Slurry distributor, system and method for using same |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007064716A (en) * | 2005-08-30 | 2007-03-15 | Hitachi Cable Ltd | Collision detection sensor |
| JP4528239B2 (en) * | 2005-10-03 | 2010-08-18 | 株式会社日立製作所 | Wireless IC tag |
| JP4896198B2 (en) * | 2009-10-14 | 2012-03-14 | 国立大学法人東北大学 | Tactile sensor system |
| JP5413131B2 (en) * | 2009-11-03 | 2014-02-12 | セイコーエプソン株式会社 | Sensor array and pressure sensor manufacturing method |
| JP5507354B2 (en) * | 2010-06-24 | 2014-05-28 | 新日本無線株式会社 | Piezoresistive element built-in sensor chip manufacturing method and sensor chip |
| CN109968348B (en) * | 2017-12-28 | 2021-04-16 | 深圳市优必选科技有限公司 | Robot control method and device and terminal equipment |
-
1985
- 1985-11-22 JP JP60261579A patent/JPH0752130B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7669480B2 (en) | 2005-03-30 | 2010-03-02 | National Institute Of Information And Communications Technology, Incorporated | Sensor element, sensor device, object movement control device, object judgment device |
| US9616591B2 (en) | 2010-12-30 | 2017-04-11 | United States Gypsum Company | Slurry distributor, system and method for using same |
| JP2014074668A (en) * | 2012-10-05 | 2014-04-24 | Alps Electric Co Ltd | Load detector and electronic apparatus using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62123326A (en) | 1987-06-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |