JPH0754815B2 - Semiconductor device inspection equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION Object of the Invention (Industrial field of application) The present invention relates to a semiconductor device inspection apparatus used in a semiconductor device manufacturing process or the like.

(Prior Art) Generally, a semiconductor device inspection apparatus is used for inspection of a semiconductor device formed on a semiconductor wafer in a semiconductor manufacturing process or the like.

A conventional semiconductor device inspection apparatus includes a prober and a tester that are separately configured.

The prober is an apparatus that sequentially conveys the semiconductor wafer to the measurement site and brings the electrode pad of the semiconductor device formed on the semiconductor wafer into contact with the probe arranged on the probe card.

Further, the tester is used by connecting with the prober, supplies a predetermined inspection signal to the semiconductor device formed on the semiconductor wafer through the prober, measures the signal from these semiconductor devices, and It is a device that determines whether or not the function of the device is normal.

(Problems to be Solved by the Invention) However, in the conventional semiconductor device inspection apparatus described above, since the prober and the tester are configured separately, the semiconductor device and the signal are supplied to the semiconductor device. The length of the connection line that electrically connects the electrical circuit section of the tester that measures the signal from the semiconductor device becomes long, and there are various harmful effects such as signal attenuation and noise, and the accuracy is high. There is a problem that inspection cannot be performed.

The present invention has been made in response to such a conventional situation, and aims to provide an inspection device for a semiconductor device capable of performing highly accurate inspection by reducing signal attenuation and mixing of noise as compared with the prior art. To do.

[Structure of the Invention] (Means for Solving Problems) That is, the present invention relates to a transfer unit for loading and unloading a semiconductor wafer on a mounting table, and a semiconductor wafer arranged on the mounting table by moving the mounting table. A drive unit for sequentially contacting the electrode pads of a large number of semiconductor devices formed on the probe of the probe card, and a semiconductor that is electrically connected to the probe of the probe card and supplies a predetermined inspection signal to the semiconductor device. A measurement unit that measures a signal from a device and inspects it, and a main control unit that integrally controls the transport unit, the drive unit, and the measurement unit are arranged at a close position to the measurement unit and the probe card. It is characterized by being housed in the same frame as described above.

(Operation) A semiconductor device inspection apparatus according to the present invention is configured to transfer a semiconductor wafer to and from a mounting table, and a plurality of semiconductors formed on a semiconductor wafer arranged on the mounting table by moving the mounting table. A drive unit that sequentially contacts the electrode pads of the device with the probe of the probe card, and is electrically connected to the probe of the probe card to supply a predetermined inspection signal to the semiconductor device and measure and inspect the signal from the semiconductor device. The measuring unit that performs the above, and the main control unit that integrally controls the transport unit, the driving unit, and the measuring unit are housed in the same frame so that the measuring unit and the probe card are arranged in the proximity position. There is.

Therefore, as compared with the conventional semiconductor device inspection apparatus in which the prober and the tester are separately configured, the semiconductor device and the measuring unit that supplies a signal to the semiconductor device and a measuring unit that measures a signal from the semiconductor device are separated from each other. It is possible to shorten the length of a connection line for electrically connecting the signal lines, reduce signal attenuation and noise mixing as compared with the conventional method, and perform highly accurate inspection.

(Embodiment) An embodiment of the semiconductor device inspection apparatus of the present invention will be described below with reference to the drawings.

A semiconductor device inspection apparatus 1 is provided with a disk-shaped mounting table 2 for mounting a semiconductor wafer, which is an object to be measured, in the same frame, and below the mounting table 2 in the XY direction and the Z direction. A drive unit 3 for moving is provided. This table 2
A probe card 4 provided with a probe 5 so as to make electrical contact with a terminal of a semiconductor wafer, which is an object to be measured provided above, is provided.
Is provided. The measuring unit 6 is provided with a transfer unit 9 for loading / unloading the semiconductor wafer 8 from the wafer cassette 7 onto the mounting table 2. The inspection device 1 is configured by providing a main control unit 10 that comprehensively controls the drive unit 3, the measurement unit 6, and the transport unit 9 in the frame 21.

In the inspection device 1 for a semiconductor device of this embodiment having the above-mentioned configuration, the drive unit 3, the measurement unit 6, and the transport unit 9 are controlled by the main control unit 10.
Is controlled as a whole and operates as follows.

That is, first, the semiconductor wafer 8 accommodated in the wafer cassette 7 is placed on the placing table 2 by the carrying section 9.

Next, the drive unit 3 moves the mounting table 2 in the XY direction and the Z direction, and the electrode pads of a large number of semiconductor devices formed on the semiconductor wafer 8 mounted on the mounting table 2 are sequentially probed. The probe 5 of the card 4 is contacted.

Then, at this time, the measuring unit 6 supplies a predetermined inspection signal to the semiconductor devices and measures signals from these semiconductor devices to determine whether or not the functions of the semiconductor devices are normal.

When the inspection of one semiconductor wafer 8 is completed, the semiconductor wafer 8 on the mounting table 2 is unloaded by the transfer unit 9 and accommodated in the wafer cassette 7, and the semiconductor wafer 8 to be inspected next is in the wafer cassette 7. From the above to the mounting table 2, the inspection is performed again as described above.

The semiconductor device inspection apparatus of this embodiment described above has a configuration in which the prober of the conventional semiconductor device inspection apparatus and the tester are integrated.

Therefore, the probe card 4 and the measuring unit 6 can be arranged close to each other, and compared with the conventional semiconductor device inspection apparatus in which the prober and the tester are separately configured,
It is possible to shorten the length of a connecting line that electrically connects these, to reduce signal attenuation and noise mixing as compared with the conventional technique, and to perform highly accurate inspection. In addition, since the drive unit 3, the measuring unit 6, and the transport unit 9 are controlled by the main control unit 10, the resource of the control system can be saved.

[Advantages of the Invention] As described above, in the semiconductor device inspection apparatus of the present invention, the semiconductor device and the semiconductor device can be compared to the conventional semiconductor device inspection apparatus in which the prober and the tester are separately configured. It is possible to shorten the length of the connection line that electrically connects the signal supply and measurement unit for measuring the signal from the semiconductor device. Accurate inspection can be performed.

[Brief description of drawings]

FIG. 1 is a block diagram showing a semiconductor device inspection apparatus according to an embodiment of the present invention. 1 ... Inspection device for semiconductor device, 2 ... Mounting table, 3 ...
… Drive unit, 4… Probe card, 5… Probe, 6…
Measuring unit, 7 ... Wafer cassette, 8 ... Semiconductor wafer,
9: Transport section, 10: Main control section, 21: Frame.

Claims (1)

[Claims] 1. A probe card in which a carrier unit for loading and unloading a semiconductor wafer on a mounting table and electrode pads of a large number of semiconductor devices formed on the semiconductor wafer arranged on the mounting table by moving the mounting table are sequentially arranged. A drive unit to be brought into contact with the probe of, and a measurement unit electrically connected to the probe of the probe card and supplying a predetermined inspection signal to the semiconductor device and measuring the signal from the semiconductor device for inspection. A semiconductor characterized in that the transport unit, the drive unit, and a main control unit that totally controls the measurement unit are housed in the same frame body so that the measurement unit and the probe card are arranged in close proximity. Device inspection equipment.